A kind of mask plate
Technical field
The utility model relates to a kind of mask plate, is specifically related to the mask plate that a kind of OLED evaporation is used.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode; OLED) indicating meter has a series of advantages such as independently luminous, low-voltage direct-current drives, entirely solidifies, visual angle is wide, color is abundant, compared with liquid-crystal display, OLED indicating meter does not need backlight, visual angle is large, power is low, its response speed can reach 1000 times of liquid-crystal display, and its manufacturing cost is but lower than the liquid-crystal display of equal resolving power.Therefore, OLED displaying appliance has broad application prospects, and becomes gradually the following 20 years the fastest novel technique of display of growth.
The making of the organic layer material in OLED structure need to be used the mask plate that evaporation is used, and tradition is made mask plate by etch process, before evaporation, needs mask plate to draw in the net to be fixed on mask frame, and after drawing in the net to fix, mask plate has certain tension force.The schematic cross-section in mask plate evaporation hole as shown in Figure 1, 1 is the ito surface (one side contacting with deposition substrate) of mask plate, 2 is the evaporation face one side of vapor deposition source (towards) of mask plate, 11 is the evaporation hole of mask plate, the cross section in evaporation hole 11 is bowl-shape, because the edge in evaporation hole 11 is thinner, mask plate has the easy perk in edge in evaporation hole afterwards of certain tension force, as shown in the perk part 12 in Fig. 1, the part 12 of evaporation bore edges perk can scratch deposition substrate in evaporate process, thereby affect the quality of indicating meter, and the bad control of size in the mask plate evaporation hole 11 making by etch process.
The utility model is mainly to propose a kind of mask plate and preparation method thereof for above problem, solves preferably the above problem.
Utility model content
In view of this, main purpose of the present utility model is to provide a kind of mask plate and preparation method thereof, makes to reduce evaporation hole wall to the blocking of deposition material in evaporate process as far as possible, and can prevent that the perk of mask plate evaporation bore edges from scratching deposition substrate.
The utility model provides a kind of mask plate, comprise mask plate body and be formed on the evaporation hole on described mask plate body, described mask plate body is run through in described evaporation hole, described mask plate comprises evaporation face and ito surface, it is characterized in that: described evaporation hole is provided with groove at described ito surface, on the cross section at central axis place, described evaporation hole, the edge line in the evaporation hole of described evaporation face is bowl-shape.
Further, the hole wall in described evaporation hole of evaporation face and the plate face of mask plate body are 30 °~60 ° angles.
Further, the plate face of the sidewall of the groove of ito surface and mask plate body is 60 °~90 ° angles.
Further, the thickness of mask plate evaporation face is 10~50 μ m.
Further, the degree of depth of groove is 2~30 μ m.
Further, the total thickness of mask plate is 12~80 μ m.
The utility model also provides a kind of method of making mask plate described above, comprises that etching step and laser partly carves step, it is characterized in that:
Metal substrate forms evaporation face opening in the region corresponding with described evaporation hole by described etching step, on the cross section at described evaporation face open centre axis place, the edge line of described evaporation face opening is bowl-shape;
Described laser is partly carved step and in the described ito surface neighboring area corresponding with described evaporation face opening, is carried out laser half and carve and form described groove, and described groove and described evaporation face opening UNICOM formation run through the described evaporation hole of described mask plate body.
Further, partly to carve the angle setting range between Laser emission route and the mask plate entity plate face of laser head in step be 60 °~90 ° to laser.
Further, partly to carve in step half degree of depth of carving be 2~30 μ m to laser.
Further, the thickness of metal substrate is 12~80 μ m.
Further, the evaporation face opening that etching step forms is to run through the through hole of described mask plate body or is blind hole.
The beneficial effects of the utility model are, on mask plate on the cross section at the central axis place in evaporation hole, the edge line in the evaporation hole of described evaporation face is bowl-shape, the hole wall in the evaporation hole of evaporation face and the plate face of mask plate body are 30 °~60 ° angles, can reduce hole wall the blocking deposition material in evaporation hole, the groove of evaporation hole ito surface can play and prevent scratch deposition substrate simultaneously, thereby improves the quality of indicating meter.
The aspect that the utility model is additional and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage will become obviously and easily from the following description of the accompanying drawings of embodiments to be understood, wherein:
Figure 1 shows that the schematic cross-section in mask plate evaporation hole in prior art;
Figure 2 shows that the two dimensional structure schematic diagram of the utility model mask plate ito surface;
Figure 3 shows that the schematic cross-section along A-A direction in Fig. 2;
Figure 4 shows that the structure enlarged diagram of 30 parts in Fig. 3;
Figure 5 shows that the another kind of structure enlarged diagram of 30 parts in Fig. 3;
Figure 6 shows that the utility model mask plate integral planar structural representation;
Fig. 7 and Figure 8 shows that 60 part enlarged diagrams in Fig. 6;
Figure 9 shows that the utility model completes the schematic cross-section of step of membrane sticking;
Figure 10 shows that the utility model completes the schematic cross-section of exposure;
Figure 11 shows that the utility model completes the schematic cross-section of development;
Figure 12 shows that the utility model completes the schematic cross-section of etching step;
Figure 13 shows that the utility model completes the two dimensional structure schematic diagram of demoulding step;
Figure 14 shows that the schematic cross-section along D-D direction in Figure 13;
Figure 15 shows that the utility model laser partly carves the schematic cross-section of step;
Figure 16 and Figure 17 shows that the utility model laser partly carves the cross section enlarged diagram of step.
