CN203668360U - Biological chip encapsulating structure - Google Patents
Biological chip encapsulating structure Download PDFInfo
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- CN203668360U CN203668360U CN201320735611.1U CN201320735611U CN203668360U CN 203668360 U CN203668360 U CN 203668360U CN 201320735611 U CN201320735611 U CN 201320735611U CN 203668360 U CN203668360 U CN 203668360U
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Abstract
A biological chip encapsulating structure comprises a biological chip, a cavity wall, a capping layer, a tape layer, a third substrate and a leading wire, wherein an induction area and a bonding pad surrounding the induction area are arranged on the upper surface of the biological chip; the cavity wall is arranged on the upper surface of the biological chip between the induction area and the bonding pad, surrounds the induction area, and forms a cavity on the induction area; the capping layer is arranged on the top surface of the cavity wall to seal the opening of the cavity and comprises one or more outlets and inlets, which are all communicated with the cavity; the tape layer is arranged on the top surface of the capping layer to seal the openings at one ends of the outlets and the inlets; a circuit is formed on the third substrate; the upper surface of the third substrate is in press fit with the lower surface of the biological chip; the leading wire electrically connects the bonding pad on the biological chip with the circuit on the third substrate. The induction area of the encapsulating structure provided by the utility model cannot be polluted or damaged.
Description
Technical field
The utility model relates to encapsulation technology, particularly a kind of biochip encapsulating structure.
Background technology
In recent years, along with engineered development, determined the Nucleotide series of the soft colour solid group of various organisms.In order to obtain the bioinformation of biological sample, and various biochips (such as: DNA chip) also arise at the historic moment, biochip becomes the instrument being widely used in the process of the various biological samples of test.The principle of biochip is the biochemical reaction utilizing between reference material and target material, judges the bioinformation of target material.
In actual production and using, in order to prevent the contaminated of biochip or to damage, need to encapsulate biochip, form biochip encapsulating structure, biochip encapsulating structure provides inner reaction compartment for biochemical reaction.
The existing biochip encapsulation technology being widely used is traditional single chips encapsulation, on chip, forms some biochips, then wafer is cut apart and is formed discrete one single chip, then to one single chip encapsulating one by one.Visible, existing biochip encapsulation technology is comparatively complicated, and cost is higher and efficiency is very low.In addition, in the encapsulation process of biochip, biochip is to be exposed in outside environment, very easily biochip is caused damage or is polluted.
Utility model content
The problem that the utility model solves is how to prevent that the chip in the encapsulation process of biochip from polluting.
For addressing the above problem, the utility model provides a kind of encapsulating structure of biochip, comprising: biochip, has induction zone and the pad around described induction zone on the upper surface of described biochip; Cavity wall, on the upper surface of the biochip between induction zone and pad, cavity wall, around described induction zone, forms cavity on induction zone; Capping layer, is positioned at the top surface of cavity wall, and the opening of enclosed cavity, has at least one export and import in described capping layer, and export and import communicates with cavity; Adhesive tape layer, is positioned at the top surface of capping layer, seals an end opening of described export and import; The 3rd substrate, is formed with circuit on the 3rd substrate, the 3rd upper surface of substrate and the laminating of the lower surface of biochip; Lead-in wire, is electrically connected the pad on biochip with the circuit on the 3rd substrate.
Optionally, the material of described cavity wall is macromolecule organic material.
Optionally, described macromolecule organic material is epoxy resin, polyimide, benzocyclobutene or polybenzoxazoles.
Optionally, the material of described capping layer is glass, silicon or pottery.
Optionally, described adhesive tape layer is UV dispergation adhesive tape or pyrolysis glue adhesive tape.
Optionally, in each encapsulating structure, the quantity of described biochip is multiple.
Optionally, on described adhesive tape layer, also there is protective layer.
Optionally, the material of described protective layer is photoresist material.
