CN203582456U - Micro-electro-mechanical device and electronic system - Google Patents

Micro-electro-mechanical device and electronic system Download PDF

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Publication number
CN203582456U
CN203582456U CN201320369526.8U CN201320369526U CN203582456U CN 203582456 U CN203582456 U CN 203582456U CN 201320369526 U CN201320369526 U CN 201320369526U CN 203582456 U CN203582456 U CN 203582456U
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China
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terminal
micro
coupled
equipment according
switch
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G·阿里加托
B·西摩尼
C·瓦尔扎西纳
L·科尔索
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STMicroelectronics SRL
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STMicroelectronics SRL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0074—3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/008—MEMS characterised by an electronic circuit specially adapted for controlling or driving the same
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/092—Buried interconnects in the substrate or in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/093—Conductive package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Electrotherapy Devices (AREA)
  • Bidet-Like Cleaning Device And Other Flush Toilet Accessories (AREA)
  • Slot Machines And Peripheral Devices (AREA)

Abstract

The utility model relates to a micro-electro-mechanical device and an electronic system. The micro-electro-mechanical device comprises a body for accommodating a micro-electro-mechanical structure, and a cap which is bonded to the body through a conductive bonding area and is electrically coupled to the micro-electro-mechanical structure. The cap comprises a selection module, having a first selection terminal, a second selection terminal and at least a control terminal, which are connected to the micro-electro-mechanical structure. The selection module controllably enables the second selection terminal to be coupled to the corresponding first selection terminal through the control terminal, based on one of coupling configurations corresponding to the operation status.

Description

Micro-electromechanical device and electronic system
Technical field
The utility model relates to micro-electromechanical device and electronic system.
Background technology
As everyone knows, the use of MEMS (MEMS) has been run into ever-increasing expansion in the technology of all trades and professions, and having produced stem-winding result in application on a large scale, especially in the production of inertial sensor, micro-integrated gyroscope and electromechanical oscillator.
Requiring under ever-increasing promotion of the flexibility to high-performance and use, technology has developed by leaps and bounds and has caused detecting the different independently production of the microminiaturized micro-electro-mechanical sensors of amount.For example, the multiaxial motion sensor (accelerator and gyroscope) that is integrated in the micro-structural in single nude film about use has proposed numerous solutions.
But trend microminiaturization and integrated trend, to being integrated in sensor and the external environment condition in nude film, especially run into restriction with the demand side conventionally communicating at the upper control appliance obtaining of the nude film separating (dice).In fact, the nude film of integrated microstructure pith is to be exclusively exclusively used in to hold the contact pad being connected with the external world.Self-contradictory, although from dynamo-electric position, ripe solution provides very-close-coupled microstructure design, and the area that pad and corresponding connecting line need but can not be reduced to and exceed certain limit.
Can detect some independently integrated sensors of amount and therefore need to consider the sizable expenditure aspect area.
For the design connecting, except wanting the difficulty on technical solution, yield per unit area is also very low, and the cost of equipment is higher.
Utility model content
Target of the present utility model is to provide the micro-electromechanical device and the electronic system that make it possible to overcome above-mentioned restriction.
According to an aspect of the present utility model, a kind of micro-electromechanical device is provided, comprising: main body, hold micro electromechanical structure; Cap, is bonded to described main body and is electrically coupled to described micro electromechanical structure by conductive bond region; Wherein said cap comprises selection module, described selection module has and is connected to first of described micro electromechanical structure and selects terminal, second to select terminal and control terminal at least, and described selection module, optionally according to one of multiple coupled configuration corresponding with corresponding operation conditions, is controllably selected terminal to be coupled to corresponding first by described second by described control terminal and is selected terminal.
Preferably, described second select terminal on number, to be less than described the first selection terminal.
Preferably, described selection module comprises multiple switches, and described multiple switches have the second conducting terminal that is coupled to the first conducting terminal of corresponding the first selection terminal and is coupled to corresponding the second selection terminal.
Preferably, comprise and be configured to determine each switch) the driver part of state.
Preferably, comprise and be configured to provide at least control appliance of clock signal to described driver part.
