CN203786757U - Anti-metal anti-transfer electronic tag - Google Patents
Anti-metal anti-transfer electronic tag Download PDFInfo
- Publication number
- CN203786757U CN203786757U CN201420063640.2U CN201420063640U CN203786757U CN 203786757 U CN203786757 U CN 203786757U CN 201420063640 U CN201420063640 U CN 201420063640U CN 203786757 U CN203786757 U CN 203786757U
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- Prior art keywords
- layer
- electronic tag
- adhesive layer
- adhesive
- chip
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- Expired - Lifetime
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- 239000002184 metal Substances 0.000 title claims abstract description 25
- 239000010410 layer Substances 0.000 claims abstract description 82
- 239000012790 adhesive layer Substances 0.000 claims abstract description 50
- 239000007769 metal material Substances 0.000 claims abstract description 23
- 239000006260 foam Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 27
- 239000003292 glue Substances 0.000 claims description 20
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 230000000007 visual effect Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 229920000742 Cotton Polymers 0.000 abstract 1
- 239000002390 adhesive tape Substances 0.000 abstract 1
- 230000003796 beauty Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000006173 Good's buffer Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- Credit Cards Or The Like (AREA)
Abstract
The utility model relates to an anti-metal anti-transfer electronic tag and belongs to the technical field of security printing. The electronic tag comprises an adhesive dripping layer, a base material layer, a first adhesive layer, an electronic tag layer, a second adhesive layer, an anti-metal material layer and a third adhesive layer, wherein the electronic tag layer is provided with a chip and a round hole is arranged at the place of the chip. According to the anti-metal anti-transfer electronic tag, the outmost layer is the adhesive dripping layer, visual information of the tag can be protected and beauty of the product is enhanced; as the third adhesive layer adopts a foam dual-cotton adhesive tape, pasting is easy and the electronic tag layer can also be protected; and an AD adhesive is used in the round hole to seal the chip, the chip can be well buffered, the reading effects of the product are not influenced, and the anti-transfer purpose of the product can be finally realized.
Description
Technical field
The utility model relates to the anti-transfer electronic tag of a kind of anti-metal, belongs to anti-counterfeiting printing technology field.
Background technology
Electronic tag is a kind of contactless automatic identification technology, it is identified destination object and is obtained related data by radiofrequency signal, identification work is without manual intervention, as the wireless version of bar code, RFID technology has the not available waterproof of bar code, antimagnetic, high temperature resistant, long service life, read that distance is large, on label data can encrypt, store that data capacity is larger, the storage information change advantage such as freely.Coded system, storage and the read-write mode of electronic tag is different from conventional labels (as bar code) or manual label, the storage of electronic tag coding on integrated circuit with read-only or read-write form storage; Particularly read-write mode, electronic tag is realized by wireless electron transmission mode.
Anti-metal tag is exactly to be directly attached to metal to use as its name suggests, and the main medium of isolating with metal that leans on is assigned metal as reflecting surface simultaneously, improves the characteristic of label on metal.Anti-metal electronic tag is attached on metal and can obtains good reading performance, even farther than the distance of reading in air.Can be applied in container management, equipment control, all occasions relevant with metal of steel management etc.
The anti-metal electronic tag major part being made on the market is at present all to use PVC, the materials such as ABS are injection molded, and such label is affixed in gas cylinder and is easy to the chip of electronic tag to crush, and causes label to use, and this label is cumbersome when mounted, need be fixed with screw.Install by this way, make lawless person be easy to be reused, reduced antifalse effect.
Utility model content
According to above deficiency of the prior art, the technical problems to be solved in the utility model is: a kind of above-mentioned defect that solved is provided, and not fragile, simple installation, the anti-transfer electronic tag of anti-metal that is difficult for being secondary use.
The anti-transfer electronic tag of anti-metal described in the utility model, comprise the glue-line, substrate layer, the first adhesive layer, electronic tag layer, the second adhesive layer, anti-metal material layer and the 3rd adhesive layer that set gradually from top to bottom, wherein electronic tag layer is with chip, chip place is provided with circular hole, circular hole is successively through the second adhesive layer, anti-metal material layer and the 3rd adhesive layer, in circular hole, drip and have AB glue, the 3rd adhesive layer is foam double sticky tape.
Customer information be can in substrate layer, print, bar code information or serial code added.
The long 0-5mm of length of the Length Ratio electronic tag layer of described substrate layer, the width of substrate layer is than the long 0-5mm of the width of electronic tag layer.
The long 0-5mm of length of the anti-metal material layer of Length Ratio of described substrate layer, the width of substrate layer is than the long 0-5mm of the width of anti-metal material layer.
