CN203607390U - Modularized packaging structure - Google Patents
Modularized packaging structure Download PDFInfo
- Publication number
- CN203607390U CN203607390U CN201320811611.5U CN201320811611U CN203607390U CN 203607390 U CN203607390 U CN 203607390U CN 201320811611 U CN201320811611 U CN 201320811611U CN 203607390 U CN203607390 U CN 203607390U
- Authority
- CN
- China
- Prior art keywords
- shell
- radiator
- circuit board
- drive circuit
- elastomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 229920001971 elastomer Polymers 0.000 claims abstract description 20
- 239000000806 elastomer Substances 0.000 claims abstract description 20
- 210000004907 gland Anatomy 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 5
- 238000005538 encapsulation Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052802 copper Inorganic materials 0.000 abstract description 10
- 239000010949 copper Substances 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 abstract 5
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 230000000191 radiation effect Effects 0.000 abstract 1
- 229920003266 Leaf® Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 230000035882 stress Effects 0.000 description 4
- 239000011195 cermet Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Abstract
The utility model relates to a modularized packaging structure which comprises a housing, a radiator, a drive circuit board and a ceramics-coated metal substrate, wherein the ceramics-coated metal substrate is connected with a semiconductor chip. The ceramics-coated metal substrate is fixed at the top surface of the radiator via heat-conducting glue, and is covered by the housing which is arranged on the radiator; the drive circuit board is arranged at the top surface of the housing; a gland is arranged at the top of the drive circuit board; at least one bolt is screwed into a threaded hole of the radiator by penetrating through the gland, the drive circuit board, the housing and the ceramics-coated metal substrate; and at least one elastomer is arranged in the housing, wherein one end of the elastomer abuts against the housing, and the other end of the elastomer abuts against the ceramics-coated metal substrate. The modularized packaging structure is simple in assembly, reduces the production cost, and cancels a copper substrate; and the modularized packaging structure is pressed towards one side of the radiator via the elastomer, thereby improving the heat radiation effect.
Description
Technical field
The utility model relates to a kind of modularized encapsulation structure, belongs to power model technical field.
Background technology
Power model mainly comprises that covering cermet substrate covers on its metal level semiconductor chip of ceramet substrate with being fixed on, covering cermet substrate is welded on copper soleplate, to cover ceramet substrate package in the enclosure, and electrode terminal draws shell and be connected with external equipment, realize the input and output of power model.At semi-conductor power module in the course of the work, the heat that semiconductor chip produces absorbs rapidly by copper soleplate, and dispels the heat on radiator by its underpart.
But conventional power module encapsulation technology is to encapsulate as the base plate of whole power module assembly with a copper base, covering ceramet substrate is welded on copper base, on weld layer, can produce certain stress or cavity, cause power model to have very large thermal effect failure risk.Also because copper base is different from the thermal coefficient of expansion that covers ceramet substrate, the thermal stress of himself and mechanical stress are all very large simultaneously, and long-term use exists very large failure risk.Moreover heat-conducting silicone grease is filled the space between copper soleplate and radiator, the heat of chip must reach on radiator by copper base, and radiating effect can not improve again.The shell of existing power model is to be arranged on radiator by four bolts of its surrounding, then realizes and being connected of drive plate busbar by the installing hole on electrode, and this installation steps are relatively loaded down with trivial details.
Summary of the invention
It is simple that the purpose of this utility model is to provide a kind of assembling, reduces cost of manufacture, the reliable modularized encapsulation structure of dispelling the heat.
The utility model is that the technical scheme achieving the above object is: a kind of modularized encapsulation structure, comprise shell, radiator and drive circuit board and be connected with semiconductor chip cover ceramet substrate, it is characterized in that: the described ceramet substrate that covers is fixed on radiator end face by heat-conducting glue, the jacket that is arranged on radiator top is covering on ceramet substrate, drive circuit board is arranged on outer casing top surface, gland is arranged on the top of drive circuit board, at least one bolt is through gland, drive circuit board and shell and cover ceramet substrate and be screwed in the screwed hole of radiator, at least one elastomer setting in the enclosure, elastomeric one end withstands on shell, the other end withstands on and covers on ceramet substrate.