Preferably, the state that described driver part is configured to receive described clock signal and determines each switch according to described clock signal.
Preferably, described first conducting terminal of described switch is coupled to corresponding independent first and selects the group of terminal and switch to have to be coupled to identical second to select corresponding described the second conducting terminal of terminal.
Preferably, described first conducting terminal of described switch is coupled to corresponding independent first and selects the group of terminal and switch to have to be coupled to identical second corresponding described the second conducting terminal of selecting terminal, described driver part) be configured in each group once an only closed switch.
Preferably, this micro-electromechanical device comprises: contact pad, is arranged on the face relative with described main body of described cap, and is coupled to the described second selection terminal of described selection module.
Preferably, this micro-electromechanical device comprises: through hole, is connected to described selection module by pad described in described cap.
Preferably, described cap comprises the routing infrastructure to described micro electromechanical structure by the described first selecting side sub-connection of described selection module.
Preferably, described cap comprises the routing infrastructure to described micro electromechanical structure by the described first selecting side sub-connection of described selection module, and described routing infrastructure selects terminal to be coupled to described pad by respective through hole by described second of described selection module.
According to second aspect of the present utility model, a kind of electronic system is provided, comprise control module and according to the micro-electromechanical device that is coupled to described control module (1) described in any one in above-mentioned.
By using technique scheme, can solve the problems of the technologies described above at least in part, and obtain corresponding technique effect.
Accompanying drawing explanation
In order to understand better the utility model, some embodiment of the present utility model will be described now, only by nonrestrictive example and with reference to the mode of accompanying drawing, wherein:
Fig. 1 is the simplification top view according to the micro-electromechanical device of embodiment of the present utility model;
Fig. 2 is the simplified block diagram of the micro-electromechanical device of Fig. 1;
Fig. 3 is the cross section through the part of the micro-electromechanical device of Fig. 1;
Fig. 4 is the circuit diagram of the simplification of the details of the micro-electromechanical device of Fig. 1;
Fig. 5 is the circuit diagram of the simplification of the variant of the details of Fig. 4;
Fig. 6 illustrates the figure about the amount of using in micro-electromechanical device according to the variant of Fig. 5;
Fig. 7 illustrates the form about the interrelated logic function using in micro-electromechanical device according to the variant of Fig. 5;
Fig. 8 is according to the simplified block diagram of the micro-electromechanical device of different embodiment of the present utility model;
Fig. 9 is according to the top view of the micro-electromechanical device of another embodiment of the present utility model;
Figure 10 is according to the cross section of the part through micro-electromechanical device of another embodiment of the present utility model;
Figure 11 is according to the cross section of the part through micro-electromechanical device of another embodiment of the present utility model;
Figure 12 is the simplification top view with the micro-electromechanical device of the Figure 11 being partly removed; And
Figure 13 is the simplified block diagram having merged according to the electronic system of the micro-electromechanical device of the utility model embodiment.
The specific embodiment
With reference to figure 1 and Fig. 2, schematically illustrate multiaxis micro-electro-mechanical sensors, and entirety is by 1 sign.Micro-electro-mechanical sensors 1 comprises structure member 2 and control circuit or ASIC (special IC) 3.
Structure member 2 comprises micro-structural nude film 4 and protective cap 5 then, by conductive bond region 7 bonding each other.
According to an embodiment, micro-structural nude film 4 holds the first micro electromechanical structure 8 and the second micro electromechanical structure 10, and it forms respectively multiaxis accelerator and the gyrostatic structure division of capacitor type multiaxis.Hereinafter, for brevity, these micro electromechanical structures will be called as " micro-structural 8 " and " micro-structural 10 ".
The first micro-structural 8 and the second micro-structural 10 have the respective ends subgroup 8a, the 10a (Fig. 3) that by corresponding conductive bond region 7, are coupled to protective cap 5.
Protective cap 5 is not only also bonded to micro-structural nude film 4 by bonding ring (not shown) by conductive bond region 7, and protective cap 5 is arranged to protect micro-structural 8,10.Bonding ring and conductive bond region 7 are preferably made by single conductive bond layer, and are comprised of identical conductive material.But conductive bond region 7 and conducting ring electric insulation, to realize suitable signal route.
