CN203689404U - Universal heat dissipation module for microcomputer - Google Patents

Universal heat dissipation module for microcomputer Download PDF

Info

Publication number
CN203689404U
CN203689404U CN201320802731.9U CN201320802731U CN203689404U CN 203689404 U CN203689404 U CN 203689404U CN 201320802731 U CN201320802731 U CN 201320802731U CN 203689404 U CN203689404 U CN 203689404U
Authority
CN
China
Prior art keywords
copper sheet
mounting
heat
transfer pipe
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320802731.9U
Other languages
Chinese (zh)
Inventor
项彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Qiaocheng Technology Development Co Ltd
Original Assignee
Chongqing Qiaocheng Technology Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Qiaocheng Technology Development Co Ltd filed Critical Chongqing Qiaocheng Technology Development Co Ltd
Priority to CN201320802731.9U priority Critical patent/CN203689404U/en
Application granted granted Critical
Publication of CN203689404U publication Critical patent/CN203689404U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a universal heat dissipation module for a microcomputer, which comprises a heat dissipation copper sheet component, a heat transfer tube, a heat dissipation fin group and a fan, wherein the heat dissipation copper sheet component comprises a rectangular copper sheet and mounting strips; the left end and the right end of the rectangular copper sheet are respectively riveted together with the corresponding mounting strips; a sinking table is stamped at each of the upper end and the lower end of each mounting strip; a mounting hole and at least two mounting claws are stamped on each sinking table, and the mounting claws surround the periphery of the sinking table and are vertical to the plane of the sinking table; a heat transfer tube mounting area and two limiting ribs are arranged on the rectangular copper sheet; the two limiting ribs are respectively placed on the left side and the right side of the heat transfer tube mounting area; vertical bent edges are arranged at the upper end and the lower end of the rectangular copper sheet; notches which are formed over against the ends of the heat transfer tube mounting area are formed in the vertical bent edges to allow the passing of the heat transfer tube; different mistakenly-mounting preventing sequence numbers are scribed in the positions, close to the four mounting holes, of the heat dissipation copper sheet component. The universal heat dissipation module for the microcomputer has the characteristics of simple structure, reliable strength, convenience in installation, smallness, perfectness and compactness, low manufacturing cost, capability of preventing mistakenly mounting and the like.