The utility model directly, by covering ceramet substrate and be fixed on by heat-conducting glue the end face of radiator, has been cancelled copper base, adopts without copper base encapsulating structure, reduces cost of manufacture.Bolt of the present utility model is screwed on radiator through drive circuit board and shell, by drive circuit board, shell and cover ceramet substrate and radiator and realize and being connected, simultaneously by the elastomer being provided with in shell, in the time that bolt is connected on radiator, elastomer is pressed to and is covered ceramet substrate by its elastic force, to cover ceramet substrate and press to radiator one side, guarantee can reach long-term close contact between power model and fin, heat on semiconductor chip is reached to radiator by covering ceramet substrate, can reach continual and steady heat-transfer effect, improve radiating efficiency.The utility model is connected to bolt on radiator, when shell is connected with radiator, exert pressure to elastomer by shell, therefore bolt can be connected to stress is transferred to and is covered on ceramet substrate by elastomer, make shell and cover ceramet substrate elasticity and be connected, be fixedly connected with mode than traditional employing and have more flexibility, can greatly reduce thermal stress and the mechanical stress of power model.The utility model by bolt clip plate by drive circuit board, shell and cover ceramet substrate once mounting on radiator, cover top portion supporting drive circuit board, both guaranteed bearing strength, facilitate power model and drive circuit board are combined again, greatly improve the integrated level of power model, reduce assembly technology, also can reach the risk that improves radiating effect and reduce thermal failure by reducing weld layer simultaneously, especially this connected mode has shortened the electric signal transmission path of power model, thereby the parasitic parameter of power model self and actuator loop is also dwindled greatly.The utility model links together power model and radiator, drive circuit board by bolt, and assembling is simple, ensures the complete cost of saving again of electric property, simplifies the production assembling of power semiconductor modular and the use of terminal client.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
Fig. 1 is the perspective view of the utility model modularized encapsulation structure.
Fig. 2 is the structural representation of facing of the utility model modularized encapsulation structure.
Fig. 3 is the A-A sectional structure schematic diagram of Fig. 2.
Fig. 4 is the sectional structure schematic diagram of the B-B of Fig. 2.
Wherein: 1-gland, 2-bolt, 3-drive circuit board, 4-shell, 4-1-spring base, 4-2-vertical gusset, 5-radiator, 6-cover ceramet substrate, 7-elastomer, 8-signal terminal.
Embodiment
See shown in Fig. 1～4, modularized encapsulation structure of the present utility model, what comprise shell 4, radiator 5 and drive circuit board 3 and be connected with semiconductor chip covers ceramet substrate 6.The ceramet substrate 6 that covers of the present utility model is fixed on radiator 5 end faces by heat-conducting glue, the shell 4 that is arranged on radiator 5 tops covers on and covers on ceramet substrate 6, cover on ceramet substrate 6 and be connected with at least two electrodes and multiple signal terminal 8, each electrode is arranged on shell 4, realize the I/O of circuit by electrode and external circuit, and drive circuit board 3 is arranged on outer casing top surface, be connected with drive circuit board 3 by each signal terminal 8, realize the transmission of each signal.
See shown in Fig. 1～4, gland 1 of the present utility model is arranged on the top of drive circuit board 3, this gland 1 can adopt insulation to make, for improving the mechanical strength of gland 1, by outside insulator and interlocking, the metallic plate in insulator forms gland 1 of the present utility model, at least one bolt 2 is through gland 1, drive circuit board 3 and shell 4 and cover ceramet substrate 6 and be screwed in the screwed hole of radiator 5, by bolt 2 by gland 1, drive circuit board 3 and shell 4 and cover that ceramet substrate 6 is disposable to be arranged on radiator 5, simplify mounting structure, improve efficiency of assembling.The middle part that adopts one shown in Fig. 1～4 and be arranged on shell is shown in by bolt 2 of the present utility model, also can be arranged on the sidepiece of shell, and its quantity can be set according to the size of power model.
See shown in Fig. 3,4, at least one elastomer 7 of the utility model is arranged in shell 4, one end of elastomer 7 withstands on shell 4, the other end withstands on and covers on ceramet substrate 6, in the time that bolt 2 is arranged on radiator 5 by shell 4, apply downward pressure by shell 4 to elastomer 7, elastomer 7 will cover ceramet substrate 6 by the elastic force of self and press to radiator 5, make to cover ceramet substrate 6 can be long-term and radiator 5 fit tightly, and keep good heat and mass, make power model keep good radiating effect.
