CN203704441U - Semiconductor refrigerating and heating device - Google Patents
Semiconductor refrigerating and heating device Download PDFInfo
- Publication number
- CN203704441U CN203704441U CN201420095287.6U CN201420095287U CN203704441U CN 203704441 U CN203704441 U CN 203704441U CN 201420095287 U CN201420095287 U CN 201420095287U CN 203704441 U CN203704441 U CN 203704441U
- Authority
- CN
- China
- Prior art keywords
- heat exchanger
- exchanger plates
- heating
- chilling plate
- semiconductor refrigerating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 74
- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000005057 refrigeration Methods 0.000 claims description 55
- 238000001816 cooling Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 6
- 235000012149 noodles Nutrition 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 13
- 238000006243 chemical reaction Methods 0.000 abstract description 10
- 239000002699 waste material Substances 0.000 abstract description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 239000012295 chemical reaction liquid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a semiconductor refrigerating and heating device which comprises a refrigerating heat exchange plate (2), a heating heat exchange plate (5) and a semiconductor refrigerating piece (4) arranged between the refrigerating heat exchange plate (2) and a heating heat exchange plate (5). The cold side of the semiconductor refrigerating piece (4) right faces the refrigerating heat exchange plate (2), the hot side of the semiconductor refrigerating piece (4) right faces the heating heat exchange plate (5), heat exchange pipes are arranged in the refrigerating heat exchange plate (2) and the heating heat exchange plate (5), and openings of the heat exchange pipes in the two plates are located in the lateral walls of the two plates respectively. By means of the structure, the semiconductor refrigerating and heating device is simple in integral structure, convenient to achieve and low in cost. When the device is applied, heat produced by the hot side of the refrigerating piece (4) is used for heating liquid of a heating reaction disc, energy is effectively utilized while the semiconductor refrigerating piece (4) is cooled, and resource waste is avoided.
Description
Technical field
The utility model relates to for the auxiliary equipment on Biochemical Analyzer, specifically a kind of semiconductor refrigerating heater.
Background technology
Refrigeration on Biochemical Analyzer is mainly carried out refrigeration refrigerant by semiconductor device at present, then by pump, the refrigerant after refrigeration is passed into reagent disc and sample disk, and refrigerant is circulated in system, realizes and continues refrigeration.Semiconductor cooling device core is semiconductor chilling plate, the cold one side heat of one side when its work, huyashi-chuuka (cold chinese-style noodles) hot side in refrigeration refrigerant can produce a large amount of heat (be generally refrigerating capacity 3 times), for semiconductor chilling plate can normally be worked, must dispel the heat to its hot side.At present, main by heat being rejected heat in air in the mode of semiconductor chilling plate hot side side installation of heat radiator and fan, the heat that semiconductor chilling plate hot side distributes could not be utilized effectively, and causes ample resources waste.In Biochemical Analyzer when work reaction tray, sample and reagent need be heated to 37 DEG C and just can carry out effecting reaction, adopt at present heating water bath mode to heat reaction liquid, it mainly heats after pure water by resistance heating wire, conduct heat to reaction cup by the pure water after heating, and then reaction liquid is heated, adopt reaction liquid in existing mode of heating heating reaction tray, heater complex structure, energy consumption is high.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of semiconductor refrigerating heater is provided, and it is simple in structure, be convenient to manufacture, cost is low, adopts the heat of semiconductor chilling plate hot side generation for the heating of reaction tray when its application, can reduce energy consumption, avoid the wasting of resources.
