CN203721203U - Test device capable of testing flash memory bonding effect - Google Patents
Test device capable of testing flash memory bonding effect Download PDFInfo
- Publication number
- CN203721203U CN203721203U CN201420058240.2U CN201420058240U CN203721203U CN 203721203 U CN203721203 U CN 203721203U CN 201420058240 U CN201420058240 U CN 201420058240U CN 203721203 U CN203721203 U CN 203721203U
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- test
- flash memory
- bonding
- plate
- flash cell
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- 238000012360 testing method Methods 0.000 title claims abstract description 96
- 230000000694 effects Effects 0.000 title claims abstract description 28
- 239000000523 sample Substances 0.000 claims abstract description 14
- 238000009434 installation Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 15
- 238000005538 encapsulation Methods 0.000 claims description 11
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000013519 translation Methods 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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Abstract
The utility model discloses a test device capable of testing a flash memory bonding effect, which is used for testing a flash memory unit splicing plate consisting of at least one bonding flash memory unit formed after bonding treatment. The test device comprises a test box, a fixed bracket, a movable rod, an end port unit printing circuit support plate, a unit control test circuit board, a supporting rod, a positioning plate and a double-sided balance cover plate. The end unit printing circuit support plate is equipped with at least one probe; during a test, the double-sided balance cover plate moves downwards to press the tested flash memory unit splicing plate to move downwards, so that the probe of the end unit printing circuit support plate electrically contacts with the flash memory unit splicing plate, and therefore, test is carried out onto each bonding flash memory unit by the unit control test circuit board. After the flash memory unit completes the bonding process, the test device disclosed by the utility model can immediately test the bonding flash memory unit, so that a bonding effect can be reliably confirmed, follow-up process is not carried out onto a product with bonding effect not reaching standards, and therefore, apparatus waste is reduced, and product manufacturing cost is lowered.
Description
Technical field
The utility model relates to product or half-finished proving installation, particularly relates to the half-finished proving installation of flash memory products or flash memory.
Background technology
Prior art is for the flash memory products of miniature storage, the secure digital memory card Secure Digital Memory Card that is for example called for short SD card, mostly to experience bonding process, being about to wafer device is welded on circuit board, formed the flash cell match board of a plurality of bonding flash cells integrated, again each bonding flash cell is encapsulated, and make flash memory finished product after flash cell match board is cut.Prior art para-linkage effect, whether wafer is correct with being electrically connected to of circuit board, and whether welding does not reliably have detection method, only has with the simple directly perceived the simplest judgement of observational technique, causes and under para-linkage effect unknown state, just carries out subsequent technique.For the bad flash cell of bonding effect, only when finished product detection, could judge, now can only adopt completely written-off processing to finished product, cause device waste, the problem that cost of goods manifactured improves.
Utility model content
The technical problems to be solved in the utility model is to avoid the deficiencies in the prior art part and proposes a kind of proving installation that can test flash memory bonding effect, before encapsulation, can para-linkage effect test reliably, reduces device waste, reduces manufacturing cost.
The utility model solve the technical problem can be by realizing by the following technical solutions:
Design, manufacture a kind of proving installation that can test flash memory bonding effect, for the flash cell match board consisting of at least one bonding flash cell forming after bonding is processed is implemented to test, comprise test box, be arranged on the fixed support on this test box, and be arranged on fixed support, can be driven and the carriage release lever of shift reciprocately vertically.Especially, described test box comprises the upper cover that is flatly arranged on this test box top.On the end face of this upper cover, be provided with port unit printed wire support plate.In described test box, be provided with for testing the unit controls testing circuit board of bonding effect.Described port unit printed wire support plate is provided with at least one group of flash memory test port unit, and with the test port of each corresponding setting in flash memory test port unit.Each flash memory test port unit be provided with protrude upward port unit printed wire support plate, for being electrically connected at least one probe of contact of the bonding flash cell of tested flash cell match board, the probe that belongs to same flash memory test port unit is electrically connected to the test port to should flash memory test cell.By test port, described port unit printed wire support plate is electrically connected to unit controls testing circuit board.Cover that be also provided with can at least one support bar elastic reset, vertically up and down reciprocatingly displacement on described.On this support bar, location-plate is installed.On described location-plate, be provided with positioning through hole, when location-plate is with support bar during to bottom offset, each probe of described port unit printed wire support plate stretches out location-plate by positioning through hole.In the lower end of described carriage release lever, two plane balancing cover plate is installed, when tested flash cell match board is positioningly placed on location-plate, described two plane balancing cover plate with driven carriage release lever to bottom offset, press described flash cell match board and move down and make the probe of port unit printed wire support plate electrically contact the contact of each bonding flash cell in flash cell match board, thus by unit controls testing circuit board to each bonding flash cell examinations.
