CN203566489U - Cleaning device used for grinding disk grooves of silicon wafer grinder - Google Patents
Cleaning device used for grinding disk grooves of silicon wafer grinder Download PDFInfo
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- CN203566489U CN203566489U CN201320616657.1U CN201320616657U CN203566489U CN 203566489 U CN203566489 U CN 203566489U CN 201320616657 U CN201320616657 U CN 201320616657U CN 203566489 U CN203566489 U CN 203566489U
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- abrasive disk
- silicon chip
- grinding machine
- disk groove
- steelframe
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Abstract
The utility model discloses a cleaning device used for grinding disk grooves of a silicon wafer grinder. The cleaning device comprises a water gun (10) and a particle smashing device. The particle smashing device comprises a steel frame (1). A thin tooth steel saw (4) is arranged on the steel frame (1). Corresponding to the grinding disk grooves of the silicon wafer grinder, thin teeth meshed with the grinding disk grooves of the silicon wafer grinder are arranged on the thin tooth steel saw (4).
Description
Technical field
The utility model relates to a kind of technical field of semiconductors, specially refers to a kind of cleaning plant of the abrasive disk groove for silicon chip grinding machine.
Background technology
In the preceding working procedure that IC manufactures, the wafer process that silicon single crystal bar need to be cut into becomes to have original silicon chip or the mating plate of high surface precision and surface quality, for the operations such as photoetching are prepared the low surface of taking advantage of of planarization, ultra-smooth, low damage.After silicon chip cutting, the surface residual cut channel of meeting and micro-crack, damage layer can reach 10-50 μ m, conventionally adopts twin grinding technique to eliminate cut channel, reduce to damage layer depth and improve surface precision.
The abrasive disk of grinder as shown in Figure 1, after grinder uses certain time length, groove between the upper lower burrs of grinder will be polished waste material and fill up, to such an extent as to the waste material grinding can not be got rid of in time, newly enter ground slurry can not stepless action in silicon chip, what especially in process of lapping, produce collapses limit, fragment, these chips can be stuck among the groove of abrasive disk, because the groove of abrasive disk only has 2mm wide, 10mm is dark, with hairbrush, pocket knife is difficult to clean out, if can not clean out the chip being stuck among abrasive disk groove completely, silicon chip surface after grinding can produce serious damage, making yield is 0 substantially, abrasive disk groove of every cleaning all needs to spend 2-3 hour, waste the production time greatly, reduce production efficiency.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of cleaning plant of the abrasive disk groove for silicon chip grinding machine simple in structure.
In order to solve the problems of the technologies described above, the utility model provides a kind of cleaning plant of the abrasive disk groove for silicon chip grinding machine, comprises hydraulic giant and grains pulverizing device; Described grains pulverizing device comprises steelframe, is provided with serration hacksaw on described steelframe; Correspond to the abrasive disk groove of silicon chip grinding machine, on serration hacksaw, be provided with the intermeshing serration of abrasive disk groove with silicon chip grinding machine.
As the improvement to the cleaning plant of the abrasive disk groove for silicon chip grinding machine described in the utility model: be provided with on described steelframe for keeping the stable crossbeam of steelframe.
As the further improvement to the cleaning plant of the abrasive disk groove for silicon chip grinding machine described in the utility model: be provided with the handle for grasping on described steelframe.
As the further improvement to the cleaning plant of the abrasive disk groove for silicon chip grinding machine described in the utility model: be provided with handle protective sleeve on described handle.
As the further improvement to the cleaning plant of the abrasive disk groove for silicon chip grinding machine described in the utility model: described steelframe and crossbeam are steelframe and the crossbeam of making by stainless steel.
As the further improvement to the cleaning plant of the abrasive disk groove for silicon chip grinding machine described in the utility model: the handle protective sleeve of described handle protective sleeve for making by plastic material or quality of rubber materials.
As the further improvement to the cleaning plant of the abrasive disk groove for silicon chip grinding machine described in the utility model: described hydraulic giant is giant.