The technical scheme in the invention for solving the above technical problem is: a kind of semiconductor refrigerating heater, comprise refrigeration heat exchanger plates, heating heat exchanger plates and be located at refrigeration heat exchanger plates and heat the semiconductor chilling plate between heat exchanger plates, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate is just to refrigeration heat exchanger plates, its hot side is just to heating heat exchanger plates, described refrigeration heat exchanger plates and heating heat exchanger plates inside are equipped with heat exchanger tube, and the opening of both internal heat exchange tubes lays respectively on sidewall separately.When the utility model application, semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) is to refrigeration heat exchanger tube refrigeration, its hot side is to the heating of heating heat exchanger plates, need refrigeration liquid flow through refrigeration heat exchanger plates inside heat exchanger tube after temperature reduce, realize the liquid refrigerating to need refrigeration, after the liquid that need heat flows through heating heat exchanger plates, temperature raises, realize the heating liquid to need heating, in heating heat exchanger plates internal heat exchange tubes under the heat exchange effect of liquid, semiconductor chilling plate hot side is cooling, and in heating heat exchanger plates internal heat exchange tubes, the liquid of heating is for the heating of reaction tray.
Further, between described refrigeration heat exchanger plates and heating heat exchanger plates, be provided with cooling piece location-plate, described cooling piece location-plate forms locating hole, the both ends open of locating hole lays respectively at cooling piece location-plate just in the both ends of the surface of refrigeration heat exchanger plates and heating heat exchanger plates, and described semiconductor chilling plate is located in locating hole.
Further, described refrigeration heat exchanger plates and heating heat exchanger plates just form the projection corresponding with semiconductor chilling plate position to the equal evagination of the end face of semiconductor chilling plate, and both projections all embed in locating hole and contact with semiconductor chilling plate.So, refrigeration heat exchanger plates of the present utility model all directly contacts with semiconductor chilling plate with heating heat exchanger plates, can improve energy transfer efficiency.
In order to reduce the loss of cooling piece location-plate to energy, further, described cooling piece location-plate adopts heat-insulating heat-preserving material to make.
In order to improve refrigeration of the present utility model and heat exchange efficiency, further, the quantity of described semiconductor chilling plate is multi-disc.
Further, the equal bending of heat exchanger tube of described refrigeration heat exchanger plates and heating heat exchanger plates inside forms wavy structure.So, the utility model can increase the interior heat exchanger tube of the heat exchanger plates that freezes and the contact area of heat exchanger plates of freezing, and can increase the contact area of the interior heat exchanger tube of heating heat exchanger plates and heating heat exchanger plates, can further improve energy transfer efficiency.
Further, the opening of the heat exchanger tube of described refrigeration heat exchanger plates and heating heat exchanger plates inside is all connected with adapter.When the utility model application, can pass through adapter external pipe, so, simple operation when external pipe.
Further, a kind of semiconductor refrigerating heater, also comprises casing and case lid, described casing one end opening, and case lid is connected with casing and the opening of closed box, and described refrigeration heat exchanger plates, semiconductor chilling plate and heating heat exchanger plates are all located in casing.Refrigeration heat exchanger plates of the present utility model, semiconductor chilling plate and heating heat exchanger plates are all located in casing, can reduce the circulation of energy between the utility model and the external world in the casing of sealing, can reduce energy loss.
In order further to reduce the utility model and extraneous energy transmission, described casing and case lid all adopt heat-insulating heat-preserving material to make.
In sum, the utlity model has following beneficial effect: the utility model comprises refrigeration heat exchanger plates, heating heat exchanger plates and semiconductor chilling plate, wherein, semiconductor chilling plate is located between refrigeration heat exchanger plates and heating heat exchanger plates, refrigeration heat exchanger plates and heating heat exchanger plates inside are equipped with heat exchanger tube, the utility model overall structure is simple, be convenient to realize, cost is low, when the utility model application, the heat exchanger tube of refrigeration heat exchanger plates and heating heat exchanger plates inside all has liquid communication, the energy that semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) produces freezes to refrigeration heat exchanger plates, and then to the liquid refrigerating in refrigeration heat exchanger plates internal heat exchange tubes, liquid after refrigeration passes into reagent disc and sample disk, the energy that semiconductor chilling plate hot side produces heats heating heat exchanger plates, heating heat exchanger plates after heating is to the heating liquid in the heat exchanger tube of heating heat exchanger plates inside, the utility model is cooling to semiconductor chilling plate hot side under to the heat exchange effect of semiconductor chilling plate hot side at heating heat exchanger plates, liquid in the heat exchanger tube of heating heat exchanger plates inside after heating is for the heating of reaction tray, can reach effective utilization of resource, avoid the wasting of resources.