Compared with prior art, the technical solution of the utility model has the following advantages:
The encapsulating structure of the utility model biochip comprises cavity wall, capping layer and adhesive tape layer, described cavity wall is around described induction zone, capping layer is positioned at the top surface of cavity wall, the opening of enclosed cavity, in described capping layer, there is at least one export and import, export and import communicates with cavity, adhesive tape layer is positioned at the top surface of capping layer, seal an end opening of described export and import, pass through cavity wall, capping layer and adhesive tape layer are by the induction zone sealing of biochip, the induction zone that prevents biochip is polluted or is damaged, ensure the detection sensitivity of biochip, stability and the reliability of encapsulating structure are improved.
Further, on described adhesive tape layer, have protective layer, described protective layer can prevent the damage of adhesive tape layer.
Brief description of the drawings
Fig. 1～Figure 10 is the structural representation of the encapsulation process of the utility model embodiment biochip.
Embodiment
Say as background technology, prior art is in the time encapsulating biochip, and manufacture craft is comparatively complicated, and efficiency is low, and easily contaminated or damage of biochip.
For this reason, the utility model provides a kind of biochip encapsulating structure, by the induction zone sealing of biochip, prevents that the induction zone of biochip from being polluted or damaging by cavity wall, capping layer and adhesive tape layer.
For above-mentioned purpose of the present utility model, feature and advantage can more be become apparent, below in conjunction with accompanying drawing, specific embodiment of the utility model is described in detail.In the time that the utility model embodiment is described in detail in detail, for ease of explanation, schematic diagram can be disobeyed general ratio and be done local amplification, and described schematic diagram is example, and it should not limit protection domain of the present utility model at this.In addition in actual fabrication, should comprise, the three-dimensional space of length, width and the degree of depth.
Fig. 1～Figure 10 is the structural representation of the encapsulation process of the utility model embodiment biochip.
First, please refer to Fig. 1 and Fig. 2, Fig. 2 is the cross-sectional view of Fig. 1 along line of cut AB direction, and first substrate 100 is provided, the upper surface of described first substrate 100 is formed with some biochips, and described biochip comprises induction zone 101 and the pad 102 around described induction zone 101.
In this enforcement, described first substrate 100 can be wafer, and the material of first substrate 100 can be silicon, SiGe, silicon carbide etc.Described first substrate 100 comprises the some chip area 11 of ranks arrangement and cutting groove regions 12 between chip area 11 of being, described chip area 11 is used to form biochip, follow-uply along cutting groove region 12, first substrate 100 is cut and forms several discrete crystal grain, each crystal grain is corresponding forms a biochip.
In other embodiment of the present utility model, the material of described first substrate can also be glass, quartz, pottery, nylon membrane or plastic film etc.
Some biochips are formed on first substrate, described biochip can be for gene expression profile, the very easily detection of somatotype, sudden change or polymorphic (as single nucleotide polymorphism), described biochip also can be for the analysis of protein or peptide, and described biochip can also be used for the detection of the screening of potential drug and the research and development of novel drugs and preparation etc.
Each biochip comprises the induction zone 101 being arranged on chip area 11 and pad 102(or the probe that is connected to induction zone 101), described induction zone 101 can directly be connected with pad 102, also can connect by interconnection structure between the two.In specific embodiment, induction zone 101 can be in hybridization analysis resistant to hydrolysis and the stable material of substrate make, for example: can be contacted by the phosphoric acid salt when being 6～9 with pH value or buffer reagent is that the stable material of substrate is made.In specific embodiment, described induction zone 101 can comprise: silicon oxide layer, as TEOS layer, high density plasma oxide layer or the thermal oxide layer etc. of plasma body enhancing; Silicate layer, as silicic acid hafnium layer or zirconium silicate layer etc.; Metal oxide layer by layer, as titanium oxide layer, alumina layer, alumina layer, hafnium oxide layer or indium tin oxide layer etc.; Polyimide; Polyamine; Metal, as gold and silver or palladium etc.; Or polymkeric substance, as polystyrene, polyacrylic ester or polyethylene etc.The type of described pad 102 can change according to the project of the kind of biological specimen to be tested and test.
