CN203689371U - Universal heat dissipation system for microcomputer - Google Patents

Universal heat dissipation system for microcomputer Download PDF

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Publication number
CN203689371U
CN203689371U CN201320802260.1U CN201320802260U CN203689371U CN 203689371 U CN203689371 U CN 203689371U CN 201320802260 U CN201320802260 U CN 201320802260U CN 203689371 U CN203689371 U CN 203689371U
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CN
China
Prior art keywords
radiating fin
copper sheet
heat
transfer pipe
heat dissipation
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Expired - Fee Related
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CN201320802260.1U
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Chinese (zh)
Inventor
项彬
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Chongqing Qiaocheng Technology Development Co Ltd
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Chongqing Qiaocheng Technology Development Co Ltd
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Priority to CN201320802260.1U priority Critical patent/CN203689371U/en
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Publication of CN203689371U publication Critical patent/CN203689371U/en
Anticipated expiration legal-status Critical
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a universal heat dissipation system for a microcomputer, which comprises a heat dissipation copper sheet component, a heat transfer tube, a heat dissipation fin group and a fan, wherein the heat dissipation copper sheet component comprises a rectangular copper sheet and mounting strips; the left end and the right end of the rectangular copper sheet are respectively riveted together with the corresponding mounting strips; different mistakenly-mounting preventing sequence numbers are scribed in the positions, close to four mounting holes, of the heat dissipation copper sheet component; the heat dissipation fin group is formed by oppositely buckling the tail ends of a first heat dissipation fin group and a second heat dissipation fin group into a whole; a U-shaped heat transfer tube channel is arranged inside the heat dissipation fin group. The universal heat dissipation system for the microcomputer has the characteristics of simple structure, reliable strength, convenience in installation, smallness, perfectness and compactness, low manufacturing cost, capability of preventing mistakenly mounting and the like, and effectively avoids the phenomenon that the buckling points of the buckling faces of heat dissipation fins are protruded.

