CN203688711U - Bare board test fixture - Google Patents
Bare board test fixture Download PDFInfo
- Publication number
- CN203688711U CN203688711U CN201320889184.2U CN201320889184U CN203688711U CN 203688711 U CN203688711 U CN 203688711U CN 201320889184 U CN201320889184 U CN 201320889184U CN 203688711 U CN203688711 U CN 203688711U
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- Prior art keywords
- needle plate
- plate
- probe
- floor
- end layer
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- 238000012360 testing method Methods 0.000 title claims abstract description 21
- 239000000523 sample Substances 0.000 claims abstract description 46
- 230000001681 protective effect Effects 0.000 claims description 26
- 238000012856 packing Methods 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 3
- 238000011056 performance test Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model relates to a piece of electric performance test equipment of a semiconductor device and specifically relates to a bare board test fixture which comprises a base, a spring tube guard plate adhered to the base, a first layer probe plate adhered to the spring tube guard plate, a lower layer probe plate adhered to a PCB plate, multiple middle probe plates disposed between the first layer probe plate and the bottom layer probe plate, a strut, gaskets and probes, wherein the strut passes through the first layer probe plate, the multiple middle probe plates and the bottom layer probe plate in sequence, the gaskets are disposed among the adjacent first layer probe plate, the multiple middle probe plates and the bottom layer probe plates, the probes pass through multiple probe holes in the spring tube guard plate, the first layer probe plate, the multiple middle probe plates and the bottom layer probe plate in sequence to get in contact with the PCB plate, the first layer probe plate and the bottom layer probe plate have the same structure and respectively comprise an external fastening area and a center reduction area, and the probe holes of the probes are disposed inside the reduction area. With the technical scheme in the utility model, the probes can be inserted more smoothly, bending of the probes is reduced and working efficiency is also increased.
Description
Technical field
The utility model relates to a kind of electric performance test equipment of semiconductor devices, is specifically related to a kind of bare board testing tool.
Background technology
Bare board testing, claims again " on off test ", is particularly important key link in quality inspection after whole circuit board process, because it is the electric-examination test step that guarantees client's original design cyberrelationship, key property practicality.Bare board testing tool divides one side tool and two-sided tool, and described pcb board is arranged on the downside of one side tool, is arranged on the centre of two-sided tool, and the one side to pcb board or two sides are tested as required.As shown in Figure 1, current tool generally comprises base 11, be fitted in the bourdon tube backplate 12 on base 11, be arranged on the some parallel needle plate 13 on bourdon tube backplate 12, pillar 14, packing ring 15 and probe 16, described pillar 14 is successively through needle plate 13, packing ring 15 is arranged between neighbouring needle plate 13, control the distance between upper and lower needle plate 13, probe 16 passes through the corresponding pin hole on bourdon tube backplate 12 and needle plate 13, touch the pcb board 17 of probe 16 bottoms, in needle plate 13, first floor needle plate and bourdon tube backplate 12 fit, in needle plate 13, end layer needle plate and pcb board 17 fit, in order to guarantee tool intensity, protection pcb board is injury-free, therefore first floor needle plate and end layer needle plate require to have certain thickness, thickness than all the other needle plates is thick.
Because the different probes 14 that make tool of density of the spring needle reticular density on needle plate 11 and the test point on pcb board must have certain slope, and there is certain thickness in first floor needle plate and end layer needle plate, therefore probe 14 is more difficult in the time of first floor needle plate and end layer needle plate, in the time pressing down tool, the easy deflection of probe 14, bending, impact is used.
Utility model content
Technical problem to be solved in the utility model is the interspersed difficulty of probe, in order to overcome above deficiency, provides a kind of bare board testing tool.
In order to solve the problems of the technologies described above, the technical solution of the utility model is: described bare board testing tool, comprise base, be fitted in the bourdon tube backplate on base, be fitted in the first floor needle plate of bourdon tube backplate, end layer needle plate with pcb board laminating, be arranged on the multiple middle needle plate between first floor needle plate and end layer needle plate, pillar, packing ring and probe, described pillar is successively through first floor needle plate, needle plate and end layer needle plate in the middle of multiple, described packing ring is arranged on adjacent first floor needle plate, between multiple middle needle plates and end layer needle plate, probe is successively through bourdon tube backplate, first floor needle plate, corresponding pin hole in the middle of multiple on needle plate and end layer needle plate, touch pcb board, described first floor needle plate is identical with end layer needle plate structure, comprise respectively peripheral fastening zone and the thinning area at center, the pin hole of described probe is arranged in thinning area.First floor needle plate and layer needle plate central area, end attenuate, contribute to probe to pass smoothly.
Preferably, described thinning area flushes with fastening zone near the one side of bourdon tube backplate or pcb board, described thinning area away from the one side of bourdon tube backplate or pcb board lower than fastening zone.
Preferably, described first floor needle plate is fitted with protective shield away from the one side of bourdon tube backplate, and described end layer needle plate is fitted with protective shield away from the one side of pcb board.Increase after protective shield and meet probe smoothly by having guaranteed again the sufficient intensity of first floor needle plate and end layer needle plate, in case weigh pcb board while pressing down wounded.
Preferably, be arranged in corresponding fastening zone through the pillar of first floor needle plate and end layer needle plate, and in the middle of adjacent, packing ring between needle plate is arranged in corresponding fastening zone.
Preferably, the thickness of described protective shield is 0.3-0.5mm, and the thickness of described thinning area is 0.5mm, and the thickness of described fastening zone is 2.5-3.0mm, and the thickness of described middle needle plate is 1mm.
Preferably, the pin hole on described first floor needle plate, multiple middle needle plate and end layer needle plate successively becomes large.Can effectively prevent that like this probe stress deformation of arranging intensive from causing being in contact with one another and getting rusty.
The technical scheme that the utility model provides is by first floor needle plate and end layer needle plate attenuate and increase corresponding backplate, makes probe can run through very smoothly each needle plate, makes to insert under probe more clear and more coherent, promotes work efficiency when reducing probe bending.
Accompanying drawing explanation
Fig. 1 is the structural representation that in prior art, bare board detects tool;
Fig. 2 is the structural representation of bare board testing tool described in embodiment 1;
Fig. 3 is the cut-open view of the layer needle plate of end described in embodiment 1;
Fig. 4 is the structural representation of bare board testing tool described in embodiment 2.
Shown in figure:
11-base, 12-bourdon tube backplate, 13-needle plate, 14-pillar, 15-packing ring, 16-probe, 17-PCB plate;
21-first floor needle plate, 22-the first protective shield, needle plate in the middle of 23-first, needle plate in the middle of 24-second, needle plate in the middle of 25-the 4th, 26-the second protective shield, 27-end layer needle plate, 271-fastening zone, 272-thinning area, 31-the first packing ring, 32-the second packing ring, 33-the 3rd packing ring, 34-the 4th packing ring, the upper tool of 41-, tool under 42-.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail:
Embodiment 1
As shown in Figure 2, described bare board testing tool, comprises the base 11 setting gradually from top to bottom, be fitted in the bourdon tube backplate 12 on base 11, be fitted in the first floor needle plate 21 of bourdon tube backplate 12, first protective shield 22 of fitting with first floor needle plate 21, needle plate 23 in the middle of first, needle plate 24 in the middle of second, needle plate 25 in the middle of the 4th, the second protective shield 26, the end layer needle plate 27 of fitting with the second protective shield 26, pcb board 15 and the pillar 14 of fitting with end layer needle plate 27, packing ring and probe 16, described pillar 14 is successively through first floor needle plate 21, the first protective shield 22, needle plate 23 in the middle of first, needle plate 24 in the middle of second, needle plate 25 in the middle of the 4th, the second protective shield 26 and end layer needle plate 27, in the middle of described the first protective shield 22 and first, between needle plate 23, be provided with the first packing ring 31, in the middle of described first, in the middle of needle plate 23 and second, between needle plate 24, be provided with the second packing ring 32, in the middle of described second, in the middle of needle plate 24 and the 3rd, between needle plate 25, be provided with the 3rd packing ring 33, in the middle of the described the 3rd, between needle plate 25 and the second protective shield 26, be provided with the 4th packing ring 34, probe 16 is successively through bourdon tube backplate 12, first floor needle plate 21, the first protective shield 22, needle plate 23 in the middle of first, needle plate 24 in the middle of second, needle plate 25 in the middle of the 4th, corresponding pin hole on the second protective shield 26 and end layer needle plate 27, touches pcb board 17.
As shown in Figures 2 and 3, described first floor needle plate 21 is identical with end layer needle plate 27 structures, take end layer needle plate 27 as example, comprise the thinning area 272 at peripheral 271He center, fastening zone, the pin hole of described probe 16 is arranged in thinning area 272, described thinning area 272 flushes with fastening zone 271 near the one side of pcb board 17, described thinning area 272 away from the one side of pcb board 17 lower than fastening zone 271, that is to say that thinning area 272 is downward attenuates of upper surface of relative fastening zone 271, then paste the second protective shield 26, and first floor needle plate 21 is oppositely arranged with end layer needle plate 27, that is to say the upwards attenuate of lower surface of the fastening zone 271 of the thinning area 272 relative first floor needle plates 21 of first floor needle plate 21, then paste the first protective shield 22.Pillar 14 through first floor needle plate 21 and end layer needle plate 27 is arranged in corresponding fastening zone 271, and the first packing ring 31 and the 4th packing ring 34 are arranged on first protective shield 22 and the second protective shield 26 of 271 regions, corresponding fastening zone.
As shown in Figures 2 and 3, in the middle of described first floor needle plate 21, the first protective shield 22, the first middle needle plate 23, the second middle needle plate 24, the 3rd, the pin hole on needle plate 25, the second protective shield 26 and end layer needle plate 27 successively becomes large.The thickness of described the first protective shield 22 and the second protective shield 26 is 0.3mm, the thickness d of described thinning area 272 is 0.5mm, the D thickness of described fastening zone 271 is 2.5mm, in the middle of described first, in the middle of needle plate 23, the second middle needle plate 24 and the 3rd, the thickness of needle plate 25 is 1mm, the thickness of described the first packing ring 31, the second packing ring 32 and the 3rd packing ring 33 is 8.5mm, and the thickness of described the 4th packing ring 34 is 3.2mm.
Embodiment 2
As shown in Figure 4, bare board testing tool described in the utility model, it is two-sided tool, between upper tool 41 and lower tool 42, pcb board 15 is set, the structure of upper tool 41 and lower tool 42 is referring to the tool of embodiment 1, wherein go up the end layer needle plate 27 of tool 41 in lower side, the end layer needle plate 27 of lower tool 42 be in top side, namely goes up tool 41 and lower tool 42 is oppositely arranged.It is pointed out that tool 41 and lower tool 42 can be all structure described in embodiment 1, can one of them be also structure described in embodiment 1.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to including these changes and modification.
Claims (6)
1. a bare board testing tool, comprise base, be fitted in the bourdon tube backplate on base, be fitted in the first floor needle plate of bourdon tube backplate, end layer needle plate with pcb board laminating, be arranged on the multiple middle needle plate between first floor needle plate and end layer needle plate, pillar, packing ring and probe, described pillar is successively through first floor needle plate, needle plate and end layer needle plate in the middle of multiple, described packing ring is arranged on adjacent first floor needle plate, between multiple middle needle plates and end layer needle plate, probe is successively through bourdon tube backplate, first floor needle plate, corresponding pin hole in the middle of multiple on needle plate and end layer needle plate, touch pcb board, it is characterized in that, described first floor needle plate is identical with end layer needle plate structure, comprise respectively peripheral fastening zone and the thinning area at center, the pin hole of described probe is arranged in thinning area.
2. a kind of bare board testing tool according to claim 1, is characterized in that, described thinning area flushes with fastening zone near the one side of bourdon tube backplate or pcb board, described thinning area away from the one side of bourdon tube backplate or pcb board lower than fastening zone.
3. a kind of bare board testing tool according to claim 2, is characterized in that, described first floor needle plate is fitted with protective shield away from the one side of bourdon tube backplate, and a described end layer needle plate is fitted with protective shield away from the one side of pcb board.
4. a kind of bare board testing tool according to claim 1, is characterized in that, be arranged in corresponding fastening zone, and in the middle of adjacent, packing ring between needle plate is arranged in corresponding fastening zone through the pillar of first floor needle plate and end layer needle plate.
5. a kind of bare board testing tool according to claim 3, is characterized in that, the thickness of described protective shield is 0.3-0.5mm, and the thickness of described thinning area is 0.5mm, and the thickness of described fastening zone is 2.5-3.0mm, described in the middle of the thickness of needle plate be 1mm.
6. according to the arbitrary described a kind of bare board testing tool of claim 1, it is characterized in that, the pin hole on described first floor needle plate, multiple middle needle plate and end layer needle plate successively becomes large.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320889184.2U CN203688711U (en) | 2013-12-31 | 2013-12-31 | Bare board test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320889184.2U CN203688711U (en) | 2013-12-31 | 2013-12-31 | Bare board test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203688711U true CN203688711U (en) | 2014-07-02 |
Family
ID=51010596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320889184.2U Expired - Lifetime CN203688711U (en) | 2013-12-31 | 2013-12-31 | Bare board test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203688711U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461699A (en) * | 2018-01-22 | 2018-08-28 | 苏州速安行新能源科技有限公司 | Easily detection cell connector |
-
2013
- 2013-12-31 CN CN201320889184.2U patent/CN203688711U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461699A (en) * | 2018-01-22 | 2018-08-28 | 苏州速安行新能源科技有限公司 | Easily detection cell connector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140702 |