CN203689375U - Computer CPU heat radiating module with reversed buckle type heat radiating fin group - Google Patents

Computer CPU heat radiating module with reversed buckle type heat radiating fin group Download PDF

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Publication number
CN203689375U
CN203689375U CN201320802294.0U CN201320802294U CN203689375U CN 203689375 U CN203689375 U CN 203689375U CN 201320802294 U CN201320802294 U CN 201320802294U CN 203689375 U CN203689375 U CN 203689375U
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China
Prior art keywords
radiating fin
heat radiating
fin group
heat
transfer pipe
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Expired - Fee Related
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CN201320802294.0U
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Chinese (zh)
Inventor
项彬
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Chongqing Qiaocheng Technology Development Co Ltd
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Chongqing Qiaocheng Technology Development Co Ltd
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Priority to CN201320802294.0U priority Critical patent/CN203689375U/en
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a computer CPU heat radiating module with a reversed buckle type heat radiating fin group. The computer CPU heat radiating module comprises a heat radiating copper sheet component, a heat transfer tube, a heat radiating fin group and a fan, wherein the heat radiating fin group (III) comprises first heat radiating fins (1) and second heat radiating fins (2), the first heat radiating fins are buckled together in a longitudinal stacking manner to form a first heat radiating fin group, the second heat radiating fins are buckled together in a longitudinal stacking manner to form a second heat radiating fin group, the tail ends of the first heat radiating fin group and the second heat radiating fin group are oppositely buckled into a whole, and a heat transfer tube arrangement space is formed on one side of the second heat radiating fin group. According to the computer CPU heat radiating module, the reversed buckling mode is adopted, so that the phenomenon about protruding of buckling points of buckling surfaces of the heat radiating fins can be avoided effectively.

Description

Computer CPU heat radiation module with back-buckling type radiating fin group
Technical field
The utility model relates to computer components technical field, is specifically related to a kind of for the heat radiation module on computer.
Background technology
Heat radiation module is requisite parts on notebook computer, is made up of radiating copper sheet assembly, heat-transfer pipe, radiating fin group and several parts of fan.Radiating fin group is the core component in heat radiation module, radiating copper sheet assembly is arranged on CPU below, by heat-transfer pipe, the heat of CPU is derived, dispel the heat by radiating fin group again, in heat radiation module, be also provided with fan, fan is cool ambient air and the heat exchange of radiating fin group, thereby realizes the cooling of CPU.
Existing radiating fin group is to be all made up of multiple radiating fins, conventionally snap together and form in the mode of vertical stack by a kind of radiating fin of specification, one sidewall of radiating fin is plane, and another sidewall is buckling surface, and a side of buckling surface has the fastening point of multiple protrusion buckling surfaces.After installation, there will be radiating fin group front end smooth, tail end fastens the phenomenon that point protrudes, and one side affects attractive in appearance, on the other hand also can scratch setter or damage computer inner body.
Utility model content
The purpose of this utility model is to provide a kind of computer CPU heat radiation module, can effectively avoid the tail end of radiating fin group to occur the phenomenon that button point protrudes.
For this reason, the technical scheme that the utility model adopts is: a kind of computer CPU heat radiation module with back-buckling type radiating fin group, comprise radiating copper sheet assembly (I), heat-transfer pipe (II), radiating fin group (III) and fan (IV), it is characterized in that: described radiating fin group (III) comprises the first radiating fin (1) and the second radiating fin (2), described the first radiating fin (1) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (2) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, described the first radiating fin (1) equates with the height of the second radiating fin (2), the width of the second radiating fin (2) is less than the width of the first radiating fin (1), thereby the side in the second radiating fin group forms heat-transfer pipe arrangement space (F),
It is upper that one end of described heat-transfer pipe (II) is welded on radiating copper sheet assembly (I), and the other end of heat-transfer pipe (II) is positioned at the heat-transfer pipe arrangement space (F) of radiating fin group (III), and described fan (IV) is arranged on a side of radiating fin group (III).
The beneficial effects of the utility model: radiating fin component is become to two kinds of different size manufactures, after first the radiating fin of specification of the same race being snapped together, oppositely be buckled into one by two groups again, the mode of this reverse fastening, has effectively avoided the phenomenon that the fastening point of radiating fin buckling surface protrudes to occur; And dexterously the width design of the second radiating fin is become to be less than the width of the first radiating fin, be used for arranging heat-transfer pipe thereby form heat-transfer pipe arrangement space in a side of the second radiating fin group, effectively avoided the phenomenon that the fastening point of radiating fin buckling surface protrudes to occur.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the front elevation of radiating fin group in Fig. 1.
Fig. 3 is the upward view of Fig. 2.
Fig. 4 is the stereographic map of Fig. 2.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
A kind of computer CPU heat radiation module with back-buckling type radiating fin group as shown in Figure 1, is made up of radiating copper sheet assembly I, heat-transfer pipe II, radiating fin group III and fan IV four parts.It is not shown that radiating copper sheet assembly I is arranged on CPU() below, by heat-transfer pipe II, the heat of CPU is derived, then by the heat radiation of radiating fin group III, fan IV is cool ambient air and the heat exchange of radiating fin group III, thereby realizes the cooling of CPU.The above is consistent with traditional structure, does not repeat them here.
Difference is: Fig. 2---shown in Fig. 4, radiating fin group III is made up of some the first radiating fins 1, some the second radiating fins 2, and the first radiating fin 1 and the second radiating fin 2 are the radiating fin of two kinds of different sizes.The first radiating fin 1 snaps together and forms the first radiating fin group in the mode of vertical stack, the second radiating fin 2 snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of the first radiating fin group and the second radiating fin group is relative and be buckled into one, fastens direction as shown by arrows in FIG..The first radiating fin group and the second radiating fin group adopt the reverse direction assembling fastening, and make the both ends of the surface of radiating fin group III not have button point protrusion.The first radiating fin 1 equates with the height of the second radiating fin 2, and the width of the second radiating fin 2 is less than the width of the first radiating fin 1, thereby forms heat-transfer pipe arrangement space F in a side of the second radiating fin group, and heat-transfer pipe arrangement space F passes through for heat-transfer pipe II.
Preferably, the aluminium sheet that the first radiating fin 1, the second radiating fin 2 are 0.2mm by thickness L1 is respectively stamped to form, and the thickness L2 of first, second radiating fin 1,2 is respectively 1.2mm.Aluminium sheet quality is light, simultaneously good heat dissipation effect.
Shown in Fig. 1, one end of heat-transfer pipe II is welded in radiating copper sheet assembly I, and the other end of heat-transfer pipe II is positioned at the heat-transfer pipe arrangement space F of radiating fin group III, and fan IV is arranged on a side of radiating fin group III.