The cleaning plant of the abrasive disk groove for silicon chip grinding machine of the present utility model is manually compared with manner of cleaning up such as pocket knife hairbrush with existing, and not only safe ready but also time saving and energy saving, enhances productivity.Be that the utility model has mainly passed through the grains pulverizing device that a kind of and abrasive disk groove dimensions match the particle in abrasive disk groove has been carried out to pulverization process, powder after pulverizing by high-pressure water-flushing device again rinses, reach afterwards the final clean of an abrasive disk groove, the processing of this pulverization can directly all be processed all particles, has improved the efficiency clean time.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is described in further detail.
Fig. 1 is the primary structure schematic diagram of steelframe 1 of the present utility model, crossbeam 2 and handle 5;
Fig. 2 is the primary structure schematic diagram of the abrasive disk of silicon chip grinding machine;
Structural representation when Fig. 3 is the actual use of the utility model.
The specific embodiment
Embodiment 1, Fig. 1～Fig. 2 have provided a kind of cleaning plant of the abrasive disk groove for silicon chip grinding machine, comprise hydraulic giant 10 and grains pulverizing device; Grains pulverizing device comprises the steelframe 1 that uses stainless steel to make, the crossbeam 2 that uses stainless steel to make, the protective sleeve 3 that uses plastic material or quality of rubber materials to make, serration hacksaw 4.
Steelframe 1 is a girder, on girder, is disposed with from left to right and orthogonal three fulcrums of girder and a handles 5, between three fulcrums, be fixed with crossbeam 2, by crossbeam 2, firm steelframe 1, make when in use, three fulcrums in steelframe 1 can stressedly not fracture, in the lower end of three fulcrums, be fixed with serration hacksaw 4, carry out as required the abrasive disk groove of clean silicon chip grinding machine, on the serration hacksaw 4(serration hacksaw 4 of selection corresponding size, the serration corresponding with abrasive disk groove is set), tooth by serration hacksaw 4 snaps in the abrasive disk groove of silicon chip grinding machine, tooth by serration hacksaw 4 is sawn into more thin pulverized powder by the residue in small, broken bits being stuck in the abrasive disk groove of silicon chip grinding machine again, thin pulverized powder can not be stuck in the abrasive disk groove of silicon chip grinding machine again, by just washing away of hydraulic giant 10, powder all can be removed again.
On handle 5, be inserted in the protective sleeve 3 that uses plastic material or quality of rubber materials to make, by adopting the protective sleeve 3 of plastic material or quality of rubber materials, make when in use, user's hand is direct contact handle 5 not, and generation sense of discomfort.
The main step of using is as follows:
1, according to the abrasive disk groove dimensions of silicon chip grinding machine, select serration hacksaw 4;
According to the abrasive disk groove dimensions of silicon chip grinding machine, select the serration hacksaw 4 of corresponding size, and according to the serration hacksaw 4 of corresponding size, use the steelframe 1 of corresponding size; By corresponding steelframe 1, use accordingly, when used less steelframe 1: adopt one and hold handle 5, corresponding, hold on the fulcrum of high order end for other one, by left and right the exerting all one's strength back and forth of two hands, can increase the efficiency of use; When used larger steelframe 1: owing to cannot using above-described posture, so adopt two postures that hand is all held handle 5.
2, use hydraulic giant 10(giant 10 to increase work efficiency) the abrasive disk groove of grinder is rinsed, but because some particles in small, broken bits are stuck in the abrasive disk groove of grinder, hydraulic giant 10 cannot be cleared up completely.
3, using serration hacksaw 4 to carry out the abrasive disk groove cleaning (posture of the form of cleaning described in step 1 carried out) to grinder, is mainly, by serration hacksaw 4, the particle in small, broken bits in the abrasive disk groove of grinder is sawn into powder;
4, again by using the abrasive disk groove of 10 pairs of grinders of hydraulic giant to rinse, the abrasive disk groove of grinder can be cleaned out.
Above-described serration hacksaw 4 mainly contains high 7cm, long 30cm, thick 1mm and high 14cm, long 60cm, two kinds of more common parameters of thick 2mm.
