CN101414505A - Inductance structure - Google Patents
Inductance structure Download PDFInfo
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- CN101414505A CN101414505A CNA2007101626559A CN200710162655A CN101414505A CN 101414505 A CN101414505 A CN 101414505A CN A2007101626559 A CNA2007101626559 A CN A2007101626559A CN 200710162655 A CN200710162655 A CN 200710162655A CN 101414505 A CN101414505 A CN 101414505A
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Abstract
The invention relates to an inductor structure comprising a coil, a non-ferrite layer, two electrode parts, a first ferrite layer and a second ferrite layer, the non-ferrite layer is coated on the coil and comprises a first surface and a second surface which are opposite to each other, the two electrode parts are respectively connected with two ends of the coil, parts of the electrode parts are extended out of the non-ferrite layer, the first ferrite layer is arranged to be adjacent to the first surface of the non-ferrite layer, and the second ferrite layer is arranged to be adjacent to the second surface of the non-ferrite layer.
Description
Technical field
The present invention relates to a kind of passive device, particularly a kind of induction structure.
Background technology
Inductance is very important passive device, has multiple function, for example stabling current, impedance matching, filtering, energy storage, exoergic, resonance, bypass etc.Along with the electronic product restriction of miniaturization and element high density assembling day by day, the size of inductance also is to heal better for a short time, and except the requirement of size must cooperate limited board area, the design of inductance also will be considered the collocation efficient with circuit board module.
Usually the selection of inductance need be considered three parameters: inductance value, saturation current rated value (Isat, or be called anti-current value) and dc impedance (DC Resistance, DCR, or be called coil impedance).Usually, bigger inductance provides less dc impedance, higher efficient and bigger saturation current rated value; Less inductance then uses less board area, and the saturation current rated value is also less, but dc impedance is bigger, makes whole efficiency lower.In addition, in frequency of utilization, the selection of inductance also considers to have higher Q value (Quality Factor).Comprehensively above-mentioned, the selection of inductance usually is to accept or reject between board area and efficient.
Inductance comprises coil and core, and their structure and material all can influence the characteristic of inductance.The material of core can be air, nonmagnetic substance, metallicl magnetic material or Ferrite Material (ferrite).And on the structure, for the requirement on the size and easy to process, but the structure of inductance often is designed to matching surface adhesion technology (Surface Mounting Technology, SMT, also claim surface adhering device (SMD)) procedure, the inductance of this class structurally can be divided into three kinds on lamination (multi-layer) type, coiling (winding) type and film (Thin Film) type.
Shown in Figure 1A, TW patent of invention notification number I256063 discloses a kind of induction structure and its manufacture method, the coil of inductance 1 (not icon) is to do the spiral coiling with metal wire rod, insert mould inside after forming helical coil, (for example: non-ferrite (Non-Ferrite)) coat helical coil, fill Magnaglo to form the cladding 2 that coats helical coil also through molded.And two ends of helical coil are connected with lead frame respectively with two electrode part 3 as inductance 1.In addition, the outer surface of cladding 2 has two tanks 4 for electrode part 3 bending back embeddings (shown in Figure 1B).The structure of above-mentioned inductance 1 has the high characteristic of the little and anti-current value of volume.
Yet when the collocation of the module of inductance and circuit board, sometimes (for example: when electric induction is used for dc power converter (DC/DC converter)) can the better characteristic of needs, for example higher inductance value, bigger anti-current value (I
Sat), littler dc impedance, higher frequency or better with circuit board module collocation efficient, but still have size can not become big restriction.
Summary of the invention
The object of the present invention is to provide a kind of induction structure, to solve prior art problems.
For achieving the above object, the induction structure that one embodiment of the invention provides comprises a coil, a non-ferrite layer, two electrode part, one first ferrite layer and one second ferrite layer, non-ferrite layer coats coil and has a relative first surface and a second surface, two electrode part are connected with the two ends of coil respectively and the electrode part of part is extended non-ferrite layer, the first surface setting of the contiguous non-ferrite layer of first ferrite layer, the second surface setting of the contiguous non-ferrite layer of second ferrite layer.
