CN203588813U - Structure of wafer-type inductor - Google Patents
Structure of wafer-type inductor Download PDFInfo
- Publication number
- CN203588813U CN203588813U CN201320752457.9U CN201320752457U CN203588813U CN 203588813 U CN203588813 U CN 203588813U CN 201320752457 U CN201320752457 U CN 201320752457U CN 203588813 U CN203588813 U CN 203588813U
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- China
- Prior art keywords
- coil
- chip
- type inductor
- iron core
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000000843 powder Substances 0.000 claims description 18
- 230000004888 barrier function Effects 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000000696 magnetic material Substances 0.000 claims description 7
- 239000011863 silicon-based powder Substances 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 6
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 6
- 239000002966 varnish Substances 0.000 claims description 5
- 150000001879 copper Chemical class 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 150000003378 silver Chemical class 0.000 claims description 3
- PMVSDNDAUGGCCE-TYYBGVCCSA-L Ferrous fumarate Chemical group [Fe+2].[O-]C(=O)\C=C\C([O-])=O PMVSDNDAUGGCCE-TYYBGVCCSA-L 0.000 claims 1
- 238000004804 winding Methods 0.000 abstract description 7
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000011162 core material Substances 0.000 description 13
- 230000035699 permeability Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 238000005056 compaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229910005347 FeSi Inorganic materials 0.000 description 2
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- KNVAYBMMCPLDOZ-UHFFFAOYSA-N propan-2-yl 12-hydroxyoctadecanoate Chemical group CCCCCCC(O)CCCCCCCCCCC(=O)OC(C)C KNVAYBMMCPLDOZ-UHFFFAOYSA-N 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
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- Coils Or Transformers For Communication (AREA)
Abstract
The utility model discloses a structure of a wafer-type inductor. The structure comprises an iron core, an insulating layer, an electrode layer, a coil and a closed magnetic circuit structure, a frame is arranged on the iron core, a winding portion is arranged in the frame, two penetrating layers are arranged between the winding portion and the frame, the insulating layer is coated on the outer surface of the iron core, the electrode layer is arranged on the surface of the insulating layer on one side of the iron core, the coil is arranged on the winding portion in a wound manner and electrically connected with the electrode layer, the closed magnetic circuit structure is arranged on the coil and wraps the coil, and the structure of the wafer-type inductor is formed.
Description
Technical field
The utility model relates to a kind of inductor, espespecially a kind of chip-type inductor structure.
Background technology
Inductor is a kind of of passive device, has the electronic component of resisting any curent change, and the iron core material that it support by coil winding is formed, and iron core material can be magnetic material or nonmagnetic substance.Inductor is that mat coil current changes, to produce magnetic flux change, and the circuit element of making according to the phenomenon in magnetic field, wherein the source in magnetic field is that electric charge is flowing, it is exactly that electric current forms.The electric current exchanging can produce magnetic field, and the magnetic field of change can induce electric current, the ratio of its linear relationship, and we are called inductance.
Traditional knockdown inductor, it is mainly the I-shaped iron core with a manganese-zinc ferrite, coil winding, on this I-shaped iron core, then is loaded on the I-shaped iron core group that is wound with coil in the lid that one section is U font, to form knockdown inductor.Because the permeability of this knockdown inductor is high, saturated magnetic force is low, easily saturated in use, cannot resistance to large electric current, be not therefore used.
Current inductor is all that requirement can resistance to large electric current, and therefore most inductor is as choke or anti-current device.The making of this inductor is to utilize powder compaction to form, be wound around in advance an air core coil, air core coil is positioned in mould, iron powder is poured in this mould and is pressed into after an inductor with this coil, the practice of this kind of powder compaction makes permeability low, saturated magnetic force is high, in use inductor be difficult for saturated, can resistance to larger electric current.
Another kind of powder compaction, when making, first make an air core coil, air core coil is placed in mould, by adding, there is the iron powder of macromolecular material colloid to pour in mould, utilize every square centimeter of compacting of the high pressure with 6 ~ 8 ton force amounts to form, in manufacturing process, easily make the insulating varnish on coil be racked, cause coil short circuit between layers, cause the generation of large electric current.
Another powder compaction, to adopt the pedestal that siderochrome Si powder (FeCrSi) is first hot pressed into a convex shape, at the coil that winding is completed, be placed on the projection of this pedestal, recycling hot forming technology is compressed on this pedestal siderochrome silicon (FeCrSi) to be coated on the projection of this coil and this pedestal, only make the bottom of pedestal expose, the production method of this kind of inductor easily produces leakage phenomenon.