Protective cap 5 comprises selects module 13, driver module 14, routing infrastructure 15 and through hole 17, for example, be TSV (silicon through hole technology) type.
Select module 13 and driver module 14 to be fabricated among a part for protective cap 5, for for simplicity, it will be hereinafter referred to as " substrate ".But, will understand, according to making, select module 13 and driver module 14 necessary requirements, this part of protective cap 5 can also comprise polycrystal semiconductor layer and single-crystal semiconductor layer and dielectric layer or part layer except comprising suitable semiconductor base.
Select module 13 and driver module 14 to be accommodated near of the face 18a adjacent with routing infrastructure 15 of substrate 18.
Routing infrastructure 15 comprises multiple connecting lines 16, and multiple connecting lines 16 are disposed on some horizontal planes and are embedded in dielectric materials layer 19.Therefore routing infrastructure 15 makes it possible in micro-structural 8,10 and selects between module 13, selecting between module 13 and driver module 14 and selecting module 13 and driver module 14 and be disposed between the contact pad 20 of corresponding signal terminal 3a on the face 18b relative with the face 18a of substrate 18 and that be coupled to control appliance 3, to provide multiple fixing and non-coplanar connections (Fig. 1 and Fig. 2).
As shown in Figure 2 schematically, selecting module 13 to have multiple first selects terminal 13a, second to select terminal 13b and control terminal 13c.As below released, select first of module 13 to select terminal 13a by routing infrastructure 15 and bonding region 7, to be coupled to terminal 8a and the 10a of the first micro-structural 8 and the second micro-structural 10.Second selects terminal far fewer than the first selection terminal 13a, and is coupled to corresponding contact pad 20.By routing infrastructure 15 and respective through hole 17, obtain the connection of the second selection terminal 13b to pad 20, this through hole 17 passes substrate 18 to opposite face 18b from the face 18a adjacent with routing infrastructure 15.
In illustrated embodiment, control terminal 13c is coupled to the corresponding output of driver module 14 herein.Alternatively, in the situation that there is no driver module 14, control terminal 13c can directly be coupled to the corresponding clock terminal 3b of control appliance 3.
Selection module 13 comprises the switch 21 (herein by driver module 14) that multiple controlled devices 3 are controlled, so that according to multiple coupled configuration, corresponding with corresponding operation conditions option and installments, the second selection terminal 13b is coupled to the first selection terminal 13a.
As illustrated by way of example in Fig. 4, switch 21 has the second conducting terminal that is coupled to the first conducting terminal of corresponding the first selection terminal 13a and is coupled to corresponding the second selection terminal 13b.In addition, the sub-13c of corresponding controling end of module 13 is selected in the control terminal control of switch 21.More specifically, in one embodiment, the first conducting terminal of switch 21 is coupled to corresponding (distinct) separately first and selects terminal 13a.The 21a of group of switch 21 has corresponding the second conducting terminal that is coupled to same selection terminal 13b on the contrary.
Switch 21 is controlled in this way, thereby in each 21a of group, only has switch 21 closures at every turn, and all other switches are all opened.
(Fig. 5) in one embodiment, micro-structural 8,10 is to corresponding the first terminal 13a ', 13a " provides signal for faster AX, AY, AZ and angular velocity signal Ω X, Ω Y, Ω Z.For brevity, illustrate the situation of unipolar signal herein, but the content having illustrated is generally also applicable to the situation of differential signal, except the following fact: the first terminal 13a, the second terminal 13b and the switch 21 that also require different numbers.The first terminal 13a ' that receives signal for faster AX, AY, AZ optionally can be connected with same the second terminal 13b ' by the first 21a ' of group of switch 21 ', and the second 21a of group of the first terminal 13a of acceptance angle rate signal Ω X, Ω Y, Ω Z " optionally by switch 21 " " with same the second terminal 13b " can be connected.The switch 21 ' of the first 21a ' of group and the second group 21 " switch 21 " the operating period of micro-electro-mechanical sensors 1 alternately optionally closed one at a time.
