CN203812866U - A highly heat conducting insulation crystal packaging structure - Google Patents
A highly heat conducting insulation crystal packaging structure Download PDFInfo
- Publication number
- CN203812866U CN203812866U CN201420077190.2U CN201420077190U CN203812866U CN 203812866 U CN203812866 U CN 203812866U CN 201420077190 U CN201420077190 U CN 201420077190U CN 203812866 U CN203812866 U CN 203812866U
- Authority
- CN
- China
- Prior art keywords
- conducting strip
- metal framework
- heat conducting
- plastic packaging
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a highly heat conducting insulation crystal packaging structure. A packaging body in the highly heat conducting insulation crystal packaging structure is a crystal all-plastic packaging body, and is formed through the assembly of a heat radiating fin metal framework and a heat conducting sheet. The heat radiating fin metal framework is subjected to overall plastic packaging, and the heat conducting sheet are attached to an exposed metal sheet on the back of the heat radiating fin metal framework in an adhesive mode. An insulation heat conducting sheet is laid on the surface of the heat radiating fin metal framework. Grooves form in the surfaces of the metal heat conducting sheet and the full-plastic packaging body. Heat conducting materials are filled on the groove surfaces to form filling surfaces. The height of the filling surfaces are level with the heights of the plastic packaging surfaces or exceed the heights of plastic packaging surfaces. A circular hole is arranged in the heat radiating fin metal framework. The heat conducting sheet is a half-surface-block heat conducting sheet or a full-surface-block heat conducting sheet. The half-surface-block heat conducting sheet covers a central portion of the heat radiating fin metal framework, and the rest exposed part of the heat radiating fin metal framework is covered through plastic packaging. The full-surface-block heat conducting sheets cover the surface of the heat radiating fin metal framework. The metal sheet at a threaded hole portion is covered through plastic packaging. Plastic packaging materials covers the heat conducting sheets in a completely seamless mode are also included. The thickness of each heat conducting sheet is larger than the thickness of the plastic packaging materials.
Description
Technical field
The utility model relates to a kind of crystal packaging structure, is specifically applied to the encapsulation of crystal in the electronic product such as power transistor and power MOS pipe components and parts.
Background technology
The transistorized use amount of power-type is very large, but along with reducing of electronic product volume, tradition Full-plastics sealed crystal and uninsulated heat conductivility cannot meet the demands gradually, and conventional uninsulated transistor will manually add a silica gel sheet and insulation grain overleaf, and assembling process is comparatively complicated; In addition, traditional Full-plastics sealed heat radiation, plastic packaging is led coefficient low-heat, needs again to lead the gap of two stiff dough of thermal grease filling.The heat radiation of Jia Neijia potsherd all can not realize high efficiency and heat radiation, does not also utilize the rapid-assembling of whole radiator structure, causes the radiating effect of crystal packaging structure poor, and packaging efficiency is low.
Utility model content
Technical problem to be solved in the utility model is, for above-mentioned deficiency of the prior art, to provide a kind of high heat conductive insulating crystal packaging structure, and it has good heat conduction effect, is convenient to the advantage of rapid-assembling.
The utility model solves the technical scheme that its technical problem adopts: high heat conductive insulating crystal packaging structure, and packaging body is the overall plastic packaging body of crystal, is assembled by fin metal framework and conducting strip; The whole five dough model envelopes of fin metal framework, have exposed metal conducting strip on the plastic packaging face at its back side, and metal conducting strip is laid on the surface of fin metal framework; The overall plastic encapsulation of metal conducting strip and crystal surface forms groove face, on this groove face, fills Heat Conduction Material, forms filling face, fills the height of face concordant with plastic packaging face or exceed plastic packaging face;
On described fin metal framework, be provided with circular hole, the metal covering plastic packaging of circular hole face is lived, described conducting strip is demifacet piece conducting strip or comprehensive piece conducting strip, described demifacet piece conducting strip is lived metal covering the plastic packaging exposed circular of fin metal framework, and described comprehensive piece conducting strip is by fin metal framework surface coverage;
Also comprise and the capsulation material of the complete seamless coverage of conducting strip, the thickness of described conducting strip is greater than the thickness of capsulation material.
As a kind of preferred implementation of the present utility model, in the time that described conducting strip is demifacet piece conducting strip, described capsulation material is plastic-sealed body, and plastic-sealed body covers the exposed part of the unlapped fin metal framework of demifacet piece conducting strip; The complete seamless coverage of demifacet piece conducting strip and plastic-sealed body, the thickness of demifacet piece conducting strip is greater than the thickness of plastic-sealed body.
As a kind of preferred implementation of the present utility model, in the time that described conducting strip is comprehensive piece conducting strip, on described comprehensive piece conducting strip, offer the through hole of the circular hole on corresponding fin metal framework, through hole capsulation material around and comprehensive complete seamless coverage of piece conducting strip, the thickness of piece conducting strip is greater than the thickness of capsulation material comprehensively.
