CN203617348U - An organic light-emitting diode packaging structure - Google Patents
An organic light-emitting diode packaging structure Download PDFInfo
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- CN203617348U CN203617348U CN201320848392.8U CN201320848392U CN203617348U CN 203617348 U CN203617348 U CN 203617348U CN 201320848392 U CN201320848392 U CN 201320848392U CN 203617348 U CN203617348 U CN 203617348U
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- Prior art keywords
- emitting diode
- organic light
- packaging structure
- diode packaging
- luminescence component
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 230000004888 barrier function Effects 0.000 claims abstract description 36
- 239000002131 composite material Substances 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000004020 luminiscence type Methods 0.000 claims description 47
- 239000011241 protective layer Substances 0.000 claims description 37
- 239000011248 coating agent Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 31
- 239000010410 layer Substances 0.000 claims description 23
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 19
- 229910052760 oxygen Inorganic materials 0.000 abstract description 19
- 239000001301 oxygen Substances 0.000 abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 22
- 238000007789 sealing Methods 0.000 description 7
- -1 acryl Chemical group 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 230000009545 invasion Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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Abstract
The utility model discloses an organic light-emitting diode packaging structure comprising a substrate, a light-emitting assembly formed on the substrate, a protection layer completely covering the light-emitting assembly and a composite barrier layer completely covering the protection layer. In the organic light-emitting diode packaging structure provided by the utility model, the protection layer forms between the light-emitting assembly and the composite barrier layer to prevent steam formed by foreign matters, etc., inside the composite barrier layer from making contact with the light-emitting assembly, so that water and oxygen can be effectively prevented from invading an organic light-emitting diode assembly, and the usage life of the organic light-emitting diode assembly can be prolonged.
Description
Technical field
The utility model relates to technical field of liquid crystal display, particularly relates to a kind of organic light-emitting diode packaging structure.
Background technology
Organic light emitting diode display (organic light emitting diode display, OLED display) there is the advantages such as high color saturation, high brightness and visual angle be wide, thereby become display product rather well received in display of new generation.But Organic Light Emitting Diode assembly (OLED device) is easily subject to the invasion of steam and oxygen and is destroyed, cause reduce useful life.Therefore, how anti-sealing and oxygen invasion Organic Light Emitting Diode assembly are an important research topic in this area.
Fig. 1 is the schematic diagram of organic light-emitting diode packaging structure in prior art, the organic light-emitting diode packaging structure 100 of prior art comprises substrate 110, luminescence component 120 is formed on substrate 110, by laser, 130 moments of glass dust (Frit material) are melted, substrate 110 and upper glass plates 140 are fit together.Wherein, luminescence component 120 comprises Thin Film Transistor (TFT) 121 and filter coating 122.Glass dust 130 and upper glass plates 140 seal luminescence component 120, anti-sealing and oxygen damage luminescence component 120.
But the flexible panel of large-scale OLED generally adopts thin-film package (Thin Film Encapsulation is called for short TFE), TFE film itself has defect (Void etc.), makes penetration by water TFE film, thus damage luminescence component 120.
Therefore, how to provide a kind of organic light-emitting diode packaging structure, can anti-sealing and oxygen invasion Organic Light Emitting Diode assembly, become the problem that those skilled in the art need to solve.
Utility model content
The purpose of this utility model is, a kind of organic light-emitting diode packaging structure is provided, can anti-sealing and oxygen invasion Organic Light Emitting Diode assembly, and extend useful life of Organic Light Emitting Diode assembly.
For solving the problems of the technologies described above, the utility model provides a kind of organic light-emitting diode packaging structure, comprising:
Substrate;
Luminescence component, is formed on described substrate;
Protective layer, covers described luminescence component completely; And
Composite barrier, covers described protective layer completely.
Further, also have an oriented film between described luminescence component and substrate, described composite barrier covers described oriented film completely.
Further, described protective layer and luminescence component also have a resilient coating, and described resilient coating covers described luminescence component completely.
Further, described resilient coating covers described oriented film completely.
Further, described resilient coating is lithium fluoride resilient coating.
Further, the thickness of described resilient coating is 0.2mm～2mm.
Further, described composite barrier is made up of at least one inorganic block film layer and at least one organic block film layer.
Further, the thickness of described inorganic block film layer is 10nm～1000nm.
Further, the thickness of described organic block film layer is 100nm～1000nm.
Further, described protective layer is inorganic barrier layer.
Compared with prior art, the organic light-emitting diode packaging structure that the utility model provides has the following advantages:
Provide in a kind of organic light-emitting diode packaging structure at the utility model, described protective layer covers described luminescence component completely, described composite barrier covers described protective layer completely, compared with prior art, described protective layer is formed between described luminescence component and composite barrier, the steam that prevents the formation such as the foreign matter in described composite barrier contacts described luminescence component, thereby anti-sealing and oxygen are invaded Organic Light Emitting Diode assembly effectively, and extend the useful life of Organic Light Emitting Diode assembly; And, first forming described protective layer and form again described composite barrier afterwards, described protective layer can be isolated described luminescence component completely, prevents steam intrusion, thereby avoids using the structures such as drier, and technique is simple.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of organic light-emitting diode packaging structure in prior art;
Fig. 2 is the schematic diagram of the organic light-emitting diode packaging structure of the utility model the first embodiment;
Fig. 3 is the schematic diagram of the organic light-emitting diode packaging structure of the utility model the second embodiment.
Embodiment
Below in conjunction with schematic diagram, organic light-emitting diode packaging structure of the present utility model is described in more detail, wherein represent preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
In the following passage, with way of example, the utility model is more specifically described with reference to accompanying drawing.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, the utility model provides a kind of organic light-emitting diode packaging structure, and this organic light-emitting diode packaging structure comprises; Substrate; Luminescence component, is formed on described substrate; Protective layer, covers described luminescence component completely; And composite barrier, cover described protective layer completely.Described protective layer is formed between described luminescence component and composite barrier, the steam that prevents the formation such as the foreign matter in described composite barrier contacts described luminescence component, thereby anti-sealing and oxygen are invaded Organic Light Emitting Diode assembly effectively, and extend the useful life of Organic Light Emitting Diode assembly; And, first forming described protective layer and form again described composite barrier afterwards, described protective layer can be isolated described luminescence component completely, prevents steam intrusion, thereby avoids using the structures such as drier, and technique is simple.
Below enumerate several embodiment of described organic light-emitting diode packaging structure, to clearly demonstrate content of the present utility model, will be clear that, content of the present utility model is not restricted to following examples, and other improvement by those of ordinary skills' routine techniques means are also within thought range of the present utility model.
The first embodiment
Refer to Fig. 2 and illustrate the first embodiment of the present utility model.As shown in Figure 2, organic light-emitting diode packaging structure 200 comprises substrate 210, luminescence component 220, protective layer 230 and composite barrier 240.Described luminescence component 220 is formed on described substrate 210, and described protective layer 230 covers described luminescence component 220 completely, and described composite barrier 240 covers described protective layer 230 completely.
Wherein, described protective layer 230 is formed between described luminescence component 220 and composite barrier 240; in the time that described composite barrier 240 contains the defects such as foreign matter; foreign matter in described composite barrier 240 may form steam; described protective layer 230 can be blocked steam and oxygen intrusion path; prevent that steam from contacting described luminescence component 220 with oxygen, thereby extend the useful life of described luminescence component 220.
In the present embodiment, described substrate 210 can be glass substrate or ceramic substrate etc.Described luminescence component 220 generally includes luminescence component 120 and comprises the parts such as Thin Film Transistor (TFT) 221 and filter coating 222, and in the present embodiment, described filter coating 222 is RGB filter coating, but described filter coating 222 is not limited to the filter coating into RGB.Described Thin Film Transistor (TFT) 221 and filter coating 222 can utilize the mode such as evaporation, coating to be formed at successively on described substrate 210; Wherein, structure and the generation type of described luminescence component 220 are prior art, so repeat no more.
