CN203695029U - Low-temperature reaction device - Google Patents
Low-temperature reaction device Download PDFInfo
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- CN203695029U CN203695029U CN201320642678.0U CN201320642678U CN203695029U CN 203695029 U CN203695029 U CN 203695029U CN 201320642678 U CN201320642678 U CN 201320642678U CN 203695029 U CN203695029 U CN 203695029U
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- cooling element
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- flow guide
- temperature
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Abstract
The utility model discloses a low-temperature reaction device. The low-temperature reaction device comprises a power supply, a temperature control system, a cold trap system, a U-shaped reaction pipe and a semiconductor refrigerator; the temperature control system comprises a thermocouple, a temperature control instrument and a semiconductor module; the cold trap system comprises a cold trap, cold trap heat transfer medium alcohol and a water circulation pipeline; the semiconductor refrigerator internally comprises a refrigerating surface base plate, a heating surface base plate, a flow guide bar, a P-type refrigerating element and an N-type refrigerating element; the upper end of the whole semiconductor refrigerator is a heat absorption end, and the lower end of the whole semiconductor refrigerator is a heat releasing end; the thermocouple detects the actual temperature and transmits to the temperature control instrument; the temperature control instrument sends a control signal to trigger the semiconductor module; the semiconductor module is connected with the power supply to supply electricity for the semiconductor refrigerator; the heat absorption end of the semiconductor refrigerator continuously absorb heat from the heat transfer medium alcohol from the cold trap, and the heat release end continuously releases heat; a flowing water circulation system continuously takes away the released heat until the temperature in the U-shaped reaction pipe reaches the set value.
Description
Technical field
The utility model relates to a kind of reaction unit of use for laboratory, specifically relates to a kind of low-temperature reactor.
Background technology
In the industry production such as chemical industry, food, pharmacy or scientific research, due to the needs of experiment, usually in preparing product process, its chemical reaction often has certain requirement to temperature and pressure, some operation of some product requires to carry out under cryogenic conditions, current low-temperature reactor is because be subject to the restriction of refrigeration plant, operates comparatively loaded down with trivial detailsly, and temperature control is inaccurate.
Summary of the invention
The utility model is mainly to solve the existing technical problem of above-mentioned prior art, and a kind of low-temperature reactor is provided.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals: a kind of low-temperature reactor, comprise power supply, temperature control instrument, semiconductor module, thermocouple, sample cell, cold-trap, heat transfer medium alcohol, chill surface substrate, flow guide bar, P type cooling element, N-type cooling element, water circulating pipe and heat face substrate, described thermocouple is fixed in U-shaped reaction tube, thermocouple, temperature control instrument and semiconductor module are connected in series successively, P type cooling element, N-type cooling element, flow guide bar and power supply are cascaded, chill surface substrate and heat face substrate and be distributed in respectively the top and bottom of cooling module, water circulation system with heat face substrate and be affixed, wherein power supply is for powering to whole system, temperature-controlling system comprises thermocouple, temperature control instrument and semiconductor module, cold-trap system comprises cold-trap, cold-trap heat transfer medium alcohol and water circulating pipe, semiconductor cooler inside comprises refrigeration face substrate, pyrogenicity face substrate, flow guide bar, P type cooling element and N-type cooling element, substrate adopts metallic plate to make, between substrate and flow guide bar, adopt adhesive to be adhesively fixed, flow guide bar is metal material, the main turn-on current that plays a part, P type cooling element, N-type cooling element and flow guide bar are welded as a whole, the positive pole of N-type element access power supply, the negative pole of P type element access power supply, electronics in N-type element moves down under electric field action, in the positive charge polymerization of lower end and power supply, heat release when polymerization, hole in P type element moves down under electric field action, in the negative electrical charge polymerization of lower end and power supply, heat release when polymerization, simultaneously, electronics separates in upper end with hole, when separation, absorb heat, the upper end of whole semiconductor cooler is heat absorbing end, lower end is release end of heat.
When work, on temperature control instrument, set a preset temperature, thermocouple detects temperature in U-shaped reaction tube, and signal is transferred to temperature control instrument, temperature control instrument is preset temperature and actual temperature size relatively: in the time that preset temperature is less than measured temperature, temperature control instrument output control signal, remove to trigger semiconductor module, the output of semiconductor module switches on power, power to semiconductor cooler, when connecting after direct current in this circuit, the just energy-producing transfer of energy, upper end is heat absorbing end, continuous alcohol in cold-trap absorbs heat, in alcohol and U-shaped reaction tube, temperature reduces, lower end is release end of heat, the continuous release heat of release end of heat, mobile water circulation system is constantly taken away the heat discharging, when the temperature in U-shaped reaction tube arrives setting value, at this moment temperature control instrument closing control signal, semiconductor module is cut off the electricity supply, whole semiconductor cooler power-off, stop refrigeration.