Particularly, described proving installation also comprises for the manual drives carriage release lever handle of shift reciprocately vertically.
In addition, described proving installation also comprises the guide rod of vertical setting, and the substrate that is arranged on described carriage release lever lower end, and described two plane balancing cover plate is removably mounted on substrate.Described guide rod is by embedding ball bearing in described substrate through substrate, thereby makes the substrate can be with carriage release lever along vertically back and forth translation of guide rod.
Particularly, at described unit controls testing circuit board, be provided with the connectivity port corresponding with test port on port unit printed wire support plate, by the winding displacement that is electrically connected to test port and connectivity port, realize unit controls testing circuit board and be electrically connected to port unit printed wire support plate.
For finished product and semi-manufacture all being implemented to bonding effect test, described two plane balancing cover plate comprises base plate, the groove of offering on the front of base plate, with and the stiffened edge of the wall of two ends connecting groove.When tested flash cell match board is not during encapsulation state, facing down of described base plate is arranged on carriage release lever.When tested flash cell match board is encapsulation state, the back side of described base plate is arranged on carriage release lever downwards.
Compared with the existing technology, the technique effect of the utility model proving installation of test flash memory bonding effect " can " is:
At flash cell, complete after bonding process, just can test by para-linkage flash cell, confirm reliably bonding effect, para-linkage effect product not up to standard no longer carries out subsequent technique at once, thereby reduces device waste, reduces cost of goods manifactured.
Accompanying drawing explanation
Fig. 1 is the axonometric projection schematic diagram of the utility model proving installation of test flash memory bonding effect " can " preferred embodiment;
Fig. 2 is the orthogonal projection schematic top plan view of the location-plate 4 of described preferred embodiment;
Fig. 3 is the orthogonal projection schematic top plan view of the port unit printed wire support plate 18 of described preferred embodiment;
Fig. 4 is the orthogonal projection schematic top plan view of the two plane balancing cover plate 8 of described preferred embodiment;
Fig. 5 is the orthogonal projection schematic top plan view of the flash cell match board 7 of described preferred embodiment;
Fig. 6 is the orthogonal projection schematic top plan view of the unit controls testing circuit board 5 of described preferred embodiment.
Embodiment
Below in conjunction with accompanying drawing illustrated embodiment, be described in further detail.
The utility model proposes a kind of proving installation that can test flash memory bonding effect, as shown in Figures 1 to 6, for the flash cell match board being formed by least one bonding flash cell 71 7 to forming, implement test after bonding is processed, comprise test box 9, be arranged on the fixed support 1 on this test box 9, and be arranged on fixed support 1, can carriage release lever 2 driven and vertically shift reciprocately.Especially, described test box 9 comprises the upper cover 11 that is flatly arranged on these test box 9 tops.On the end face of this upper cover 11, be provided with port unit printed wire support plate 4.In described test box 9, be provided with for testing the unit controls testing circuit board 5 of bonding effect.Described port unit printed wire support plate 18 is provided with at least one group of flash memory test port unit 17, and with the test port 16 of each flash memory test port unit 17 corresponding settings.Each flash memory test port unit 17 be provided with protrude upward port unit printed wire support plate 18, for being electrically connected at least one probe 6 of contact of the bonding flash cell 71 of tested flash cell match board 7, the probe 6 that belongs to same flash memory test port unit 17 is electrically connected to the test port 16 to should flash memory test cell 17.By test port 16, described port unit printed wire support plate 18 is electrically connected to unit controls testing circuit board 5.On described upper cover 11, being also provided with can at least one support bar 12 elastic