Preferably; described protective layer 230 is inorganic barrier layer; as glass etc.; described inorganic barrier layer has good stability, and can prevent well steam and oxygen invasion, but described protective layer 230 is not limited to as inorganic barrier layer; described protective layer 230 can also be the materials such as organosilicon; organosilicon has good viscosity and waterproof effect, can also prevent steam and oxygen invasion, also within thought range of the present utility model.
Described composite barrier 240 at least comprises that an inorganic block film layer 241 and at least one organic block film layer 242 alternately utilize vapour deposition method, sputtering method, atomic deposition method or rubbing method to be covered in completely outside described protective layer 230, in order to intercept water and oxygen.Wherein, the number of plies of described inorganic block film layer 241 and described organic block film layer 242 can determine according to the actual requirements, and the number of plies reaches better water and oxygen obstruction effect, but can increase the thickness of encapsulating structure and reduce optical appearance; Otherwise the number of plies is fewer to be reduced the thickness of encapsulating structure and improves optical appearance, but can reduce water and oxygen obstruction effect.The mode of utilizing vapour deposition method, sputtering method, atomic deposition method or rubbing method to form described composite barrier 240 is prior art, so repeat no more.The thickness of described organic block film layer 242 can be between 100nm～1000nm, its mainly in order to increase by 241, described inorganic block film layer adhesive force, absorb the stress between inorganic layer and increase surface flatness; The thickness of described inorganic block film layer 241 can be between 10nm～1000nm, and it is mainly in order to exclusion of water and oxygen.Described inorganic block film layer 241 and described organic block film layer 242 can use suitable material in prior art to make, for example can be selected from acryl polymer (acryl-based resin), epoxy resin base polyalcohol (epoxy-based resin), polyimides (polyimide), polyethylene (polyethylene, PE), polypropylene (polypropylene, PP), polyvinyl chloride (polyvinyl chloride, PVC), one or more material compositions in polystyrene (polystyrene, PS) etc.
Preferably, in the present embodiment, also have an oriented film 211 between described luminescence component 220 and substrate 210, described composite barrier 210 covers described oriented film 211 completely.
The organic light-emitting diode packaging structure of the present embodiment can be applied to liquid crystal indicator, to facilitate the preparation of described liquid crystal indicator.
The second embodiment
Refer to Fig. 3, Fig. 3 is the schematic diagram of the organic light-emitting diode packaging structure of the utility model the second embodiment.In Fig. 3, reference number represents the parts that the statement identical with Fig. 1 is identical with the first execution mode.The organic light-emitting diode packaging structure 300 of described the second embodiment is basic identical with the organic light-emitting diode packaging structure 100 of described the first embodiment; its difference is: described protective layer 230 also has a resilient coating 350 with luminescence component 220, and described resilient coating 350 covers described luminescence component 220 completely.In the present embodiment, described organic light-emitting diode packaging structure 300 also comprises described oriented film 211, and preferably, described resilient coating 350 covers described oriented film 211 completely.Preferably; described resilient coating 350 is lithium fluoride resilient coating; lithium fluoride resilient coating can be modified the surface of described luminescence component 220 well; reduce the formation of boundary defect state between described luminescence component 220 and protective layer 230, strengthened the stability of described organic light-emitting diode packaging structure 300.But described resilient coating 350 is not limited to as lithium fluoride resilient coating, as long as can reduce the formation of boundary defect state between described luminescence component 220 and protective layer 230, also within thought range of the present utility model.Preferably, the thickness of described resilient coating 350 is 0.2mm～2mm, for example, and 0.5mm, 1mm.But the thickness of described resilient coating 350 is not limited to as 0.2mm～2mm, the thickness of described resilient coating 350 can also be 0.1mm, 3mm etc.
In the second embodiment of the present utility model; described protective layer 230 in organic light-emitting diode packaging structure 300 is also formed between described luminescence component 220 and composite barrier 240; in the time that described composite barrier 240 contains the defects such as foreign matter; described protective layer 230 can also be blocked steam and oxygen intrusion path; prevent that steam from contacting described luminescence component 220 with oxygen; thereby extend the useful life of described luminescence component 220, also within thought range of the present utility model.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment, between each embodiment identical similar part mutually referring to.
In sum, the utility model provides a kind of organic light-emitting diode packaging structure, and this organic light-emitting diode packaging structure comprises: substrate; Luminescence component, is formed on described substrate; Protective layer, covers described luminescence component completely; And composite barrier, cover described protective layer completely.Compared with prior art, the organic light-emitting diode packaging structure that the utility model provides has the following advantages:
Provide in a kind of organic light-emitting diode packaging structure at the utility model, described protective layer is formed between described luminescence component and composite barrier, the steam that prevents the formation such as the foreign matter in described composite barrier contacts described luminescence component, thereby anti-sealing and oxygen are invaded Organic Light Emitting Diode assembly effectively, and extend the useful life of Organic Light Emitting Diode assembly; And, first forming described protective layer and form again described composite barrier afterwards, described protective layer can be isolated described luminescence component completely, prevents steam intrusion, thereby avoids using the structures such as drier, and technique is simple.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (10)
1. an organic light-emitting diode packaging structure, is characterized in that, comprising:
Substrate;
Luminescence component, is formed on described substrate;
Protective layer, covers described luminescence component completely; And
Composite barrier, covers described protective layer completely.
2. organic light-emitting diode packaging structure as claimed in claim 1, is characterized in that between described luminescence component and substrate, also having an oriented film, and described composite barrier covers described oriented film completely.
3. organic light-emitting diode packaging structure as claimed in claim 2, is characterized in that, described protective layer and luminescence component also have a resilient coating, and described resilient coating covers described luminescence component completely.
4. organic light-emitting diode packaging structure as claimed in claim 3, is characterized in that, described resilient coating covers described oriented film completely.
5. organic light-emitting diode packaging structure as claimed in claim 3, is characterized in that, described resilient coating is lithium fluoride resilient coating.
6. organic light-emitting diode packaging structure as claimed in claim 3, is characterized in that, the thickness of described resilient coating is 0.2mm～2mm.
7. organic light-emitting diode packaging structure as claimed in claim 1, is characterized in that, described composite barrier is made up of at least one inorganic block film layer and at least one organic block film layer.
8. organic light-emitting diode packaging structure as claimed in claim 7, is characterized in that, the thickness of described inorganic block film layer is 10nm～1000nm.
9. organic light-emitting diode packaging structure as claimed in claim 7, is characterized in that, the thickness of described organic block film layer is 100nm～1000nm.
10. organic light-emitting diode packaging structure as claimed in claim 1, is characterized in that, described protective layer is inorganic barrier layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320848392.8U CN203617348U (en) | 2013-12-20 | 2013-12-20 | An organic light-emitting diode packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320848392.8U CN203617348U (en) | 2013-12-20 | 2013-12-20 | An organic light-emitting diode packaging structure |
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| CN203617348U true CN203617348U (en) | 2014-05-28 |
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| CN201320848392.8U Expired - Lifetime CN203617348U (en) | 2013-12-20 | 2013-12-20 | An organic light-emitting diode packaging structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113078179A (en) * | 2020-01-06 | 2021-07-06 | 群创光电股份有限公司 | Electronic device |
| CN113078247A (en) * | 2021-03-26 | 2021-07-06 | 厦门乾照光电股份有限公司 | Light-emitting diode |
-
2013
- 2013-12-20 CN CN201320848392.8U patent/CN203617348U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113078179A (en) * | 2020-01-06 | 2021-07-06 | 群创光电股份有限公司 | Electronic device |
| CN113078247A (en) * | 2021-03-26 | 2021-07-06 | 厦门乾照光电股份有限公司 | Light-emitting diode |
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| GR01 | Patent grant | ||
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| CX01 | Expiry of patent term |
Granted publication date: 20140528 |