As a kind of preferred implementation of the present utility model, the thickness of above-mentioned conducting strip is higher than capsulation material face.
The beneficial effects of the utility model:
The utility model can also can be with comprehensive piece conducting strip with demifacet piece conducting strip in when encapsulation.The thickness of the utility model conducting strip used is a bit super a little or put down the capsulation material in crystal package, and heat-conducting effect is better than additional silicon Film Effect, in being also better than, adds potsherd effect, is more better than Full-plastics sealed effect.The utility model packaged type good heat conduction effect, is used this structure in the time that finished product is produced, and only needs fin metal framework and conducting strip rapid-assembling, on Full-plastics sealed crystal, can obtain whole packaging body, can effectively reduce society human material resources.The utility model crystal packaging structure, has accomplished all insulation, high heat-conducting effect (be common to locking-type and overlay formula or cassette operation), and package type is many.The utility model conducting strip material is high insulation, highly heat-conductive material, (no matter ceramic, glue class, mica sheet, contour heat-conducting medium).
The utility model high heat conductive insulating crystal packaging structure, directly can lock, and need not add insulating trip and insulation grain, can reach the effect that is better than adding insulating trip, heat-conducting effect, and personnel can be saved in operation aspect, can automated job.
Brief description of the drawings
Fig. 1 is the overall structure schematic diagram of embodiment mono-;
Fig. 2 is the first decomposition texture schematic diagram of embodiment mono-;
Fig. 3 is the second decomposition texture schematic diagram of embodiment mono-;
Fig. 4 is the overall structure schematic diagram of embodiment bis-;
Fig. 5 is the first decomposition texture schematic diagram of embodiment bis-;
Fig. 6 is the second decomposition texture schematic diagram of embodiment bis-.
Description of reference numerals:
1-packaging body, the overall plastic packaging body of 2-crystal, 3-fin metal framework, 4-plastic-sealed body, 5-demifacet piece conducting strip, the comprehensive piece conducting strip of 6-.
Embodiment
Below in conjunction with drawings and Examples, the utility model embodiment is described:
Fig. 1～Fig. 3 shows the concrete structure of the utility model embodiment mono-, and wherein, Fig. 1 is the overall structure of packaging body 1, and Fig. 2 is the structure that packaging body 1 all parts frontal is checked, Fig. 3 is the structure that packaging body 1 all parts back side direction is checked.
As shown in the figure, 2 is the overall plastic packaging body of crystal; 3 is fin metal framework; 4 is plastic-sealed body; Plastic-sealed body encases the circular hole of fin metal framework, covers the exposed metal/bare metal sheet that demifacet piece conducting strip does not cover; 5 is demifacet piece conducting strip; Completely seamless covering of the plastic-sealed body of circular and demifacet conducting strip, conducting strip than the face of plastic packaging material slightly thick go out a bit, be conducive to better heat conduction;
Fig. 4～Fig. 6 shows the concrete structure of the utility model embodiment bis-, and wherein, Fig. 4 is the overall structure of packaging body 1, and Fig. 5 is the structure that packaging body 1 all parts frontal is checked, Fig. 6 is the structure that packaging body 1 all parts back side direction is checked.
2 is the overall plastic packaging body of crystal; 3 is fin metal framework; Conducting strip circular is plastic packaging, encases the circular hole of fin metal framework; In the present embodiment, conducting strip is a comprehensive piece conducting strip, covers the sheet metal of exposed fin metal framework; Comprehensively on piece conducting strip, correspondence is offered through hole, hole capsulation material and the complete seamless coverage of conducting strip around, conducting strip than the face of plastic packaging material slightly thick go out a bit, be conducive to better heat conduction.
The utility model can also can be with comprehensive piece conducting strip with demifacet piece conducting strip in when encapsulation.The thickness of the utility model conducting strip used is a bit super a little or put down the capsulation material in crystal package, and heat-conducting effect is better than additional silicon Film Effect, in being also better than, adds potsherd effect, is more better than Full-plastics sealed effect.The utility model packaged type good heat conduction effect, is used the assembling of this structure simple and fast in the time that finished product is produced, and can effectively reduce society human material resources.
The utility model crystal packaging structure, has accomplished all insulation, high heat-conducting effect (be common to locking-type and overlay formula or cassette operation), and package type is many.The utility model conducting strip material is high insulation, highly heat-conductive material, (no matter ceramic, glue class, mica sheet, contour heat-conducting medium).
By reference to the accompanying drawings the utility model preferred implementation is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken possessing those of ordinary skill in the art, can also under the prerequisite that does not depart from the utility model aim, make a variety of changes.
Do not depart from design of the present utility model and scope and can make many other changes and remodeling.Should be appreciated that the utility model is not limited to specific execution mode, scope of the present utility model is defined by the following claims.
