CN203771220U - High-heat-dissipation LED bulb lamp - Google Patents

High-heat-dissipation LED bulb lamp Download PDF

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Publication number
CN203771220U
CN203771220U CN201420184785.8U CN201420184785U CN203771220U CN 203771220 U CN203771220 U CN 203771220U CN 201420184785 U CN201420184785 U CN 201420184785U CN 203771220 U CN203771220 U CN 203771220U
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CN
China
Prior art keywords
heat
devitrified glass
microcrystalline glass
lamp
shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420184785.8U
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Chinese (zh)
Inventor
徐虹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XIAMEN FENGHONG LIGHTING Co Ltd
Original Assignee
XIAMEN FENGHONG LIGHTING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XIAMEN FENGHONG LIGHTING Co Ltd filed Critical XIAMEN FENGHONG LIGHTING Co Ltd
Priority to CN201420184785.8U priority Critical patent/CN203771220U/en
Application granted granted Critical
Publication of CN203771220U publication Critical patent/CN203771220U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a high-heat-dissipation LED bulb lamp which comprises a microcrystalline glass bulb shell, a microcrystalline glass lamp base, a lamp holder, an FPC circuit board and a group of LED chips. The microcrystalline glass bulb shell is spherical, and one end of the microcrystalline glass bulb shell is provided with an opening. The microcrystalline glass lamp base and the microcrystalline glass bulb shell are sintered into a whole. The lamp holder is connected with the microcrystalline glass lamp base. The FPC circuit board is bonded to the microcrystalline glass lamp base through heat conducting glue and electrically connected with the lamp holder. The LED chips are welded onto the FPC circuit board. According to the high-heat-dissipation LED bulb lamp, the microcrystalline glass bulb shell and the microcrystalline glass lamp base are sintered into a whole structure, heat resistance is reduced, heat generated by the LED chips can be rapidly transmitted to the whole microcrystalline glass bulb shell through the microcrystalline glass lamp base, and therefore heat can be dissipated easily.

