CN203689375U - Computer CPU heat radiating module with reversed buckle type heat radiating fin group - Google Patents
Computer CPU heat radiating module with reversed buckle type heat radiating fin group Download PDFInfo
- Publication number
- CN203689375U CN203689375U CN201320802294.0U CN201320802294U CN203689375U CN 203689375 U CN203689375 U CN 203689375U CN 201320802294 U CN201320802294 U CN 201320802294U CN 203689375 U CN203689375 U CN 203689375U
- Authority
- CN
- China
- Prior art keywords
- radiating fin
- heat radiating
- fin group
- heat
- transfer pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a computer CPU heat radiating module with a reversed buckle type heat radiating fin group. The computer CPU heat radiating module comprises a heat radiating copper sheet component, a heat transfer tube, a heat radiating fin group and a fan, wherein the heat radiating fin group (III) comprises first heat radiating fins (1) and second heat radiating fins (2), the first heat radiating fins are buckled together in a longitudinal stacking manner to form a first heat radiating fin group, the second heat radiating fins are buckled together in a longitudinal stacking manner to form a second heat radiating fin group, the tail ends of the first heat radiating fin group and the second heat radiating fin group are oppositely buckled into a whole, and a heat transfer tube arrangement space is formed on one side of the second heat radiating fin group. According to the computer CPU heat radiating module, the reversed buckling mode is adopted, so that the phenomenon about protruding of buckling points of buckling surfaces of the heat radiating fins can be avoided effectively.
Description
Technical field
The utility model relates to computer components technical field, is specifically related to a kind of for the heat radiation module on computer.
Background technology
Heat radiation module is requisite parts on notebook computer, is made up of radiating copper sheet assembly, heat-transfer pipe, radiating fin group and several parts of fan.Radiating fin group is the core component in heat radiation module, radiating copper sheet assembly is arranged on CPU below, by heat-transfer pipe, the heat of CPU is derived, dispel the heat by radiating fin group again, in heat radiation module, be also provided with fan, fan is cool ambient air and the heat exchange of radiating fin group, thereby realizes the cooling of CPU.
Existing radiating fin group is to be all made up of multiple radiating fins, conventionally snap together and form in the mode of vertical stack by a kind of radiating fin of specification, one sidewall of radiating fin is plane, and another sidewall is buckling surface, and a side of buckling surface has the fastening point of multiple protrusion buckling surfaces.After installation, there will be radiating fin group front end smooth, tail end fastens the phenomenon that point protrudes, and one side affects attractive in appearance, on the other hand also can scratch setter or damage computer inner body.
Utility model content
The purpose of this utility model is to provide a kind of computer CPU heat radiation module, can effectively avoid the tail end of radiating fin group to occur the phenomenon that button point protrudes.
For this reason, the technical scheme that the utility model adopts is: a kind of computer CPU heat radiation module with back-buckling type radiating fin group, comprise radiating copper sheet assembly (I), heat-transfer pipe (II), radiating fin group (III) and fan (IV), it is characterized in that: described radiating fin group (III) comprises the first radiating fin (1) and the second radiating fin (2), described the first radiating fin (1) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (2) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, described the first radiating fin (1) equates with the height of the second radiating fin (2), the width of the second radiating fin (2) is less than the width of the first radiating fin (1), thereby the side in the second radiating fin group forms heat-transfer pipe arrangement space (F),
It is upper that one end of described heat-transfer pipe (II) is welded on radiating copper sheet assembly (I), and the other end of heat-transfer pipe (II) is positioned at the heat-transfer pipe arrangement space (F) of radiating fin group (III), and described fan (IV) is arranged on a side of radiating fin group (III).
The beneficial effects of the utility model: radiating fin component is become to two kinds of different size manufactures, after first the radiating fin of specification of the same race being snapped together, oppositely be buckled into one by two groups again, the mode of this reverse fastening, has effectively avoided the phenomenon that the fastening point of radiating fin buckling surface protrudes to occur; And dexterously the width design of the second radiating fin is become to be less than the width of the first radiating fin, be used for arranging heat-transfer pipe thereby form heat-transfer pipe arrangement space in a side of the second radiating fin group, effectively avoided the phenomenon that the fastening point of radiating fin buckling surface protrudes to occur.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the front elevation of radiating fin group in Fig. 1.
Fig. 3 is the upward view of Fig. 2.
Fig. 4 is the stereographic map of Fig. 2.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
A kind of computer CPU heat radiation module with back-buckling type radiating fin group as shown in Figure 1, is made up of radiating copper sheet assembly I, heat-transfer pipe II, radiating fin group III and fan IV four parts.It is not shown that radiating copper sheet assembly I is arranged on CPU() below, by heat-transfer pipe II, the heat of CPU is derived, then by the heat radiation of radiating fin group III, fan IV is cool ambient air and the heat exchange of radiating fin group III, thereby realizes the cooling of CPU.The above is consistent with traditional structure, does not repeat them here.
