CN203561104U - Semiconductor refrigerator - Google Patents
Semiconductor refrigerator Download PDFInfo
- Publication number
- CN203561104U CN203561104U CN201320657935.8U CN201320657935U CN203561104U CN 203561104 U CN203561104 U CN 203561104U CN 201320657935 U CN201320657935 U CN 201320657935U CN 203561104 U CN203561104 U CN 203561104U
- Authority
- CN
- China
- Prior art keywords
- fixed part
- fins
- groups
- heat exchange
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000001816 cooling Methods 0.000 claims abstract description 38
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Abstract
The utility model relates to the field of semiconductor cold and heat exchange devices, in particular to a semiconductor refrigerator. The semiconductor refrigerator comprises a heat exchange fan bracket, a heat exchange fan, a semiconductor refrigerating plate, a first cooling fin group and a second cooling fin group, wherein the first cooling fin group comprises a plurality of first cooling fins and first fixing parts; the second cooling fin group comprises a plurality of second cooling fins and second fixing parts; the heat exchange fan is fixed on the heat exchange fan bracket; and the first cooling fin group is fixedly connected with the heat exchange fan bracket. The semiconductor refrigerator can not only cool an electronic device effectively but also is small in size and low in manufacturing cost.
Description
Technical field
The utility model relates to semiconductor cooling heat-exchange device field, in particular to a kind of semiconductor cooling device.
Background technology
Semiconductor cooling device is to utilize semi-conductive peltier effect to produce the device of cold, due to its noiselessness, friction, do not need cold-producing medium, working stability and the advantage such as easy to operate, therefore be widely used in numerous technical fields.In correlation technique, be applied in electron trade, the semiconductor cooling device that electronic device is freezed, includes radiating end and refrigeration end, and by oppositely, a side produces cold air, and opposite side produces hot gas, realizes electronic device is dispelled the heat.If realize, electronic device is effectively dispelled the heat, semiconductor cooling device needs two radiators and two heat exchange fans, therefore not only volume is large for existing semiconductor cooling device, and manufacturing cost is high.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor cooling device, to solve the above problems.
A kind of semiconductor cooling device is provided in embodiment of the present utility model, has comprised heat exchange blower tray, heat exchange fan, semiconductor chilling plate, the first groups of fins and the second groups of fins.The first groups of fins comprises some the first fin and the first fixed part, is provided with the first through hole on the first fixed part, and some the first fin are fixedly installed on the outer peripheral face of the first fixed part.The second groups of fins comprises some the second fin and the second fixed part, is provided with the second through hole on the second fixed part, and some the second fin are fixedly installed on the inner peripheral surface of the second through hole.The second groups of fins is inserted in the first through hole, is fixedly connected with the first groups of fins.Semiconductor chilling plate is arranged between the first groups of fins and the second groups of fins, and one side contacts with the first fixed part, and opposite side contacts with the second fixed part.Heat exchange fan is fixed on heat exchange blower tray, and the first groups of fins is fixedly connected with heat exchange blower tray.
A kind of semiconductor cooling device of the utility model above-described embodiment, the second groups of fins is fixed in the first through hole of the first groups of fins, semiconductor chilling plate is arranged between the first groups of fins and the second groups of fins, and heat exchange fan is arranged on away from the second groups of fins one side.By the heat radiation entirety of a heat exchange fan composition, the hot blast of its generation is discharged from the first groups of fins; And the cold wind of its generation is discharged from the second groups of fins, for electronic device is freezed.Therefore the semiconductor cooling device that the present embodiment provides not only can effectively dispel the heat to electronic device; And its volume is little, low cost of manufacture.
Accompanying drawing explanation
Fig. 1 shows the overall structure schematic diagram of a side of a kind of semiconductor cooling device that the utility model provides;
Fig. 2 shows the overall structure schematic diagram of the opposite side of a kind of semiconductor cooling device that the utility model provides;
Fig. 3 shows the decomposition texture schematic diagram of a kind of semiconductor cooling device that the utility model provides.
The specific embodiment
Below by specific embodiment, also by reference to the accompanying drawings the utility model is described in further detail.