As preferably, between chill surface substrate and flow guide bar, adopt adhesive to be adhesively fixed and be positioned at the upper end of semiconductor cooling element, between pyrogenicity face substrate and flow guide bar, adopt adhesive to be adhesively fixed and be positioned at the lower end of semiconductor cooling element.
As preferably, described U-shaped reaction tube is placed in cold-trap, in cold-trap, fill cold-trap heat transfer medium alcohol, the upper end of the lower end of cold-trap and refrigeration face substrate, flow guide bar and semiconductor cooling element is connected in series successively, and the lower end of semiconductor cooling element and flow guide bar, pyrogenicity face substrate and water circulating pipe are connected in series successively.
The temperature-controlling system of the utility model low-temperature reactor by thermocouple, temperature control instrument and semiconductor module composition and semiconductor cooler realized automatic temperature controlling, temperature control precisely, noiselessness, refrigeration speed be fast; In addition, by changing the size of working power, can to change refrigeration speed, long service life, cost low.Therefore, the utlity model has the features such as simple in structure, reasonable in design.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the present utility model.
Description of reference numerals:
1 is power supply, and 2 is temperature control instrument, and 3 is semiconductor module, and 4 is thermocouple, and 5 is U-shaped reaction tube, 6 is cold-trap, and 7 is heat transfer medium alcohol, and 8 is chill surface substrate, and 9 is flow guide bar, 10 is P-type semiconductor, and 11 is N-type semiconductor, and 12 is water circulating pipe, and 13 for heating face substrate.
The specific embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment: referring to Fig. 1, a kind of low-temperature reactor of the utility model, comprises power supply 1, temperature control instrument 2, semiconductor module 3, thermocouple 4, U-shaped reaction tube 5, cold-trap 6, heat transfer medium alcohol 7, chill surface substrate 8, flow guide bar 9, P-type semiconductor 10, N-type semiconductor 11, water circulating pipe 12 and heats face substrate 13.Power supply 1 is for powering to whole system, and thermocouple 4 is fixed in U-shaped reaction tube 5, and thermocouple 4, temperature control instrument 2 and semiconductor module 3 are connected in series successively, form a temperature-controlling system.Refrigeration face substrate 8, pyrogenicity face substrate 13, flow guide bar 9, P type cooling element 10 and N-type cooling element 11 form a semiconductor cooler, chill surface substrate 8 and pyrogenicity face substrate 13 all adopt metallic plate to make, between substrate and flow guide bar 9, adopt adhesive to be adhesively fixed, flow guide bar 9 is metal material, mainly play turn-on current, P type cooling element 10, N-type cooling element 11 and flow guide bar 9 are welded as a whole.P type cooling element 10, N-type cooling element 11, flow guide bar 9 and power supply 1 are cascaded, N-type cooling element 11 accesses the positive pole of power supply 1, P type cooling element 10 accesses the negative pole of power supply 1, electronics in N-type cooling element 11 moves down under electric field action, in the positive charge polymerization of lower end and power supply, heat release when polymerization, the hole in P type cooling element 10 moves down under electric field action, in the negative electrical charge polymerization of lower end and power supply, heat release when polymerization; Meanwhile, electronics separates in upper end with hole, absorbs heat when separation, and the upper end of whole semiconductor cooler is heat absorbing end, and lower end is release end of heat.U-shaped reaction tube 5 is placed in cold-trap 6, in cold-trap 6, fill cold-trap heat transfer medium alcohol 7, the upper end of the lower end of cold-trap 6 and refrigeration face substrate 8, flow guide bar 9 and semiconductor cooler is connected in series successively, and the lower end of semiconductor cooler and flow guide bar 9, pyrogenicity face substrate 13 and water circulating pipe 12 are connected in series successively.
When work, on temperature control instrument 2, set a preset temperature, thermocouple 4 detects the interior temperature of U-shaped reaction tube and signal is transferred to temperature control instrument 2, relatively preset temperature and actual temperature size of temperature control instrument 2: in the time that preset temperature is less than the actual temperature detecting, temperature control instrument 2 is exported control signal, remove to trigger semiconductor module 3, the output of semiconductor module 3 switches on power 1, power to semiconductor cooler, when connecting after direct current in this circuit, the just energy-producing transfer of energy, upper end is heat absorbing end, continuous alcohol in cold-trap 6 absorbs heat, the interior temperature of U-shaped reaction tube 5 is reduced, lower end is release end of heat, constantly release heat, mobile water circulation be 12 constantly discharge heat take away, until the temperature in U-shaped reaction tube 5 arrives setting value, at this moment temperature control instrument 2 closing control signals, semiconductor module 3 is cut off the electricity supply, whole semiconductor cooler power-off, stop refrigeration.