Described chip is positioned at the center position of circular hole.
The diameter of described circular hole is 6-8mm.
Described substrate layer adopts synthetic paper to make, and the first adhesive layer and the second adhesive layer are hot-fusible pressure-sensitive adhesive or double sticky tape.
The method for making of the above-mentioned anti-transfer electronic tag of anti-metal, comprises the following steps:
A, set gradually substrate layer, electronic tag layer and anti-metal material layer from top to bottom, substrate layer and electronic tag layer are bondd by the first adhesive layer, electronic tag layer and anti-metal material layer are by the second adhesive layer bonding, and anti-metal material layer bottom surface is bonded on the 3rd adhesive layer;
B, on the second adhesive layer, anti-metal material layer and the 3rd adhesive layer, make a call to the circular hole that a diameter is 6-8mm simultaneously, make chip on electronic tag layer be positioned at the centre of circular hole;
C, drip transparent AB glue on substrate layer surface, form and drip a glue-line;
D, in circular hole, splash into AB glue, chip is sealed.
This AB glue just drips upper AB glue by chip position and whole circular hole is not filled up, and the chip of label is played a protective role.
Anti-metal material layer is attached in the middle of the 3rd adhesive layer, error ± 1mm, and the size of dripping glue-line of formation is identical with the size of the 3rd adhesive layer, and dripping glue-line can play a very good protection to the printing information in substrate layer, can also increase the aesthetics of product.Can adopt a glue-line that each layer except the 3rd adhesive layer is encased, improve protection effect.
In c step, this glue of AB glue and the ratio of rigidizer of dripping glue-line use are 1:1.5-1:3.
When use, after being filled up with AB glue, again one deck silicon oil membrane on the 3rd adhesive layer bottom surface is taken off the former circular hole not filling up, this label is affixed on affixed object, because this label is a kind of softer product, even if be affixed on the affixed object of certain radian, be also easy to stick, even and label by strong impaction, because the foam double sticky tape of the 3rd adhesive layer has certain toughness, label also can not be damaged by pressure.When lawless person by label from affixed object paste time because the AB glue of circular hole position not only sticks on affixed object, and chip position also has AB glue, so be easy to chip to sticking out, whole label cannot to be used, thereby play the object of good anti-transfer.
The beneficial effect that the utility model has is: the utility model label outermost layer has adopted a glue-line; the visual information of protection label and increased the aesthetics of product; the 3rd adhesive layer uses the two celloidin bands of foam, not only easily pastes, but also can protect electronic tag layer.Chip position place at electronic tag layer arranges circular hole, and with AB glue, chip is sealed in circular hole, so not only chip has been played to good buffer action, nor can affect the effect that reads of product, finally can also play the anti-transfer object of product.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure: 1, drip glue-line; 2, substrate layer; 3, the first adhesive layer; 4, electronic tag layer; 5, the second adhesive layer; 6, anti-metal material layer; 7, the 3rd adhesive layer; 8, chip; 9, circular hole.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described further:
As shown in Figure 1, the anti-transfer electronic tag of anti-metal comprises the glue-line 1, substrate layer 2, the first adhesive layer 3, electronic tag layer 4, the second adhesive layer 5, anti-metal material layer 6 and the 3rd adhesive layer 7 that set gradually from top to bottom, wherein electronic tag layer 4 is with chip 8, chip 8 places are provided with circular hole 9, circular hole 9 is successively through the second adhesive layer 5, anti-metal material layer 6 and the 3rd adhesive layer 7, in circular hole 9, drip and have AB glue, the 3rd adhesive layer 7 is foam double sticky tape.
The long 0-5mm of length of the Length Ratio electronic tag layer 4 of substrate layer 2, the width of substrate layer 2 is than the long 0-5mm of the width of electronic tag layer 4.
The long 0-5mm of length of the anti-metal material layer 6 of Length Ratio of substrate layer 2, the width of substrate layer 2 is than the long 0-5mm of the width of anti-metal material layer 6.
Chip 8 is positioned at the center position of circular hole 9, and the diameter of circular hole 9 is 6-8mm, and substrate layer 2 adopts synthetic paper to make, and the first adhesive layer 3 and the second adhesive layer 5 are hot-fusible pressure-sensitive adhesive or double sticky tape.