In the present embodiment, described induction zone 101 is positioned at the mid-way of chip area 11, and described pad 102 is positioned at the marginal position of chip area 11.In other embodiments, the position of described pad and induction zone also can be adjusted flexibly according to cabling requirement.
In the present embodiment, the independent setting of pad 102 of different chip areas 11.In other embodiments, the pad in adjacent chips region is connected, and described pad is crossed over cutting groove region, because can cut hold after encapsulation completes in cutting groove region, cut the opening of pad in described leap cutting groove region, therefore can not affect the performance of any one biochip.
Then, with reference to figure 3, provide second substrate 200, in described second substrate 200, be formed with some imports 21 and outlet 22; Upper surface at second substrate 200 forms adhesive tape film 202, an end opening of the 202 sealing outlets 21 of adhesive tape film and import 22.
The material of described second substrate 200 can be glass, silicon or pottery etc.Can in second substrate 200, form by the etching technics in laser boring or manufacture of semiconductor outlet 21 and import 22.
Described second substrate 200 can be transparent or opaque, for example, be while utilizing the fluorescent material detection method of visible ray and/or UV light when treating the data analysis (hybridization analysis) of detection of biological sample, described second substrate 200 is printing opacity, concrete, the material of described second substrate 200 can be soda-lime glass.
Follow-up by second substrate 200 and first substrate pressing, and form capping layer by cutting second substrate, capping layer is for sealing the cavity on induction zone, to protect the induction zone of biochip and to form the passage of reaction chamber.Described outlet 21 and import 22 communicate with the cavity (or reaction chamber) forming on follow-up induction zone, and outlet 21 and import 22 are for being incorporated into fluid (as biological sample, washing soln or nitrogen etc.) cavity of follow-up formation or the removal fluid from cavity (as biological sample, washing soln or nitrogen etc.).The quantity of described outlet 21 and import 22 is at least 1, in specific embodiment, an outlet 21 and an import 22 can be only set; An import 22 also can be set, multiple outlets 21; 22, one outlets 21 of multiple imports also can be set; Multiple imports 22 also can be set, multiple outlets 21.
In second substrate 200, form after outlet 21 and import 22, upper surface at described second substrate 200 forms adhesive tape film 202, described adhesive tape film 202 is for sealing the opening of outlet 21 and import 22 one end, prevent contacting of cavity on induction zone and outside atmosphere, follow-up second substrate 200 on cutting and etching pad and when bonding coat, can prevent that induction zone is exposed in outside atmosphere by cavity and outlet 21 and import 22, prevent that induction zone is contaminated or damage.
Described adhesive tape film 202 can be UV dispergation adhesive tape or pyrolysis glue adhesive tape or other suitable materials, and described adhesive tape film 202 can be formed on by modes such as direct stickup, plastic roll, press molds the upper surface of second substrate 200.In the present embodiment; adhesive tape film 202 encapsulation process in protect induction zone not contaminated or damage; forming after biochip encapsulating structure; described adhesive tape film 202 can remove very easily by the mode of UV rayed or heating; to expose outlet 21 and import 22; adhesive tape film 202 can form very easily, and very easily removes, the forming process of adhesive tape film 202 and remove process and can induction zone not polluted or be damaged.
In other embodiment of the present utility model, can also on described adhesive tape film, form protective membrane, the protective membrane between adjacent cavities is removed in following adopted cutting, adhesive tape film, the bonding coat of second substrate and segment thickness, form the cavity wall around described induction zone, be positioned at the capping layer of cavity wall top surface enclosed cavity, and the upper surface that is positioned at capping layer seals the adhesive tape layer of an end opening of export and import, and be positioned at the protective layer on adhesive tape layer, described protective layer can adopt plasma dry degumming process to remove remaining adhesion-layer materials on pad, while exposing pad surperficial, adhesive tape layer on tamper seal cap rock can not sustain damage.