Description

A kind of high-heat-dispersion LED bulb lamp
Technical field
The utility model relates to lighting field, particularly a kind of LED bulb lamp.
Background technology
LED bulb lamp outward appearance adopts bulb profile (spherical), and internal light source adopts LED light source, and it relies on energy-saving and environmental protection, without plurality of advantages such as stroboscopic, long service life, is widely used in various lighting fields.
Because the luminous intensity of single led chip is limited, in order to obtain required brightness of illumination, need to be at the inner integrated a plurality of LED chips of LED bulb lamp, but will certainly cause like this LED bulb lamp internal calorific power large.Given this, how to promote the radiating effect of LED bulb lamp, more receive people's concern.
Existing LED bulb lamp generally includes glass cell-shell, lamp socket, lamp holder and LED light source, its radiating mode is mainly: the heat that LED light source produces is delivered on glass cell-shell by lamp socket in heat conducting mode, glass cell-shell with the mode of thermal convection current by dissipation of heat in air.Different from the material that glass cell-shell adopts due to lamp socket, need to connect by connected modes such as splicing, between the two, there is certain thermal resistance, heat can not be transmitted on glass cell-shell in time, thereby cause LED bulb lamp integral heat sink weak effect.In addition, glass cell-shell is easily broken, causes LED bulb lamp to reduce service life, and after the fragmentation of glass cell-shell, LED light source is directly exposed to the external world, and still can, in energising duty, exist certain potential safety hazard.
Utility model content
The purpose of this utility model is to provide that a kind of good heat dissipation effect, intensity are high, long service life, LED bulb lamp that security is good.
For achieving the above object, the utility model is by the following technical solutions:
A high-heat-dispersion LED bulb lamp, comprising:
Devitrified glass cell-shell, its spherical in shape and one end has opening;
Devitrified glass lamp socket, itself and described devitrified glass cell-shell are sintered to one;
Lamp holder, it is connected with described devitrified glass lamp socket;
FPC circuit board, it fits on described devitrified glass lamp socket by heat-conducting glue, and is electrically connected with described lamp holder;
One group of LED chip, it is welded on FPC circuit board.
Preferably, described devitrified glass lamp socket is class conical shell, and its one end has opening, and the openend of described devitrified glass lamp socket is connected with the openend sintering of described devitrified glass cell-shell.
Preferably, described LED chip is vertical flip LED chips, is coated with fluorescent material on it.
Adopt after technique scheme, the utility model is compared with background technology, and tool has the following advantages:
1. devitrified glass cell-shell of the present utility model and devitrified glass lamp socket are sintered to integrative-structure, have reduced thermal resistance, and the heat that LED chip produces can be delivered to rapidly whole devitrified glass cell-shell by devitrified glass lamp socket, is conducive to distributing of heat.
2. adopt cell-shell and the lamp socket that high strength micro-crystalline glass material is made to be difficult for fragmentation, improved bulk strength and the service life of LED bubble lamp, also improved the security of LED bubble lamp simultaneously.
3. the utility model becomes class conical shell by devitrified glass lamp socket designs, increased itself and devitrified glass cell-shell over against angle and area, LED chip can carry out multi-angle installation, is convenient to increase light angle.
4.LED chip adopts vertical flip LED chips, can form effective thermoelectricity separated, and resistance to large-drive-current, has significantly promoted radiating efficiency and luminous efficiency.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of the utility model devitrified glass cell-shell.
Fig. 3 is the structural representation of the utility model devitrified glass lamp socket.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Embodiment
Refer to Fig. 1, the utility model discloses a kind of high-heat-dispersion LED bulb lamp, comprise devitrified glass cell-shell 100, devitrified glass lamp socket 200, lamp holder 300, FPC circuit board 400 and one group of LED chip 500, wherein:
Shown in figure 2, devitrified glass cell-shell 100 is spherical in shape, and its one end has opening.
Shown in figure 1 and Fig. 3, devitrified glass lamp socket 200 is class conical shell, its one end has opening, so just increased devitrified glass lamp socket 200 and devitrified glass cell-shell 100 over against angle and area, be convenient to realize the multi-angle installation of LED chip 500, thereby increased light angle.The openend of devitrified glass lamp socket 200 is connected with the openend sintering of devitrified glass cell-shell 100, can reduce thermal resistance like this, is convenient to heat and is delivered to rapidly whole devitrified glass cell-shell 100 by devitrified glass lamp socket 200, is conducive to distributing of heat.
Shown in figure 1, lamp holder 300 is connected with devitrified glass lamp socket 200, is provided with drive circuit board 310 in it.
FPC circuit board 400 fits on devitrified glass lamp socket 200 by heat-conducting glue, and be electrically connected by wire with the drive circuit board 310 in lamp holder 300, accordingly, devitrified glass lamp socket 200 offers the through hole passing for wire, and wire seals through hole through after through hole with heat-conducting glue.
LED chip 500 is welded on FPC circuit board 400.In the present embodiment, LED chip 500 is vertical flip LED chips, is coated with fluorescent material on it.During production, LED chip 500 can adopt SMT technique to be welded on FPC circuit board 400, is conducive to enhance productivity.
The above; it is only the preferably specific embodiment of the utility model; but protection domain of the present utility model is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement, within all should being encompassed in protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain of claim.

Claims (3)

1. a high-heat-dispersion LED bulb lamp, is characterized in that, comprising:
Devitrified glass cell-shell, its spherical in shape and one end has opening;
Devitrified glass lamp socket, itself and described devitrified glass cell-shell are sintered to one;
Lamp holder, it is connected with described devitrified glass lamp socket;
FPC circuit board, it fits on described devitrified glass lamp socket by heat-conducting glue, and is electrically connected with described lamp holder;
One group of LED chip, it is welded on FPC circuit board.
2. a kind of high-heat-dispersion LED bulb lamp as claimed in claim 1, is characterized in that: described devitrified glass lamp socket is class conical shell, and its one end has opening, and the openend of described devitrified glass lamp socket is connected with the openend sintering of described devitrified glass cell-shell.
3. a kind of high-heat-dispersion LED bulb lamp as claimed in claim 2, is characterized in that: described LED chip is vertical flip LED chips, is coated with fluorescent material on it.
CN201420184785.8U 2014-04-16 2014-04-16 High-heat-dissipation LED bulb lamp Expired - Fee Related CN203771220U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420184785.8U CN203771220U (en) 2014-04-16 2014-04-16 High-heat-dissipation LED bulb lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420184785.8U CN203771220U (en) 2014-04-16 2014-04-16 High-heat-dissipation LED bulb lamp

Publications (1)

Publication Number Publication Date
CN203771220U true CN203771220U (en) 2014-08-13

Family

ID=51288410

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420184785.8U Expired - Fee Related CN203771220U (en) 2014-04-16 2014-04-16 High-heat-dissipation LED bulb lamp

Country Status (1)

Country Link
CN (1) CN203771220U (en)

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140813

CF01 Termination of patent right due to non-payment of annual fee