CN203732503U - Low-frequency ultrasonic transducer type array coupling detection device - Google Patents
Low-frequency ultrasonic transducer type array coupling detection device Download PDFInfo
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- CN203732503U CN203732503U CN201420015932.9U CN201420015932U CN203732503U CN 203732503 U CN203732503 U CN 203732503U CN 201420015932 U CN201420015932 U CN 201420015932U CN 203732503 U CN203732503 U CN 203732503U
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- 230000008878 coupling Effects 0.000 title claims abstract description 42
- 238000010168 coupling process Methods 0.000 title claims abstract description 42
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 42
- 238000001514 detection method Methods 0.000 title abstract description 24
- 239000000523 sample Substances 0.000 claims description 58
- 238000002604 ultrasonography Methods 0.000 claims description 19
- 238000003491 array Methods 0.000 claims description 11
- 235000012431 wafers Nutrition 0.000 abstract 7
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000009659 non-destructive testing Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
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- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
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Abstract
The utility model discloses a low-frequency ultrasonic transducer type array coupling detection device. The low-frequency ultrasonic transducer type array coupling detection device mainly comprises force measuring sensors, single-chip microcomputers and display devices, wherein each of ultrasonic transducer wafers is provided with the force measuring sensors, and the force measuring sensors are connected with the corresponding display devices through the single-chip microcomputers; when a transducer wafer array is arranged on a sample to be detected, the force measuring sensor on each wafer can sense the contact pressure between the wafer and the sample to be detected and then respectively displays the contact pressure on the display device corresponding to each wafer, and each display device can determine the contact state of the corresponding transducer wafer. With the adoption of the low-frequency ultrasonic transducer type array coupling detection device, the coupling state between each transducer wafer in an ultrasonic array and the sample to be detected can be quickly and clearly reflected; the device is applied to multi-channel and contact type ultrasonic detection, in particular applied to the multi-channel large ultrasonic array detection on the geotechnical engineering with the frequency band being 20-100kHz.
Description
Technical field
The utility model relates to a kind of low frequency ultrasound transducer array coupling pick-up unit, is applicable to the Ultrasonic Detection of hyperchannel, contact, and the large-scale supersonic array of hyperchannel that is particularly useful for the 20-100 KHz frequency range in Geotechnical Engineering detects.
Background technology
Ultrasonic Detection is one of method of industrial Non-Destructive Testing, and when ultrasound wave enters object and runs into defect, a part of sound wave can produce reflection, receiver can be analyzed reflection wave, just can extremely accurately measure defect, and can show position and the size of inherent vice, measure material thickness etc.Contact Ultrasonic Detection is conventional Ultrasonic Detection mode, it need to have the coupling of certain form between transducer and sample to be tested, the vibration of sample to be tested is delivered to transducer by coupling material, transducer senses vibration signal and is translated into electric signal, can obtain the stress wave signal of propagating through tested sample after analog to digital conversion.Conventionally adopt couplant or adopt water seaoning to realize the coupling between transducer and sample to be tested, and transducer is consistent with the coupling between sample to be tested, is the necessary condition of carrying out high-precision ultrasound detection.
Development along with ultrasonic detecting technology, there is at present a large amount of multichannel ultrasonic detection equipment, as TOFD reflectoscope, phased array ultrasonic detection instrument etc., these instruments generally adopt the ultrasonic transducer of multicast and even MIMO (Multiple-Input Multiple-Out-put) to carry out signals collecting, are particularly suitable for the Non-Destructive Testing of general a large amount of special-shaped complex components that exist in the industries such as Aeronautics and Astronautics, ground, weapons and nuclear industry.Wherein, the design of ultrasonic phased array transducer is based on Huygens' principle, transducer forms array by a plurality of separate piezoelectric chips, each wafer is called a unit, by certain rule and sequential electricity consumption subsystem controls, excite unit, make the ultrasound wave stack of each unit transmitting in array form a new wave front; Equally, in the receiving course of reflection wave, by the reception of certain rule and sequential control receiving element and to carry out signal synthetic, then will synthesize result and show with appropriate format.So, all energy is consistent with the coupling between sample to be tested just to require each ultrasonic transducer wafer, if the coupling of one of them ultrasonic transducer wafer is out of condition, can cause certain influence to the precision of testing result.
For how guaranteeing transducer and the consistent problem of coupling between sample to be tested; in medical science and industrial nondestructive testing; because the ultrasonic frequency that adopts is usually above 500 KHz; its piezoelectricity wafer is little, probe size is little, it is hand-held to be easy to; can guarantee by probe positions adjustment the consistance of coupling, as the ultrasonic phase array detection of human body B ultrasonic and weld seam etc.But, in Geotechnical Engineering field, the investigation depth requiring is large, the ultrasonic frequency adopting is low, the aperture of the low frequency phased array probe adopting is large, there is significant difference in each transducer wafer in array and the coupling state between tested sample surface, only depends on manual operation cannot learn which wafer and tested sample are coupled inconsistent, and then take to adjust accordingly measure.