The method for making of the above-mentioned anti-transfer electronic tag of anti-metal, comprises the following steps:
A, set gradually substrate layer 2, electronic tag layer 4 and anti-metal material layer 6 from top to bottom, substrate layer 2 and electronic tag layer 4 are bondd by the first adhesive layer 3, electronic tag layer 4 and anti-metal material layer 6 bond by the second adhesive layer 5, and anti-metal material layer 6 bottom surfaces are bonded on the 3rd adhesive layer 7;
B, on the second adhesive layer 5, anti-metal material layer 6 and the 3rd adhesive layer 7, make a call to the circular hole 9 that a diameter is 6-8mm simultaneously, make chip 8 on electronic tag layer 4 be positioned at the centre of circular hole 9;
C, drip transparent AB glue on substrate layer 2 surface, form and drip a glue-line 1, the size of dripping glue-line 1 of formation is identical with the size of the 3rd adhesive layer 7;
D, in circular hole 9, splash into AB glue, chip 8 is sealed.
In c step, this glue of AB glue and the ratio of rigidizer that a glue-line 1 uses are 1:1.5-1:3.
When use, after being filled up, again one deck silicon oil membrane on the 3rd adhesive layer 7 bottom surfaces is taken off by the former circular hole not filling up 9 use AB glue, this label is affixed on affixed object, because this label is a kind of softer product, even if be affixed on the affixed object of certain radian, be also easy to stick, even and label by strong impaction, because the foam double sticky tape of the 3rd adhesive layer 7 has certain toughness, label also can not be damaged by pressure.When lawless person by label from affixed object paste time because the AB glue of circular hole 9 positions not only sticks on affixed object, and chip 8 positions also have AB glue, so be easy to chip 8 to sticking out, whole label cannot to be used, thereby play the object of good anti-transfer.
Claims (6)
1. the anti-transfer electronic tag of anti-metal, it is characterized in that: comprise the glue-line (1) setting gradually from top to bottom, substrate layer (2), the first adhesive layer (3), electronic tag layer (4), the second adhesive layer (5), anti-metal material layer (6) and the 3rd adhesive layer (7), wherein electronic tag layer (4) is with chip (8), chip (8) locates to be provided with circular hole (9), circular hole (9) is successively through the second adhesive layer (5), anti-metal material layer (6) and the 3rd adhesive layer (7), in circular hole (9), drip and have AB glue, the 3rd adhesive layer (7) is foam double sticky tape.
2. the anti-transfer electronic tag of anti-metal according to claim 1, is characterized in that: the long 0-5mm of length of the Length Ratio electronic tag layer (4) of described substrate layer (2), the width of substrate layer (2) is than the long 0-5mm of width of electronic tag layer (4).
3. the anti-transfer electronic tag of anti-metal according to claim 1, it is characterized in that: the long 0-5mm of length of the anti-metal material layer of Length Ratio (6) of described substrate layer (2), the width of substrate layer (2) is than the long 0-5mm of width of anti-metal material layer (6).
4. the anti-transfer electronic tag of anti-metal according to claim 1, is characterized in that: described chip (8) is positioned at the center position of circular hole (9).
5. the anti-transfer electronic tag of anti-metal according to claim 1, is characterized in that: the diameter of described circular hole (9) is 6-8mm.
6. the anti-transfer electronic tag of anti-metal according to claim 1, is characterized in that: described substrate layer (2) adopts synthetic paper to make, and the first adhesive layer (3) and the second adhesive layer (5) are hot-fusible pressure-sensitive adhesive or double sticky tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420063640.2U CN203786757U (en) | 2014-02-12 | 2014-02-12 | Anti-metal anti-transfer electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420063640.2U CN203786757U (en) | 2014-02-12 | 2014-02-12 | Anti-metal anti-transfer electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203786757U true CN203786757U (en) | 2014-08-20 |
Family
ID=51322918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420063640.2U Expired - Lifetime CN203786757U (en) | 2014-02-12 | 2014-02-12 | Anti-metal anti-transfer electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203786757U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103778462A (en) * | 2014-02-12 | 2014-05-07 | 山东泰宝防伪技术产品有限公司 | Metal-resisting anti-transfer electronic tag and manufacturing method thereof |
-
2014
- 2014-02-12 CN CN201420063640.2U patent/CN203786757U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103778462A (en) * | 2014-02-12 | 2014-05-07 | 山东泰宝防伪技术产品有限公司 | Metal-resisting anti-transfer electronic tag and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 256407 Shandong Zibo County, Huantai Province, north of the first sea Patentee after: Shandong Taibao Information Technology Group Co.,Ltd. Address before: 256407 Shandong Zibo County, Huantai Province, north of the first sea Patentee before: SHANDONG TAIBAO PREVENTING COUNTERFEIT PRODUCT Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140820 |
|
| CX01 | Expiry of patent term |