As shown in Figure 1, Figure 2 and Figure 3, a kind of semiconductor cooling device that the present embodiment provides, comprises heat exchange blower tray 1, heat exchange fan 2, semiconductor chilling plate 3, the first groups of fins and the second groups of fins.The first groups of fins comprises on some the first fin 4 and the first fixed part 5, the first fixed parts 5 and is provided with the first through hole 8, and some the first fin 4 are fixed on the outer peripheral face of the first fixed part 5.The second groups of fins comprises on some the second fin 6 and the second fixed part 7, the second fixed parts 7 and is provided with the second through hole 9, and some the second fin 6 are fixedly installed on the inner peripheral surface of the second through hole 9.The second groups of fins is inserted in the first through hole 8, is fixedly connected with the first groups of fins.Semiconductor chilling plate 3 is arranged between the first groups of fins and the second groups of fins, and one side contacts with the first fixed part 5, and opposite side contacts with the second fixed part 7.Heat exchange fan 2 is fixed on heat exchange blower tray 1, and the first groups of fins is fixedly connected with heat exchange blower tray 1.The semiconductor cooling device that the present embodiment provides, the mode that is fixedly connected with between wherein each parts, can adopt any known mode that is fixedly connected with in this area, such as screw connection, riveted joint or welding etc.As long as can be fixed, link together, be all applicable to the present embodiment.The semiconductor cooling device that the present embodiment provides, the second groups of fins is fixed in the first through hole 8 of the first groups of fins, semiconductor chilling plate 3 is arranged between the first groups of fins and the second groups of fins, and heat exchange fan 2 is arranged on away from the second groups of fins one side.The heat radiation entirety forming by a heat exchange fan 2, the hot blast of its generation is discharged from the first groups of fins; And the cold wind of its generation is discharged from the second groups of fins, for electronic device is freezed.Therefore the semiconductor cooling device that the present embodiment provides not only can effectively dispel the heat to electronic device; And its volume is little, low cost of manufacture.
As shown in Figure 1, Figure 2 and Figure 3, the semiconductor cooling device that the present embodiment provides, can also comprise wind scooper 11, the hollow cavity that wind scooper 11 is both ends open, the axial size of the second fixed part 7 is greater than the first fixed part 5 in the party's size upwards, the second fixed part 7 passes an openend of wind scooper 11, and is fixedly connected with wind scooper 11.By being provided with wind scooper 11, the hot gas of generation and cold air effectively can be separated, avoid hot gas to be combined with cold air, the cold air physical efficiency producing is more effectively lowered the temperature to electronic device.The shape of wind scooper 11 can be any three-dimensional shape, as long as can play, hot gas and cold air is effectively separated, and is all applicable to the present embodiment.In the present embodiment, the shape of wind scooper 11 is preferably the hollow round table body of both ends open, and the openend that wind scooper 11 diameters are less is fixedly connected with the second fixed part 7.By wind scooper 11 being set to the Rotary-table of hollow, can expand the diffusion area of cold air, more effectively electronic device is lowered the temperature, refrigeration.On the edge of the openend that in addition, wind scooper 11 diameters are larger, be provided with annular projection.By being provided with annular projection, can gather the cold air of diffusion, guarantee that all cold air all act on electronic device; Adopt design like this, can also conveniently be connected with the external device (ED) that holds electronic device, such as cabinet.
As shown in Figure 1, Figure 2 and Figure 3, the semiconductor cooling device that the present embodiment provides, some the first fin 4 are circular away from the line of one end of the first fixed part 5.Some the second fin 6 are circular away from the line of one end of the second fixed part 7.The axis of the axis of the first groups of fins and the second groups of fins is on same straight line.Adopt such design, improved the stability in use of this device.It is worth mentioning that, the semiconductor cooling device that the present embodiment provides, can also comprise the cylindrical shape that the 3rd fixed part 10, the three fixed parts 10 are both ends open, and the first groups of fins is fixed on heat exchange blower tray 1 by the 3rd fixed part 10.By being provided with the 3rd fixed part 10, can make on the one hand the gas producing discharge towards specific direction; Also further improved on the other hand the stability in use energy of this device.Furthermore, this device can also comprise protection network 12, and protection network 12 is fixedly connected with heat exchange blower tray 1, and it is arranged on the side of heat exchange blower tray 1 away from the second groups of fins.By being provided with protection network 12, can be by this device in use, the heat exchange fan 2 of rotation is isolated from the outside out, and has improved the security performance of this device.In this device, the quantity of semiconductor chilling plate 3 can be set according to actual needs.In the present embodiment, preferred semiconductor cooling piece 3 has two, and it is oppositely arranged between the first fixed part 5 and the second fixed part 7.Like this, the effect of realization refrigeration that not only can be good, and low cost of manufacture.