To sum up, the coupling between the distributed probe of channel ultrasonic test request and tested sample is reliably consistent, and this is to carry out the precondition that high-precision low frequency ultrasound phased array detects.In Geotechnical Engineering detects, if attempt, use channel ultrasonic detection technique to improve the efficiency of Geotechnical Engineering Ultrasonic Detection, just need to develop the equipment that detects coupling state between interior each transducer wafer of low frequency phased array linear transducer array and sample to be tested.
Summary of the invention
For Geotechnical Engineering field channel ultrasonic, detect and need to realize the transducer problem consistent with coupling between sample to be tested, the utility model provides a kind of low frequency ultrasound transducer array coupling pick-up unit, by showing that contact between each ultrasonic transducer wafer and sample to be tested reflects the coupling state of the two in real time, to improve efficiency and the precision of Geotechnical Engineering Ultrasonic Detection.
While utilizing channel ultrasonic detection technique to carry out Geotechnical Engineering Ultrasonic Detection, when the conditions such as the flatness of surface of contact, coupling material, transducer performance are identical or close, the coupling state between each transducer wafer and tested sample depends on the contact of the two.According to above-mentioned principle, the utility model low frequency ultrasound transducer array coupling pick-up unit, comprise force cell, single-chip microcomputer and display device, by the monitoring to contact, can learn fast the coupling state of each transducer wafer of phased array supersonic probe.
Wherein: each force cell is arranged in the rear end of each ultrasonic transducer wafer of phased array probe, for responding to corresponding ultrasonic transducer wafer and the contact between tested sample.
In each force cell is equal, establish metering circuit.In general, sensor is comprised of sensitive element and conversion elements, but the electric weight of conversion elements output is usually difficult to directly show, record, process and control, at this moment just it further need to be varied to the electric signal that can directly utilize, and the part that completes this function in sensor is called metering circuit, also be the part that sensor forms, for the electric signal of contact that force cell is sensed, be converted into digital signal.
Each force cell is all electrically connected to single-chip microcomputer, for the digital signal of the contact transforming is inputted to single-chip microcomputer.Be the digital signal of the contact between each ultrasonic transducer wafer and tested sample, certainly distinguish the metering circuit input single-chip microcomputer of corresponding force cell.
Single-chip microcomputer is electrically connected to respectively each display device, and each display device and each force cell connect one to one, for showing the size of corresponding ultrasonic transducer wafer and tested sample Contact pressure.
In sum, corresponding one by one between ultrasonic transducer wafer, force cell and display device three, check for convenience, can be on three numbering corresponding to mark, and each force cell itself is located in the rear end of corresponding ultrasonic transducer wafer, therefore each force cell has adopted and position identical with ultrasonic transducer wafer corresponding arranged in arrays form one by one.Preferably, according to each ultrasound transducer array arrangement of phased array probe, display device also can adopt the arranged in arrays form identical with ultrasonic transducer wafer, and the position of the connected ultrasonic transducer wafer of each display device in array is identical, thereby judge more intuitively the coupling state between each ultrasonic transducer wafer of phased array probe and tested sample.
Phased array probe has three kinds of main array type: the one, and probe is by one group of linear (linear array) forming along axle wafer side by side, the 2nd, probe forms face shape (two-dimensional rectangle array) by one group of wafer of arranging along two axles, and the 3rd, annular, circle and the circular array such as fan-shaped.Wherein, linear or rectangular array is programmed easily, and expense is starkly lower than other types array, therefore preferred, the arranged in arrays form of ultrasonic transducer wafer is one dimensional linear array row or two-dimensional rectangle array.
Further, display device adopts at least one in pilot lamp, tensimeter, in single-chip microcomputer, can preset according to the program of contact judgement coupling state, by power or the color of light, or the size of pressure gauge reading characterizes the size of contact, to judge fast the coupling state between low frequency phased array probe and tested sample.
To sum up, while using channel ultrasonic detection technique, when transducer array is arranged on sample to be tested, force sensor on each transducer wafer can both sense the contact between each self-corresponding wafer and tested sample, this contact is presented in the display device that each transducer wafer is corresponding, by each display device indication, can judge the contact condition between corresponding transducer wafer and tested sample.Realized and quick and precisely reflected intuitively the ultrasonic transducer corresponding with each display device position and the coupling state between tested sample, for realizing fast low frequency ultrasound transducer array and consistent the giving security of coupling between tested sample, met and carried out the prerequisite that high-precision low frequency ultrasound phased array detects, be applicable to the Ultrasonic Detection of hyperchannel, contact, the large-scale ultrasonic phase array of hyperchannel that is particularly useful for the 20-100 KHz frequency range in Geotechnical Engineering detects.