Refer again to Fig. 1 to Fig. 3, driver module 14 has the input that is coupled to the corresponding clock terminal 3b of control appliance 3 by routing infrastructure 15, through hole 17 and the pad 20 on the face 18b of substrate 18.Driver module 14 is from control appliance 3 receive clock signal CK1 ..., CKM, and produce the control signal SC1 for switch 21 ..., SCN.Can be by the shared control signal SC1 of switch 21 of the independent 21a of group ..., SCN is provided for the control terminal 13c that selects module 13, in order to determine the state (open or closed) of each switch 20.In this way, driver module 14 is determined the selection configuration of module 13 and the running status of micro-electro-mechanical sensors 1.
In the example of Fig. 5, two clock signal C K1, CK2 are offered the corresponding input of driver module 14 concurrently.Alternatively, clock signal can be provided serially by single terminal or a small amount of terminal.Such as during powering up or enter or exit the step of energy-conservation (power saving) configuration, clock signal C K1, CK2 take illustrated value in reading from the Fig. 6 during the step of the signal of micro-structural 8,10 successively, and when micro-electro-mechanical sensors 1 is not in read step, take null value simultaneously.Driver module 14 comprises realizes respective logic function F 1, F2, F3 to generate the logical block 24 of three control signal SC1, SC2, SC3 according to clock signal C K1, CK2.Control signal SC1, SC2, SC3 are provided for respectively respective switch 21 ' and the control terminal the second 21a of group " respective switch 21 " of the first 21a ' of group.
By the mode of illustrated form in Fig. 7, define logical function F1, F2, F3, thereby at each 21a ' of group, 21a " in, all switches 21 ', 21 are " optionally closed one at a time by alternately in the step that reads micro-electro-mechanical sensors 1.
According to illustrated variant schematically in Fig. 8, micro-electro-mechanical sensors 1 comprises the selection module 13* with memory and automatic processing capabilities, and select module 13* that the necessary control signal SC1 of proper handling starting from the single clock signal CK being provided by control appliance 3 is provided, ..., the sequence of SCN.
In this case, except being coupled to the necessary pad 20 of signal terminal 3a, on control appliance 3, single clock terminal 3b is enough, and single pad 20 is enough on protective cap.
According to illustrated embodiment in Fig. 9, the structure member 102 of micro-electro-mechanical sensors comprises micro-structural chip 104 and protective cap 105, and micro-structural chip 104 holds the first micro-structural 108 and the second micro-structural 110.Protective cap 105 the is integrated selection module 113 of substantially having described, driver module 114 and routing infrastructure (not shown).On protective cap 105, contact pad 120 is produced the micro-structural for being contained in micro-structural chip 104.Micro-structural nude film 104 is planned at least one side about protective cap, and in free part, also holds contact pad 120 '.
Figure 10 shows the structure member 202 according to the micro-electro-mechanical sensors of another embodiment of the present utility model.Intactly do not illustrate micro-electro-mechanical sensors, and except comprising structure member 202, micro-electro-mechanical sensors also comprises the control appliance or the ASIC that have substantially described.
Structure member 202 comprises micro-structural nude film 204 and protective cap 205, by conductive bond region 207 bonding each other.
Micro-structural nude film 204 holds the first micro-structural 208 and second micro-structural 210 of the structure division that forms respectively two-axis accelerometer (have in plane and detect) and single shaft accelerator (having plane detects) outward.
Particularly, the first micro-structural 208 comprises the first detection mass body 230 of being made by semi-conducting material, and it is constrained to the substrate 231 of micro-structural chip 204 herein by flexible Connection Element (not shown).Independently translation freedoms is removable about substrate 231 according to two for the first detection mass body 204, and can near equilibrium locations, vibrate.The first detection mass body 230 has plane travelling electrode 232 (being illustrated by the broken lines), is capacitively coupled to corresponding fixed electrode 235 (being also plane), and fixed electrode 235 is anchored into substrate 231.Unshowned other travelling electrode is disposed in the plane vertical with travelling electrode 232 and with fixed electrode 235 and is coupled with fixed electrode.