Description

A kind of general microcomputer heat radiation module
Technical field
The utility model relates to computer components technical field, is specifically related to a kind of for the heat radiation module on computer.
Background technology
Heat radiation module is requisite parts on notebook computer, is made up of radiating copper sheet, heat-transfer pipe, radiating fin group, fan and several parts of copper sheet mounting bracket.Radiating copper sheet is the core component in heat radiation module, and radiating copper sheet is arranged on CPU below, by heat-transfer pipe, the heat of CPU is derived, dispel the heat by radiating fin again, also be provided with fan in heat radiation in module, fan is cool ambient air and radiating fin heat exchange, thereby realizes the cooling of CPU.
Radiating copper sheet is fixed by welding on special mounting bracket, forms radiating copper sheet assembly.Heat-transfer pipe is fixed by welding in the back side of radiating copper sheet.Existing heat radiation module ubiquity complex structure, take up room large, bulk strength is inadequate, manufacturing cost is high, the easy problem such as wrongly installed.
Utility model content
The purpose of this utility model is to provide that a kind of simple in structure, intensity is reliable, the microcomputer heat radiation module of low cost of manufacture, compact, anti-misloading.
For this reason, the technical scheme that the utility model adopts is: a kind of general microcomputer heat radiation module, comprise radiating copper sheet assembly (I), heat-transfer pipe (II), radiating fin group (III) and fan (IV), it is characterized in that: described radiating copper sheet assembly (I) comprises rectangle copper sheet (1), be symmetricly set on the mounting bar (2) of rectangle copper sheet (1) left and right sides, described mounting bar (2) adopts corrosion resistant plate to be stamped to form, the two ends, left and right of described rectangle copper sheet (1) are riveted together with corresponding mounting bar (2) respectively, the each punching in two ends up and down of each mounting bar (2) has a heavy stand (2a), each heavy stand (2a) upper punch has a mounting hole (2b) and at least two mounting jaws (2c), described mounting jaw (2c) is looped around heavy stand (2a) periphery and perpendicular to heavy stand (2a) plane, on described rectangle copper sheet (1), be provided with heat-transfer pipe installing zone (1a) and two limit ribs (1b), described heat-transfer pipe installing zone (1a) is positioned at the middle part at rectangle copper sheet (1) back side, two limit ribs (1b) are arranged in the left and right sides of heat-transfer pipe installing zone (1a), the two ends up and down of described rectangle copper sheet (1) are with vertical bending edges (1c), just on described vertical bending edges (1c), have the breach (1d) of heat-transfer pipe installing zone (1a) termination is passed through for heat-transfer pipe (II), described radiating copper sheet assembly (I) is carved with different anti-misloading serial numbers (B) in the position near four mounting holes (2b), one end of described heat-transfer pipe (II) is welded in the heat-transfer pipe installing zone (1a) of radiating copper sheet assembly (I), and is positioned between two limit ribs (1b), and the other end of heat-transfer pipe (II) is connected with radiating fin group (III), fan (IV).
Be preferably, described rectangle copper sheet (1) is riveted together by upper and lower spaced three riveting points (A) with each mounting bar (2).
Further, described anti-misloading serial number (B) is engraved on mounting bar (2).
The beneficial effects of the utility model:
(1) substituted traditional mounting bracket by two mounting bars, mounting hole is set on mounting bar, realized the installation of heat radiation module on CPU, structure is simplified greatly, and manufacturing cost reduces greatly, and compact;
(2) four mounting holes are separately positioned on heavy stand, coupling collar has improved the intensity of mounting bar jointly around the mounting jaw of heavy stand, and the relative mounting bar of mounting hole caves in backward simultaneously, has improved the laminating degree of mounting bar and CPU;
(3) radiating copper sheet and mounting bar riveted joint, compare welding processing more convenient, and manufacturing cost is lower and reliability is high;
(4) two limit ribs that arrange in radiating copper sheet, one side has increased the intensity of radiating copper sheet, also heat-transfer pipe is played to position-limiting action on the other hand;
(5) be carved with different anti-misloading serial numbers near the position of four mounting holes, avoiding occurring in installation process misloading.
In sum, the utlity model has simple in structure, the feature such as intensity is reliable, easy for installation, low cost of manufacture, compact, anti-misloading.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the front view of radiating copper sheet assembly.
Fig. 3 is the rear view of Fig. 2.
Fig. 4 is the left view of Fig. 2.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
A kind of general microcomputer heat radiation module as shown in Figure 1, is made up of radiating copper sheet assembly I, heat-transfer pipe II, radiating fin group III and fan IV four parts.It is not shown that radiating copper sheet assembly I is arranged on CPU() below, by heat-transfer pipe II, the heat of CPU is derived, then by the heat radiation of radiating fin group III, fan IV is cool ambient air and the heat exchange of radiating fin group III, thereby realizes the cooling of CPU.The above is consistent with traditional structure, does not repeat them here.
Difference is: Fig. 2---Figure 4 shows that radiating copper sheet assembly I, formed by a rectangle copper sheet 1 and two mounting bars 2.Mounting bar 2 is symmetricly set on the left and right sides of rectangle copper sheet 1, and mounting bar 2 adopts corrosion resistant plate to be stamped to form, to avoid corrosion in use procedure.The two ends, left and right of rectangle copper sheet 1 are riveted together with corresponding mounting bar 2 respectively, the each punching in two ends up and down of each mounting bar 2 has a heavy stand 2a, each heavy stand 2a upper punch has a mounting hole 2b and at least two mounting jaw 2c, and mounting jaw 2c is looped around heavy stand 2a periphery and perpendicular to heavy stand 2a plane.Shown in Fig. 1, on rectangle copper sheet 1, be provided with heat-transfer pipe installing zone 1a and two limit ribs 1b, heat-transfer pipe installing zone 1a is positioned at the middle part at rectangle copper sheet 1 back side, for heat-transfer pipe II is installed.Two limit ribs 1b are arranged in the left and right sides of heat-transfer pipe installing zone 1a, to the spacing II of heat-transfer pipe.The two ends up and down of rectangle copper sheet 1, with vertical bending edges 1c, just have the breach 1d of heat-transfer pipe installing zone 1a termination are passed through for heat-transfer pipe II on vertical bending edges 1c.
Radiating copper sheet assembly I is carved with different anti-misloading serial numbers in the position near four mounting hole 2b, and totally four anti-misloading serial number B, are respectively " 1 ", " 2 ", " 3 " and " 4 ", also can adopt other anti-misloading serial number.Four respectively corresponding four mounting hole 1a of anti-misloading serial number B.Anti-misloading serial number B is preferably engraved on mounting bar 2.
One end of heat-transfer pipe II is welded in the heat-transfer pipe installing zone 1a of radiating copper sheet assembly I, heat-transfer pipe II be positioned at rectangle copper sheet 1 under, and between two limit ribs 1b, spacing by two limit ribs 1b, the other end of heat-transfer pipe II is connected with radiating fin group III, fan IV.
Preferably, rectangle copper sheet 1 is riveted together by upper and lower spaced three riveting point A with each mounting bar 2.

