CN203658240U - Automatic detection device for stress of silicon carbide polishing wafer - Google Patents
Automatic detection device for stress of silicon carbide polishing wafer Download PDFInfo
- Publication number
- CN203658240U CN203658240U CN201320864481.1U CN201320864481U CN203658240U CN 203658240 U CN203658240 U CN 203658240U CN 201320864481 U CN201320864481 U CN 201320864481U CN 203658240 U CN203658240 U CN 203658240U
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- stress
- camera
- detection device
- column
- automatic detection
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000001514 detection method Methods 0.000 title claims abstract description 18
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title abstract description 5
- 238000005498 polishing Methods 0.000 title abstract 2
- 229910010271 silicon carbide Inorganic materials 0.000 title abstract 2
- 238000006073 displacement reaction Methods 0.000 claims abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 16
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 14
- 239000013078 crystal Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 230000035882 stress Effects 0.000 description 24
- 230000003993 interaction Effects 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000000105 evaporative light scattering detection Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320864481.1U CN203658240U (en) | 2013-12-25 | 2013-12-25 | Automatic detection device for stress of silicon carbide polishing wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320864481.1U CN203658240U (en) | 2013-12-25 | 2013-12-25 | Automatic detection device for stress of silicon carbide polishing wafer |
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CN203658240U true CN203658240U (en) | 2014-06-18 |
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CN201320864481.1U Expired - Lifetime CN203658240U (en) | 2013-12-25 | 2013-12-25 | Automatic detection device for stress of silicon carbide polishing wafer |
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CN (1) | CN203658240U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105067421A (en) * | 2015-09-15 | 2015-11-18 | 中南大学 | Three-dimensional stress characterizing method for TSV (Through Silicon Vias) structure based on image analysis |
CN105549216A (en) * | 2016-02-19 | 2016-05-04 | 天津市职业大学 | Multi-user real-time visual gem polariscope |
-
2013
- 2013-12-25 CN CN201320864481.1U patent/CN203658240U/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105067421A (en) * | 2015-09-15 | 2015-11-18 | 中南大学 | Three-dimensional stress characterizing method for TSV (Through Silicon Vias) structure based on image analysis |
CN105067421B (en) * | 2015-09-15 | 2017-11-10 | 中南大学 | A kind of triaxiality characterizing method of the TSV structure based on graphical analysis |
CN105549216A (en) * | 2016-02-19 | 2016-05-04 | 天津市职业大学 | Multi-user real-time visual gem polariscope |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Automatic detection device for stress of silicon carbide polishing wafer Effective date of registration: 20180806 Granted publication date: 20140618 Pledgee: Agricultural Bank of China Limited by Share Ltd. Ji'nan branch Pledgor: SICC Co.,Ltd. Registration number: 2018370000146 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191218 Granted publication date: 20140618 Pledgee: Agricultural Bank of China Limited by Share Ltd. Ji'nan branch Pledgor: SICC Co.,Ltd. Registration number: 2018370000146 |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: No.99, Tianyue South Road, Huaiyin District, Jinan City, Shandong Province Patentee after: Shandong Tianyue advanced technology Co.,Ltd. Address before: 3-409, Yinhe building, 2008 Xinluo street, Lixia District, Jinan City, Shandong Province Patentee before: SICC Co.,Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20140618 |