The second micro-structural 210 comprises the second detection mass body 240, and it is also to be made and also by another elastic coupling element (not shown), be constrained to substrate 231 by semi-conducting material, so that about the axle A vibration parallel with the face 231a of substrate 231.The second detection mass body 240 limits travelling electrode, and is capacitively coupled to the fixed electrode 243 forming in substrate 231.
The travelling electrode 232 of the first micro-structural 208 and fixed electrode 235 are electrically coupled to protective cap 205 (connection of travelling electrode 232 has also utilized elastic coupling element and invisible in Figure 10) by corresponding bonding region 207.
The second detection mass body 240 is electrically coupled to protective cap 205 (being connected in Figure 10 of the second detection mass body 240 is invisible) by elastic coupling element and corresponding bonding region.
The fixed electrode 243 of the second micro-structural 210 is electrically coupled to protective cap 205 by the connecting line 245, conductive plunger 246 and the corresponding bonding region 207 that form in substrate 231.
Protective cap 205 is bonded to micro-structural chip 204 by bonding region 207 and bonding ring (not shown), and is arranged to protect micro-structural 208,210.Bonding ring and conductive bond region 207 are preferably comprised of same conductive bond layer, and are made by same conductive material.But conductive bond region 207 and bonding ring electric insulation, to realize proper signal route.
Protective cap 205 comprises the selection module 213, routing infrastructure 215 and the through hole 217 that are contained in substrate 218.In this case, protective cap 205 does not have independently driver module, and possible logical function is incorporated in (by schematically sign of numeral 214) in selection module 213.
Routing infrastructure 215 comprises and is embedded in dielectric layer 219 and is disposed in the metal connecting line 216 on some single horizontal faces.Metal connecting line 216 is for example made of copper, and " Damascus " technology of use obtains.
Select module 213 to be accommodated near the face 218a adjacent with routing infrastructure 215 of substrate 218, and there is multiple the first selection terminal 213a and the second selection terminal 213b.First selects terminal 213a to be coupled to the first micro-structural 208 by routing infrastructure 215 and bonding region 207 and to the second micro-structural 210.Second selects terminal 213b far fewer than the first selection terminal 213a, and is coupled to the corresponding contact pad 220 on the face 218b relative with face 218a that is arranged on substrate 218.By routing infrastructure 215 and respective through hole 217, obtain the connection of the second selection terminal 213b to pad 220, this through hole 217 passes substrate 218 to opposite face 218b from face 218a.
Select module 213 substantially according to as described in be made into, and comprise multiple switches (not shown) herein, control this switch, to optionally, according to one of multiple coupled configuration corresponding with corresponding operation conditions, the second selection terminal 213b is coupled to the first selection terminal 213a.In this case, select module 213 to there is memory and automatic processing capabilities, and receive the clock signal C K of the connection for configuring the second selection terminal 213b to the first selection terminal 213a.
Figure 11 shows the structure member 302 according to the micro-electro-mechanical sensors of another embodiment of the present utility model.Intactly do not illustrate micro-electro-mechanical sensors, and except comprising structure member 302, micro-electro-mechanical sensors also comprises the control appliance or the ASIC that have substantially described.
Structure member 302 comprises by conductive bond region 307 micro-structural chip 304 and the protective cap 205 of bonding each other.
Micro-structural chip 304 holds the micro-structural 308 of the structure division that forms two-axis accelerometer.
More specifically, micro-structural 308 comprises the detection mass body 330 of being made by semi-conducting material, detection mass body 330 is mechanically coupled to the substrate 331 of micro-structural nude film 304 to have two frees degree (in the embodiment describing herein, translation freedoms and the rotational freedom about noncentral axis of mass).
Detection mass body 330 has two groups of travelling electrodes 332,333 of surface plate form, and these two groups of travelling electrodes 332,333 extend with pectination form in parallel to each other and vertical with the face 331a of substrate 331 plane.In addition, two groups of travelling electrodes 332,333 are symmetrical substantially.
Micro-structural 308 also comprises two groups of fixed electrodes 335,336, is fixed to substrate 331 and is capacitively coupled to respectively the group of travelling electrode 332,333.