Claims (3)
1. high heat conductive insulating crystal packaging structure, is characterized in that: packaging body (1) is the overall plastic packaging body of crystal (2), is assembled by fin metal framework (3) and conducting strip; Whole five dough models of fin metal framework (3) seal, and on the plastic packaging face at its back side, have exposed metal conducting strip, and metal conducting strip is laid on the surface of fin metal framework (3); The overall plastic packaging body of metal conducting strip and crystal (2) surface forms groove face, on this groove face, fills Heat Conduction Material, forms filling face, fills the height of face concordant with plastic packaging face or exceed plastic packaging face;
On described fin metal framework (3), be provided with circular hole, the metal covering plastic packaging of circular hole face is lived, described conducting strip is demifacet piece conducting strip (5) or comprehensive piece conducting strip (6), described demifacet piece conducting strip (5) is lived metal covering the plastic packaging exposed circular of fin metal framework (3), and described comprehensive piece conducting strip (6) is by fin metal framework (3) surface coverage;
Also comprise and the capsulation material of the complete seamless coverage of conducting strip, the thickness of described conducting strip is greater than the thickness of capsulation material.
2. high heat conductive insulating crystal packaging structure as claimed in claim 1, it is characterized in that: in the time that described conducting strip is demifacet piece conducting strip, described capsulation material is plastic-sealed body (4), and plastic-sealed body (4) covers the exposed part of the unlapped fin metal framework of demifacet piece conducting strip (3); The complete seamless coverage of demifacet piece conducting strip and plastic-sealed body, the thickness of demifacet piece conducting strip is greater than the thickness of plastic-sealed body (4).
3. high heat conductive insulating body crystal packaging structure as claimed in claim 1, it is characterized in that: in the time that described conducting strip is comprehensive piece conducting strip, on described comprehensive piece conducting strip, offer the through hole of the circular hole on corresponding fin metal framework, through hole capsulation material around and comprehensive complete seamless coverage of piece conducting strip, the thickness of piece conducting strip is greater than the thickness of capsulation material comprehensively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420077190.2U CN203812866U (en) | 2014-02-21 | 2014-02-21 | A highly heat conducting insulation crystal packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420077190.2U CN203812866U (en) | 2014-02-21 | 2014-02-21 | A highly heat conducting insulation crystal packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203812866U true CN203812866U (en) | 2014-09-03 |
Family
ID=51451585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420077190.2U Expired - Fee Related CN203812866U (en) | 2014-02-21 | 2014-02-21 | A highly heat conducting insulation crystal packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203812866U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107546190A (en) * | 2016-06-28 | 2018-01-05 | 厦门芯晶亮电子科技有限公司 | Transistor-packaging structure |
-
2014
- 2014-02-21 CN CN201420077190.2U patent/CN203812866U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107546190A (en) * | 2016-06-28 | 2018-01-05 | 厦门芯晶亮电子科技有限公司 | Transistor-packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204634261U (en) | Multiple field composite graphite fin | |
| CN203812866U (en) | A highly heat conducting insulation crystal packaging structure | |
| CN206364005U (en) | A kind of heat sinking chip structure | |
| CN208061843U (en) | A kind of Novel reactor encapsulating device | |
| CN205179142U (en) | Modified heat dissipation type mobile phone motherboard | |
| CN207690806U (en) | A kind of solar panel | |
| CN203761753U (en) | Conductive graphite flake | |
| CN206314163U (en) | Heat radiator for communication system | |
| CN207256988U (en) | A kind of lithium battery housing material | |
| CN201416866Y (en) | Plate type radiator structure used for LEDs | |
| CN204994196U (en) | A thermal -insulated membrane of heat dissipation and heat radiation structure for electronic components | |
| CN106357161A (en) | Installing structure of temperature-difference power generation module | |
| CN203826405U (en) | Novel solar cell panel | |
| CN209199909U (en) | A kind of novel TO-220 type semiconductor package | |
| TWM462447U (en) | Solar cell junction box | |
| CN206341548U (en) | A kind of package assembly of aluminium base and heat-dissipating casing | |
| CN207011175U (en) | A kind of automobile power source conductive structure | |
| CN202616258U (en) | Pouring sealant type junction box photovoltaic component | |
| CN206490604U (en) | A kind of mounting structure of temperature-difference power generation module | |
| CN207268853U (en) | A kind of externally embedded type cooling cabinet | |
| CN205790281U (en) | A kind of battery heat radiator of electric automobile | |
| CN206364027U (en) | A kind of anti-PID is from cooling photovoltaic module | |
| CN104244666A (en) | Novel insulating graphite | |
| CN203788620U (en) | Novel electronic component radiation structure | |
| CN218277644U (en) | FPGA chip with heat radiation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140903 Termination date: 20160221 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |