CN203771776U

CN203771776U - Gas refrigerating device

Info

Publication number: CN203771776U
Application number: CN201420191030.0U
Authority: CN
Inventors: 王艳丽
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-04-14
Filing date: 2014-04-14
Publication date: 2014-08-13
Anticipated expiration: 2024-04-14

Abstract

The utility model relates to a gas refrigerating device. The gas refrigerating device comprises a support body, wherein a semiconductor refrigerating plate is arranged on the support body; a condensation chamber is fixedly formed in a refrigerating surface of the semiconductor refrigerating plate; a gas inlet and a gas outlet are formed in the upper part of the support body; a drain outlet is formed in the bottom of the support body; the gas inlet, the gas outlet and the drain outlet are respectively communicated with the condensation chamber; the condensation chamber comprises a shell; a partition plate is arranged in the middle of the shell; the partition plate is connected to the inner wall of the upper side of the condensation chamber in a sealing mode; a spacing is formed between the partition plate and the inner wall of the lower side of the condensation chamber; a plurality of barrier plates are arranged in the shell; a spacing is formed between the upper and lower adjacent barrier plates; the left and right adjacent barrier plates are crossed, so that the condensed water vapor is adsorbed to the wall of the condensation chamber; the condensed water vapor flows to the drain outlet under the driving of the gravity and the gas flow to be discharged out of the drain outlet; and the gas refrigerating device is high in refrigerating efficiency and quick in refrigerating speed and has the effect of removing water.

Description

A kind of gas refrigeration device

Technical field

The utility model relates to a kind of refrigerating plant, specifically, relates to a kind of gas refrigeration device of low discharge, belongs to gas refrigeration device field.

Background technology

In chemistry, chemical production field gas used, some gas temperature is higher, thereby can contain a certain amount of water vapour, this gas is in the time carrying out gas analysis, need first gas to be lowered the temperature, after removing the steam in gas, just can proceed, otherwise will affect the result of gas analysis.The device of removing at present steam, some removal effects are relatively good, but complex structure; Although what have is simple in structure, refrigeration is undesirable, has affected water removal effect.

Utility model content

Problem to be solved in the utility model is for above deficiency, a kind of gas refrigeration device is provided, overcome the defect that in prior art, de-watering apparatus exists, adopt after gas refrigeration device of the present utility model, have advantages of that use is simple, refrigerating efficiency is high, refrigerating speed is fast and have water removal effect.

For solving above technical problem, the technical scheme of this novel employing is: a kind of gas refrigeration device, it is characterized in that: described gas refrigeration device comprises supporter, supporter is provided with semiconductor chilling plate, on the chill surface of semiconductor chilling plate, be fixedly installed condensation chamber, the top of supporter is provided with gas access, gas vent, and the bottom of supporter is provided with sewage draining exit;

Described gas access, gas vent, sewage draining exit are communicated with condensation chamber respectively;

Described condensation chamber comprises housing, the centre position of housing is provided with dividing plate, the upper inside walls of dividing plate and condensation chamber is tightly connected, between the downside inwall of dividing plate and condensation chamber, there is interval, in housing, be provided with several bafflers, between neighbouring baffler, there is interval, the baffler cross arrangement that left and right is adjacent.

A kind of prioritization scheme, the radiating surface of described semiconductor chilling plate is fixedly installed the first heat conduction aluminium block, the second heat conduction aluminium block and fin successively, between condensation chamber, semiconductor chilling plate, the first heat conduction aluminium block, the second heat conduction aluminium block, fin, scribbles heat-conducting silicone grease.

Further, the surface area of the surface area ratio first heat conduction aluminium block of described the second heat conduction aluminium block is large.

The utility model adopts above technical scheme, compared with prior art, have the following advantages: be connected with condensation chamber by polyfluortetraethylene pipe is set, and semiconductor chilling plate, the first heat conduction aluminium block, the second heat conduction aluminium block and fin be housed, between the interior neighbouring baffler of condensation chamber, there is interval, the baffler cross arrangement that left and right is adjacent, can make the Vapor adsorption of condensation to condensation locular wall, under the drive of gravity and air-flow, to discharging downstream to sewage draining exit, refrigerating efficiency is high, refrigerating speed is fast and have water removal effect.

Below in conjunction with drawings and Examples, the utility model is described in further detail.

Brief description of the drawings

Accompanying drawing 1 is the structural representation of gas refrigeration device in the utility model embodiment;

Accompanying drawing 2 is the left view of accompanying drawing 1;

Accompanying drawing 3 is the structural representation of condensation chamber in the utility model embodiment;

In figure,

1-gas access, 2-fin, 3-polyfluortetraethylene pipe, 4-the second heat conduction aluminium block, 5-the first heat conduction aluminium block, 6-condensation chamber, 7-semiconductor chilling plate, 8-supporter, 9-gas vent, 10-sewage draining exit, 11-pressing plate, 12-dividing plate, 13-baffler, 14-housing.

Detailed description of the invention

Below preferred embodiment of the present utility model is described, should be appreciated that preferred embodiment described herein is only for description and interpretation the utility model, and be not used in restriction the utility model.

Embodiment 1, as Fig. 1, shown in Fig. 2, a kind of gas refrigeration device, comprises the supporter 8 of a rectangular shape, and supporter 8 is provided with semiconductor chilling plate 7, is fixedly installed condensation chamber 6 on the chill surface of semiconductor chilling plate 7, and the top of supporter 8 is provided with gas access 1, gas vent 9, the bottom of supporter 8 is provided with sewage draining exit 10, gas access 1, gas vent 9, sewage draining exit 10 is respectively equipped with BULKHEAD UNION, and BULKHEAD UNION is communicated with condensation chamber 6 by polyfluortetraethylene pipe 3 respectively, and the radiating surface of semiconductor chilling plate 7 is fixedly installed the first heat conduction aluminium block 5 successively, the surface area of the surface area ratio first heat conduction aluminium block 5 of the second heat conduction aluminium block 4 and fin 2, the second heat conduction aluminium blocks 4 is large, and stainless pressing plate 11 is by condensation chamber 6, semiconductor chilling plate 7, the first heat conduction aluminium block 5, the second heat conduction aluminium block 4, fin 2 is pressed on supporter 8, adjacent condensation chamber 6, semiconductor chilling plate 7, the first heat conduction aluminium block 5, the second heat conduction aluminium block 4, between fin 2, scribble heat-conducting silicone grease, increased thermal conductivity energy.

As shown in Figure 3, condensation chamber 6 comprises housing 14, the centre position of housing 14 is provided with dividing plate 12, dividing plate 12 is tightly connected with the upper inside walls of condensation chamber 6, between the downside inwall of dividing plate 12 and condensation chamber 6, there is interval, in housing 14, be provided with several bafflers 13, between neighbouring baffler 13, there is interval, baffler 13 cross arrangements that left and right is adjacent.

Chill surface at semiconductor chilling plate is settled a condensation chamber, when condensation chamber passes into gas, semiconductor chilling plate is lowered the temperature to condensation chamber, gas circuit in condensation chamber can make the Vapor adsorption of condensation to condensation locular wall, under the drive of gravity and air-flow, to discharging downstream to sewage draining exit.Radiating surface at the semiconductor chilling plate of two series connection is settled a fin, and the heat out of exchange is dispelled the heat in time.

Finally it should be noted that: the foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, although the utility model is had been described in detail with reference to previous embodiment, for a person skilled in the art, its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement.All within spirit of the present utility model and principle, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.

Claims

1. a gas refrigeration device, it is characterized in that: described gas refrigeration device comprises supporter (8), supporter (8) is provided with semiconductor chilling plate (7), on the chill surface of semiconductor chilling plate (7), be fixedly installed condensation chamber (6), the top of supporter (8) is provided with gas access (1), gas vent (9), and the bottom of supporter (8) is provided with sewage draining exit (10);

Described gas access (1), gas vent (9), sewage draining exit (10) are communicated with condensation chamber (6) respectively;

Described condensation chamber (6) comprises housing (14), the centre position of housing (14) is provided with dividing plate (12), dividing plate (12) is tightly connected with the upper inside walls of condensation chamber (6), between the downside inwall of dividing plate (12) and condensation chamber (6), there is interval, in housing (14), be provided with several bafflers (13), between neighbouring baffler (13), there is interval, baffler (13) cross arrangement that left and right is adjacent.

2. gas refrigeration device as claimed in claim 1, it is characterized in that: the radiating surface of described semiconductor chilling plate (7) is fixedly installed the first heat conduction aluminium block (5), the second heat conduction aluminium block (4) and fin (2) successively, condensation chamber (6), semiconductor chilling plate (7), the first heat conduction aluminium block (5), the second heat conduction aluminium block (4), fin scribble heat-conducting silicone grease between (2).

3. gas refrigeration device as claimed in claim 2, is characterized in that: the surface area of the surface area ratio first heat conduction aluminium block (5) of described the second heat conduction aluminium block (4) is large.