Accompanying drawing explanation
Fig. 1 is that the utility model force cell is arranged schematic diagram;
Fig. 2 is electric theory diagram of the present utility model in embodiment;
Fig. 3 a is the arranged in arrays of One-dimension Phased Array ultrasonic transducer wafer in embodiment;
Fig. 3 b is that the one-dimensional array couple state pilot lamp corresponding with Fig. 3 a arranged;
Fig. 4 a is the arranged in arrays of two dimensional phased battle array ultrasonic transducer wafer in embodiment;
Fig. 4 b is that the two-dimensional array couple state pilot lamp corresponding with Fig. 4 a arranged;
Fig. 5 is the control flow chart of single-chip microcomputer in embodiment.
In figure: A, tested sample, H, ultrasonic transducer wafer, C, force cell, D, display device, P, contact.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As depicted in figs. 1 and 2, the utility model comprises force cell C, single-chip microcomputer and display device D; Each force cell C is arranged in each ultrasonic transducer wafer H rear end in phased array probe, for responding to corresponding ultrasonic transducer wafer H and the contact P between tested sample A; In each force cell C is equal, establish metering circuit, for the electric signal of the contact P of induction is converted into digital signal; Each force cell C is all electrically connected to single-chip microcomputer, for the digital signal of the contact P transforming is inputted to single-chip microcomputer; Single-chip microcomputer is electrically connected to respectively each display device D, and each display device D and each force cell C connect one to one, for showing the size of corresponding ultrasonic transducer wafer H and tested sample A Contact pressure P.
Corresponding one by one between ultrasonic transducer wafer H, force cell C and display device D three in the utility model, by force cell C, test each ultrasonic transducer wafer H of phased array probe and the contact P between tested sample A, and by single-chip microcomputer, judge the size of the two Contact pressure P; Again by the couple state of each ultrasonic transducer wafer H in the reflection probe with the display device D quicklook one to one of ultrasonic transducer wafer H array.While applying channel ultrasonic detection technique in Geotechnical Engineering, can first utilize the utility model to carry out ultrasound transducer array coupling and detect, then carry out subsequent operation.
When implementing coupling detection, first, according to the material of tested sample A and detection target, select quantity and the arrangement of ultrasonic transducer wafer H in phased array probe.As required, if the arranged in arrays form of ultrasonic transducer wafer H is elected one dimensional linear array row as, see Fig. 3 a, H
1-H
nrepresent each transducer wafer in ultrasonic probe, and subscript n represents the number that transducer wafer is arranged.If the arranged in arrays form of ultrasonic transducer wafer H is elected two-dimensional rectangle array as, see Fig. 4 a, H
11-H
mnall represent each transducer in ultrasonic probe, and subscript m represents transducer wafer line number, n represents the columns of transducer wafer.
Then, in each ultrasonic transducer wafer H rear end, arrange respectively a force cell C, corresponding one by one on connecting between each force cell C and each ultrasonic transducer wafer H, force cell C can respond to the contact P between tested sample A and corresponding ultrasonic transducer wafer H, sees Fig. 1.Each force cell C is all electrically connected to single-chip microcomputer, and single-chip microcomputer is electrically connected to respectively each display device D again, sees Fig. 2.Thus, each display device D is also corresponding one by one on connecting with each ultrasonic transducer wafer H by force cell C, and each display device D can reflect corresponding with it ultrasonic transducer wafer H and the contact P between tested sample A.
Secondly, distinguish for convenience and check, on ultrasonic transducer wafer H, having numbering separately, mark and the corresponding label of corresponding wafer on each display device D.During practical operation, also can be according to ultrasonic transducer wafer H arrangement in phased array probe, by identical and one-to-one relationship, by CDU coupling display unit D according to the numbering arranged in arrays of wafer on sample to be tested.See in Fig. 3 b D
1-D
nrepresent the display device D with the corresponding layout of ultrasound transducer array in Fig. 3 a; See in Fig. 4 b D
11-D
mnrepresent the display device D with the corresponding layout of ultrasound transducer array in Fig. 4 a.Hence one can see that, and display device D array is identical with ultrasonic transducer wafer H array, and have one group of display device D of annexation also identical with the position of wafer in array, is convenient to the coupling state of each wafer of judgement of simple, intuitive.