Description

A kind of general microcomputer cooling system
Technical field
The utility model relates to computer components technical field, is specifically related to a kind of for the cooling system on computer.
Background technology
Cooling system is requisite parts on notebook computer, is made up of radiating copper sheet, heat-transfer pipe, radiating fin group, fan and several parts of copper sheet mounting bracket.Radiating copper sheet and radiating fin group are the core components in cooling system, radiating copper sheet is arranged on CPU below, by heat-transfer pipe, the heat of CPU is derived, dispel the heat by radiating fin group again, in cooling system, be also provided with fan, fan is cool ambient air and the heat exchange of radiating fin group, thereby realizes the cooling of CPU.
Radiating copper sheet is fixed by welding on special mounting bracket, forms radiating copper sheet assembly.Heat-transfer pipe is fixed by welding in the back side of radiating copper sheet.Existing cooling system ubiquity complex structure, take up room large, bulk strength is inadequate, manufacturing cost is high, the easy problem such as wrongly installed.
In addition, existing radiating fin group is to be all made up of multiple radiating fins, is conventionally snapped together and forms in the mode of vertical stack by a kind of radiating fin of specification, and a sidewall of radiating fin is plane, another sidewall is buckling surface, and a side of buckling surface has the fastening point of multiple protrusion buckling surfaces.After installation, there will be radiating fin group front end smooth, tail end fastens the phenomenon that point protrudes, and one side affects attractive in appearance, on the other hand also can scratch setter or damage computer inner body.
Utility model content
The purpose of this utility model is to provide that a kind of simple in structure, intensity is reliable, the microcomputer cooling system of low cost of manufacture, compact, anti-misloading, and can effectively avoid the tail end of radiating fin group to occur the phenomenon that button point protrudes.
For this reason, the technical scheme that the utility model adopts is: a kind of general microcomputer cooling system, comprise radiating copper sheet assembly (I), heat-transfer pipe (II), radiating fin group (III) and fan (IV), it is characterized in that: described radiating copper sheet assembly (I) comprises rectangle copper sheet (1), be symmetricly set on the mounting bar (2) of rectangle copper sheet (1) left and right sides, described mounting bar (2) adopts corrosion resistant plate to be stamped to form, the two ends, left and right of described rectangle copper sheet (1) are riveted together with corresponding mounting bar (2) respectively, the each punching in two ends up and down of each mounting bar (2) has a heavy stand (2a), each heavy stand (2a) upper punch has a mounting hole (2b) and at least two mounting jaws (2c), described mounting jaw (2c) is looped around heavy stand (2a) periphery and perpendicular to heavy stand (2a) plane, on described rectangle copper sheet (1), be provided with heat-transfer pipe installing zone (1a) and two limit ribs (1b), described heat-transfer pipe installing zone (1a) is positioned at the middle part at rectangle copper sheet (1) back side, two limit ribs (1b) are arranged in the left and right sides of heat-transfer pipe installing zone (1a), the two ends up and down of described rectangle copper sheet (1) are with vertical bending edges (1c), just on described vertical bending edges (1c), have the breach (1d) of heat-transfer pipe installing zone (1a) termination is passed through for heat-transfer pipe (II), described radiating copper sheet assembly (I) is carved with different anti-misloading serial numbers (B) in the position near four mounting holes (2b),
Described radiating fin group (III) comprises the first radiating fin (11) and the second radiating fin (12), described the first radiating fin, the second radiating fin (11, 12) on, have " U " shape groove, described the first radiating fin (11) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (12) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, and the common heat-transfer pipe passage (F) that forms " U " shape of " U " shape groove of " U " shape groove of the first radiating fin (11) and the second radiating fin (12),
One end of described heat-transfer pipe (II) is welded in the heat-transfer pipe installing zone (1a) of radiating copper sheet assembly (I), and be positioned between two limit ribs (1b), the other end of heat-transfer pipe (II) is arranged in the heat-transfer pipe passage (F) of radiating fin group (III), and described fan (IV) is arranged on a side of radiating fin group (III).
Be preferably, described rectangle copper sheet (1) is riveted together by upper and lower spaced three riveting points (A) with each mounting bar (2).
Further, described anti-misloading serial number (B) is engraved on mounting bar (2).
The beneficial effects of the utility model:
(1) substituted traditional mounting bracket by two mounting bars, mounting hole is set on mounting bar, realized the installation of cooling system on CPU, structure is simplified greatly, and manufacturing cost reduces greatly, and compact;
(2) four mounting holes are separately positioned on heavy stand, coupling collar has improved the intensity of mounting bar jointly around the mounting jaw of heavy stand, and the relative mounting bar of mounting hole caves in backward simultaneously, has improved the laminating degree of mounting bar and CPU;
(3) radiating copper sheet and mounting bar riveted joint, compare welding processing more convenient, and manufacturing cost is lower and reliability is high;
(4) two limit ribs that arrange in radiating copper sheet, one side has increased the intensity of radiating copper sheet, also heat-transfer pipe is played to position-limiting action on the other hand;