Figure 18 shows that the utility model completes a kind of schematic cross-section of etching step;
Figure 19 shows that the utility model completes a kind of schematic cross-section of demoulding step;
Figure 20 shows that the utility model laser partly carves a kind of schematic cross-section of step;
In Fig. 1,1 is ito surface, and 2 is evaporation face, the 11 evaporation holes that are mask plate, and 12 is evaporation bore edges perk part;
In Fig. 2,20 is mask plate body, and 21 is evaporation hole, and 22 is mask plate, 23 grooves that are ito surface, and A-A is for treating Anatomical observation direction;
In Fig. 3,3 is ito surface, and 4 is evaporation face, and 30 for waiting to amplify observation part;
In Fig. 4, θ is the hole wall in evaporation hole of evaporation face and the angle of the plate face of mask plate body, the thickness that t1 is mask plate, and t2 is the degree of depth of mask plate ito surface groove, t3 is the thickness of mask plate evaporation face;
In Fig. 5, β is the sidewall of ito surface groove and the angle of mask plate entity plate face;
In Fig. 6,60 wait to amplify observation part, and 61 is mask pattern;
In Fig. 7, B-B is for treating Anatomical observation direction;
In Fig. 8, C-C is for treating Anatomical observation direction;
In Fig. 9,90 is metal substrate, and 91 is film;
In Figure 10,100 and 101 protective membranes for step of exposure formation;
In Figure 11,110 is the metal substrate region of exposing;
In Figure 12,120 is evaporation face opening (for through hole);
In Figure 13, D-D is for treating Anatomical observation direction;
In Figure 15,150 is laser head;
In Figure 16, α is that laser is partly carved the angle between Laser emission route and the mask plate entity plate face of laser head in step;
In Figure 18,180 is evaporation face opening (for blind hole).
Embodiment
Describe below with reference to accompanying drawings embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the utility model, and can not be interpreted as restriction of the present utility model.
According to embodiment of the present utility model, shown in figure 2~Fig. 8, a kind of mask plate is provided, mask plate 22 comprises mask plate body 20 and is formed on the evaporation hole 21 on described mask plate body, described mask plate body is run through in described evaporation hole, and described mask plate comprises evaporation face 4 and ito surface 3, it is characterized in that: described evaporation hole 21 is provided with groove 23 at described ito surface, on the cross section at the central axis place in described evaporation hole, the edge line in the evaporation hole of described evaporation face is bowl-shape.
According to an embodiment of the present utility model, with reference to figure 2~Figure 4 shows that (evaporation hole dimension is greater than 100 μ mask plate m) in large size evaporation hole, Figure 2 shows that the two dimensional structure schematic diagram of mask plate ito surface, 20 is mask plate body, 21 is evaporation hole, 23 is the groove of evaporation hole at ito surface, evaporation hole 21 is arranged on mask plate body 20 in the mode of array, Figure 3 shows that in Fig. 2 along A-A direction schematic cross-section, 3 is ito surface, 4 is evaporation face, and 30 part enlarged diagrams are as shown in Fig. 4~Fig. 5.
As shown in Fig. 4~Fig. 5, on the cross section at 21 central axis places, evaporation hole, the edge line in evaporation face evaporation hole is bowl-shape, θ is the angle of the hole wall in evaporation face evaporation hole and the plate face of mask plate body 20, the scope at θ angle is 30 °~60 °, the angle β of the plate face of the sidewall of the groove of ito surface and mask plate body is 60 °~90 °, and evaporation hole 21 is arranged on mask plate body 20 in the mode of array, adapts with the organic membrane deposition region of deposition substrate.
According to another embodiment of the present utility model, with reference to figure 6~Figure 8 shows that (evaporation hole dimension is less than 100 μ mask plate m) in small size evaporation hole, Figure 6 shows that mask plate integral planar structural representation, mask pattern 61 is arranged on mask plate body 20 in the mode of array, evaporation hole 21 is arranged in the mode of array on the mask pattern 61 of mask plate 22, and evaporation hole 21 adapts with the evaporation region of deposition substrate.
A kind of enlarged diagram that Figure 7 shows that 60 part mask patterns in Fig. 6, in Fig. 6, evaporation hole 21 is arranged on mask plate body 20 in the mode of array for little opening, along the cross section enlarged diagram of B-B direction as shown in Fig. 4 or Fig. 5.
Figure 8 shows that the enlarged diagram of the another kind of arrangement mode of mask pattern in Fig. 6, the opening that in Fig. 8, evaporation hole 21 is strip, along the cross section enlarged diagram of C-C direction as shown in Fig. 4 or Fig. 5.
In addition, according to the disclosed a kind of mask plate of the utility model, also there is following additional technical feature:
According to embodiment more of the present utility model, as shown in Fig. 4~Fig. 5, the thickness t 3 of mask plate evaporation face is 10~50 μ m.
According to embodiment more of the present utility model, as shown in Fig. 4~Fig. 5, the degree of depth t2 of ito surface groove is 2~30 μ m.
According to embodiment more of the present utility model, as shown in Fig. 4~Fig. 5, the total thickness t of mask plate is 12~80 μ m.
According on the other hand of the present utility model, shown in figure 9~Figure 20, provide a kind of method of making mask plate described above, comprise that etching step and laser partly carves step, it is characterized in that:
Metal substrate 10 forms evaporation face opening in the region corresponding with evaporation hole by etching step, on the cross section at evaporation face open centre axis place, the edge line of evaporation face opening is bowl-shape;
Laser is partly carved step and in the ito surface neighboring area corresponding with evaporation face opening, is carried out the groove 23 that laser partly forms quarter, and groove and evaporation face opening UNICOM form the evaporation hole 21 of running through mask plate body.
The concrete steps of the making mask plate method that the utility model provides, as shown in Fig. 9~17, comprising:
Step of membrane sticking: as shown in Figure 9, film 91 is overlayed or is coated to the both sides of metal substrate 90;
Step of exposure: as shown in figure 10, the film exposure of the corresponding non-open area of metal substrate 90 etching faces is formed to protective membrane 100, the film of corresponding open area does not expose, and the film exposure of metal substrate 90 non-etched faces forms protective membrane 101;
Development step: as shown in figure 11, unexposed corresponding open area film is removed by development step, exposed metal substrate region 110, protective membrane 100 and protective membrane 101 continue to retain;
Etching step: as shown in figure 12, the metal reaction in etching solution and the metal substrate region 110 of exposing in etching step, the evaporation face opening 120(evaporation face opening 120 that forms corresponding evaporation hole is through hole), on the cross section at the central axis place of evaporation face opening 120, the edge line of evaporation face opening is bowl-shape;
Demoulding step: as shown in Figure 13~Figure 14; protective membrane 100 and protective membrane 101 are removed; form the through hole 120 on mask plate body 20 and mask plate body, Figure 13 shows that the two dimensional structure schematic diagram of demoulding step, Figure 14 shows that the schematic cross-section along D-D direction in Figure 13.
Laser is partly carved step: for laser, partly carve step schematic cross-section as shown in figure 15, carry out laser half carve and form groove 23 in the ito surface neighboring area corresponding with evaporation face opening 120, Figure 16~Figure 17 shows that laser is partly carved the amplification schematic cross-section of step.
The Laser emission route of laser head 150 shown in Figure 16 is vertical with mask plate entity plate face, and the angle α between the Laser emission route of laser head 150 and mask plate entity plate face is 90 °.
Angle setting range α between the Laser emission route of laser head 150 shown in Figure 17 and mask plate entity plate face is 60 °~90 °.
In addition, according to a kind of disclosed method of making mask plate of the utility model, also there is following additional technical feature:
According to embodiment more of the present utility model, as shown in Figure 16~Figure 17, it is 2~30 μ m that laser is partly carved half degree of depth t2 carving in step.
According to embodiment more of the present utility model, as shown in Figure 16~Figure 17, the thickness t 1 of mask plate body 20 is 12~80 μ m.
According to an embodiment of the present utility model, the evaporation face opening that etching step forms is the through hole 120 that runs through mask plate body 20, as shown in figure 12, laser is partly carved step and in the ito surface neighboring area corresponding with evaporation face opening, is carried out laser formation at half quarter groove, groove and evaporation face opening UNICOM form the evaporation hole 21 of running through mask plate body, and demoulding step and laser are partly carved step as shown in Figure 14~Figure 17.
According to an embodiment of the present utility model, the evaporation face opening that etching step forms is blind hole 180, as shown in Figure 18~Figure 19, laser is partly carved step and in the ito surface neighboring area corresponding with evaporation face opening, is carried out laser formation at half quarter groove 23, groove and evaporation face opening UNICOM form the evaporation hole 21 of running through mask plate body, as shown in figure 20.
By mask plate provided by the utility model, on mask plate on the cross section at the central axis place in evaporation hole 21, the edge line in the evaporation hole of evaporation face is bowl-shape, the angle theta of the hole wall in the evaporation hole of evaporation face and the plate face of mask plate body is 30 °~60 °, during evaporation, can reduce hole wall the blocking deposition material in evaporation hole, the groove 23 of evaporation hole ito surface can play and prevent scratch deposition substrate simultaneously, thereby improves the quality of indicating meter.
Although embodiment of the present utility model is described in detail with reference to multiple illustrative examples of the present utility model, but it must be understood that, those skilled in the art can design multiple other improvement and embodiment, these improve and embodiment by within dropping on the spirit and scope of the utility model principle.Particularly, within the scope of aforementioned open, accompanying drawing and claim, can aspect the layout of component and/or subordinate composite configuration, make rational modification and improvement, and can not depart from spirit of the present utility model.Except modification and the improvement of component and/or layout aspect, its scope is limited by claims and equivalent thereof.