Useful technique effect of the present invention is that it can address the deficiencies of the prior art and problem.When the collocation of the module of inductance and circuit board, for example: electric induction can have better characteristic when being used for dc power converter (DC/DC converter), for example has higher inductance value, bigger anti-current value (I
Sat), littler dc impedance, higher frequency or better with the circuit board module efficient of arranging in pairs or groups, big but size can't become.
Description of drawings
Figure 1A and Figure 1B are the constitutional diagram of traditional induction structure;
Fig. 2 A is the constitutional diagram of an embodiment of induction structure of the present invention;
Fig. 2 B is the end view of Fig. 2 A;
Fig. 3 is the constitutional diagram of another embodiment of induction structure of the present invention;
Fig. 4 A and Fig. 4 B are the end view of another embodiment of induction structure of the present invention;
Fig. 5 and Fig. 6 are the inductance value and the current relationship curve of the present invention and prior art induction structure;
Fig. 7 A and Fig. 7 B are the constitutional diagram of another embodiment of induction structure of the present invention;
Fig. 8 is the manufacturing flow chart of an embodiment of induction structure of the present invention;
Fig. 9 is another inductance value and the current relationship curve of the present invention and prior art induction structure.
Symbol description among the figure
10 induction structures
12 non-ferrite layers
13 electrode part
14 tanks
15a first ferrite layer
The 151a tank
15b second ferrite layer
The 151b tank
16a first adhesion coating
16b second adhesion coating
17 coils
18 fixtures
The 19a first surface
The 19b second surface
Embodiment
Fig. 2 A and Fig. 2 B show the embodiment of induction structure of the present invention, and wherein Fig. 2 B is the end view of Fig. 2 A.Induction structure 10 can be described as power inductance (power inductor or powerchoke), and so-called power inductance is the high induction structure of anti-current value.Induction structure 10 comprises a coil (Coil) 17, one first magnetic, two electrode part 13 and second magnetic.Wherein, coil 17 has two ends, and in the present embodiment, coil 17 is coiling (winding) structure, in detail, is to use the helical form winding structure with metal wire rod coiled hollow that insulation coats and forms; But the structure of coil 17 is lamination (multi-layer) or film (Thin Film) structure also.The material of metal wire rod can be gold, copper or other alloy.
In the present embodiment, first magnetic is a non-ferrite (Non-Ferrite) layer 12, non-ferrite layer 12 coats coil 17 and has a relative first surface 19a and a second surface 19b, and non-ferrite layer 12 has one first permeability (permeability).The non-ferrite layer 12 of part is filled in the magnetic core (magnetic core) that coil 17 centres can be used as induction structure 10, and remaining non-ferrite layer 12 is coated on the coil 17 outside closed magnetic paths that form.And non-ferrite layer 12 can be metallicl magnetic material (Metallic magnetic material), for example can be the group that is selected from pure iron (Fe), siderochrome silicon alloy (Fe-Cr-Si Alloy) or ferro-silicium (Fe-Si Alloy) one of them or its combination.In the present embodiment, non-ferrite layer 12 is one-body molded with compression forming (CompressionMolding) mode and coil 17, but not as limit.Non-ferrite layer 12 also can utilize alternate manner to form, as injection mo(u)lding or hot-forming.Moreover, also can insert magnetic core in the centre of coil 17, form the non-ferrite layer 12 that only is coated on coil 17 outsides with compression forming or injection mo(u)lding again.Two electrode part 13 are connected with the two ends of coil 17 respectively and the electrode part 13 of part is extended non-ferrite layer 12.Electrode part 13 can be utilized the lead frame that is connected in coil 17 two ends and form or the coil two ends are imposed machining and form flat body as electrode part 13.Electrode part 13 electrically connects in order to the module (not icon) with collocation.