See shown in Fig. 3,4, in the utility model shell 4, be provided with at least one vertical gusset 4-2 of being connected or/and at least one horizontal bar plate, by vertical gusset 4-2 or/and horizontal bar plate, to increase the intensity of shell 4, has also alleviated the weight of shell 4 simultaneously.See Fig. 3, shown in 4, the utility model at the vertical gusset 4-2 of shell 4 or/and be provided with the spring base 4-1 of indent on horizontal bar plate, elastomer 7 of the present utility model is spring leaf, at least one spring leaf is arranged on vertical gusset 4-2 or/and in the spring base 4-1 of horizontal bar plate, one end of spring leaf withstands on spring base 4-1, the other end withstands on and covers on ceramet substrate 6, spring leaf of the present utility model can adopt two, and be symmetrical arranged along longitudinal center's axis or the central transverse axis of shell 4, provide a uniform pressure by two spring leafs to covering ceramet substrate 6, make to cover ceramet substrate 6 can be long-term and radiator 5 fit tightly.
See shown in Fig. 3,4, the bottom on the limit, the left and right sides of the utility model shell 4 is provided with inner stopper, or the bottom of shell 4 front and back dual-sides is provided with inner stopper, the left and right both ends of the surface or the rear and front end face that cover ceramet substrate 6 join with the corresponding inner stopper of shell 4, facilitate shell 4 to install.
Claims (5)
1. a modularized encapsulation structure, comprise shell (4), radiator (5) and drive circuit board (3) and be connected with semiconductor chip cover ceramet substrate (6), it is characterized in that: the described ceramet substrate (6) that covers is fixed on radiator (5) end face by heat-conducting glue, the shell (4) that is arranged on radiator (5) top covers on and covers on ceramet substrate (6), drive circuit board (3) is arranged on shell (4) end face, gland (1) is arranged on the top of drive circuit board (3), at least one bolt (2) is through gland (1), drive circuit board (3) and shell (4) cover ceramet substrate (6) and are screwed in the screwed hole of radiator (5), at least one elastomer (7) is arranged in shell (4), one end of elastomer (7) withstands on shell (4), the other end withstands on and covers on ceramet substrate (6).
2. modularized encapsulation structure according to claim 1, is characterized in that: in described shell (4), be provided with at least one the vertical gusset (4-2) being connected or/and at least one horizontal bar plate.
3. modularized encapsulation structure according to claim 2, it is characterized in that: described vertical gusset (4-2) is or/and horizontal bar plate is provided with the spring base (4-1) of indent, described elastomer (7) is spring leaf, at least one spring leaf is arranged on vertical gusset (4-2) or/and in the spring base (4-1) of horizontal bar plate, one end of spring leaf withstands on spring base (4-1), the other end withstands on and covers on ceramet substrate (6).
4. modularized encapsulation structure according to claim 1, it is characterized in that: the inwall of described shell (4) is provided with the spring base of at least one indent, the spring that described elastomer (7) is cast, spring is arranged in spring base, and one end of each spring withstands on the inwall of shell (4), the other end withstands on and covers on ceramet substrate (6).
5. modularized encapsulation structure according to claim 1, it is characterized in that: the bottom on the limit, the left and right sides of described shell (4) is provided with inner stopper, or the bottom of dual-side is provided with inner stopper before and after shell (4), the left and right both ends of the surface or the rear and front end face that cover ceramet substrate (6) join with the corresponding inner stopper of shell (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320811611.5U CN203607390U (en) | 2013-12-10 | 2013-12-10 | Modularized packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320811611.5U CN203607390U (en) | 2013-12-10 | 2013-12-10 | Modularized packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203607390U true CN203607390U (en) | 2014-05-21 |
Family
ID=50720054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320811611.5U Expired - Lifetime CN203607390U (en) | 2013-12-10 | 2013-12-10 | Modularized packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203607390U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701277A (en) * | 2013-12-10 | 2015-06-10 | 江苏宏微科技股份有限公司 | Power module package structure |
| CN106711107A (en) * | 2015-07-23 | 2017-05-24 | 江苏宏微科技股份有限公司 | Bolt-free fastening power module |
-
2013
- 2013-12-10 CN CN201320811611.5U patent/CN203607390U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701277A (en) * | 2013-12-10 | 2015-06-10 | 江苏宏微科技股份有限公司 | Power module package structure |
| CN104701277B (en) * | 2013-12-10 | 2017-12-05 | 江苏宏微科技股份有限公司 | The encapsulating structure of power model |
| CN106711107A (en) * | 2015-07-23 | 2017-05-24 | 江苏宏微科技股份有限公司 | Bolt-free fastening power module |
| CN106711107B (en) * | 2015-07-23 | 2019-02-15 | 江苏宏微科技股份有限公司 | Screwless fastening type power module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |