CN203679535U - Laser cutting system under liquid - Google Patents
Laser cutting system under liquid Download PDFInfo
- Publication number
- CN203679535U CN203679535U CN201320533514.4U CN201320533514U CN203679535U CN 203679535 U CN203679535 U CN 203679535U CN 201320533514 U CN201320533514 U CN 201320533514U CN 203679535 U CN203679535 U CN 203679535U
- Authority
- CN
- China
- Prior art keywords
- platform
- laser cutting
- axis displacement
- laser
- displacement platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model relates to a laser cutting system under liquid. The laser cutting system comprises a Y-axis displacement platform, an X-axis displacement platform, a Z-axis displacement platform, a workpiece suction disc, a laser focusing assembly and a liquid containing box, wherein the laser focusing assembly is arranged above the workpiece suction disc; the workpiece suction disc is connected with the Z-axis displacement platform; the Z-axis displacement platform is arranged above the Y-axis displacement platform; the workpiece suction disc is arranged in the liquid containing box and can ascend and descend in the liquid containing box. According to the laser cutting system under the liquid provided by the utility model, blanking or drilling cutting under the liquid carried out on the workpiece to be machined can achieve the cold machining effect same as the cold machining effect of a picosecond laser, so that the quality of the notch edge of the workpiece can be improved, the damage caused by splashing of cut chips can be prevented, and the yield is greatly improved.
Description
Technical field
The utility model relates to Laser cutting field, relates in particular to the Laser cutting system under a kind of liquid.
Background technology
Laser cutting technique has now become a kind of industrial processes technology of maturation, except traditional using metal outside the main object of cutting, in meticulous micro-processed glass field, glass, pottery, sapphire, silicon etc. are that the cutting technique of cutting object is also more and more abundanter.You find Supreme Being by laser in the process of research; cutting at present not only requires the edge-smoothing of cutting; without micro-fractures; reduce local stress on material and easily cause product fragmentation; improve the yield rate of cutting; also need cut material to protect, prevent from that the smear metal producing in cutting from splashing cut workpiece is caused to scuffing.
Utility model content
The utility model embodiment technical problem to be solved is, provides a kind of edge to collapse limit amount little, improved the notching edge quality of workpiece, the Laser cutting system under the liquid that equipment cost declines to a great extent simultaneously.
Described Laser cutting system, comprises that two dimension moves platform, Z axis displacement platform, workpiece sucker, Laser Focusing assembly, liquid bearing box; Described Laser Focusing assembly is located at described workpiece sucker top, described workpiece sucker is connected with described Z axis displacement platform, described Z axis displacement platform is located at described two dimension and is moved platform top, and described workpiece sucker is placed in liquid bearing box, can in liquid bearing box, rise and decline.
Described two dimension is moved platform and is comprised that X-axis moves platform, y-axis shift platform, and wherein said X-axis moves platform and described y-axis shift platform is horizontally disposed with, and passes through driven by servomotor.
Described workpiece sucker is negative-pressure adsorption structure.
Implement the utility model embodiment, there is following beneficial effect:
Laser cutting system applies under a kind of liquid of the utility model embodiment is particularly carried out cutting processing with the panel of ink in overall contact panel, finds that ink area can be cut the bits scuffing of splashing in the time of cutting research; In laser cutting sawing sheet boring procedure, adopt the utility model cutting process method can prevent the smear metal damage causing of splashing, yields is significantly promoted; Adopt nanosecond laser cutting also can reach the cold working effect that picosecond laser is the same, it is little that edge collapses limit amount, improved the notching edge quality of workpiece, and equipment cost declines to a great extent simultaneously.
Accompanying drawing explanation
Fig. 1 is the Laser cutting system architecture schematic diagram under the utility model embodiment liquid;
Fig. 2 completes product after the utility model embodiment contact panel entirety Laser cutting;
Fig. 3 is the utility model embodiment contact panel entirety Laser cutting workpiece.
The specific embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, the utility model is described in further detail.
The utility model embodiment illustrates the specific embodiment with Fig. 3 contact panel entirety Laser cutting, apply laser cutting method of the present utility model to laser sawing sheet or boring cutting under Fig. 3 contact panel entirety Laser cutting workpiece liquid, concrete implementation step is as follows: whole workpiece panel is particularly placed in to water or the water with additive with the panel of ink, regulate diced system nanosecond laser, laser is the one in 355 nm or 532nm or 1064nm, focus is placed on line of cut, under liquid, workpiece is carried out to sawing sheet or boring cutting, adopt this cutting process method can prevent the smear metal damage causing of splashing, yields is significantly promoted, adopt nanosecond laser cutting also can reach the cold working effect that picosecond laser is the same, it is little that edge collapses limit amount, improved the notching edge quality of workpiece, and equipment cost declines to a great extent simultaneously.
As shown in Figure 1, the utility model also provides and has also related to Laser cutting system under liquid, comprises Y-axis displacement platform 100, X-axis displacement platform 200, Z axis displacement platform 300, workpiece sucker 400, Laser Focusing assembly 500, liquid bearing box 600;
The Laser Focusing assembly 500 of focus lamp structure or galvanometer structure is located at described workpiece sucker 400 tops, workpiece sucker 400 is connected with Z axis displacement platform 300, Z axis displacement platform 300 is located at described Y-axis displacement platform 100 tops, the workpiece sucker 400 of negative-pressure adsorption structure is placed in liquid bearing box 600, can in liquid bearing box 600, rise and decline, wherein X-axis is moved platform 200 and is horizontally disposed with y-axis shift platform 100, and drives in X-axis, Y-axis by servomotor.
After being illustrated in figure 2 contact panel entirety Laser cutting, complete product, a, receiver hole; B, navigation hole; C, fillet; D, ink area;
When use, workpiece is placed on the workpiece sucker 400 of liquid bearing box 600, then, by X, Y, Z axis displacement platform adjusting position, Laser Focusing assembly 500 is focused on line of cut, under liquid, workpiece is cut.
Above disclosed is only a kind of preferred embodiment of the utility model, certainly can not limit with this interest field of the utility model, and the equivalent variations of therefore doing according to the utility model claim, still belongs to the scope that the utility model is contained.
Claims (4)
1. the Laser cutting system under liquid, is characterized in that, comprises that two dimension moves platform, Z axis displacement platform, workpiece sucker, Laser Focusing assembly, liquid bearing box; Described Laser Focusing assembly is located at described workpiece sucker top, described workpiece sucker is connected with described Z axis displacement platform, described Z axis displacement platform is located at described two dimension and is moved platform top, and described workpiece sucker is placed in liquid bearing box, can in liquid bearing box, rise and decline.
2. the Laser cutting system under liquid according to claim 1, is characterized in that, described two dimension is moved platform and comprised that X-axis moves platform, y-axis shift platform, and wherein said X-axis moves platform and described y-axis shift platform is horizontally disposed with, and passes through driven by servomotor.
3. the Laser cutting system under liquid according to claim 1, is characterized in that, described workpiece sucker is negative-pressure adsorption structure.
4. the Laser cutting system under liquid according to claim 1, is characterized in that, Laser Focusing assembly is focus lamp structure or galvanometer structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320533514.4U CN203679535U (en) | 2013-08-29 | 2013-08-29 | Laser cutting system under liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320533514.4U CN203679535U (en) | 2013-08-29 | 2013-08-29 | Laser cutting system under liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203679535U true CN203679535U (en) | 2014-07-02 |
Family
ID=51001494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320533514.4U Expired - Lifetime CN203679535U (en) | 2013-08-29 | 2013-08-29 | Laser cutting system under liquid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203679535U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433628A (en) * | 2013-08-29 | 2013-12-11 | 武汉帝尔激光科技有限公司 | Laser cutting method and laser cutting system under liquid |
-
2013
- 2013-08-29 CN CN201320533514.4U patent/CN203679535U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433628A (en) * | 2013-08-29 | 2013-12-11 | 武汉帝尔激光科技有限公司 | Laser cutting method and laser cutting system under liquid |
| CN103433628B (en) * | 2013-08-29 | 2016-08-10 | 武汉帝尔激光科技有限公司 | Laser scribe processing method under a kind of liquid and system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203019938U (en) | Multifunctional engraving machine | |
| CN203918126U (en) | Gear-hobbing machine apparatus for automatically removing burr | |
| CN103949779A (en) | Efficient sapphire sheet cutting technology | |
| CN105750736A (en) | Laser cutting method for double-layer glass | |
| CN203863356U (en) | Thread cutting machine capable of conducting drilling and tapping at same time | |
| CN104816088B (en) | A kind of plate with laser excision forming feeding device | |
| CN203679535U (en) | Laser cutting system under liquid | |
| CN101920441B (en) | Processing method of upper die and lower die of die | |
| CN103433628A (en) | Laser cutting method and laser cutting system under liquid | |
| CN203018531U (en) | Device for cutting burr of mobilephone camera module | |
| CN204725226U (en) | A kind of auxiliary recovery unit of drilling machine cutting fluid | |
| CN105116581A (en) | Display screen cutting technology | |
| CN103420600A (en) | Laser cutting machining method and system for transparent workpiece | |
| CN204162887U (en) | A kind of ultrasonic wave bead cutter | |
| CN203495296U (en) | Through hole processing device convenient to remove chips | |
| CN205020855U (en) | Cross axle processingequipment for automobile rear drive | |
| CN203316777U (en) | Numerical-control deep hole drilling machine for machining cooling holes of glass bottle molds | |
| CN204397051U (en) | A kind of horizontal internal broaching machine for carbide alloy wire pulling method | |
| CN202952752U (en) | Multifunctional engraving machine | |
| CN103395978B (en) | The circular hole diced system and cutting method of a kind of panel workpiece | |
| CN203683374U (en) | Laser cutting and processing system for transparent workpieces | |
| CN205021995U (en) | Die -cut integral type tool of hot melt | |
| CN204977095U (en) | 2. 5D optical glass panel in vertical position processing tool | |
| CN203696218U (en) | Numerical control plasma steel angle cutting machine | |
| CN204019286U (en) | Remove the mould of burr on bicycle front fork |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 430000 Hubei city of Wuhan province Optics Valley Industrial Park of East Lake Development Zone, Shiyuan two Road No. four Patentee after: WUHAN DR LASER TECHNOLOGY Co.,Ltd. Address before: 430000 Hubei city of Wuhan province Optics Valley Industrial Park of East Lake Development Zone, Shiyuan two Road No. four Patentee before: WUHAN DR LASER TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20140702 |
|
| CX01 | Expiry of patent term |