Another powder compaction, is first to make an air core coil and a lead frame, and air core coil and lead frame are placed in mould, again iron powder is being poured in mould and is first being carried out after mold pressing, then after hot-pressing processing, completing the making of inductor.Because the spare part of this kind of inductor is more, therefore on making, also relatively take a lot of work order and man-hour.
Utility model content
In view of this, the technical problems to be solved in the utility model is to provide a kind of structure of chip-type inductor, and it is high that profit makes inductor have resistance to electric current, heat-resisting height.
The technical problem that another will solve of the present utility model is, coil can avoid producing leakage phenomenon.
For solving the problems of the technologies described above, the technical solution of the utility model is achieved in that a kind of structure of chip-type inductor, comprising: an iron core, on it, there is a framework, and in this framework, there is a wound portion, between this wound portion and framework, have two and wear groove; One insulating barrier, is coated on the outer surface of this iron core; One electrode layer, is located on the surface of insulating layer of this iron core one side; One coil, through two this wound portions that are wound in of wearing groove, and with this electrode layer electrically connect; And a closed-flux structure, be located on this coil, and coated this coil.
Further, this iron core is " day " font.
Further, to take iron nickel 50 powder of iron Si powder material or soft magnetic material be material to this iron core.
Further, this insulating barrier is insulating varnish.
Further, on this electrode layer, there is a bronze medal layer, on this copper layer, be provided with a silver layer.
Further, this electrode layer is a silver layer, is provided with a tin layer on this silver layer.
Further, have two the end of a thread on this coil, this two the end of a thread is electrically connected on this electrode layer.
Further, have two the end of a thread on this coil, this two the end of a thread is electrically connected on this electrode layer.
Further, this coil is flat bare copper wire.
Further, this closed-flux structure is magnetic glue.
The technique effect that the utility model reaches is as follows: the structure of the utility model chip-type inductor, and utilize thermosetting, sintered compound mode to make chip-type inductor, make inductor there is resistance to electric current high, heat-resisting height.
The structure of the utility model chip-type inductor, after inductor completes, this coil is coated in this closed-flux structure, can avoid producing leakage phenomenon.
Accompanying drawing explanation
Fig. 1 is the making schematic flow sheet of chip-type inductor of the present utility model.
Fig. 2 is the core structure schematic diagram of chip-type inductor of the present utility model.
Fig. 3 makes insulating barrier schematic diagram on the iron core of chip-type inductor of the present utility model.
Fig. 4 makes electrode layer schematic diagram on the insulating barrier of chip-type inductor of the present utility model.
Fig. 5 is winding around schematic diagram on the iron core of chip-type inductor of the present utility model.
Fig. 6 is the section cross-sectional schematic of the 6-6 position of Fig. 5 of the present utility model.
Fig. 7 is the encapsulation schematic diagram of chip-type inductor of the present utility model.
Fig. 8 is the section cross-sectional schematic of the 8-8 position of Fig. 7 of the present utility model.
Wear groove 13
The end of a thread 41
Closed-flux structure 5.
Embodiment
Hereby, about the technical content and a detailed description of the present utility model, coordinate now graphic being described as follows:
Referring to Fig. 1 ~ Fig. 7, is making flow process and the structural representation of chip-type inductor of the present utility model.As shown in the figure: the manufacture method of chip-type inductor of the present utility model, first, as step 100, have iron core powder, this iron core powder is iron nickel 50 powder (FeNi50) of iron Si powder material (FeSi) or soft magnetic material.
Above-mentioned iron core 1 is that iron nickel 50 powder (FeNi50) sintering of adopting iron Si powder or soft magnetic material makes magnetic permeability mu=60.Because permeability is high, 4 of this coils around the number of turns few, copper loss is 0.67W, Equivalent DC impedance DCR (DC Resistance) is 6.74mohm, so electric current is little, has the high and heat-resisting high characteristic of resistance to electric current.
Referring to Fig. 2 ~ Fig. 8, is each visual angle structural representation of chip-type inductor of the present utility model.As shown in the figure: the structure of chip-type inductor of the present utility model, comprising: an iron core 1, an insulating barrier 2, an electrode layer 3, a coil 4 and a closed-flux structure 5.
This iron core 1, has a framework 11 on it, have a wound portion 12 in this framework 11, has two and wear groove 13 between this wound portion 12 and framework 11.In this is graphic, this iron core 1 be a day font, and to take iron nickel 50 powder (FeNi50) of iron Si powder material (FeSi) or soft magnetic material be material, utilizes sintering technology to make magnetic permeability mu=60.
This insulating barrier 2, is coated on the outer surface of this iron core 1.In this is graphic, this insulating barrier 2 is insulating varnish.