Claims (3)

1. a general microcomputer heat radiation module, comprise radiating copper sheet assembly (I), heat-transfer pipe (II), radiating fin group (III) and fan (IV), it is characterized in that: described radiating copper sheet assembly (I) comprises rectangle copper sheet (1), be symmetricly set on the mounting bar (2) of rectangle copper sheet (1) left and right sides, described mounting bar (2) adopts corrosion resistant plate to be stamped to form, the two ends, left and right of described rectangle copper sheet (1) are riveted together with corresponding mounting bar (2) respectively, the each punching in two ends up and down of each mounting bar (2) has a heavy stand (2a), each heavy stand (2a) upper punch has a mounting hole (2b) and at least two mounting jaws (2c), described mounting jaw (2c) is looped around heavy stand (2a) periphery and perpendicular to heavy stand (2a) plane, on described rectangle copper sheet (1), be provided with heat-transfer pipe installing zone (1a) and two limit ribs (1b), described heat-transfer pipe installing zone (1a) is positioned at the middle part at rectangle copper sheet (1) back side, two limit ribs (1b) are arranged in the left and right sides of heat-transfer pipe installing zone (1a), the two ends up and down of described rectangle copper sheet (1) are with vertical bending edges (1c), just on described vertical bending edges (1c), have the breach (1d) of heat-transfer pipe installing zone (1a) termination is passed through for heat-transfer pipe (II), described radiating copper sheet assembly (I) is carved with different anti-misloading serial numbers (B) in the position near four mounting holes (2b), one end of described heat-transfer pipe (II) is welded in the heat-transfer pipe installing zone (1a) of radiating copper sheet assembly (I), and is positioned between two limit ribs (1b), and the other end of heat-transfer pipe (II) is connected with radiating fin group (III), fan (IV).
2. according to general microcomputer heat radiation module claimed in claim 1, it is characterized in that: described rectangle copper sheet (1) is riveted together by upper and lower spaced three riveting points (A) with each mounting bar (2).
3. according to the general microcomputer heat radiation module described in claim 1 or 2, it is characterized in that: described anti-misloading serial number (B) is engraved on mounting bar (2).
CN201320802731.9U 2013-12-08 2013-12-08 Universal heat dissipation module for microcomputer Expired - Fee Related CN203689404U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320802731.9U CN203689404U (en) 2013-12-08 2013-12-08 Universal heat dissipation module for microcomputer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320802731.9U CN203689404U (en) 2013-12-08 2013-12-08 Universal heat dissipation module for microcomputer

Publications (1)

Publication Number Publication Date
CN203689404U true CN203689404U (en) 2014-07-02

Family

ID=51011282

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320802731.9U Expired - Fee Related CN203689404U (en) 2013-12-08 2013-12-08 Universal heat dissipation module for microcomputer

Country Status (1)

Country Link
CN (1) CN203689404U (en)

Similar Documents

Publication Publication Date Title
CN203689404U (en) Universal heat dissipation module for microcomputer
CN203689353U (en) Simple type computer CPU heat dissipation module
CN203689378U (en) Computer radiating module with advantages of convenience in installation and compact structure
CN203812176U (en) Incorrect installation-prevention enhanced computer heat dissipation module
CN203689352U (en) Computer heat dissipation sheet copper component
CN203689370U (en) Simple type computer heat dissipation copper sheet component
CN203689376U (en) Sheet copper component in computer thermal module
CN203689394U (en) Heat dissipation copper sheet module for computer
CN203689402U (en) Universal heat dissipation component for microcomputer
CN203689356U (en) Laptop radiating module with firmly fixed heat pipes
CN203689371U (en) Universal heat dissipation system for microcomputer
CN203706098U (en) Mistaken assembly proofing reinforced computer radiating component
CN203689377U (en) Computer radiating module with advantages of convenience in installation and compact structure
CN203689339U (en) Laptop CPU radiating module with firmly fixed heat pipes
CN203689396U (en) Simple type computer CPU heat dissipation component
CN203706075U (en) Thermal module for CPU (central processing unit) of notebook
CN203706099U (en) Mistaken assembly proofing reinforced computer radiating system
CN203606771U (en) Computer heat dissipation system convenient to install and compact in structure
CN203689408U (en) Simple type computer CPU heat dissipation system
CN203689313U (en) Novel computer heat dissipation module with two firmly fixed heat pipes
CN203689320U (en) Novel heat dissipation module for computer
CN203689305U (en) Computer heat elimination module with firmly fixed heat pipes
CN203689411U (en) Heat dissipation module for notebook computer
CN203689331U (en) Computer thermal module
CN203606772U (en) Radiating module of computer

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140702

Termination date: 20141208

EXPY Termination of patent right or utility model