The first surface 19a or the second surface 19b of contiguous at least first magnetic (being non-ferrite layer 12) of second magnetic are provided with, and second magnetic has one second permeability (permeability), and second permeability is greater than first permeability.In the present embodiment, second magnetic comprises the first ferrite layer 15a and the second ferrite layer 15b, and the first surface 19a of the contiguous non-ferrite layer 12 of the first ferrite layer 15a is provided with, and the second surface 19b of the contiguous non-ferrite layer 12 of the second ferrite layer 15b is provided with.The permeability of the first ferrite layer 15a and the second ferrite layer 15b can be identical or different.The first ferrite layer 15a and the second ferrite layer 15b can be Ferrite Material (Ferritematerial), for example can be that manganese-zinc ferrite (MnZn Ferrite), nickel-zinc ferrite (NiZnFerrite) wait one of them or its combination.The first ferrite layer 15a and the second ferrite layer 15b have two tanks 14 on one of them the surface away from non-ferrite layer 12.In the present embodiment, tank 14 is arranged on the surface of the first ferrite layer 15a.And the electrode part 13 of extending non-ferrite layer 12 is respectively after non-ferrite layer 12 and the bending of first ferrite layer 15a surface, embed in the tank 14, but the first ferrite layer 15a also can not be provided with tank 14 (as Fig. 3), in this situation, electrode part 13 can bend other position in induction structure 10 on demand.
Between first magnetic and second magnetic a non-magnetic layer can be set, non-magnetic layer can be mica sheet, air, epoxy resin (Epoxy) or heat resistant adhesive tape.In the present embodiment, non-magnetic layer comprises the first adhesion coating 16a and the second adhesion coating 16b, the first adhesion coating 16a directly is arranged between the first surface 19a and the first ferrite layer 15a of non-ferrite layer 12, and the second adhesion coating 16b directly is arranged between the second surface 19b and the second ferrite layer 15b of non-ferrite layer 12.Second magnetic can be fixed on first magnetic by the first adhesion coating 16a and the second adhesion coating 16b.The material of the first adhesion coating 16a and the second adhesion coating 16b can be epoxy resin (Epoxy).Yet, the present invention also can utilize alternate manner to fix the first ferrite layer 15a and the second ferrite layer 15b, for example, Fig. 4 A provides another embodiment, the first adhesion coating 16a and the second adhesion coating 16b have been omitted, and set up two cross sections is the fixture 18 of ㄈ type and the outer surface that is held on the first ferrite layer 15a and the second ferrite layer 15b, makes the first ferrite layer 15a and the second ferrite layer 15b be individually fixed in the first surface 19a and the second surface 19b of non-ferrite layer 12.In addition, for icon succinct, not show electrode portion 13 and tank 14 in the icon.Moreover shown in Fig. 4 B, the first ferrite layer 15a and the second ferrite layer 15b more can comprise tank 151a, 151b respectively, and the two ends of fixture 18 can be placed in tank 151a, the 151b so that induction structure not reason use fixture and thickness increased.
The induction structure 10 of the foregoing description is applicable to that (Surface MountingTechnology SMT), but is not limited to this to the surface adhering technology; And the induction structure 10 of the foregoing description be shaped as cube, but also can be cuboid, cylinder, oval cylinder or other shape.
The characteristic of non-ferrite (Non-Ferrite) is to have lower permeability (permeability), make the higher but dc impedance height of the anti-current value that to bear, the characteristic of ferrite (Ferrite) is to have higher permeability (permeability), makes that the anti-current value that dc impedance is low but can bear is low.But, certain module (as: dc power converter (DC/DC converter)), need bigger inductance value, bigger anti-current value, less dc impedance, higher frequency and better and circuit board module collocation efficient, have low inductance value during perhaps high electric current and low current has high inductance value, and prior art only adopts the induction structure of non-ferritic material or only adopt the induction structure of ferritic material all can't reach the demand.The present invention utilizes being provided with of ferrite layer to replace the non-ferrite layer of part, because the high permeability of ferrite layer, the inductance value of induction structure 10 of the present invention can than the inductance value that is the induction structure formed of non-ferrite layer fully come highly and dc impedance value less, make the whole efficiency raising.And in original identical inductance value condition under, induction structure of the present invention can utilize the number of turns with coil 17 to reduce, and makes inductance value remain unchanged, and because the number of turns minimizing of coil 17, therefore the dc impedance value also reduces, and reaches the purpose that reduces power loss and promote efficient.