reset, vertically up and down reciprocatingly displacement.On this support bar 12, location-plate 4 is installed.On described location-plate 4, be provided with positioning through hole 41, when location-plate 4 is with support bar during to bottom offset, each probe 6 of described port unit printed wire support plate 18 stretches out location-plate 4 by positioning through hole 41.In the lower end of described carriage release lever 2, two plane balancing cover plate 8 is installed, when tested flash cell match board is positioningly placed on location-plate 4, described two plane balancing cover plate 8 with driven carriage release lever 2 to bottom offset, press described flash cell match board 7 and move down and make the probe 6 of port unit printed wire support plate 18 electrically contact the contact of each bonding flash cell 71 in flash cell match board 7, thereby by 5 pairs of each bonding flash cell 71 examinations of unit controls testing circuit board.Described flash cell match board 7 is on a circuit board, by welding, respectively to organize wafer to form each bonding flash cell 71, flash cell match board 7 through bonding also needs to make flash memory semi-manufacture through packaging technology, and these semi-manufacture become flash memory finished product again after cutting.So described flash cell match board 7 comprises not encapsulation state and encapsulation state.Described location-plate 4 plays the function of support and location flash cell match board 7, and location-plate 4 is realized location by pin position 12.The elastic reset structure of described support bar 12 can prevent that the contact of bonding flash cell 71 is scratched, and buffering two plane balancing cover plate 8 downforce.
The utility model preferred embodiment, as shown in Figure 1, described proving installation also comprises for manual drives carriage release lever 2 handle 21 of shift reciprocately vertically.The utility model relates to take the test of storage component part of the encapsulation such as Micron SD, UDP that flash media is storer, LGA, EMMC.
In order to ensure pressing down steadily, and the two-sided functional of performance two plane balancing cover plate 8, the utility model preferred embodiment, as shown in Figure 1, described proving installation also comprises the guide rod 15 of vertical setting, and the substrate 22 that is arranged on described carriage release lever 2 lower ends, described two plane balancing cover plate 8 is removably mounted on substrate 22.Described guide rod 15 is by embedding ball bearing in described substrate 22 through substrate 22, thereby makes the substrate 22 can be with carriage release lever 2 along vertically back and forth translation of guide rod 15.
The utility model preferred embodiment, as shown in Figure 3 and Figure 6, at described unit controls testing circuit board 5, be provided with the connectivity port 30 corresponding with test port 16 on port unit printed wire support plate 4, by the winding displacement that is electrically connected to test port 16 and connectivity port 30, realize unit controls testing circuit board 5 and be electrically connected to port unit printed wire support plate 4.
For finished product and semi-manufacture are all implemented to bonding effect test, the utility model preferred embodiment, as shown in Figure 4, described two plane balancing cover plate 8 comprises base plate 81, the groove 13 of offering on the front of base plate 81, with and the stiffened edge 14 of the wall of two ends connecting groove 13.When tested flash cell match board 7 is not during encapsulation state, facing down of described base plate 81 is arranged on carriage release lever 2, at two plane balancing cover plate 81, with the downward translation of carriage release lever 2, be pressed onto after flash cell match board 7, described groove 13 can be avoided the front of base plate 81, be the not bonding flash cell 71 of encapsulation of A face contact, and stiffened edge 14 play the effect of structural strengthening.When tested flash cell match board 7 is encapsulation state, the back side of described base plate 81 is arranged on downwards on carriage release lever 2, at two plane balancing cover plate 81, with the downward translation of carriage release lever 2, be pressed onto after flash cell match board 7, the back side of described base plate 81, be the bonding flash cell 71 that the contact of B face has encapsulated, to guarantee each bonding flash cell 71 to apply the pressure of balance.
