CN203090826U - Dual-purpose magnetic stirring device capable of heating and refrigerating of semiconductor - Google Patents

Dual-purpose magnetic stirring device capable of heating and refrigerating of semiconductor Download PDF

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Publication number
CN203090826U
CN203090826U CN 201220641595 CN201220641595U CN203090826U CN 203090826 U CN203090826 U CN 203090826U CN 201220641595 CN201220641595 CN 201220641595 CN 201220641595 U CN201220641595 U CN 201220641595U CN 203090826 U CN203090826 U CN 203090826U
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CN
China
Prior art keywords
magnetic stirring
semiconductor
metal sheet
conductive metal
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201220641595
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Chinese (zh)
Inventor
罗绍华
李辉
田勇
诸葛福长
胡平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GANSU ELEPHANT ENERGY TECHNOLOGY Co Ltd
Original Assignee
GANSU ELEPHANT ENERGY TECHNOLOGY Co Ltd
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Publication date
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Priority to CN 201220641595 priority Critical patent/CN203090826U/en
Application granted granted Critical
Publication of CN203090826U publication Critical patent/CN203090826U/en
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Abstract

The utility model relates to a dual-purpose magnetic stirring device capable of heating and refrigerating of semiconductor. The dual-purpose magnetic stirring device is composed of a semiconductor heating and refrigerating device, a radiator, a radiating fan, a magnetic stirring device and a thermocouple, wherein the semiconductor heating and refrigerating device comprises a n-shaped semiconductor sheet, a p-shaped semiconductor sheet, an insulating layer and a conductive metal sheet; the n-shaped semiconductor sheet and the p-shaped semiconductor sheet are arranged between two insulating layers without contacting with each other; the upper end surface is adhered at the bottom of a water bath pot of the magnetic stirring device through a heat-conducting silica gel, and the radiator is arranged on the lower end surface of the heating and refrigerating device. The dual-purpose magnetic stirring device provided by the utility model is simple in structure and convenient for operation; and by combining the semiconductor heating/refrigerating function with the stirring and temperature controlling function of the magnetic stirring device, the magnetic stirring device is capable of achieving optimal heating/refrigerating effect by simultaneously combining with the radiator and the radiating fan.

Description

A kind of semiconductor heats the dual-purpose magnetic stirring apparatus of refrigeration
[technical field]
The utility model relates to a kind of semiconductor and heats the dual-purpose magnetic stirring apparatus of refrigeration, particularly a kind of magnetic stirring apparatus that utilizes semiconductor to heat/freeze.
[background technology]
Existing laboratory utilizes the heating wire heating with magnetic stirring apparatus, does not have refrigerating plant, adopts the ice cube refrigeration usually, and refrigeration can not accurate temperature controlling, operation is loaded down with trivial details and do not reach sub-zero low temperature.Therefore, invent a kind of without heating wire heating, also can heat and automatically the magnetic stirring apparatus of refrigeration can realize temperature automatically controlledly, heating/refrigeration is integrated.
[utility model content]
At the deficiency that prior art exists, the purpose of this utility model is to provide the semiconductor of a kind of automatic refrigeration, accurate temperature controlling to heat the dual-purpose magnetic stirring apparatus of refrigeration.
The purpose of this utility model is achieved through the following technical solutions:
A kind of semiconductor heats the dual-purpose magnetic stirring apparatus of refrigeration, and its structure is made of semiconductor cooling device, radiator, radiator fan, magnetic stirring apparatus, thermocouple.Described semiconductor cooling device, radiator, radiator fan are all between the water-bath and magnetic stirring apparatus base of magnetic stirring apparatus.Described semiconductor heats refrigerating plant and comprises n type semiconductor chip, p type semiconductor chip, insulating barrier, conductive metal sheet.Described conductive metal sheet is fixed on the conduction insulating barrier, and the conductive metal sheet on the last layer insulating lacks a slice than the conductive metal sheet on the following layer insulating; N type semiconductor chip more than 2 or 2 and p type semiconductor chip are alternately and not contactedly be arranged on up and down between the dielectric layers and be connected into annular; On every conductive metal sheet on the last layer insulating, all be fixedly connected with 1 n type semiconductor and 1 p type semiconductor, and be fixed on the layer insulating n type semiconductor and the semi-conductive other end of p type on the same conductive metal sheet and be separately fixed at down on the different conductive metal sheet on the layer insulating.The upper surface that described semiconductor heats refrigerating plant is bonded at the water-bath bottom surface of magnetic stirring apparatus by heat conductive silica gel.Described radiator is positioned at semiconductor and heats the refrigerating plant lower surface, and its material is a kind of in copper, aluminium, the aluminium alloy.
Outstanding feature of the present utility model and marked improvement are, simple in structure, easy to operate, semiconductor heating/refrigerating function and magnetic stirrer and temperature controlling function is combined, in conjunction with radiator, radiator fan, make magnetic stirring apparatus reach best heating/refrigeration simultaneously.
[description of drawings]
Fig. 1 heats the overall structure schematic diagram of the dual-purpose magnetic stirring apparatus of refrigeration for semiconductor.
Fig. 2 heats the vertical view of refrigerating plant n, p semiconductor chip and conductive metal sheet for semiconductor.
[specific embodiment]
With reference to accompanying drawing 1 and accompanying drawing 2, a kind of semiconductor heats the dual-purpose magnetic stirring apparatus of refrigeration, heats refrigerating plant 1, radiator 2, radiator fan 3, magnetic stirring apparatus 4, thermocouple by semiconductor and constitutes.Semiconductor heats refrigerating plant 1, radiator 2, radiator fan 3 all between the base of the water-bath of magnetic stirring apparatus 4 and magnetic stirring apparatus 4.Semiconductor heats refrigerating plant 1, comprises n type semiconductor chip, p type semiconductor chip, insulating barrier, conductive metal sheet 5.Radiator 2 is formed by copper, and is positioned at semiconductor and heats refrigerating plant 1 lower surface.
Operation principle: connect power supply, open the switch of magnetic stirring apparatus 4, according to the requirement of experiment design temperature.In the water-bath of magnetic stirring apparatus 4, add an amount of water, reaction vessel is fixed in the water-bath of magnetic stirring apparatus 4.Thermocouple is inserted thermometric in the water-bath, and thermocouple is passed to the temperature-controlling system of magnetic stirring apparatus 4 with signal, and temperature-controlling system changes the sense of current that semiconductor heats refrigerating plant 1, and then the control semiconductor heats refrigerating plant 1 heating or refrigeration.When temperature was lower than design temperature, semiconductor heated the heating of refrigerating plant 1 upper surface.When temperature was higher than design temperature, semiconductor heated refrigerating plant 1 upper surface refrigeration.

