CN203804419U - Electronic element pin cutting device utilizing laser for cutting - Google Patents
Electronic element pin cutting device utilizing laser for cutting Download PDFInfo
- Publication number
- CN203804419U CN203804419U CN201420185036.7U CN201420185036U CN203804419U CN 203804419 U CN203804419 U CN 203804419U CN 201420185036 U CN201420185036 U CN 201420185036U CN 203804419 U CN203804419 U CN 203804419U
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- China
- Prior art keywords
- axis
- axis motor
- electronic component
- laser
- cutting
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- Expired - Fee Related
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Abstract
The utility model provides an electronic element pin cutting device utilizing laser for cutting. The electronic element pin cutting device comprises a controller, a vibration sorting machine, a pin cutter body, a laser transmitter, an X-axis motor component and a Z-axis motor component. The laser transmitter is arranged on the Z-axis motor component, the Z-axis motor component is arranged on the X-axis motor component and can drive the laser transmitter to move up and down to adjust the cutting height of pins, the X-axis motor component can drive the laser transmitter to move left and right to cut the pins, and the controller can control moving of the laser transmitter. Compared with the prior art, laser is used for cutting off pins of electronic elements, impact force on the electronic element can not be caused, the electronic elements can not be damaged, pins of a plurality of electronic elements can be cut off in one time, and cutting efficiency is greatly improved.
Description
Technical field
The utility model relates to a kind of electronic element processing equipment, particularly a kind of electronic component cutting device that utilizes laser to cut.
Background technology
In the production process of some electronic component, conventionally need to carry out Partial Resection to the pin of electronic component, so that electronic component is at plug-in unit, the scolding tin of wiring board, and avoid the excision operation to long pin after scolding tin, to improve efficiency and the automaticity of circuit board processing.Therefore, the cutting operation of electronic component is extremely important to its follow-up use.At present, generally use punching press shut-off mechanism to carry out cutting work, by punching mechanism, cut off the pin of electronic component, still, have following defect:
The pin that cuts off electronic component with punching mechanism can bring impulsive force to electronic component, thereby easily causes electronic component to suffer damage, and pin of every cut-out needs punching mechanism to move back and forth once, and efficiency is lower.
Utility model content
The utility model object is to provide a kind of electronic component cutting device cutting with laser, to solve electronic component cutting device of the prior art, with the pin that punching mechanism cuts off electronic component, can bring impulsive force to electronic component, thereby easily cause electronic component to suffer damage, and pin of every cut-out needs punching mechanism to move back and forth once, the technical matters that efficiency is lower.
The utility model object is achieved through the following technical solutions:
A kind of electronic component cutting device cutting with laser, comprise controller, vibration sorting machine, cutter main body, generating laser, X-axis motor sub-assembly and Z axis motor sub-assembly, described X-axis motor sub-assembly comprises X-axis motor, X-axis drive lead screw and X-axis mobile support saddle, X-axis motor is arranged in described cutter main body, X-axis motor is connected with X-axis drive lead screw, described X-axis drive lead screw is located in the screwed hole of described X-axis mobile support saddle and matches with screwed hole, described cutter main body is provided with can hold the guide rail that described X-axis mobile support saddle slides, described Z axis motor sub-assembly comprises Z axis motor, Z-axis transmission screw mandrel and Z axis mobile support saddle, described Z axis motor is arranged on described X-axis mobile support saddle, described Z axis motor is connected with Z-axis transmission screw mandrel, Z-axis transmission screw mandrel is located in the screwed hole of Z axis mobile support saddle and matches with screwed hole, described X-axis mobile support saddle is provided with and can holds the guide rail that described Z axis mobile support saddle slides, described generating laser is arranged on described Z axis mobile support saddle, described cutter main body is provided with can hold the slotted eye that electronic component is arranged, the outlet of described vibration sorting machine is connected with described slotted eye, described controller respectively with described X-axis motor, Z axis motor connects.The pin that the utility model cuts off electronic component by laser can not bring impulsive force to electronic component, thereby can avoid electronic component to suffer damage, and can once cut off the pin of a plurality of electronic components, thereby has greatly improved cutting efficiency.
In the utility model preferred embodiment, described controller is connected with described generating laser.By controller, can set the working time of generating laser and frequency.
In the utility model preferred embodiment, described X-axis drive lead screw is horizontally disposed with, and described Z-axis transmission screw mandrel vertically arranges.X-axis drive lead screw can be used for driving generating laser side-to-side movement with the pin of cutting electronic components, and Z-axis transmission screw mandrel can be used for driving generating laser to move up and down to adjust the height of generating laser, thus the cutting-height of capable of regulating pin.
In the utility model preferred embodiment, also comprise control panel, described control panel is connected with described controller.By control panel, can control X-axis motor and the motion of Z axis motor and the working time of generating laser and frequency.
In the utility model preferred embodiment, also comprise material collecting device, described material collecting device is arranged on the below of described slotted eye one end.Material collecting device can be used for collecting the electronic component of well cutting.