The group of fixed electrode 335 comprises that form is the electrode structure 337 of surface plate equally, and electrode structure 337 extends with pectination form towards detection mass body 330.Travelling electrode 332 and electrode structure 337 extend toward each other and are formed as combing finger-like.
Each electrode structure 337 comprises corresponding the first fixed electrode 337a and corresponding the second fixed electrode 337b, and the first fixed electrode 337a and the second fixed electrode 337b are made by polysilicon and be insulated from each other by dielectric regions 338.The first fixed electrode 337a, dielectric regions 338 and the second fixed electrode 337b form in order stacking in the direction vertical with the face 331a of substrate 331.The first fixed electrode 337a occupy fixed electrode structure 337, in dielectric regions 338 with towards the part of extending between edge (margin) 337c of substrate 331.The second fixed electrode 337b occupy on the contrary electrode structure 337, in dielectric regions 338 and part relative with edge 337c and in the face of extending between the edge 337d of protective cap 305.
The group of fixed electrode 336 is being fixed to substrate 331 rigidly about the position that movably mass body 330 is relative with the group of fixed electrode 335.The group of fixed electrode 336 comprises that form is also the electrode structure 340 of surface plate, electrode structure 340 parallel to each other and with the plane of the face 331a of substrate 331 in towards detection mass body 330, in pectination mode, extend.Travelling electrode 333 and electrode structure 340 extend toward each other and are formed as combing finger-like.
Each electrode structure 340 comprises corresponding the first fixed electrode 340a and corresponding the second fixed electrode 340b, and the two is all made by polysilicon and be insulated from each other by dielectric regions 341.The first fixed electrode 340a, dielectric regions 341 and the second fixed electrode 340b form in order stacking in the direction vertical with the face 331a of substrate 331.The first fixed electrode 340b (the first fixed electrode 337a to corresponding electrode structure 337 is coplanar) occupy fixed electrode structure 340 in dielectric regions 341 with towards the part of extending between the edge 340c of substrate 331.The 4th fixed electrode 340b (the first fixed electrode 337b to corresponding electrode structure 337 is coplanar) occupy on the contrary electrode structure 340 in dielectric regions 341 and relative with edge 340c and towards the part of extending between the edge 340d of protective cap 305.
The first fixed electrode 337a, the 340a of electrode structure 337,340 are coupled to respective electrical connecting line 345, and electric connection line 345 forms and is coupled to protective cap 305 by conductive plunger 346 and corresponding bonding region 307 in substrate 331.
The second fixed electrode 337b, the 340b of electrode structure 337,340 are bonded to protective cap 305 by corresponding bonding region 307.
As illustrated with simplified way in Figure 12, the first fixed electrode 337a of electrode structure 337 and the second fixed electrode 337b are capacitively coupled to the corresponding travelling electrode 332a of detection mass body 3, and with the latter's definition, have the respective electrical container of integral capacitor Ca, Cb.The 3rd fixed electrode 340a of fixed electrode structure 340 and the 4th fixed electrode 340b are capacitively coupled to the corresponding travelling electrode 332b of detection mass body 3 and with the latter's definition, have the respective electrical container of integral capacitor Cc, Cd.
Refer again to Figure 11, protective cap 305 comprises the selection module 313, routing infrastructure 315 and the through hole 317 that are accommodated in substrate 318.
Routing infrastructure 315 comprises and is embedded in dielectric layer 319 and is disposed in the metal connecting line 316 on some single horizontal faces.
Select module 313 to be accommodated near face 318a substrate 318, adjacent with routing infrastructure 315, and there is multiple the first selection terminal 313a and the second selection terminal 313b.First selects terminal 313a to be coupled to micro-structural 308 by routing infrastructure 315 and bonding region 307.Second selects terminal 313b far fewer than the first selection terminal 313a and is coupled to the corresponding contact pad 320 on the face 318b relative with face 318a that is arranged on substrate 318.By routing infrastructure 315 and respective through hole 317, obtain the connection of the second selection terminal 313b to pad 320, through hole 317 passes substrate 318 to relative face 318b from face 318a.