(5) be carved with different anti-misloading serial numbers near the position of four mounting holes, avoiding occurring in installation process misloading;
(6) radiating fin component is become to two kinds of different size manufactures, after first the radiating fin of specification of the same race being snapped together, oppositely be buckled into one by two groups again, the mode of this reverse fastening, has effectively avoided the phenomenon that the fastening point of radiating fin buckling surface protrudes to occur; And on first, second radiating fin, offer dexterously " U " shape groove, the heat-transfer pipe passage that all radiating fins snap together formation " U " shape passes through for heat-transfer pipe.
In sum, the utlity model has the features such as simple in structure, intensity is reliable, easy for installation, low cost of manufacture, compact, anti-misloading, effectively avoided the phenomenon that the fastening point of radiating fin buckling surface protrudes to occur.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the front view of radiating copper sheet assembly.
Fig. 3 is the rear view of Fig. 2.
Fig. 4 is the left view of Fig. 2.
Fig. 5 is the front elevation of radiating fin group in Fig. 1.
Fig. 6 is the stereographic map of Fig. 5.
Fig. 7 is the structural representation of single radiating fin in Fig. 5.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
A kind of general microcomputer cooling system as shown in Figure 1, is made up of radiating copper sheet assembly I, heat-transfer pipe II, radiating fin group III and fan IV four parts.It is not shown that radiating copper sheet assembly I is arranged on CPU() below, by heat-transfer pipe II, the heat of CPU is derived, then by the heat radiation of radiating fin group III, fan IV is cool ambient air and the heat exchange of radiating fin group III, thereby realizes the cooling of CPU.The above is consistent with traditional structure, does not repeat them here.
Difference is: Fig. 2---Figure 4 shows that radiating copper sheet assembly I, formed by a rectangle copper sheet 1 and two mounting bars 2.Mounting bar 2 is symmetricly set on the left and right sides of rectangle copper sheet 1, and mounting bar 2 adopts corrosion resistant plate to be stamped to form, to avoid corrosion in use procedure.The two ends, left and right of rectangle copper sheet 1 are riveted together with corresponding mounting bar 2 respectively, the each punching in two ends up and down of each mounting bar 2 has a heavy stand 2a, each heavy stand 2a upper punch has a mounting hole 2b and at least two mounting jaw 2c, and mounting jaw 2c is looped around heavy stand 2a periphery and perpendicular to heavy stand 2a plane.Shown in Fig. 1, on rectangle copper sheet 1, be provided with heat-transfer pipe installing zone 1a and two limit ribs 1b, heat-transfer pipe installing zone 1a is positioned at the middle part at rectangle copper sheet 1 back side, for heat-transfer pipe II is installed.Two limit ribs 1b are arranged in the left and right sides of heat-transfer pipe installing zone 1a, to the spacing II of heat-transfer pipe.The two ends up and down of rectangle copper sheet 1, with vertical bending edges 1c, just have the breach 1d of heat-transfer pipe installing zone 1a termination are passed through for heat-transfer pipe II on vertical bending edges 1c.
Radiating copper sheet assembly I is carved with different anti-misloading serial numbers in the position near four mounting hole 2b, and totally four anti-misloading serial number B, are respectively " 1 ", " 2 ", " 3 " and " 4 ", also can adopt other anti-misloading serial number.Four respectively corresponding four mounting hole 1a of anti-misloading serial number B.Anti-misloading serial number B is preferably engraved on mounting bar 2.
Preferably, rectangle copper sheet 1 is riveted together by upper and lower spaced three riveting point A with each mounting bar 2.
In conjunction with Fig. 5---shown in Fig. 7, radiating fin group III is made up of some the first radiating fins 11, some the second radiating fins 12, and the first radiating fin 11 and the second radiating fin 12 are the radiating fin of two kinds of different sizes.On the first radiating fin 11, the second radiating fin 12, have " U " shape groove.The first radiating fin 11 snaps together and forms the first radiating fin group in the mode of vertical stack, the second radiating fin 12 snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of the first radiating fin group and the second radiating fin group is relative and be buckled into one, fastens direction as shown by arrows in FIG..The first radiating fin group and the second radiating fin group adopt the reverse direction assembling fastening, and make the both ends of the surface of radiating fin group III not have button point protrusion.Preferably, the first radiating fin 11 equates with the height of the second radiating fin 12, and the first radiating fin 11 also equates with the width of the second radiating fin 12, makes associative perception stronger.The common heat-transfer pipe passage F that forms " U " shape of " U " shape groove of " U " shape groove of the first radiating fin 11 and the second radiating fin 12, heat-transfer pipe passage F passes through for heat-transfer pipe II.
Preferably, the aluminium sheet that the first radiating fin 11, the second radiating fin 12 are 0.2mm by thickness L1 is respectively stamped to form, and the thickness L2 of first, second radiating fin 11,12 is respectively 1.2mm.Aluminium sheet quality is light, simultaneously good heat dissipation effect.
Shown in Fig. 1, one end of heat-transfer pipe II is welded in the heat-transfer pipe installing zone 1a of radiating copper sheet assembly I, and between two limit ribs 1b, the other end of heat-transfer pipe II is arranged in the heat-transfer pipe passage F of radiating fin group III, fan IV is arranged on a side of radiating fin group III.Heat-transfer pipe II be positioned at rectangle copper sheet 1 under, and by two limit ribs 1b spacing.

