CN203665304U - Grinding disc for ultra-thin wafer - Google Patents
Grinding disc for ultra-thin wafer Download PDFInfo
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- CN203665304U CN203665304U CN201320684462.0U CN201320684462U CN203665304U CN 203665304 U CN203665304 U CN 203665304U CN 201320684462 U CN201320684462 U CN 201320684462U CN 203665304 U CN203665304 U CN 203665304U
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- Prior art keywords
- abrasive disk
- ring gear
- toroidal cavity
- thin wafer
- disk
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Abstract
The utility model relates to the field of wafer cutting, and particularly discloses a grinding disc for an ultra-thin wafer. The grinding disc for the ultra-thin wafer comprises a grinding disc body, wherein an internal-tooth type outer ring gear is arranged at the periphery of the grinding disc body, an external-tooth type inner ring gear is arranged on the grinding disc body, the external-tooth type inner ring gear and the grinding disc body are arranged in a concentric mode, a shaft hole which is arranged in a through mode is formed in the middle of the outer ring gear, a shaft hole which is arranged in a through mode is formed in the middle of the inner ring gear, a circular-ring-shaped groove is formed in the grinding disc body along the outer side of the inner ring gear in a digging mode, and a plurality of flow guiding grooves are formed in the circular-ring-shaped groove. According to the grinding disc for the ultra-thin wafer, wafer abrasion can be reduced, and the percent of pass of the optical wafer can be increased.
Description
Technical field
The utility model relates to wafer grinding manufacture field, relates in particular to a kind of for ultra thin optical wafer being carried out to the abrasive disk of attrition process.
Background technology
Quartz wafer is the electronic devices and components of manufacturing frequency generation and controlling use, the thickness same frequency of quartz wafer is inversely proportional to, and the wafer of quartz crystal after cutting, be according to the designing requirement of wafer, flood to fixed thickness together, then reach fixed frequency through excessive erosion and could use.Therefore, grinding is the critical process in wafer process.
In the time wafer being carried out to grinding and polishing processing, conventionally need to use grinder.Abrasive disk is topmost workpiece in grinder, and when grinding wafers, plural wafer is waxed and sticked to be placed on abrasive disk, then is arranged at this abrasive disk the attenuate operation of carrying out wafer grinding in corresponding grinder.Each eyeglass can take out abrasive disk in by machine after grinding.
Optical crystal chip is in attrition process at present, and the abrasive disk adopting in industry is all made up of cast iron or carbon steel, and its weight is heavier, so in the process of processing, easily cause the extruding of optical crystal chip, produces scratch, reduces the qualification rate of optical crystal chip.If without this operation of attrition process, optical crystal chip can not reach ultra-thin requirement, therefore, be necessary existing abrasive disc structure to improve.
Utility model content
The purpose of this utility model is, proposes a kind of ultra thin wafer abrasive disk, and it can reduce wafer wearing and tearing, improves the qualification rate of optical crystal chip.
For achieving the above object, the utility model provides a kind of ultra thin wafer abrasive disk, it comprises: an abrasive disk disk body, the periphery of this abrasive disk disk body is provided with the outer ring gear of inner tooth type, this abrasive disk disk body is provided with the inner ring gear of the external tooth type of a concentric setting, and the centre position place of this outer ring gear and inner ring gear is equipped with and always wears the axis hole of putting; On described abrasive disk disk body, draw and be provided with a toroidal cavity along inner ring gear outside, in this toroidal cavity, be provided with several guiding gutter.
Wherein, described abrasive disk disk body can adopt ferrous material to be made.
Or described abrasive disk disk body can adopt synthetic plastic to be made.
In the utility model, described abrasive disk disk body thickness is about 23mm-25mm, and inner ring gear height is about 19mm-25mm, and the degree of depth of toroidal cavity is about 4mm-7mm.
Concrete, described abrasive disk disk body thickness can be 24mm, and inner ring gear height can be 22mm, and the degree of depth of toroidal cavity can be 6mm.