Claims (1)

1. a semiconductor heats the dual-purpose magnetic stirring apparatus of refrigeration, it is characterized in that, its structure heats refrigerating plant by semiconductor, radiator, radiator fan, magnetic stirring apparatus, thermocouple constitutes, described semiconductor heats refrigerating plant, radiator, radiator fan is all between the water-bath and magnetic stirring apparatus base of magnetic stirring apparatus, described semiconductor heats refrigerating plant and comprises n type semiconductor chip, p type semiconductor chip, insulating barrier, conductive metal sheet, described conductive metal sheet is fixed on the conduction insulating barrier, and the conductive metal sheet on the last layer insulating lacks a slice than the conductive metal sheet on the following layer insulating; N type semiconductor chip more than 2 or 2 and p type semiconductor chip are alternately and not contactedly be arranged on up and down between the dielectric layers and be connected into annular; On every conductive metal sheet on the last layer insulating, all be fixedly connected with 1 n type semiconductor and 1 p type semiconductor, and being fixed on the layer insulating n type semiconductor and the semi-conductive other end of p type on the same conductive metal sheet is separately fixed at down on the different conductive metal sheet on the layer insulating, the upper surface that described semiconductor heats refrigerating plant is bonded at the water-bath bottom surface of magnetic stirring apparatus by heat conductive silica gel, described radiator is positioned at semiconductor and heats the refrigerating plant lower surface, and its material is a kind of in copper, aluminium, the aluminium alloy.
CN 201220641595 2012-11-21 2012-11-21 Dual-purpose magnetic stirring device capable of heating and refrigerating of semiconductor Expired - Lifetime CN203090826U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220641595 CN203090826U (en) 2012-11-21 2012-11-21 Dual-purpose magnetic stirring device capable of heating and refrigerating of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220641595 CN203090826U (en) 2012-11-21 2012-11-21 Dual-purpose magnetic stirring device capable of heating and refrigerating of semiconductor

Publications (1)

Publication Number Publication Date
CN203090826U true CN203090826U (en) 2013-07-31

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220641595 Expired - Lifetime CN203090826U (en) 2012-11-21 2012-11-21 Dual-purpose magnetic stirring device capable of heating and refrigerating of semiconductor

Country Status (1)

Country Link
CN (1) CN203090826U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103464074A (en) * 2013-09-06 2013-12-25 复旦大学 Cooling type and heating type integrated magnetic stirring reactor
CN103846039A (en) * 2014-03-12 2014-06-11 许期年 Three-point type reversely-inclined track low-temperature electric shaking table
CN105004094A (en) * 2015-06-26 2015-10-28 湖北申安亚明照明科技有限公司 Semiconductor refrigeration equipment achieving heat radiation through heat pipes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103464074A (en) * 2013-09-06 2013-12-25 复旦大学 Cooling type and heating type integrated magnetic stirring reactor
CN103846039A (en) * 2014-03-12 2014-06-11 许期年 Three-point type reversely-inclined track low-temperature electric shaking table
CN105004094A (en) * 2015-06-26 2015-10-28 湖北申安亚明照明科技有限公司 Semiconductor refrigeration equipment achieving heat radiation through heat pipes

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: Dual-purpose magnetic stirring device capable of heating and refrigerating of semiconductor

Effective date of registration: 20171213

Granted publication date: 20130731

Pledgee: Gansu double credit Company limited by guarantee

Pledgor: GANSU DX ENERGY TECHNOLOGY CO.,LTD.

Registration number: 2017620000028

PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20190813

Granted publication date: 20130731

Pledgee: Gansu double credit Company limited by guarantee

Pledgor: GANSU DX ENERGY TECHNOLOGY CO.,LTD.

Registration number: 2017620000028

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20130731