CN203573960U - Silicon chip subfissure detection device - Google Patents
Silicon chip subfissure detection device Download PDFInfo
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- CN203573960U CN203573960U CN201320723723.5U CN201320723723U CN203573960U CN 203573960 U CN203573960 U CN 203573960U CN 201320723723 U CN201320723723 U CN 201320723723U CN 203573960 U CN203573960 U CN 203573960U
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- silicon chip
- detection device
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- heater
- aqueous water
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Abstract
The utility model discloses a silicon chip subfissure detection device which comprises a closed box body, a heater, a thermocouple, a temperature control intelligent instrument, an inlet pipe and an outlet pipe. Liquid water is contained in the closed box body. The liquid water is heated by the heater. The thermocouple measures the temperature of the liquid water. The temperature control intelligent instrument controls of the power on and power off of the heater. Air is inputted into the closed box body through the inlet pipe. Mixed gas is formed by the air and water vapor. The mixed gas is outputted from the closed box body through the outlet pipe and is jetted to a silicon chip to be measured. The silicon chip subfissure detection device has the advantages of low cost, simple operation and long continuity and can be produced and widely applied.
Description
Technical field
The utility model relates to area of solar cell, relates in particular to a kind of silicon chip subfissure detection device.
Background technology
In photovoltaic field, silicon chip is hidden to be split and refers on the surface of silicon chip and exist and do not penetrate and sightless crackle.This hidden splitting along with long-time placement or the hidden silicon chip repeatability of splitting contact, crackle can extend gradually or penetrate, and causes die crack.
In prior art, mostly utilize screening installation to carry out infrared transmission to silicon chip, catch the hidden defect of splitting of silicon chip.But most screening installations are easily judged by accident, cause the silicon chip of non-defective unit to be mistaken for the hidden silicon chip that splits, the hidden silicon chip splitting is mistaken for non-defective unit.The company of giving and client bring very large loss.
Utility model content
Technical problem to be solved in the utility model is, a kind of silicon chip subfissure detection device is provided, and can effectively detect the hidden of silicon chip and split, and improves the accuracy rate detecting.
In order to solve the problems of the technologies described above, the utility model provides a kind of silicon chip subfissure detection device, comprises an airtight casing, heater, thermocouple, temperature control intelligent instrument, air inlet pipe and escape pipe; Described airtight casing content is put aqueous water; Described heater heats described aqueous water; The temperature of aqueous water described in described thermocouple measurement; The power on/off of heater described in the control of described temperature control intelligent instrument; Air is in the described airtight casing of described air inlet pipe input, and described air and described steam formation gaseous mixture; Described gaseous mixture is exported described airtight casing through described escape pipe, and sprays on silicon slice under test.
Wherein, described airtight casing is the anti-material of getting rusty.
Wherein, the material of described airtight casing is the one in stainless steel, aluminium, copper, aluminium alloy or polytetrafluoroethylene, and the material of described heater is the one in ferrum-chromium-aluminum heating wire and nichrome wire.
Wherein, the temperature range of described aqueous water is between 24 ℃～100 ℃.
Wherein, when described thermocouple records described aqueous water and is the first temperature, heater energising described in the control of described temperature control intelligent instrument, described heater heats described aqueous water; When described thermocouple records described aqueous water temperature and is the second temperature, heater power-off described in the control of described temperature control intelligent instrument, described heater stops described aqueous water heating, and described the first temperature is lower than described the second temperature.
Wherein, described the first temperature is less than 30 ℃, and described the second temperature is 30～50 ℃.
Wherein, described silicon chip subfissure detection device also comprises a level sensor, and the aqueous water in described airtight casing is during lower than degree of depth set point, heater power-off described in the control of described temperature control intelligent instrument, and described heater stops described aqueous water heating.
Wherein, described air inlet pipe is external to the first end of air cleaner, and the second end of described air cleaner is connected to an air compressor, and described air is 0.05～1MPa at the pressure at described air inlet pipe place.
Wherein, described escape pipe is " L " type, the first end of described escape pipe is connected with described airtight casing, and the first end relative level of described escape pipe towards on be 15 °～45 ° inclinations, described gaseous mixture is exported the second end of described escape pipe, and being ejected into described silicon slice under test surface, the pressure of the second end of described escape pipe is less than 0.1MPa.
Wherein, filter screen is established in the end of the second end of described escape pipe, and described gaseous mixture sprays in described silicon slice under test surface after described filter screen.
The utility model adopts described air to mix with described steam, and under certain pressure intensity, is sprayed on described silicon slice under test surface.Described gaseous mixture can cover described silicon slice under test surface dry rapidly, and then hidden the splitting simultaneously of described silicon slice under test show and disappear.Now, whether testing staff can there is hidden splitting by naked eyes intuitive judgment, and accuracy rate is higher.The described silicon chip subfissure detection device that the utility model embodiment provides, cost is low, simple to operate, and continuation is long, can drop into extensive use aborning.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the silicon chip subfissure detection device that provides of the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Below with reference to accompanying drawing, embodiment of the present utility model is described.Referring to Fig. 1, it is the structural representation of the silicon chip subfissure detection device 100 of embodiment in the utility model.Described silicon chip subfissure detection device 100 comprises an airtight casing 10, heater 20, thermocouple 30, temperature control intelligent instrument (not shown), air inlet pipe 50, escape pipe 60 and electric cabinet 40.
The interior accommodating aqueous water of described airtight casing 10.Described heater 20 heats described aqueous water, and described aqueous water also can evaporate and become steam at normal temperatures.Under heating condition, the speed that described aqueous water is evaporated to steam increases.In order to improve thermal endurance and anti-the getting rusty property of described airtight casing 10, described airtight casing 10 is the anti-material of getting rusty, and concrete is the one in stainless steel, aluminium, copper, aluminium alloy or polytetrafluoroethylene.In addition, the material of described heater 20 is the one in ferrum-chromium-aluminum heating wire and nichrome wire.And the temperature of described aqueous water is 24 ℃～100 ℃.
Described thermocouple 30 is measured the temperature of described aqueous water.The power on/off state of heater 20 described in the control of described temperature control intelligent instrument.Concrete, when described thermocouple 30 records described aqueous water and is the first temperature, heater 20 is switched on described in the control of described temperature control intelligent instrument, and described heater 20 heats described aqueous water.When the temperature that described thermocouple 30 records described aqueous water is the second temperature, heater 20 power-off described in the control of described temperature control intelligent instrument, described heater 20 stops described aqueous water heating, and described the first temperature is lower than described the second temperature.In present embodiment, described the first temperature is less than 30 ℃, and described the second temperature is 30～50 ℃.For example, the temperature that described thermocouple 30 records described heater 20 is 45 ℃, higher than in described temperature control intelligent instrument, arrange power-off temperature time, heater 20 power-off described in the control of described temperature control intelligent instrument.
Described silicon chip subfissure detection device 100 also comprises a level sensor (not shown), for described heater 20 is protected, and while preventing that the water level of described aqueous water is lower, described heater 20 dry combustion methods and damaging.Concrete, when the aqueous water in described airtight casing 10 is during lower than degree of depth set point, heater 20 power-off described in the control of described temperature control intelligent instrument, described heater 20 stops, to described aqueous water heating, reducing liquid water evaporation rate.The control device of described level sensor, the control device of described thermocouple and described temperature control intelligent instrument are all installed in described electric cabinet 40.
Described air inlet pipe 50 is external to the first end of air cleaner (not shown), and the second end of described air cleaner is connected to an air compressor (not shown).Air is in described air inlet pipe 50 is inputted described airtight casing 10, and described air and described steam formation gaseous mixture.Described air is for regulating the humidity of described gaseous mixture, and is beneficial to described gaseous mixture and sprays through described escape pipe 60.Described air cleaner is for the moisture of filtered air.Described air is 0.05～1MPa at the pressure at described air inlet pipe 50 places.
Described escape pipe 60 is " L " type, and the first end of described escape pipe 60 is connected with described airtight casing 10.And the first end relative level of described escape pipe 60 towards on be 15 °～45 ° inclinations, be beneficial to condensed described gaseous mixture and be back in described airtight casing 10.
Filter screen (not shown) is established in the end of the second end of described escape pipe 60, and described gaseous mixture sprays in described silicon slice under test surface after described filter screen.The pressure of the second end of described escape pipe 60 is less than 0.1MPa, is beneficial to described gaseous mixture and dries with suitable speed, improves detection efficiency.
The utility model embodiment adopts described air to mix with described steam, and under certain pressure intensity, is sprayed on described silicon slice under test surface.Described gaseous mixture can cover described silicon slice under test surface dry rapidly, and then hidden the splitting simultaneously of described silicon slice under test show and disappear.Now, whether testing staff can there is hidden splitting by naked eyes intuitive judgment, and accuracy rate is higher.
To sum up, the described silicon chip subfissure detection device 100 that the utility model embodiment provides, cost is low, simple to operate, and continuation is long, can drop into extensive use aborning.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The modification done within any spirit at above-mentioned execution mode and principle, be equal to and replace and improvement etc., within all should being included in the protection range of this technical scheme.
Claims (10)
1. a silicon chip subfissure detection device, is characterized in that, comprises an airtight casing, heater, thermocouple, temperature control intelligent instrument, air inlet pipe and escape pipe; Described airtight casing content is put aqueous water; Described heater heats described aqueous water; The temperature of aqueous water described in described thermocouple measurement; The power on/off of heater described in the control of described temperature control intelligent instrument; Air is in the described airtight casing of described air inlet pipe input, and described air and described steam formation gaseous mixture; Described gaseous mixture is exported described airtight casing through described escape pipe, and sprays on silicon slice under test.
2. silicon chip subfissure detection device as claimed in claim 1, is characterized in that, described airtight casing is the anti-material of getting rusty.
3. silicon chip subfissure detection device as claimed in claim 2, it is characterized in that, the material of described airtight casing is the one in stainless steel, aluminium, copper, aluminium alloy or polytetrafluoroethylene, and the material of described heater is the one in ferrum-chromium-aluminum heating wire and nichrome wire.
4. silicon chip subfissure detection device as claimed in claim 1, is characterized in that, the temperature range of described aqueous water is between 24 ℃～100 ℃.
5. silicon chip subfissure detection device as claimed in claim 1, is characterized in that, when described thermocouple records described aqueous water and is the first temperature, and heater energising described in the control of described temperature control intelligent instrument, described heater heats described aqueous water; When described thermocouple records described aqueous water temperature and is the second temperature, heater power-off described in the control of described temperature control intelligent instrument, described heater stops described aqueous water heating, and described the first temperature is lower than described the second temperature.
6. silicon chip subfissure detection device as claimed in claim 5, is characterized in that, described the first temperature is less than 30 ℃, and described the second temperature is 30～50 ℃.
7. silicon chip subfissure detection device as claimed in claim 1, it is characterized in that, described silicon chip subfissure detection device also comprises a level sensor, aqueous water in described airtight casing is during lower than degree of depth set point, heater power-off described in the control of described temperature control intelligent instrument, described heater stops described aqueous water heating.
8. silicon chip subfissure detection device as claimed in claim 1, it is characterized in that, described air inlet pipe is external to the first end of air cleaner, and the second end of described air cleaner is connected to an air compressor, and described air is 0.05～1MPa at the pressure at described air inlet pipe place.
9. silicon chip subfissure detection device as claimed in claim 1, it is characterized in that, described escape pipe is " L " type, the first end of described escape pipe is connected with described airtight casing, and the first end relative level of described escape pipe towards on be 15 °～45 ° inclinations, described gaseous mixture is exported the second end of described escape pipe, and is ejected into described silicon slice under test surface, and the pressure of the second end of described escape pipe is less than 0.1MPa.
10. silicon chip subfissure detection device as claimed in claim 9, is characterized in that, filter screen is established in the end of the second end of described escape pipe, and described gaseous mixture sprays in described silicon slice under test surface after described filter screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320723723.5U CN203573960U (en) | 2013-11-15 | 2013-11-15 | Silicon chip subfissure detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320723723.5U CN203573960U (en) | 2013-11-15 | 2013-11-15 | Silicon chip subfissure detection device |
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| Publication Number | Publication Date |
|---|---|
| CN203573960U true CN203573960U (en) | 2014-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320723723.5U Expired - Fee Related CN203573960U (en) | 2013-11-15 | 2013-11-15 | Silicon chip subfissure detection device |
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| CN (1) | CN203573960U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789082A (en) * | 2016-05-18 | 2016-07-20 | 上海柏凌电子科技有限公司 | System for detecting silicon chip subfissure |
| CN113921416A (en) * | 2021-12-14 | 2022-01-11 | 南京日托光伏新能源有限公司 | MWT battery laser drilling subfissure testing method |
-
2013
- 2013-11-15 CN CN201320723723.5U patent/CN203573960U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789082A (en) * | 2016-05-18 | 2016-07-20 | 上海柏凌电子科技有限公司 | System for detecting silicon chip subfissure |
| CN105789082B (en) * | 2016-05-18 | 2018-04-06 | 上海柏凌电子科技有限公司 | A kind of silicon chip is hidden to split detecting system |
| CN113921416A (en) * | 2021-12-14 | 2022-01-11 | 南京日托光伏新能源有限公司 | MWT battery laser drilling subfissure testing method |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140430 Termination date: 20201115 |