In the utility model preferred embodiment, also comprise and control main cabinet, described cutter main body, described vibration sorting machine, described material collecting device and described control panel are arranged on described control master cashier's office in a shop.
Compared with prior art, the utility model has following beneficial effect:
1. the pin that the utility model cuts off electronic component by laser can not bring impulsive force to electronic component, thereby can avoid electronic component to suffer damage, and can once cut off the pin of a plurality of electronic components, thereby has greatly improved cutting efficiency;
2. the utility model can be adjusted the cutting-height of pin as required, the utility model can be aspect electronic components fabrication and electronic circuit board manufacture the extensive use of producer face, be specially adapted to the cutting work of responsive electronic devices and components.
Certainly, implement arbitrary product of the present utility model and might not need to reach above-described all advantages simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of the electronic component cutting device cutting with laser of the present utility model.
The specific embodiment
The utility model can bring impulsive force mainly for existing electronic component cutting device to electronic component with the pin that punching mechanism cuts off electronic component, thereby easily cause electronic component to suffer damage, and pin of every cut-out needs punching mechanism to move back and forth once, the defect that efficiency is lower, structure to electronic component cutting device redesigns, the main pin that adopts laser to cut off electronic component, can not bring impulsive force to electronic component, thereby can avoid electronic component to suffer damage, and can once cut off the pin of a plurality of electronic components, thereby greatly improved cutting efficiency.
Below in conjunction with preferred embodiment of the present utility model, the utility model is further described.
Embodiment 1
Refer to Fig. 1, the electronic component cutting device cutting with laser of the present utility model, comprise controller, vibration sorting machine 1, cutter main body 6, generating laser 12, X-axis motor sub-assembly and Z axis motor sub-assembly, X-axis motor sub-assembly comprises X-axis motor 5, X-axis drive lead screw 7 and X-axis mobile support saddle 9, X-axis motor 5 is arranged in cutter main body 6, X-axis motor 5 is connected with X-axis drive lead screw 7, X-axis drive lead screw 7 is located in the screwed hole of X-axis mobile support saddle 9 and matches with screwed hole, cutter main body 6 is provided with can hold the guide rail that X-axis mobile support saddle 9 slides, Z axis motor sub-assembly comprises Z axis motor 10, Z-axis transmission screw mandrel 8 and Z axis mobile support saddle 11, Z axis motor 10 is arranged on X-axis mobile support saddle 9, Z axis motor 10 is connected with Z-axis transmission screw mandrel 8, Z-axis transmission screw mandrel 8 is located in the screwed hole of Z axis mobile support saddle 11 and matches with screwed hole, X-axis mobile support saddle 9 is provided with and can holds the guide rail that Z axis mobile support saddle 11 slides, generating laser 12 is arranged on Z axis mobile support saddle 11, cutter main body 6 is provided with can hold the slotted eye 13 that electronic component is arranged, the outlet of vibration sorting machine 1 is connected with slotted eye 13, generating laser 12 faces slotted eye 13, controller respectively with X-axis motor 5, Z axis motor 10 connects.The pin that the utility model cuts off electronic component by laser can not bring impulsive force to electronic component, thereby can avoid electronic component to suffer damage, and can once cut off the pin of a plurality of electronic components, thereby has greatly improved cutting efficiency.
In the utility model, vibration sorting machine 1 can buy from the market.
In the present embodiment, controller is connected with generating laser 12.By controller, can set the working time of generating laser 12 and frequency.Generating laser 12 can not be connected with controller yet, can be by manually controlling the Push And Release of generating laser 12.
In the present embodiment, X-axis drive lead screw 7 is horizontally disposed with, and Z-axis transmission screw mandrel 8 vertically arranges.X-axis drive lead screw 7 can be used for driving generating laser 12 side-to-side movements with the pin of cutting electronic components, and Z-axis transmission screw mandrel 8 can be used for driving generating laser 12 to move up and down to adjust the height of generating laser, thus the cutting-height of capable of regulating pin.
In the present embodiment, electronic component cutting device of the present utility model also can comprise control panel 3, and control panel 3 is connected with controller.By control panel 3, can control the motion of X-axis motor 5 and Z axis motor 10 and working time and the frequency of generating laser 12.
In the present embodiment, electronic component cutting device of the present utility model also can comprise material collecting device 4, and material collecting device 4 is arranged on the below of slotted eye 13 one end.Material collecting device 4 can be used for collecting the electronic component of well cutting.
In the present embodiment, electronic component cutting device of the present utility model also can comprise controls main cabinet 2, and cutter main body 6, vibration sorting machine 1, material collecting device 4 and control panel 3 are arranged on to be controlled on main cabinet 2.