The connection of pick-up unit and arrange by above-mentioned ready after, in the situation that ultrasonic transducer wafer H arranged in arrays form is elected one dimensional linear array row as shown in Figure 3 a as, as shown in Figure 2 and Figure 5, force cell Ci(i=1 ~ n) by the contact P sensing
ibe converted to the metering circuit that electric signal is established in inputting respectively separately, by this metering circuit, carry out analog to digital conversion, by contact P
ielectric signal be converted into digital signal, then input single-chip microcomputer respectively.The contact P that force cell Ci senses
idifference to some extent, but can record a P
min~ P
maxzone of reasonableness, and charge to single-chip microcomputer.Single-chip microcomputer and detecting instrument can share a computing machine, but single-chip microcomputer and detecting instrument are separate, are only responsible for judgement couple state.
As shown in Figure 5, display device D can adopt tensimeter or/and status indicator lamp is arranged to one-dimensional array as shown in Figure 3 b, by each ultrasonic transducer wafer Hi(i=1 ~ n) couple state show simultaneously.If working pressure table, can intuitively read the ultrasonic transducer wafer Hi corresponding with tensimeter i and the contact P between tested sample A
i.If use status indicator lamp in default program, is set the value of contact P at P in single-chip microcomputer
min~ P
maxfor rationally, when contact P is not enough, reasonable, excessive, status indicator lamp is shown as respectively " blueness ", " green " and " redness ", by status indicator lamp array, gets final product each transducer wafer of demonstration of quicklook and the coupling state between tested sample A.If any some or a plurality of status indicator lamps, be shown as " redness " or " blueness ", show to be coupled between interior this ultrasonic transducer wafer Hi of array and tested sample A inconsistent, the adjustment of need popping one's head in; The status indicator lamp corresponding when each wafer is " green ", shows that between interior each ultrasonic transducer wafer Hi of array and tested sample A, coupling is good, can carry out testing by manual operation detecting instrument.
So far, realized by each display device D and quick and precisely reflected intuitively ultrasonic transducer wafer H that position is with it corresponding and the coupling state between tested sample A, and adjust in real time probe according to coupling situation, complete and carry out the element task that high-precision low frequency ultrasound phased array detects.
Claims (4)
1. a low frequency ultrasound transducer array coupling pick-up unit, is characterized in that, comprises force cell (C), single-chip microcomputer and display device (D); Each force cell (C) is arranged in each ultrasonic transducer wafer (H) rear end in phased array probe, in each force cell (C) is equal, establish metering circuit, each force cell (C) is all electrically connected to single-chip microcomputer, single-chip microcomputer is electrically connected to respectively each display device (D), and each display device (D) connects one to one with each force cell (C).
2. a kind of low frequency ultrasound transducer array coupling pick-up unit according to claim 1, it is characterized in that, described display device (D) adopts the arranged in arrays form identical with ultrasonic transducer wafer (H), and the position of each display device (D) ultrasonic transducer wafer (H) corresponding with it in array is identical.
3. a kind of low frequency ultrasound transducer array coupling pick-up unit according to claim 2, is characterized in that, the arranged in arrays form of described ultrasonic transducer wafer (H) is one dimensional linear array row or two-dimensional rectangle array.
4. according to a kind of low frequency ultrasound transducer array coupling pick-up unit described in claims 1 to 3 any one claim, it is characterized in that, described display device (D) adopts at least one in pilot lamp, tensimeter.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420015932.9U CN203732503U (en) | 2014-01-10 | 2014-01-10 | Low-frequency ultrasonic transducer type array coupling detection device |
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| CN201420015932.9U CN203732503U (en) | 2014-01-10 | 2014-01-10 | Low-frequency ultrasonic transducer type array coupling detection device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103743817A (en) * | 2014-01-10 | 2014-04-23 | 中国矿业大学 | Low-frequency ultrasonic transducer array coupling detection device |
| CN112098518A (en) * | 2020-09-30 | 2020-12-18 | 吉林大学 | High-resolution dislocation array ultrasonic B/C scanning detection device and method |
-
2014
- 2014-01-10 CN CN201420015932.9U patent/CN203732503U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103743817A (en) * | 2014-01-10 | 2014-04-23 | 中国矿业大学 | Low-frequency ultrasonic transducer array coupling detection device |
| CN103743817B (en) * | 2014-01-10 | 2017-06-09 | 中国矿业大学 | A kind of low frequency ultrasound transducer array couples detection means |
| CN112098518A (en) * | 2020-09-30 | 2020-12-18 | 吉林大学 | High-resolution dislocation array ultrasonic B/C scanning detection device and method |
| CN112098518B (en) * | 2020-09-30 | 2021-08-31 | 吉林大学 | High-resolution dislocation array ultrasonic B/C scanning detection device and method |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20150110 |
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| EXPY | Termination of patent right or utility model |