Difference is: Fig. 2---shown in Fig. 4, radiating fin group III is made up of some the first radiating fins 1, some the second radiating fins 2, and the first radiating fin 1 and the second radiating fin 2 are the radiating fin of two kinds of different sizes.The first radiating fin 1 snaps together and forms the first radiating fin group in the mode of vertical stack, the second radiating fin 2 snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of the first radiating fin group and the second radiating fin group is relative and be buckled into one, fastens direction as shown by arrows in FIG..The first radiating fin group and the second radiating fin group adopt the reverse direction assembling fastening, and make the both ends of the surface of radiating fin group III not have button point protrusion.The first radiating fin 1 equates with the height of the second radiating fin 2, and the width of the second radiating fin 2 is less than the width of the first radiating fin 1, thereby forms heat-transfer pipe arrangement space F in a side of the second radiating fin group, and heat-transfer pipe arrangement space F passes through for heat-transfer pipe II.
Preferably, the aluminium sheet that the first radiating fin 1, the second radiating fin 2 are 0.2mm by thickness L1 is respectively stamped to form, and the thickness L2 of first, second radiating fin 1,2 is respectively 1.2mm.Aluminium sheet quality is light, simultaneously good heat dissipation effect.
Shown in Fig. 1, one end of heat-transfer pipe II is welded in radiating copper sheet assembly I, and the other end of heat-transfer pipe II is positioned at the heat-transfer pipe arrangement space F of radiating fin group III, and fan IV is arranged on a side of radiating fin group III.
Claims (2)
1. the computer CPU heat radiation module with back-buckling type radiating fin group, comprise radiating copper sheet assembly (I), heat-transfer pipe (II), radiating fin group (III) and fan (IV), it is characterized in that: described radiating fin group (III) comprises the first radiating fin (1) and the second radiating fin (2), described the first radiating fin (1) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (2) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, described the first radiating fin (1) equates with the height of the second radiating fin (2), the width of the second radiating fin (2) is less than the width of the first radiating fin (1), thereby the side in the second radiating fin group forms heat-transfer pipe arrangement space (F),
It is upper that one end of described heat-transfer pipe (II) is welded on radiating copper sheet assembly (I), and the other end of heat-transfer pipe (II) is positioned at the heat-transfer pipe arrangement space (F) of radiating fin group (III), and described fan (IV) is arranged on a side of radiating fin group (III).
2. according to the computer CPU heat radiation module with back-buckling type radiating fin group claimed in claim 1, it is characterized in that: the aluminium sheet that described the first radiating fin (1), the second radiating fin (2) are 0.2mm by thickness L1 is respectively stamped to form, the thickness L2 of described first, second radiating fin (1,2) is respectively 1.2mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320802294.0U CN203689375U (en) | 2013-12-08 | 2013-12-08 | Computer CPU heat radiating module with reversed buckle type heat radiating fin group |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320802294.0U CN203689375U (en) | 2013-12-08 | 2013-12-08 | Computer CPU heat radiating module with reversed buckle type heat radiating fin group |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203689375U true CN203689375U (en) | 2014-07-02 |
Family
ID=51011253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320802294.0U Expired - Fee Related CN203689375U (en) | 2013-12-08 | 2013-12-08 | Computer CPU heat radiating module with reversed buckle type heat radiating fin group |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203689375U (en) |
-
2013
- 2013-12-08 CN CN201320802294.0U patent/CN203689375U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN203689375U (en) | Computer CPU heat radiating module with reversed buckle type heat radiating fin group | |
CN203689374U (en) | Computer CPU radiating module with reversely buckled radiating fin group | |
CN203689406U (en) | Computer heat dissipating fin group | |
CN203706097U (en) | Fin group for heat dissipation of computer central processing unit (CPU) | |
CN203689322U (en) | Compact heat dissipation system for laptop | |
CN203689387U (en) | Heat dissipation system suitable for computer CPU | |
CN203689343U (en) | Property enhanced heat dissipation module for computer | |
CN203689348U (en) | Property enhanced heat dissipation system for computer | |
CN203689388U (en) | Simple computer CPU heat dissipation component | |
CN203689397U (en) | Simple type computer heat dissipation component | |
CN203689400U (en) | Simple type computer heat dissipation system | |
CN203689315U (en) | Novel heat dissipation system for computer | |
CN203706098U (en) | Mistaken assembly proofing reinforced computer radiating component | |
CN203689402U (en) | Universal heat dissipation component for microcomputer | |
CN203689407U (en) | Heat dissipation system for computer CPU | |
CN203689361U (en) | Heat dissipation system for computer | |
CN203689377U (en) | Computer radiating module with advantages of convenience in installation and compact structure | |
CN203689349U (en) | Heat dissipation module for computer | |
CN203706099U (en) | Mistaken assembly proofing reinforced computer radiating system | |
CN203689418U (en) | Heat dissipation component for notebook computer | |
CN203689371U (en) | Universal heat dissipation system for microcomputer | |
CN203689385U (en) | Heat dissipation system for notebook computer | |
CN203689414U (en) | Novel computer heat dissipation module | |
CN203689373U (en) | Compact heat dissipation component for laptop | |
CN203689383U (en) | Heat dissipation module for computer CPU |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20141208 |
|
EXPY | Termination of patent right or utility model |