If for stable, can adopt the form of two steelframes 1 to carry out the fixing of serration hacksaw 4, as crossbeam 2 and serration hacksaw 4 are placed in to two positions between steelframe 1 successively under upper, then will between two steelframes 1 and crossbeam 2, by screw, be fixed, will between two steelframes 1 and serration hacksaw 4, by screw, be fixed.
Be different from hairbrush processing mode of the prior art, because hairbrush is to very limited of the disposal ability of particle, so in the time of cleaning, often cannot process completely clean, and the utility model looks for another way, adopted a kind of particle reducing mechanism to carry out the pulverization process of particle, make the particle in the abrasive disk groove after processing all become powder, then after powder being processed, can complete final cleaning, this clean cleaning particles thing completely, very thoroughly.
Finally, it is also to be noted that, what more than enumerate is only a specific embodiment of the present utility model.Obviously, the utility model is not limited to above embodiment, can also have many distortion.All distortion that those of ordinary skill in the art can directly derive or associate from the disclosed content of the utility model, all should think protection domain of the present utility model.
Claims (7)
1. for the cleaning plant of the abrasive disk groove of silicon chip grinding machine, comprise hydraulic giant (10) and grains pulverizing device; It is characterized in that: described grains pulverizing device comprises steelframe (1), on described steelframe (1), be provided with serration hacksaw (4);
Correspond to the abrasive disk groove of silicon chip grinding machine, on serration hacksaw (4), be provided with the intermeshing serration of abrasive disk groove with silicon chip grinding machine.
2. the cleaning plant of the abrasive disk groove for silicon chip grinding machine according to claim 1, is characterized in that: on described steelframe (1), be provided with for keeping the stable crossbeam (2) of steelframe (1).
3. the cleaning plant of the abrasive disk groove for silicon chip grinding machine according to claim 2, is characterized in that: on described steelframe (1), be provided with the handle (5) for grasping.
4. the cleaning plant of the abrasive disk groove for silicon chip grinding machine according to claim 3, is characterized in that: on described handle (5), be provided with handle protective sleeve (3).
5. the cleaning plant of the abrasive disk groove for silicon chip grinding machine according to claim 4, is characterized in that: described steelframe (1) and crossbeam (2) are steelframe and the crossbeam of making by stainless steel.
6. the cleaning plant of the abrasive disk groove for silicon chip grinding machine according to claim 5, is characterized in that: the handle protective sleeve of described handle protective sleeve (3) for making by plastic material or quality of rubber materials.
7. the cleaning plant of the abrasive disk groove for silicon chip grinding machine according to claim 6, is characterized in that: described hydraulic giant (10) is giant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320616657.1U CN203566489U (en) | 2013-09-30 | 2013-09-30 | Cleaning device used for grinding disk grooves of silicon wafer grinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320616657.1U CN203566489U (en) | 2013-09-30 | 2013-09-30 | Cleaning device used for grinding disk grooves of silicon wafer grinder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203566489U true CN203566489U (en) | 2014-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320616657.1U Expired - Lifetime CN203566489U (en) | 2013-09-30 | 2013-09-30 | Cleaning device used for grinding disk grooves of silicon wafer grinder |
Country Status (1)
| Country | Link |
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| CN (1) | CN203566489U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113400196A (en) * | 2021-06-18 | 2021-09-17 | 西安奕斯伟硅片技术有限公司 | Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium |
-
2013
- 2013-09-30 CN CN201320616657.1U patent/CN203566489U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113400196A (en) * | 2021-06-18 | 2021-09-17 | 西安奕斯伟硅片技术有限公司 | Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.3 workshop, no.808 Minta Road, Shihudang Town, Songjiang District, Shanghai, 201617 Patentee after: Shanghai Chaosi Semiconductor Co.,Ltd. Address before: No.3 workshop, no.808 Minta Road, Shihudang Town, Songjiang District, Shanghai, 201617 Patentee before: SHANGHAI ADVANCED SILICON TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140430 |