Claims (2)

1. the computer CPU heat radiation module with back-buckling type radiating fin group, comprise radiating copper sheet assembly (I), heat-transfer pipe (II), radiating fin group (III) and fan (IV), it is characterized in that: described radiating fin group (III) comprises the first radiating fin (1) and the second radiating fin (2), described the first radiating fin (1) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (2) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, described the first radiating fin (1) equates with the height of the second radiating fin (2), the width of the second radiating fin (2) is less than the width of the first radiating fin (1), thereby the side in the second radiating fin group forms heat-transfer pipe arrangement space (F),
It is upper that one end of described heat-transfer pipe (II) is welded on radiating copper sheet assembly (I), and the other end of heat-transfer pipe (II) is positioned at the heat-transfer pipe arrangement space (F) of radiating fin group (III), and described fan (IV) is arranged on a side of radiating fin group (III).
2. according to the computer CPU heat radiation module with back-buckling type radiating fin group claimed in claim 1, it is characterized in that: the aluminium sheet that described the first radiating fin (1), the second radiating fin (2) are 0.2mm by thickness L1 is respectively stamped to form, the thickness L2 of described first, second radiating fin (1,2) is respectively 1.2mm.
CN201320802294.0U 2013-12-08 2013-12-08 Computer CPU heat radiating module with reversed buckle type heat radiating fin group Expired - Fee Related CN203689375U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320802294.0U CN203689375U (en) 2013-12-08 2013-12-08 Computer CPU heat radiating module with reversed buckle type heat radiating fin group

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320802294.0U CN203689375U (en) 2013-12-08 2013-12-08 Computer CPU heat radiating module with reversed buckle type heat radiating fin group

Publications (1)

Publication Number Publication Date
CN203689375U true CN203689375U (en) 2014-07-02

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CN201320802294.0U Expired - Fee Related CN203689375U (en) 2013-12-08 2013-12-08 Computer CPU heat radiating module with reversed buckle type heat radiating fin group

Country Status (1)

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CN (1) CN203689375U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140702

Termination date: 20141208

EXPY Termination of patent right or utility model