Claims (3)

1. a general microcomputer cooling system, comprise radiating copper sheet assembly (I), heat-transfer pipe (II), radiating fin group (III) and fan (IV), it is characterized in that: described radiating copper sheet assembly (I) comprises rectangle copper sheet (1), be symmetricly set on the mounting bar (2) of rectangle copper sheet (1) left and right sides, described mounting bar (2) adopts corrosion resistant plate to be stamped to form, the two ends, left and right of described rectangle copper sheet (1) are riveted together with corresponding mounting bar (2) respectively, the each punching in two ends up and down of each mounting bar (2) has a heavy stand (2a), each heavy stand (2a) upper punch has a mounting hole (2b) and at least two mounting jaws (2c), described mounting jaw (2c) is looped around heavy stand (2a) periphery and perpendicular to heavy stand (2a) plane, on described rectangle copper sheet (1), be provided with heat-transfer pipe installing zone (1a) and two limit ribs (1b), described heat-transfer pipe installing zone (1a) is positioned at the middle part at rectangle copper sheet (1) back side, two limit ribs (1b) are arranged in the left and right sides of heat-transfer pipe installing zone (1a), the two ends up and down of described rectangle copper sheet (1) are with vertical bending edges (1c), just on described vertical bending edges (1c), have the breach (1d) of heat-transfer pipe installing zone (1a) termination is passed through for heat-transfer pipe (II), described radiating copper sheet assembly (I) is carved with different anti-misloading serial numbers (B) in the position near four mounting holes (2b),
Described radiating fin group (III) comprises the first radiating fin (11) and the second radiating fin (12), described the first radiating fin, the second radiating fin (11, 12) on, have " U " shape groove, described the first radiating fin (11) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (12) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, and the common heat-transfer pipe passage (F) that forms " U " shape of " U " shape groove of " U " shape groove of the first radiating fin (11) and the second radiating fin (12),
One end of described heat-transfer pipe (II) is welded in the heat-transfer pipe installing zone (1a) of radiating copper sheet assembly (I), and be positioned between two limit ribs (1b), the other end of heat-transfer pipe (II) is arranged in the heat-transfer pipe passage (F) of radiating fin group (III), and described fan (IV) is arranged on a side of radiating fin group (III).
2. according to general microcomputer cooling system claimed in claim 1, it is characterized in that: described rectangle copper sheet (1) is riveted together by upper and lower spaced three riveting points (A) with each mounting bar (2).
3. according to the general microcomputer cooling system described in claim 1 or 2, it is characterized in that: described anti-misloading serial number (B) is engraved on mounting bar (2).
CN201320802260.1U 2013-12-08 2013-12-08 Universal heat dissipation system for microcomputer Expired - Fee Related CN203689371U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320802260.1U CN203689371U (en) 2013-12-08 2013-12-08 Universal heat dissipation system for microcomputer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320802260.1U CN203689371U (en) 2013-12-08 2013-12-08 Universal heat dissipation system for microcomputer

Publications (1)

Publication Number Publication Date
CN203689371U true CN203689371U (en) 2014-07-02

Family

ID=51011249

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320802260.1U Expired - Fee Related CN203689371U (en) 2013-12-08 2013-12-08 Universal heat dissipation system for microcomputer

Country Status (1)

Country Link
CN (1) CN203689371U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140702

Termination date: 20141208

EXPY Termination of patent right or utility model