The material of described protective membrane can be photoresist material, and the formation technique of protective membrane is spin coating proceeding, spraying coating process or film coating process, and the formation technique of protective membrane simply and not can cause damage to adhesive tape film.In other embodiment of the present utility model, described protective membrane can also be other suitable materials and form technique.
Then, please refer to Fig. 4, on the lower surface of second substrate 200, form bonding coat 205, in described bonding coat 205, there are some cavitys 201, each cavity 201 expose at least one outlet 21 and import 22 of in second substrate 200, forming.
Described bonding coat 205 is for please refer to Fig. 2 by first substrate 100() and second substrate 200 be bonded together, described cavity 201 is as the reaction chamber of biochip.
The technique that forms described bonding coat 205 is screen printing, and its process is: first by the lower surface of the web plate laminating second substrate 200 with some openings, the position of the bonding coat 205 forming on the lower surface of the position of opening and second substrate 200 is corresponding; In the opening of web plate, fill adhesion-layer materials; Remove web plate, on the lower surface of second substrate 200, form bonding coat 205, in bonding coat 205, form cavity 201.In other embodiment of the present utility model, also can form described bonding coat 205 and cavity 201 by photoetching process, detailed process is to adopt dry film or wet film technique to form bonding coat on the lower surface of second substrate, then bonding coat is carried out to photoetching process (comprise exposure and develop), in bonding coat, form cavity.
The material of described bonding coat 205 is macromolecule organic material, and described macromolecule organic material is epoxy resin, polyimide, benzocyclobutene or polybenzoxazoles etc., and in the present embodiment, the material of described bonding coat 205 is epoxy resin.
In other embodiment of the present utility model, please refer to Fig. 5 and Fig. 6, Fig. 5 is the plan structure schematic diagram of the part-structure of Fig. 6, in second substrate 200, form after at least one outlet 21 and import 22, then form the adhesive tape layer 202 that covers described second substrate 200 upper surfaces, described adhesive tape layer 202 seals an end opening of described outlet 21 and import 22, then, on the lower surface of second substrate 200, form bonding coat 205, in described bonding coat 205, there is cavity 201, the bottom-exposed of cavity 201 goes out at least one outlet 21 and import 22 of in second substrate 200, forming, on the relative two side of described cavity 201, also there is respectively the first wall extension 207 and the second wall extension 208 to cavity 201 interior extensions, the first wall extension 207 and the second wall extension 208 are parallel to each other, the elongated end of the first wall extension 207 or the second wall extension 208 does not contact with relative sidewall, the elongated end subregion C of the elongated end of the first wall extension 207 and the second wall extension 208 is overlapping, described outlet 21 and import 22 lay respectively in the second substrate 200 of the first wall extension 207 and the second wall extension 208 remaining cavity 201 tops, both sides.The first wall extension 207 and the second wall extension 208 form in the time adopting screen printing or photoetching process to form bonding coat 205 and cavity 201 simultaneously, in the utility model embodiment, form the first wall extension 207 and the second wall extension 208 to cavity 201 interior extensions by the sidewall at cavity 201, the first wall extension 207 and the second wall extension 208 are divided into cavity 201 in the region of " S " type, follow-up by the upper surface of the lower surface of second substrate 200 and first substrate when bonding coat 205 pressing, make induction zone be positioned at cavity 201, the first wall extension 207 and the second wall extension 208 in cavity 201 are pressed together on part induction zone, the first wall extension 207 and the second wall extension 208 are also divided into induction zone the region of " S " type, when from import 22 to the interior introducing fluid of cavity 201 (as biological sample, washing soln or nitrogen etc.) after, fluid is along the zone flows of " S " type of induction zone, and can be from exporting 21 sucking-offs, therefore define fluid mobile path on induction zone by forming the first wall extension 207 and the second wall extension 208, be conducive to improve the sensitivity of biochip test.