The temperature-controlling system of the utility model low-temperature reactor by thermocouple, temperature control instrument and semiconductor module composition and semiconductor cooler realized automatic temperature controlling, temperature control precisely, noiselessness, refrigeration speed be fast; In addition, by changing the size of working power, can to change refrigeration speed, long service life, cost low.
Finally, it should be pointed out that above embodiment is only the more representational example of the utility model.Obviously, the utility model is not limited to above-described embodiment, can also have many distortion.Any simple modification, equivalent variations and modification that every foundation technical spirit of the present utility model is done above embodiment, all should think and belong to protection domain of the present utility model.
Claims (5)
1. a low-temperature reactor, comprise power supply, temperature control instrument, semiconductor module, thermocouple, sample cell, cold-trap, heat transfer medium alcohol, chill surface substrate, flow guide bar, P type cooling element, N-type cooling element, water circulating pipe and heat face substrate, it is characterized in that described thermocouple is fixed in U-shaped reaction tube, thermocouple, temperature control instrument and semiconductor module are connected in series successively, P type cooling element, N-type cooling element, flow guide bar and power supply are cascaded, chill surface substrate and heat face substrate and be distributed in respectively the top and bottom of cooling module, water circulation system with heat face substrate and be affixed.
2. a kind of low-temperature reactor according to claim 1, it is characterized in that described chill surface substrate and pyrogenicity face substrate all adopt metallic plate to make, between described chill surface substrate and flow guide bar, adopt adhesive to be adhesively fixed and be positioned at the upper end of semiconductor cooling element, between described pyrogenicity face substrate and flow guide bar, adopt adhesive to be adhesively fixed and be positioned at the lower end of semiconductor cooling element, flow guide bar is metal material.
3. a kind of low-temperature reactor according to claim 1, is characterized in that described P type cooling element, N-type cooling element and flow guide bar are welded as a whole.
4. a kind of low-temperature reactor according to claim 1, is characterized in that the positive pole of described N-type cooling element access power supply, the negative pole of P type cooling element access power supply.
5. a kind of low-temperature reactor according to claim 1, it is characterized in that described U-shaped reaction tube is placed in cold-trap, in described cold-trap, fill cold-trap heat transfer medium alcohol, the upper end of the lower end of described cold-trap and refrigeration face substrate, flow guide bar and semiconductor cooling element is connected in series successively, and the lower end of described semiconductor cooling element and flow guide bar, pyrogenicity face substrate and water circulating pipe are connected in series successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320642678.0U CN203695029U (en) | 2013-10-17 | 2013-10-17 | Low-temperature reaction device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320642678.0U CN203695029U (en) | 2013-10-17 | 2013-10-17 | Low-temperature reaction device |
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| Publication Number | Publication Date |
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| CN203695029U true CN203695029U (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320642678.0U Expired - Fee Related CN203695029U (en) | 2013-10-17 | 2013-10-17 | Low-temperature reaction device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105004094A (en) * | 2015-06-26 | 2015-10-28 | 湖北申安亚明照明科技有限公司 | Semiconductor refrigeration equipment achieving heat radiation through heat pipes |
| CN107328846A (en) * | 2017-08-10 | 2017-11-07 | 中国科学院长春应用化学研究所 | Mass spectrum sampling system and cooling device |
| CN107889428A (en) * | 2017-11-17 | 2018-04-06 | 郑州爱派科技有限公司 | A kind of smart mobile phone high temperature intelligent alarm device |
| CN109107515A (en) * | 2018-10-12 | 2019-01-01 | 圣戈莱（北京）科技有限公司 | A kind of material feeding reaction system preparing ternary anode material precursor and its application |
-
2013
- 2013-10-17 CN CN201320642678.0U patent/CN203695029U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105004094A (en) * | 2015-06-26 | 2015-10-28 | 湖北申安亚明照明科技有限公司 | Semiconductor refrigeration equipment achieving heat radiation through heat pipes |
| CN107328846A (en) * | 2017-08-10 | 2017-11-07 | 中国科学院长春应用化学研究所 | Mass spectrum sampling system and cooling device |
| CN107328846B (en) * | 2017-08-10 | 2021-01-08 | 中国科学院长春应用化学研究所 | Mass spectrum sampling system and cooling device |
| CN107889428A (en) * | 2017-11-17 | 2018-04-06 | 郑州爱派科技有限公司 | A kind of smart mobile phone high temperature intelligent alarm device |
| CN109107515A (en) * | 2018-10-12 | 2019-01-01 | 圣戈莱（北京）科技有限公司 | A kind of material feeding reaction system preparing ternary anode material precursor and its application |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20161017 |
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| CF01 | Termination of patent right due to non-payment of annual fee |