Substantially according to as described in make select module 313, and select module 313 to comprise multiple switches (not shown) herein, control this switch so as optionally according to multiple coupled configuration corresponding with corresponding operation conditions one of, the second selection terminal 313b is coupled to the first selection terminal 313a.In this case, select module 313 to there is to realize memory and the automatic processing capabilities (entirety is indicated by numeral 314) of logic control function, and receive the clock signal C K of the connection for configuring the second selection terminal 313b to the first selection terminal 313a.
On protective cap, use and select module and contact pad advantageously to make it possible to discharge the larger region that space on micro-structural chip and realization can be used for micro-structural.In fact should consider to there is no need pad to be arranged in exclusively around micro-structural.Can cap, cover micro-structural, pad is provided in selecting the region of module and driver module (referring in this connection in Fig. 1 about micro-structural 8,10, select the pad 20 of module 13 and driver module 14).
For towards the external world, especially less towards the number of the required pad of the connection of control appliance, split the number of controlling required pad in pass also less.Therefore, simplified design, also because of the larger flexibility in connecting line forming process, thus provide the pad of large-size to become possibility, thus the follow-up contact that provides is provided.
Figure 13 illustrates according to the part of the electronic system 400 of an embodiment of the present utility model.System 400 has merged micro-electromechanical device 1 and can in following equipment, use, such as palmtop computer (personal digital assistant, PDA), the on knee or portable computer may with wireless capability, cell phone, transmission of messages equipment, digital music player, digital camera or be designed to process, storage, send or the miscellaneous equipment of the information of reception.For example, micro-electromechanical device 1 can be for detection of mobile and carry out image stabilized in digital camera.In another embodiment, the user interface activating in the action of computer or video game console comprises micro-electromechanical device 1.In another embodiment, micro-electromechanical device 1 is merged in satellite navigation and for tracing positional provisionally in the situation that losing satellite positioning signal.
Electronic system 400 (for example can comprise controller 410, I/O (I/O) equipment 420, keyboard or display), micro-electromechanical device 1, wave point 440 and volatibility or non-volatile memory 460, it is coupled to each other by bus 450.In one embodiment, can use battery 480 that system 480 is provided.Should be noted that scope of the present utility model is not limited to have inevitably the embodiment of or the whole equipment of listing.
Controller 410 can for example comprise one or more microprocessors, microcontroller etc.
I/O equipment 420 can be for generation of message.System 400 can be used wave point 440 to send and receive from cordless communication network the message with radio frequency (RF) signal to cordless communication network.The example of wave point can comprise antenna, wireless transceiver, and such as dipole antenna, however, but scope of the present utility model is unrestricted this position.In addition, I/O equipment 420 can provide or with numeral output (if having stored digital information) or represent the voltage of the content of storage with the form of simulation output (if having stored analog information).
Can micro-electromechanical device and method that describe be modified and be changed, and can not depart from the scope of the present utility model that claims limit.
In particular, micro-electromechanical device can merge the micro-electro-mechanical sensors of one or more any types, and micromotor and micro-actuator.
To selecting the grouping and driving of switch of module to change significantly and substantially by the mode decision of operation that is incorporated in sensor, micromotor and micro-actuator in equipment.
In addition, select the switch of module can also be disposed on different selection level faces, for example, according to tree construction.

Claims (13)

1. a micro-electromechanical device, is characterized in that, comprising:
Main body (4; 104; 204; 304), hold micro electromechanical structure (8,10; 108; 208,210; 308);
Cap (5; 105; 205; 305), by conductive bond region (7; 207; 307) be bonded to described main body (4; 104; 204; 304) and be electrically coupled to described micro electromechanical structure (8,10; 108; 208; 308);
Wherein said cap (5; 105; 205; 305) comprise and select module (13; 213; 313), described selection module (13; 213; 313) have and be connected to described micro electromechanical structure (8,10; 108; 208,210; 308) first select terminal (13a), second to select terminal (13b) and control terminal (13c) at least, and described selection module (13; 213; 313), optionally according to one of multiple coupled configuration corresponding with corresponding operation conditions, by described control terminal (13c), controllably by described second, select terminal (13b) to be coupled to corresponding first and select terminal (13a).