This electrode layer 3, is located on the insulating barrier 2 of these iron core 1 one side surfaces, has a bronze medal layer on this electrode layer 3, on this copper layer, is provided with a silver layer, or this electrode layer 3 is a silver layer, is provided with a tin layer on this silver layer.
This coil 4, two to wear groove 13 and be wound in this wound portion 12 through this, has two the end of a thread 41 on it, this two the end of a thread 41 is electrically connected on this electrode layer 3.This coil 4 is flat bare copper wire.
This closed-flux structure 5, be located on this coil 4, to be coated the flat bare copper wire of this coil 4, after coated this coil 4 of this closed-flux structure 5, form a chip-type inductor structure (as shown in Figure 7), can allow chip-type inductor structure being attached on this circuit board (not shown) with surface mount technology.In this is graphic, this closed-flux structure 5 can avoid producing leakage field phenomenon for magnetic glue.
Above-mentioned iron core 1 is that iron nickel 50 powder (FeNi50) sintering of adopting iron Si powder or soft magnetic material makes magnetic permeability mu=60.Because permeability is high, 4 of this coils around the number of turns few, copper loss is about 0.67W, equivalence makes DC impedance DCR (DC Resistance) be about 6.74mohm, so electric current is little, has the high and heat-resisting high characteristic of resistance to electric current.
Above are only preferred embodiment of the present utility model, be not used for limiting the scope that the utility model is implemented.Be that all equalizations of doing according to the utility model claim change and modify, all by the utility model the scope of the claims, contained.
Claims (10)
1. a structure for chip-type inductor, is characterized in that, comprising:
One iron core, has a framework on it, have a wound portion in this framework, has two and wear groove between this wound portion and framework;
One insulating barrier, is coated on the outer surface of this iron core;
One electrode layer, is located on the surface of insulating layer of this iron core one side;
One coil, through two this wound portions that are wound in of wearing groove, and with this electrode layer electrically connect; And
One closed-flux structure, is located on this coil, and coated this coil.
2. the structure of chip-type inductor as claimed in claim 1, is characterized in that, this iron core is " day " font.
3. the structure of chip-type inductor as claimed in claim 2, is characterized in that, it is material that this iron core be take iron nickel 50 powder of iron Si powder material or soft magnetic material.
4. the structure of chip-type inductor as claimed in claim 3, is characterized in that, this insulating barrier is insulating varnish.
5. the structure of chip-type inductor as claimed in claim 4, is characterized in that on this electrode layer, having a bronze medal layer, on this copper layer, is provided with a silver layer.
6. the structure of chip-type inductor as claimed in claim 4, is characterized in that, this electrode layer is a silver layer, is provided with a tin layer on this silver layer.
7. the structure of chip-type inductor as described in claim 5 or 6, is characterized in that, has two the end of a thread on this coil, and this two the end of a thread is electrically connected on this electrode layer.
8. the structure of chip-type inductor as claimed in claim 7, is characterized in that on this coil, having two the end of a thread, and this two the end of a thread is electrically connected on this electrode layer.
9. the structure of chip-type inductor as claimed in claim 8, is characterized in that, this coil is flat bare copper wire.
10. the structure of chip-type inductor as claimed in claim 9, is characterized in that, this closed-flux structure is magnetic glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320752457.9U CN203588813U (en) | 2013-11-26 | 2013-11-26 | Structure of wafer-type inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320752457.9U CN203588813U (en) | 2013-11-26 | 2013-11-26 | Structure of wafer-type inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203588813U true CN203588813U (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320752457.9U Expired - Lifetime CN203588813U (en) | 2013-11-26 | 2013-11-26 | Structure of wafer-type inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203588813U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183359A (en) * | 2014-09-07 | 2014-12-03 | 资兴市弘电电子科技有限公司 | Sendust powder integrated pressing inductor and production process thereof |
-
2013
- 2013-11-26 CN CN201320752457.9U patent/CN203588813U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183359A (en) * | 2014-09-07 | 2014-12-03 | 资兴市弘电电子科技有限公司 | Sendust powder integrated pressing inductor and production process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: KUNSHAN MAJI ELECTRONICS CO., LTD. Free format text: FORMER OWNER: ZHAO YITAI Effective date: 20140711 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 215300 SUZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140711 Address after: Suzhou City, Jiangsu province 215300 town Kunshan city flower road 1618 Patentee after: KUNSHAN MAJI ELECTRONICS CO.,LTD. Address before: Lane 1, Lane 103, Lane three, Sha Tin Road, Taichung District, Taichung City, Taiwan, China 8 Patentee before: Zhao Yitai |
|
| CX01 | Expiry of patent term |
Granted publication date: 20140507 |
|
| CX01 | Expiry of patent term |