In other embodiment of the present utility model, the quantity of described the first wall extension 207 and the second wall extension 208 can be multiple, on the relative sidewall that is distributed in cavity 201 that multiple the first wall extensions 207 replace with the second wall extension 208.
In other embodiment of the present utility model, described the first wall extension 207 and the second wall extension 208 can adopt other distribution or arrangement mode.
With reference to figure 7, by bonding coat 205 pressings, make induction zone 101 be positioned at cavity 201 upper surface of the lower surface of second substrate 200 and first substrate 100.
By bonding coat 205, second substrate 200 and adhesive tape film 202, the induction zone of biochip 101 and outside atmosphere are isolated, first substrate 100 can pass through the direct pressing of bonding coat 205 with second substrate 200, there is not solution or corrosive gases etc. in pressing process, can induction zone 101 not polluted or be damaged, and in follow-up encapsulation process, induction zone 101 and outside atmosphere isolation (or sealing completely), also can not be polluted or be damaged.
Then, please refer to Fig. 8, cutting is removed on pad 102 and cutting groove region 12 the adhesive tape film 202(of (or first substrate 100 on) between adjacent cavities 201 with reference to figure 7), the bonding coat 205 of second substrate 200 and segment thickness, form around the cavity wall 204 of described induction zone 101, be positioned at the capping layer 206 of cavity wall 204 top surface enclosed cavities 201 and be positioned at the upper surface sealing outlet 21 of capping layer 206 and the adhesive tape layer 203 of an end opening of import 22.
The bonding coat 205 that cuts described adhesive tape film 202, second substrate 200 and segment thickness adopts blade cuts technique, than dry method or wet-etching technology, employing blade cuts process efficiency is high, technique simple, it is little to pollute, adopt low activity and the detection sensitivity that can not destroy induction zone of cutting technique temperature, and adopt blade cuts without according to material selective etching gas to be etched or etching solution, adopt blade cuts technique also without forming mask layer, can prevent damage or pollution to induction zone 101 in the time forming mask layer and remove mask layer.In the present embodiment, adopt blade to cut the second substrate 200 of adhesive tape film 202 and segment thickness.
In the present embodiment, after cutting completes, on first substrate 100(between adjacent cavities 201 or pad 102 and cutting groove region 12) bonding coat 205 materials of upper remainder thickness, prevent that the cutting of crossing in cutting process from causing damage to pad 102, remaining bonding coat 205 materials on the follow-up first substrate 100 that can pass through between plasma dry degumming process or laser degumming process removal adjacent cavities 201.
In the present embodiment, the thickness that remains bonding coat 205 between adjacent cavities 201 on the first substrate 100 in (or on pad 102 and cutting groove region 12) is less than 20 microns, reduce the burden of subsequent etching technique, to reduce the etching of the bonding coat 205 to cavity wall 204 etchings and cavity wall 204 bottoms in etching process.
Then, please refer to Fig. 9, (or first substrate 100 on) between adjacent cavities 201 upper remaining bonding coat 205 materials (with reference to figure 8) on etching pad 102 and cutting groove region 12, expose the surface in the surface of pad 102 and the cutting groove region 11 of first substrate 100.
Remaining bonding coat 205 materials of etching adopt anisotropic plasma dry degumming process, the gas that described plasma dry degumming process adopts is oxygen, oxygen forms plasma body under the effect of radio frequency power, and plasma body carries out etching to remaining bonding coat 205 materials on first substrate 100.Because the material of cavity wall 204, pad 102 and adhesive tape layer 203 is not identical with respect to the material of bonding coat 205, dry method is removed photoresist in process, less to the etch amount of adhesive tape layer 203 and cavity wall 204, and less to the damage of pad 102.In etching process, due to the protection of cavity wall 204, adhesive tape layer 203 and bonding coat 205, induction zone 101 can not sustain damage or pollute.