2. equipment according to claim 1, is characterized in that, described second selects terminal (13b) on number, to be less than described first selects terminal (13a).
3. equipment according to claim 1 and 2, is characterized in that, described selection module (13; 213; 313) comprise multiple switches (21,21 ', 21 "); described multiple switches (21; 21 ', 21 ") have and are coupled to corresponding first and select the first conducting terminal of terminal (13a, 13a ', 13a ") and be coupled to corresponding second the second conducting terminal of selecting terminal (13b, 13b ', 13b ").
4. equipment according to claim 3, is characterized in that, comprises the driver part (14 that is configured to the state of determining each switch (21,21 ', 21 "); 214; 314).
5. equipment according to claim 4, comprises and being configured to described driver part (14; 214; 314) provide at least clock signal (CK1 ..., CKM, CK1, CK2; CK) control appliance (3).
6. equipment according to claim 5, is characterized in that, described driver part (14; 214; 314) be configured to receive described clock signal (CK1 ..., CKM, CK1, CK2; CK) and according to described clock signal (CK1 ..., CKM, CK1, CK2; CK) determine the state of each switch (21,21 ', 21 ").
7. equipment according to claim 3, it is characterized in that, described first conducting terminal of described switch (21,21 ', 21 ") is coupled to the corresponding independent first group of selecting terminal (13a, 13a ', 13a ") and switch (21,21 ', 21 ") (21a, 21a ', 21a ") to be had and is coupled to identical second corresponding described the second conducting terminal of selecting terminal (13b, 13b ', 13b ").
8. equipment according to claim 6, it is characterized in that, described first conducting terminal of described switch (21,21 ', 21 ") is coupled to the corresponding independent first group of selecting terminal (13a, 13a ', 13a ") and switch (21,21 ', 21 ") (21a, 21a ', 21a ") to be had and is coupled to identical second corresponding described the second conducting terminal of selecting terminal (13b, 13b ', 13b "), described driver part (14; 214; 314) be only configured in each group (21a, 21a ', 21a ") once a closed switch (21,21', 21 ").
9. equipment according to claim 1 and 2, is characterized in that, comprising:
Contact pad (20; 220; 320), be arranged in described cap (5; 105; 205; 305) and described main body (4; 104; 204; 304) relative face (18b; 218b; 318b) upper, and be coupled to described selection module (13; 213; 313) described second select terminal (13b, 13b ', 13b ").
10. equipment according to claim 9, is characterized in that, comprising:
Through hole (17; 217; 317), by described cap (5; 105; 205; 305) by described pad (20; 220; 320) be connected to described selection module (13; 213; 313).
11. equipment according to claim 1 and 2, is characterized in that, described cap (5; 105; 205; 305) comprise described selection module (13; 213; 313) described first select terminal (13a, 13a ', 13a ") to be connected to described micro electromechanical structure (8,10; 108; 208,210; 308) routing infrastructure (15; 215; 315).
12. equipment according to claim 10, is characterized in that, described cap (5; 105; 205; 305) comprise described selection module (13; 213; 313) described first select terminal (13a, 13a ', 13a ") to be connected to described micro electromechanical structure (8,10; 108; 208,210; 308) routing infrastructure (15; 215; 315), described routing infrastructure (15; 215; 315) by respective through hole (17; 217; 317) by described selection module (13; 213; 313) described second select terminal (13b, 13b ', 13b ") to be coupled to described pad (20; 220; 320).
13. 1 kinds of electronic systems, is characterized in that, comprise control module (410) and according to the micro-electromechanical device that is coupled to described control module (410) (1) described in any one in aforementioned claim.
CN201320369526.8U 2012-06-20 2013-06-20 Micro-electro-mechanical device and electronic system Expired - Lifetime CN203582456U (en)

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US20200385260A1 (en) 2020-12-10
US9452922B2 (en) 2016-09-27
US10611629B2 (en) 2020-04-07
US11274036B2 (en) 2022-03-15
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US9718675B2 (en) 2017-08-01
US20140230546A1 (en) 2014-08-21
US20160145096A1 (en) 2016-05-26

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