Embodiment 2
The utility model also provides the using method of the above-mentioned electronic component cutting device cutting with laser, comprises the following steps:
First electronic component to be cut being put into vibration sorting machine sorts, vibration sorting machine pushes the electronic component after sequence in slotted eye again, after the electronic component arrival some of arranging in slotted eye (number of electronic components of arranging can be determined according to need), thereby make controller drive the motion of Z axis motor to drive generating laser to move up and down to proper height (height of generating laser can be determined according to the cutting-height of pin) by control panel setting, open generating laser (can set in control panel again, also can manually control), thereby by control panel setting, make controller drive the motion of X-axis motor to drive generating laser to move left and right the pin with cutting electronic components simultaneously.The electronic component of well cutting pushes in material collecting device by vibrating sorting machine.
The pin that the utility model cuts off electronic component by laser can not bring impulsive force to electronic component, thereby can avoid electronic component to suffer damage, and can once cut off the pin of a plurality of electronic components, thereby has greatly improved cutting efficiency.The utility model can be adjusted the cutting-height of pin as required, the utility model can be aspect electronic components fabrication and electronic circuit board manufacture the extensive use of producer face, be specially adapted to the cutting work of responsive electronic devices and components.
Disclosed is above only several specific embodiments of the application, but the application is not limited thereto, and the changes that any person skilled in the art can think of, all should drop in the application's protection domain.
Claims (6)
1. the electronic component cutting device cutting with laser, it is characterized in that, comprise controller, vibration sorting machine, cutter main body, generating laser, X-axis motor sub-assembly and Z axis motor sub-assembly, described X-axis motor sub-assembly comprises X-axis motor, X-axis drive lead screw and X-axis mobile support saddle, X-axis motor is arranged in described cutter main body, X-axis motor is connected with X-axis drive lead screw, described X-axis drive lead screw is located in the screwed hole of described X-axis mobile support saddle and matches with screwed hole, described cutter main body is provided with can hold the guide rail that described X-axis mobile support saddle slides, described Z axis motor sub-assembly comprises Z axis motor, Z-axis transmission screw mandrel and Z axis mobile support saddle, described Z axis motor is arranged on described X-axis mobile support saddle, described Z axis motor is connected with Z-axis transmission screw mandrel, Z-axis transmission screw mandrel is located in the screwed hole of Z axis mobile support saddle and matches with screwed hole, described X-axis mobile support saddle is provided with and can holds the guide rail that described Z axis mobile support saddle slides, described generating laser is arranged on described Z axis mobile support saddle, described cutter main body is provided with can hold the slotted eye that electronic component is arranged, the outlet of described vibration sorting machine is connected with described slotted eye, described controller respectively with described X-axis motor, Z axis motor connects.
2. the electronic component cutting device cutting with laser as claimed in claim 1, is characterized in that, described controller is connected with described generating laser.
3. the electronic component cutting device cutting with laser as claimed in claim 1, is characterized in that, described X-axis drive lead screw is horizontally disposed with, and described Z-axis transmission screw mandrel vertically arranges.
4. the electronic component cutting device cutting with laser as claimed in claim 1, is characterized in that, also comprise control panel, described control panel is connected with described controller.
5. the electronic component cutting device cutting with laser as claimed in claim 4, is characterized in that, also comprise material collecting device, described material collecting device is arranged on the below of described slotted eye one end.
6. the electronic component cutting device cutting with laser as claimed in claim 5, is characterized in that, also comprises and controls main cabinet, and described cutter main body, described vibration sorting machine, described material collecting device and described control panel are arranged on described control master cashier's office in a shop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420185036.7U CN203804419U (en) | 2014-04-16 | 2014-04-16 | Electronic element pin cutting device utilizing laser for cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420185036.7U CN203804419U (en) | 2014-04-16 | 2014-04-16 | Electronic element pin cutting device utilizing laser for cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203804419U true CN203804419U (en) | 2014-09-03 |
Family
ID=51443228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420185036.7U Expired - Fee Related CN203804419U (en) | 2014-04-16 | 2014-04-16 | Electronic element pin cutting device utilizing laser for cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203804419U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921003A (en) * | 2014-04-16 | 2014-07-16 | 苏州工业职业技术学院 | Electronic element pin cutting device for carrying out cutting through laser and application method |
| CN110976705A (en) * | 2019-11-25 | 2020-04-10 | 安徽锐光电子科技有限公司 | Slitting device for capacitor machining and working method thereof |
-
2014
- 2014-04-16 CN CN201420185036.7U patent/CN203804419U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921003A (en) * | 2014-04-16 | 2014-07-16 | 苏州工业职业技术学院 | Electronic element pin cutting device for carrying out cutting through laser and application method |
| CN103921003B (en) * | 2014-04-16 | 2016-06-29 | 苏州工业职业技术学院 | Electronic component foot cut device and the using method cut is carried out with laser |
| CN110976705A (en) * | 2019-11-25 | 2020-04-10 | 安徽锐光电子科技有限公司 | Slitting device for capacitor machining and working method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140903 Termination date: 20150416 |
|
| EXPY | Termination of patent right or utility model |