Claims (5)
- One kind can test flash memory bonding effect proving installation, for the flash cell match board (7) consisting of at least one bonding flash cell (71) forming after bonding is processed is implemented to test, comprise test box (9), be arranged on the fixed support (1) on this test box (9), and be arranged on fixed support (1) upper, can carriage release lever driven and vertically shift reciprocately (2); It is characterized in that:Described test box (9) comprises the upper cover (11) that is flatly arranged on this test box (9) top; On the end face of this upper cover (11), be provided with port unit printed wire support plate (4); In described test box (9), be provided with for testing the unit controls testing circuit board (5) of bonding effect;Described port unit printed wire support plate (18) is provided with at least one group of flash memory test port unit (17), and with the test port (16) of each corresponding setting in flash memory test port unit (17); Each flash memory test port unit (17) be provided with protrude upward port unit printed wire support plate (18), for being electrically connected at least one probe (6) of contact of the bonding flash cell (71) of tested flash cell match board (7), the probe (6) that belongs to same flash memory test port unit (17) is electrically connected to the test port (16) to should flash memory test cell (17); By test port (16), described port unit printed wire support plate (18) is electrically connected to unit controls testing circuit board (5);On described upper cover (11), being also provided with can at least one support bar (12) elastic reset, vertically up and down reciprocatingly displacement; Location-plate (4) is installed on this support bar (12); On described location-plate (4), be provided with positioning through hole (41), when location-plate (4) is with support bar during to bottom offset, each probe (6) of described port unit printed wire support plate (18) stretches out location-plate (4) by positioning through hole (41);In the lower end of described carriage release lever (2), two plane balancing cover plate (8) is installed, when tested flash cell match board is positioningly placed on location-plate (4), described two plane balancing cover plate (8) with driven carriage release lever (2) to bottom offset, press described flash cell match board (7) and move down and make the probe (6) of port unit printed wire support plate (18) to electrically contact the contact of upper each bonding flash cell (71) of flash cell match board (7), thus by unit controls testing circuit board (5) to each bonding flash cell (71) examinations.
- 2. proving installation that can test flash memory bonding effect according to claim 1, is characterized in that:Also comprise for manual drives carriage release lever (2) handle of shift reciprocately (21) vertically.
- 3. proving installation that can test flash memory bonding effect according to claim 1, is characterized in that:Also comprise the guide rod (15) of vertical setting, and the substrate (22) that is arranged on described carriage release lever (2) lower end, described two plane balancing cover plate (8) is removably mounted on substrate (22);Described guide rod (15) is by embedding ball bearing in described substrate (22) through substrate (22), thereby makes the substrate (22) can be with carriage release lever (2) along vertically back and forth translation of guide rod (15).
- 4. proving installation that can test flash memory bonding effect according to claim 1, is characterized in that:At described unit controls testing circuit board (5), be provided with the connectivity port (30) corresponding with test port (16) on port unit printed wire support plate (4), by the winding displacement that is electrically connected to test port (16) and connectivity port (30), realize unit controls testing circuit board (5) and be electrically connected to port unit printed wire support plate (4).
- 5. proving installation that can test flash memory bonding effect according to claim 1, is characterized in that:Described two plane balancing cover plate (8) comprises base plate (81), the groove of offering on the front of base plate (81) (13), with and the stiffened edge (14) of the wall of two ends connecting groove (13);When tested flash cell match board (7) is not during encapsulation state, facing down of described base plate (81) is arranged on carriage release lever (2); When tested flash cell match board (7) is encapsulation state, the back side of described base plate (81) is arranged on downwards on carriage release lever (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420058240.2U CN203721203U (en) | 2014-01-30 | 2014-01-30 | Test device capable of testing flash memory bonding effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420058240.2U CN203721203U (en) | 2014-01-30 | 2014-01-30 | Test device capable of testing flash memory bonding effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203721203U true CN203721203U (en) | 2014-07-16 |
Family
ID=51160340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420058240.2U Expired - Lifetime CN203721203U (en) | 2014-01-30 | 2014-01-30 | Test device capable of testing flash memory bonding effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203721203U (en) |
-
2014
- 2014-01-30 CN CN201420058240.2U patent/CN203721203U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210712 Address after: 221000 workshop D1, fenghuangwan Electronic Information Industrial Park, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Jiangsu Jingkai Semiconductor Technology Co.,Ltd. Address before: 518000 Guangdong province Shenzhen Hongfa Technology Park G Baoan District Shiyan town building 4 floor Patentee before: SHENZHEN CITY GCAI ELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140716 |
|
| CX01 | Expiry of patent term |