In addition, by the setting of non-magnetic layer and the thickness of suitably controlling non-magnetic layer, make when the magnetic field that produces under big electric current is delivered to ferrite layer, can act on the non-saturated region of the curve (being B-H loop) of its B of ferrite and H relation, increase fixing inductance value to keep whole system, simultaneously induction structure 10 can have bigger anti-current value, and solving the induction structure that adopts ferritic material, inductance value can level off to the problem of zero (producing magnetic saturation) when high electric current.Prior art structure (only adopting non-ferritic material) with Figure 1A is carried out software simulation, result such as following table one, table two, table three, Fig. 5 and Fig. 6 with the structure of the present invention of Fig. 2 A:
Table one:
Table two:
Table three:
By experimental result as can be known, the present invention has higher value of inductance and anti-current value (being the saturation current rated value) compared to prior art; And shown in Fig. 5 (corresponding to table one) and Fig. 6 (corresponding to table three), the present invention is almost parallel with the current relationship curve with the inductance value of the induction structure of prior art, and curve of the present invention is compared to the up translation of curve of prior art, so represent that obviously the present invention can have prior art and only adopt the high anti-current value characteristic of non-Ferrite Material and inductance value is improved.
In addition, another embodiment of the present invention, adopt single ferrite layer 15a (shown in Fig. 7 A) or 15b (shown in Fig. 7 B), and the software simulation result of this embodiment is as follows:
Table four:
Table five:
By experimental result as can be known, the present invention has higher value of inductance and anti-current value compared to prior art; And shown in Fig. 6 (corresponding to table five), the present invention is almost parallel with the current relationship curve with the inductance value of the induction structure of prior art, and curve of the present invention is compared to the up translation of curve of prior art, so represent that obviously the present invention can have prior art and only adopt the high anti-current value characteristic of non-Ferrite Material and inductance value is improved.
Moreover, prior art structure (only adopting non-ferritic material) with Figure 1A is carried out software simulation with the structure of the present invention of Fig. 2 A, and both height and winding turns are identical, non-magnetic layer gross thickness of the present invention is 100um, the thickness of each ferrite layer is 0.225mm, the result of gained as shown in Figure 9, as seen from the figure, its inductance value of induction structure of the present invention and anti-current value characteristic all only adopt the induction structure of non-Ferrite Material good than prior art.
Fig. 8 shows an embodiment of the manufacture method of induction structure 10 of the present invention, and manufacture method comprises the non-ferrite layer (step 502) of the reservation shape that a coil 17 (step 501), moulding one embedded coil are provided and fixes the surface (step 503) of a ferrite sheet material in non-ferrite layer respectively.In this preferred embodiment, step 502 is to utilize compression forming (Compression Molding) to form non-ferrite layer 12, but also can use other method to form non-ferrite layer at other embodiment, and step 502 more comprises and places coil 17 in the mould (figure do not show) and mould is extended to form two electrode part 13 in the two ends of coil 17, the non-ferrite powder of filling magnetic is in mould and coat coil 17, and carry out compression forming, make non-ferrite powder form the non-ferrite layer 12 of reservation shape.And step 503 is fixed the method for a ferrite sheet material, utilize sticker fixedly ferrite sheet material in the surface of this non-ferrite layer 12, ferrite sheet material can be the first ferrite layer 15a or one second ferrite layer 15b, sticker is the first adhesion coating 16a or the second adhesion coating 16b, but also can fix in other embodiments, for example the method for fixture 18 with other method.
The above is preferred embodiment of the present invention only, is not in order to limit claim of the present invention; All other do not break away from the equivalence of being finished under the spirit that invention discloses and changes or modify, and all should be included in the scope of claims.