In other embodiment of the present utility model, also can adopt laser degumming process to remove remaining bonding coat 205 materials (with reference to figure 8) on etching pad 102 and cutting groove region 12, expose the surface in the surface of pad 102 and the cutting groove region 11 of first substrate 100.
Laser degumming process is using light laser as thermal source, bonding coat 205 materials to be heated, bonding coat 205 materials are rapidly heated, the bonding coat 205 material generating gasification in laser radiation region, described gasification can be direct physical gasification or chemical reaction gasification.Concrete, the process that laser ablation is removed remaining bonding coat 205 materials on pad 102 is: in remaining bonding coat 205 materials of the laser focusing of laser head transmitting on pad 102; Laser head moves back and forth with respect to the first substrate 100, removes remaining bonding coat 205 materials on pad 102, exposes the surface of pad 102.Adopt laser ablation just can optionally remove bonding coat 205 materials on pad without forming mask, can not bring damage to adhesive tape layer 203 and cavity wall 204, ensure the integrity of adhesive tape layer 203 and cavity wall 204, better to protect induction zone 101 can not to be damaged or to stain in follow-up encapsulation process, and, while adopting laser degumming process, the heat that laser produces only can accumulate in the bonding coat 205 on pad 102, heat effects when induction zone 101 can not be subject to laser and removes photoresist, thereby the whole laser process of removing photoresist is chilling process, can not exert an influence to the detection sensitivity of induction zone, laser ablation is noncontact etching in addition, byproduct of reaction is gaseous state, pollute little.
Described laser degumming process is divided into repeatedly laser ablation, each laser ablation is removed remaining bonding coat 205 materials of segment thickness, until expose the surface of pad 102, and to reach good removal effect, second substrate 200 materials on clean removal pad 102.
Laser ablation in laser degumming process is for repeatedly time, and the power of laser ablation is identical or not identical each time.In the present embodiment, the number of times of described laser ablation at least comprises laser ablation and for the second time laser ablation for the first time, laser ablation is removed the adhesion-layer materials of segment thickness for the first time, form groove, laser ablation is removed bottom portion of groove remaining adhesion-layer materials for the second time, forms the opening that exposes bond pad surface, the laser power when power of laser when the first laser ablation is greater than laser ablation for the second time, in adhesion-layer materials on clean removal pad, reduce the damage to pad.The thickness of the adhesion-layer materials of removing when the thickness of the adhesion-layer materials of removing when the first laser ablation is greater than the second laser ablation, improves the efficiency while removing adhesion-layer materials.
Finally, please refer to Figure 10, along cutting groove region 12 by first substrate 100(with reference to figure 9) cut apart (or cutting first substrate 100 between adjacent pad 102), form single biochip 106; By the upper surface laminating of the lower surface of biochip 106 and the 3rd substrate 300; Pad on biochip 106 102 is electrically connected by lead-in wire 301 with the circuit (not shown) on the 3rd substrate 300, thus the encapsulating structure 104 of formation biochip.
To the division process of first substrate 100, the attaching process of first substrate 100 and the 3rd substrate 300, and Bonding forms lead-in wire 301 technique and please refer to existing technique, do not repeat them here.
The biochip encapsulating structure that the utility model embodiment also provides a kind of above-mentioned method for packing to form, please refer to Figure 10, comprising:
Biochip 106, has induction zone 101 and the pad 102 around described induction zone 101 on described biochip 106 upper surfaces;
Capping layer 206, is positioned at the top surface of cavity wall 204, and the opening of enclosed cavity 201 has at least one outlet 21 and import 22 in described capping layer 206, and outlet 21 and import 22 communicate with cavity 201;
On the 3rd substrate 300, the three substrates 300, be formed with circuit (not shown), the lower surface laminating of the upper surface of the 3rd substrate 300 and biochip 106;
Lead-in wire 301, is electrically connected the pad on biochip 106 102 with the circuit on the 3rd substrate 300.