Brief description of the drawings
Fig. 1 is the structural representation of a specific embodiment of the utility model;
Fig. 2 is the decomposition texture schematic diagram of Fig. 1;
Fig. 3 be in Fig. 1, freeze heat exchanger plates or heating heat exchanger plates sectional structure schematic diagram.
In accompanying drawing, the corresponding name of Reference numeral is called: 1, case lid, 2, refrigeration heat exchanger plates, 3, cooling piece location-plate, 4, semiconductor chilling plate, 5, heating heat exchanger plates, 6, casing.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the utility model is done to detailed description further, but embodiment of the present utility model is not limited to this.
Embodiment 1:
As shown in Figures 1 and 2, a kind of semiconductor refrigerating heater, comprise refrigeration heat exchanger plates 2, heating heat exchanger plates 5 and polylith semiconductor chilling plate 4, wherein, semiconductor chilling plate 4 is located between refrigeration heat exchanger plates 2 and heating heat exchanger plates 5, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 4 is just to refrigeration heat exchanger plates 2, and its hot side is just to heating heat exchanger plates 5.Refrigeration heat exchanger plates 2 and heating heat exchanger plates 5 both inside are equipped with heat exchanger tube, and the opening of both internal heat exchange tubes lays respectively on sidewall separately.For heat exchanger tube when application that makes the present embodiment is convenient to external pipe, the opening of the heat exchanger tube of refrigeration heat exchanger plates 2 and heating heat exchanger plates 5 both inside is all connected with adapter.During for fear of heat exchanger tube external pipe, affect the energy transmission of semiconductor chilling plate 4, the both ends open of refrigeration heat exchanger plates 2 is all preferably placed at it just on any sidewall outside semiconductor chilling plate 4 sidewalls, and the both ends open of heating heat exchanger plates 5 is all preferably placed at it just on any sidewall outside semiconductor chilling plate 4 sidewalls.
When the present embodiment application, liquid circulates in the heat exchanger tube of refrigeration heat exchanger plates 2 and heating heat exchanger plates 5 both inside, semiconductor chilling plate 4 freezes to refrigeration heat exchanger plates 2, and heating heat exchanger plates 5 is heated, under the effect of transmitting in heat, refrigeration heat exchanger plates 2 inside heat exchanger tube in fluid temperature reduce and for sample disc and reagent disc, heating heat exchanger plates 5 inside heat exchanger tube in fluid temperature raise and for reaction tray.
Embodiment 2:
The present embodiment has been made following further restriction on the basis of embodiment 1: between the refrigeration heat exchanger plates 2 of the present embodiment and heating heat exchanger plates 5, be provided with cooling piece location-plate 3, wherein, cooling piece location-plate 3 adopts heat-insulating heat-preserving material to make, and the cooling piece location-plate 3 of the present embodiment preferably adopts one-level joy, and this forms with foamed cotton is bonding.Cooling piece location-plate 3 forms locating hole, locating hole is identical with the quantity of semiconductor chilling plate 4, the both ends open of locating hole lays respectively at cooling piece location-plate 3 just in the both ends of the surface of refrigeration heat exchanger plates 2 and heating heat exchanger plates 5, and semiconductor chilling plate 4 is located in locating hole one to one.Both just form multiple, projections that quantity identical corresponding with semiconductor chilling plate 4 positions to the equal evagination of the end face of semiconductor chilling plate 4 refrigeration heat exchanger plates 2 and heating heat exchanger plates 5, and it is interior and contact with semiconductor chilling plate 4 that both projections all embed locating hole.
Embodiment 3:
The present embodiment has been made following further restriction on the basis of embodiment 1 or embodiment 2: in order to strengthen the heat exchange area of heat exchanger plates and heat exchanger tube, the equal bending of heat exchanger tube of the refrigeration heat exchanger plates 2 of the present embodiment and heating heat exchanger plates 5 both inside forms wavy structure.