Claims (7)
1. an induction structure is characterized in that, comprises:
One coil has two ends;
One first magnetic coats this coil, and has a relative first surface and a second surface, and this first magnetic has one first permeability;
Two electrode part are connected with the two ends of this coil respectively and this electrode part of part is extended this first magnetic; And
One second magnetic, this first surface of contiguous at least this first magnetic is provided with, and has one second permeability, and this second permeability is greater than this first permeability.
2. structure as claimed in claim 1 is characterized in that, more comprises a non-magnetic layer, is arranged between the first surface and this second magnetic of this first magnetic.
3. structure as claimed in claim 2 is characterized in that, wherein this non-magnetic layer can be mica sheet, air, epoxy resin or heat resistant adhesive tape.
4. structure as claimed in claim 1, it is characterized in that, wherein second magnetic comprises one first ferrite layer and one second ferrite layer, and this first surface of contiguous this first magnetic of this first ferrite layer is provided with, and this second surface of contiguous this first magnetic of this second ferrite layer is provided with.
5. structure as claimed in claim 4, it is characterized in that, more comprise one first adhesion coating and one second adhesion coating, this first adhesion coating directly is arranged between the first surface and this first ferrite layer of this first magnetic, and this second adhesion coating directly is arranged between the second surface and this second ferrite layer of this first magnetic.
6. structure as claimed in claim 1 is characterized in that, more comprises a fixture, is held on the outer surface of this second magnetic.
7. structure as claimed in claim 1 is characterized in that, wherein this first magnetic is a metallicl magnetic material, and this second magnetic is a Ferrite Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101626559A CN101414505A (en) | 2007-10-16 | 2007-10-16 | Inductance structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101626559A CN101414505A (en) | 2007-10-16 | 2007-10-16 | Inductance structure |
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| Publication Number | Publication Date |
|---|---|
| CN101414505A true CN101414505A (en) | 2009-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101626559A Pending CN101414505A (en) | 2007-10-16 | 2007-10-16 | Inductance structure |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104078205A (en) * | 2013-03-25 | 2014-10-01 | 乾坤科技股份有限公司 | Inductor |
| CN105390246A (en) * | 2014-08-21 | 2016-03-09 | 乾坤科技股份有限公司 | Induction and induction manufacturing method |
| CN110600246A (en) * | 2018-06-13 | 2019-12-20 | Tdk株式会社 | Coil component |
| CN113380507A (en) * | 2021-05-21 | 2021-09-10 | 无锡蓝沛新材料科技股份有限公司 | Four-electrode integrally-formed inductor and preparation method thereof |
| CN113936893A (en) * | 2021-10-11 | 2022-01-14 | 天通凯立科技有限公司 | Method for manufacturing multilayer composite soft magnetic ferrite magnetic core |
-
2007
- 2007-10-16 CN CNA2007101626559A patent/CN101414505A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104078205A (en) * | 2013-03-25 | 2014-10-01 | 乾坤科技股份有限公司 | Inductor |
| CN104078205B (en) * | 2013-03-25 | 2017-01-04 | 乾坤科技股份有限公司 | Inducer |
| CN105390246A (en) * | 2014-08-21 | 2016-03-09 | 乾坤科技股份有限公司 | Induction and induction manufacturing method |
| CN105390246B (en) * | 2014-08-21 | 2019-03-12 | 乾坤科技股份有限公司 | Inductance and the method for manufacturing inductance |
| CN110600246A (en) * | 2018-06-13 | 2019-12-20 | Tdk株式会社 | Coil component |
| CN110600246B (en) * | 2018-06-13 | 2022-07-12 | Tdk株式会社 | Coil component |
| CN113380507A (en) * | 2021-05-21 | 2021-09-10 | 无锡蓝沛新材料科技股份有限公司 | Four-electrode integrally-formed inductor and preparation method thereof |
| CN113936893A (en) * | 2021-10-11 | 2022-01-14 | 天通凯立科技有限公司 | Method for manufacturing multilayer composite soft magnetic ferrite magnetic core |
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Application publication date: 20090422 |