Moreover, the diameter of described abrasive disk disk body is about 370mm-390mm, and internal ring gear wheel diameter is about 200mm-205mm, and the diameter of axis hole is about 138mm-142mm, the internal diameter of toroidal cavity is identical with internal ring gear wheel diameter, and the external diameter of this toroidal cavity is about 350mm-355mm.
Concrete, the diameter of described abrasive disk disk body can be 385mm, and internal ring gear wheel diameter can be 204mm, and the diameter of axis hole can be 139mm, and the internal diameter of toroidal cavity is identical with internal ring gear wheel diameter, and the external diameter of this toroidal cavity can be 352mm.
In the utility model, described guiding gutter comprises several cannelure that stretches out along the center of circle of toroidal cavity and arrange, and several radial slot arranging along the radial direction of toroidal cavity, and setting is connected between this cannelure and radial slot.
Optionally, on described toroidal cavity, can also be provided with a grinding layer, described several guiding gutter is located on this grinding layer, this guiding gutter comprises several cannelure that stretches out along the center of circle of toroidal cavity and arrange, and several radial slot arranging along the radial direction of toroidal cavity, setting is connected between this cannelure and radial slot.
Several cannelure described in the utility model is concentric circles setting, and all equidistant settings between per pass cannelure, are equidistant setting between described several radial slot, and the degree of depth of this cannelure and radial slot is 2.5mm-2.8mm.
Ultra thin wafer abrasive disk of the present utility model, it is being guaranteed under the prerequisite of original abrasive disk precision, fall part annular region by the upper surface at abrasive disk disk body with numerical control lathe wheeled litter, reach the object that alleviates abrasive disk weight, greatly promoted the qualification rate that ultra thin wafer grinds; Simultaneously, its guiding gutter is according to erratic star wheel traffic direction, adopts the particular design of cannelure and radial slot, can reduce greatly the broken wafers of optical crystal chip edge and original intersecting parallels guiding gutter grazing generation, thereby can reduce wafer wearing and tearing, improve the qualification rate of optical crystal chip.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of a kind of specific embodiment of ultra thin wafer abrasive disk of the present utility model;
Fig. 2 is the generalized section along A-A direction in Fig. 1.
The specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1, 2, the utility model provides a kind of ultra thin wafer abrasive disk, it comprises: an abrasive disk disk body 10, the periphery of this abrasive disk disk body 10 is provided with the outer ring gear 11 of inner tooth type, this abrasive disk disk body 10 is provided with the inner ring gear 20 of the external tooth type of a concentric setting, and this outer ring gear 11 and inner ring gear 20 centre position places are equipped with and always wear the axis hole 30 of putting; On described abrasive disk disk body 10, draw and be provided with a toroidal cavity 12 along inner ring gear 20 outsides, in this toroidal cavity 12, be provided with several guiding gutter (not shown).The utility model is in the time of concrete use, can fix by the turning cylinder (not shown) of axis hole 30 and a grinder, this turning cylinder is provided with keyway, axis hole 30 is interior can be arranged at the spline that this keyway matches, and optical crystal chip to be processed is positioned on the toroidal cavity 12 of abrasive disk disk body 10 and carries out grinding and polishing.
Wherein, described abrasive disk disk body 10 can adopt ferrous material to be made.Or as a kind of preferred embodiment of the present utility model, described abrasive disk disk body 10 can adopt synthetic plastic to be made.This synthetic plastic is take resin (or using monomer direct polymerization in process) as main component, take additives such as plasticizer, filler, lubricant, colouring agents as auxiliary element, the material of energy flowing forming in process, it is the middle abrasive disk that adopts cast iron or carbon steel to make compared to existing technology, greatly reduce hardness and the weight of material, can reduce to act on pressure and the frictional force of wafer surface in the time of wafer grinding, make wafer be not easy to occur cut and because of stressed excessive fragmented situation in the time grinding.
In the utility model, described abrasive disk disk body 10 thickness are about 23mm-25mm, and inner ring gear 20 is highly about 19mm-25mm, and the degree of depth of toroidal cavity 12 is about 4mm-7mm.As one of the present utility model optionally, described abrasive disk disk body 10 thickness can be 24mm, and inner ring gear 20 can be highly 22mm, and the degree of depth of toroidal cavity 12 can be 6mm.Pressure wafer being born in the time grinding due to the weight of grinding plays a decisive role, in order to improve the qualification rate of ultra thin wafer processing, we to abrasive disk under the prerequisite of guaranteeing original precision, constantly repeatedly design, test, by the upper surface at abrasive disk disk body 10, fall part annular region with numerical control lathe wheeled litter, to form a toroidal cavity 12, thereby reach the object that alleviates abrasive disk weight, greatly promoted the qualification rate that ultra thin wafer grinds.
In the utility model specific embodiment, the diameter of described abrasive disk disk body 10 is about 370mm-390mm, inner ring gear 20 diameters are about 200mm-205mm, the diameter of axis hole 30 is about 138mm-142mm, the internal diameter of toroidal cavity 12 is identical with inner ring gear 20 diameters, and the external diameter of this toroidal cavity 12 is about 350mm-355mm.Optionally, the diameter of described abrasive disk disk body 10 can be 385mm, and inner ring gear 20 diameters can be 204mm, and the diameter of axis hole 30 can be 139mm, the internal diameter of toroidal cavity 12 is identical with inner ring gear 20 diameters, and the external diameter of this toroidal cavity 12 can be 352mm.
Because abrasive disk need to be used in conjunction with lapping liquid, therefore the groove that is conventionally provided with several intersecting parallels setting at abrasive disk upper surface in prior art is to make guide functions, the groove quantity that this intersecting parallels structure arranges is very many, thereby has increased the broken wafers that between Waffer edge and intersecting parallels groove, grazing produces.And guiding gutter in the utility model comprises several cannelure that stretches out along the center of circle of toroidal cavity 12 and arrange, and several radial slot (not shown) arranging along the radial direction of toroidal cavity 12, setting is connected between this cannelure and radial slot.The structure setting of the cannelure that this employing of the utility model is novel and radial slot, its guiding gutter makes into by the setting of erratic star wheel traffic direction, can reduce greatly the broken wafers that optical crystal chip edge and original intersecting parallels guiding gutter grazing produce, thereby reduce wafer wearing and tearing, improved the qualification rate of optical crystal chip.In the utility model specific embodiment, described several cannelure is concentric circles setting, all equidistant settings between per pass cannelure.Between described several radial slot, be equidistant setting.In the utility model specific embodiment, the degree of depth of described cannelure and radial slot is about 2.5mm-2.8mm.Preferably, the degree of depth of described cannelure and radial slot can be all 2.6mm.As the selective embodiment of one of the present utility model, described cannelure and radial slot can adopt the square groove mode of right-angle structure to arrange.As the selective embodiment of another kind of the present utility model, this cannelure and radial slot can also adopt the mode of the U-shaped groove of inner round and smooth setting to arrange, and can reduce to a certain extent like this grazing between Waffer edge and guiding gutter.
Moreover, because abrasive disk all can produce wearing and tearing in use for some time, affect Grinding Quality, if integral replacing abrasive disk, cost is higher, causes the raising on cost.Based on above-mentioned consideration, the utility model can also be provided with a grinding layer (not shown) on described toroidal cavity 12, described several guiding gutter is located on this grinding layer, this guiding gutter comprises several cannelure that stretches out along the center of circle of toroidal cavity and arrange, and several radial slot arranging along the radial direction of toroidal cavity, setting is connected between this cannelure and radial slot.The independently design of grinding layer of this employing of the utility model, in the time producing wearing and tearing, only needs to change separately grinding layer, can reduce production costs to a great extent like this, avoids waste of material.As a kind of preferred embodiment of the present utility model, can also, by be coated with the mode of one deck macromolecule epoxy resin layer as protective layer on grinding layer, further extend the service life of abrasive disk.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (10)
1. a ultra thin wafer abrasive disk, it is characterized in that, comprise an abrasive disk disk body, the periphery of this abrasive disk disk body is provided with the outer ring gear of inner tooth type, this abrasive disk disk body is provided with the inner ring gear of the external tooth type of a concentric setting, and the centre position place of this outer ring gear and inner ring gear is equipped with and always wears the axis hole of putting; On described abrasive disk disk body, draw and be provided with a toroidal cavity along inner ring gear outside, in this toroidal cavity, be provided with several guiding gutter.
2. ultra thin wafer abrasive disk as claimed in claim 1, is characterized in that, described abrasive disk disk body adopts ferrous material to be made.
3. ultra thin wafer abrasive disk as claimed in claim 1, is characterized in that, described abrasive disk disk body adopts synthetic plastic to be made.
4. ultra thin wafer abrasive disk as claimed in claim 1, is characterized in that, described abrasive disk disk body thickness is 23mm-25mm, and inner ring gear height is 19mm-25mm, and the degree of depth of toroidal cavity is 4mm-7mm.
5. ultra thin wafer abrasive disk as claimed in claim 4, is characterized in that, described abrasive disk disk body thickness is 24mm, and inner ring gear height is 22mm, and the degree of depth of toroidal cavity is 6mm.
6. ultra thin wafer abrasive disk as claimed in claim 1, it is characterized in that, the diameter of described abrasive disk disk body is 370mm-390mm, internal ring gear wheel diameter is 200mm-205mm, the diameter of axis hole is 138mm-142mm, the internal diameter of toroidal cavity is identical with internal ring gear wheel diameter, and the external diameter of this toroidal cavity is 350mm-355mm.
7. ultra thin wafer abrasive disk as claimed in claim 6, is characterized in that, the diameter of described abrasive disk disk body is 385mm, internal ring gear wheel diameter is 204mm, the diameter of axis hole is 139mm, and the internal diameter of toroidal cavity is identical with internal ring gear wheel diameter, and the external diameter of this toroidal cavity is 352mm.
8. ultra thin wafer abrasive disk as claimed in claim 1, it is characterized in that, described guiding gutter comprises several cannelure that stretches out along the center of circle of toroidal cavity and arrange, and several radial slot arranging along the radial direction of toroidal cavity, and setting is connected between this cannelure and radial slot.
9. ultra thin wafer abrasive disk as claimed in claim 1, it is characterized in that, described toroidal cavity is provided with a grinding layer, described several guiding gutter is located on this grinding layer, this guiding gutter comprises several cannelure that stretches out along the center of circle of toroidal cavity and arrange, and several radial slot arranging along the radial direction of toroidal cavity, setting is connected between this cannelure and radial slot.
10. the ultra thin wafer abrasive disk as described in claim 8 or 9 any one, it is characterized in that, described several cannelure is concentric circles setting, all equidistant settings between per pass cannelure, between described several radial slot, be equidistant setting, the degree of depth of this cannelure and radial slot is 2.5mm-2.8mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320684462.0U CN203665304U (en) | 2013-10-31 | 2013-10-31 | Grinding disc for ultra-thin wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320684462.0U CN203665304U (en) | 2013-10-31 | 2013-10-31 | Grinding disc for ultra-thin wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203665304U true CN203665304U (en) | 2014-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320684462.0U Expired - Fee Related CN203665304U (en) | 2013-10-31 | 2013-10-31 | Grinding disc for ultra-thin wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203665304U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107598762A (en) * | 2017-10-21 | 2018-01-19 | 德清凯晶光电科技有限公司 | Large scale erratic star wheel and its uniform grinding method |
-
2013
- 2013-10-31 CN CN201320684462.0U patent/CN203665304U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107598762A (en) * | 2017-10-21 | 2018-01-19 | 德清凯晶光电科技有限公司 | Large scale erratic star wheel and its uniform grinding method |
| CN107598762B (en) * | 2017-10-21 | 2023-10-31 | 德清凯晶光电科技有限公司 | Large-size planetary wheel and uniform polishing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140625 Termination date: 20151031 |
|
| EXPY | Termination of patent right or utility model |