Embodiment 4:
On the basis of the present embodiment any one embodiment in embodiment 1～embodiment 3, make following further restriction: the present embodiment also comprises casing 6 and case lid 1, wherein, casing 6 and case lid 1 all adopt heat-insulating heat-preserving material to make, and this forms the casing 6 of the present embodiment and the preferred employing one-level of case lid 1 joy with foamed cotton is bonding.Casing 6 one end openings, case lid 1 is connected with casing 6 and the opening of closed box 6, and refrigeration heat exchanger plates 2, semiconductor chilling plate 4 and heating heat exchanger plates 5 are all located in casing 6.Wherein, the conversion head being connected with heat exchanger tube is through casing 6.The present embodiment is in the time being provided with cooling piece location-plate 3, and cooling piece location-plate 3 is also located in casing 6.
As mentioned above, can realize preferably the utility model.
Claims (9)
1. a semiconductor refrigerating heater, it is characterized in that, comprise refrigeration heat exchanger plates (2), heating heat exchanger plates (5) and be located at refrigeration heat exchanger plates (2) and heat the semiconductor chilling plate (4) between heat exchanger plates (5), the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate (4) is just to refrigeration heat exchanger plates (2), its hot side is just to heating heat exchanger plates (5), described refrigeration heat exchanger plates (2) and heating both inside of heat exchanger plates (5) are equipped with heat exchanger tube, and the opening of both internal heat exchange tubes lays respectively on sidewall separately.
2. a kind of semiconductor refrigerating heater according to claim 1, it is characterized in that, between described refrigeration heat exchanger plates (2) and heating heat exchanger plates (5), be provided with cooling piece location-plate (3), described cooling piece location-plate (3) forms locating hole, the both ends open of locating hole lays respectively at cooling piece location-plate (3) just in the both ends of the surface of refrigeration heat exchanger plates (2) and heating heat exchanger plates (5), and described semiconductor chilling plate (4) is located in locating hole.
3. a kind of semiconductor refrigerating heater according to claim 2, it is characterized in that, both just form the projection corresponding with semiconductor chilling plate (4) position to the equal evagination of the end face of semiconductor chilling plate (4) described refrigeration heat exchanger plates (2) and heating heat exchanger plates (5), and both projections all embed in locating hole and contact with semiconductor chilling plate (4).
4. a kind of semiconductor refrigerating heater according to claim 2, is characterized in that, described cooling piece location-plate (3) adopts heat-insulating heat-preserving material to make.
5. a kind of semiconductor refrigerating heater according to claim 1, is characterized in that, the quantity of described semiconductor chilling plate (4) is multi-disc.
6. a kind of semiconductor refrigerating heater according to claim 1, is characterized in that, the equal bending of heat exchanger tube of described refrigeration heat exchanger plates (2) and heating both inside of heat exchanger plates (5) forms wavy structure.
7. a kind of semiconductor refrigerating heater according to claim 1, is characterized in that, the opening of the heat exchanger tube of described refrigeration heat exchanger plates (2) and heating both inside of heat exchanger plates (5) is all connected with adapter.
8. according to a kind of semiconductor refrigerating heater described in any one in claim 1～7, it is characterized in that, also comprise casing (6) and case lid (1), described casing (6) one end openings, case lid (1) is connected with casing (6) and the opening of closed box (6), and described refrigeration heat exchanger plates (2), semiconductor chilling plate (4) and heating heat exchanger plates (5) are all located in casing (6).