Concrete, the material of described cavity wall 204 is macromolecule organic material, described macromolecule organic material is epoxy resin, polyimide, benzocyclobutene or polybenzoxazoles etc.
The material of described capping layer 206 is glass, silicon or pottery.
Described adhesive tape layer 203 can be UV dispergation adhesive tape or pyrolysis glue adhesive tape or other suitable rubber belt materials.
In each encapsulating structure 104, the quantity of described biochip 106 can be multiple.
On described adhesive tape layer 203, also have protective layer (not shown), the material of described protective layer is photoresist material or other suitable materials.
To sum up, the biochip encapsulating structure of the utility model embodiment, by the sealing induction zone of cavity wall, capping layer and adhesive tape layer; prevent that induction zone is outside exposed; thereby in the encapsulation process of biochip, protection biochip, prevents that induction zone from being polluted or damaging.
Although the utility model discloses as above, the utility model is not defined in this.Any those skilled in the art, not departing from spirit and scope of the present utility model, all can make various changes or modifications, and therefore protection domain of the present utility model should be as the criterion with claim limited range.
Claims (8)
1. an encapsulating structure for biochip, is characterized in that, comprising:
Biochip, induction zone and the pad around described induction zone on the upper surface of described biochip;
Cavity wall, on the upper surface of the biochip between induction zone and pad, cavity wall, around described induction zone, forms cavity on induction zone;
Capping layer, is positioned at the top surface of cavity wall, and the opening of enclosed cavity, has at least one export and import in described capping layer, and export and import communicates with cavity;
Adhesive tape layer, is positioned at the top surface of capping layer, seals an end opening of described export and import;
The 3rd substrate, is formed with circuit on the 3rd substrate, the 3rd upper surface of substrate and the laminating of the lower surface of biochip;
Lead-in wire, is electrically connected the pad on biochip with the circuit on the 3rd substrate.
2. the encapsulating structure of biochip as claimed in claim 1, is characterized in that, the material of described cavity wall is macromolecule organic material.
3. the encapsulating structure of biochip as claimed in claim 2, is characterized in that, described macromolecule organic material is epoxy resin, polyimide, benzocyclobutene or polybenzoxazoles.
4. the encapsulating structure of biochip as claimed in claim 1, is characterized in that, the material of described capping layer is glass, silicon or pottery.
5. the encapsulating structure of biochip as claimed in claim 1, is characterized in that, described adhesive tape layer is UV dispergation adhesive tape or pyrolysis glue adhesive tape.
6. the encapsulating structure of biochip as claimed in claim 1, is characterized in that, in each encapsulating structure, the quantity of described biochip is multiple.
7. the encapsulating structure of biochip as claimed in claim 1, is characterized in that, also has protective layer on described adhesive tape layer.
8. the encapsulating structure of biochip as claimed in claim 7, is characterized in that, the material of described protective layer is photoresist material.
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| CN201320735611.1U CN203668360U (en) | 2013-11-19 | 2013-11-19 | Biological chip encapsulating structure |
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| CN201320735611.1U CN203668360U (en) | 2013-11-19 | 2013-11-19 | Biological chip encapsulating structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103589631A (en) * | 2013-11-19 | 2014-02-19 | 苏州晶方半导体科技股份有限公司 | Biological chip packaging structure and packaging method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103589631A (en) * | 2013-11-19 | 2014-02-19 | 苏州晶方半导体科技股份有限公司 | Biological chip packaging structure and packaging method |
| CN103589631B (en) * | 2013-11-19 | 2015-04-22 | 苏州晶方半导体科技股份有限公司 | Biological chip packaging structure and packaging method |
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Granted publication date: 20140625 Effective date of abandoning: 20150422 |