9. a kind of semiconductor refrigerating heater according to claim 8, is characterized in that, described casing (6) and case lid (1) all adopt heat-insulating heat-preserving material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420095287.6U CN203704441U (en) | 2014-03-04 | 2014-03-04 | Semiconductor refrigerating and heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420095287.6U CN203704441U (en) | 2014-03-04 | 2014-03-04 | Semiconductor refrigerating and heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203704441U true CN203704441U (en) | 2014-07-09 |
Family
ID=51054867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420095287.6U Expired - Lifetime CN203704441U (en) | 2014-03-04 | 2014-03-04 | Semiconductor refrigerating and heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203704441U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104859958A (en) * | 2015-04-16 | 2015-08-26 | 华南农业大学 | Double-working-condition semiconductor refrigeration type fruit and vegetable distribution box and control method thereof |
| CN108738281A (en) * | 2018-05-31 | 2018-11-02 | 四川斐讯信息技术有限公司 | A kind of enhancing radiator and control method |
| CN108981227A (en) * | 2017-06-05 | 2018-12-11 | 深圳迈瑞生物医疗电子股份有限公司 | Temperature of reagent controls equipment and sample analyser |
| CN109184007A (en) * | 2018-08-30 | 2019-01-11 | 绿点建筑科技（广州）有限公司 | A kind of building heat preservation structure |
| CN109536211A (en) * | 2018-12-25 | 2019-03-29 | 华中科技大学 | Based on the asymmetric tar cooling-collecting device for leading warm runner |
| CN109976415A (en) * | 2017-12-27 | 2019-07-05 | 中国科学院长春光学精密机械与物理研究所 | A kind of temperature range control system of infrared optical system |
| CN111227390A (en) * | 2020-04-02 | 2020-06-05 | 丁锬 | Prevent atomizing medical gauze mask of glasses lens |
| WO2022206568A1 (en) * | 2021-03-30 | 2022-10-06 | 华为技术有限公司 | Thermoelectric refrigeration module, heat dissipation component, chip packaging structure, and electronic device |
-
2014
- 2014-03-04 CN CN201420095287.6U patent/CN203704441U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104859958A (en) * | 2015-04-16 | 2015-08-26 | 华南农业大学 | Double-working-condition semiconductor refrigeration type fruit and vegetable distribution box and control method thereof |
| CN108981227A (en) * | 2017-06-05 | 2018-12-11 | 深圳迈瑞生物医疗电子股份有限公司 | Temperature of reagent controls equipment and sample analyser |
| CN109976415A (en) * | 2017-12-27 | 2019-07-05 | 中国科学院长春光学精密机械与物理研究所 | A kind of temperature range control system of infrared optical system |
| CN108738281A (en) * | 2018-05-31 | 2018-11-02 | 四川斐讯信息技术有限公司 | A kind of enhancing radiator and control method |
| CN109184007A (en) * | 2018-08-30 | 2019-01-11 | 绿点建筑科技（广州）有限公司 | A kind of building heat preservation structure |
| CN109184007B (en) * | 2018-08-30 | 2020-06-02 | 绿点建筑科技（广州）有限公司 | Building insulation structure |
| CN109536211A (en) * | 2018-12-25 | 2019-03-29 | 华中科技大学 | Based on the asymmetric tar cooling-collecting device for leading warm runner |
| CN109536211B (en) * | 2018-12-25 | 2021-01-01 | 华中科技大学 | Tar cooling and collecting device based on asymmetric temperature conduction flow channel |
| CN111227390A (en) * | 2020-04-02 | 2020-06-05 | 丁锬 | Prevent atomizing medical gauze mask of glasses lens |
| WO2022206568A1 (en) * | 2021-03-30 | 2022-10-06 | 华为技术有限公司 | Thermoelectric refrigeration module, heat dissipation component, chip packaging structure, and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SICHUAN XINJIANKANGCHENG BIOLOG TECHNOLOGY CO., LT Free format text: FORMER NAME: SICHUAN XINCHENG BIOTECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 610000 No. 101 Tian Xin Road, hi tech Zone, Sichuan, Chengdu Patentee after: SICHUAN XINJIAN KANGCHENG BIOLOGICAL Co.,Ltd. Address before: High tech Zone Tianchen road Chengdu City, Sichuan province 610000 No. 88 Patentee before: SICHUAN PROVINCE XINCHENG BIOLOGICAL TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140709 |