As shown in Figure 1, Figure 2 and Figure 3, the semiconductor cooling device that the present embodiment provides, the heat radiation entirety forming with a heat exchange fan 2, cold air and hot gas are discharged from the same side of this device, by wind scooper 11, cold air and hot gas are isolated.Not only effectively can realize heat radiation, the refrigeration to electronic device; And volume is little, does not take up room, low cost of manufacture.In addition, this device manufacturing process is simple, applied widely, is easy to promote the use of.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (8)
1. a semiconductor cooling device, is characterized in that, comprising: heat exchange blower tray, heat exchange fan, semiconductor chilling plate, the first groups of fins and the second groups of fins;
Described the first groups of fins comprises some the first fin and the first fixed part, on described the first fixed part, is provided with the first through hole, and some described the first fin are fixedly installed on the outer peripheral face of described the first fixed part;
Described the second groups of fins comprises some the second fin and the second fixed part, on described the second fixed part, is provided with the second through hole, and some described the second fin are fixedly installed on the inner peripheral surface of described the second through hole;
Described the second groups of fins is inserted in described the first through hole, be fixedly connected with described the first groups of fins, described semiconductor chilling plate is arranged between described the first groups of fins and described the second groups of fins, one side contacts with described the first fixed part, and opposite side contacts with described the second fixed part;
Described heat exchange fan is fixed on described heat exchange blower tray, and described the first groups of fins is fixedly connected with described heat exchange blower tray.
2. a kind of semiconductor cooling device according to claim 1, it is characterized in that, also comprise wind scooper, described wind scooper is the hollow cavity of both ends open, the axial size of described the second fixed part is greater than described the first fixed part in the party's size upwards, described the second fixed part passes an openend of described wind scooper, and is fixedly connected with described wind scooper.
3. a kind of semiconductor cooling device according to claim 2, is characterized in that, the hollow round table body that described wind scooper is both ends open, and the openend that described wind scooper diameter is less is fixedly connected with described the second fixed part.
4. a kind of semiconductor cooling device according to claim 3, is characterized in that, on the edge of the openend that described wind scooper diameter is larger, is provided with annular projection.
5. a kind of semiconductor cooling device according to claim 1, is characterized in that, some described the first fin are circular away from the line of one end of described the first fixed part; Some described the second fin are circular away from the line of one end of described the second fixed part; The axis of the axis of described the first groups of fins and described the second groups of fins is on same straight line.
6. a kind of semiconductor cooling device according to claim 5, it is characterized in that, also comprise the 3rd fixed part, the cylindrical shape that described the 3rd fixed part is both ends open, described the first groups of fins is fixed on described heat exchange blower tray by described the 3rd fixed part.
7. a kind of semiconductor cooling device according to claim 1, is characterized in that, also comprises protection network, and described protection network is fixedly connected with described heat exchange blower tray, and it is arranged on the side of described heat exchange blower tray away from described the second groups of fins.
8. a kind of semiconductor cooling device according to claim 1, is characterized in that, described semiconductor chilling plate has two, and it is oppositely arranged between described the first fixed part and described the second fixed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320657935.8U CN203561104U (en) | 2013-10-24 | 2013-10-24 | Semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320657935.8U CN203561104U (en) | 2013-10-24 | 2013-10-24 | Semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203561104U true CN203561104U (en) | 2014-04-23 |
Family
ID=50510822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320657935.8U Expired - Lifetime CN203561104U (en) | 2013-10-24 | 2013-10-24 | Semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203561104U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066507A (en) * | 2015-09-02 | 2015-11-18 | 北京三相典创科技有限公司 | Air-cooling semiconductor refrigeration device for circulating cooling system |
| CN106793680A (en) * | 2016-12-02 | 2017-05-31 | 苏州格曼斯温控科技有限公司 | A kind of TEC heat-exchanger rigs for rack |
-
2013
- 2013-10-24 CN CN201320657935.8U patent/CN203561104U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066507A (en) * | 2015-09-02 | 2015-11-18 | 北京三相典创科技有限公司 | Air-cooling semiconductor refrigeration device for circulating cooling system |
| WO2017036282A1 (en) * | 2015-09-02 | 2017-03-09 | 柳熠 | Air cooling semiconductor refrigerating device for circulation cooling system |
| CN106793680A (en) * | 2016-12-02 | 2017-05-31 | 苏州格曼斯温控科技有限公司 | A kind of TEC heat-exchanger rigs for rack |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101922778B (en) | Semiconductor refrigerating air conditioning device | |
| CN102573420B (en) | Embedded cabinet air-conditioning refrigeration system | |
| CN201844486U (en) | Semiconductor refrigerating air-conditioning device | |
| CN101959388A (en) | Telecommunication machine cabinet with refrigerating agent for circular heat exchange and cooling method thereof | |
| CN203561104U (en) | Semiconductor refrigerator | |
| CN204717939U (en) | A kind of heat pipe semiconductor air-conditioning | |
| CN201509386U (en) | Telecommunication cabinet with refrigerant circulating heat exchange function | |
| CN203893485U (en) | Heat pipe type efficient semiconductor refrigeration device | |
| CN201876001U (en) | Split multi-stage thermoelectric refrigerator | |
| CN203480400U (en) | Water-cooling radiating device for flat computer | |
| CN203881188U (en) | Radiating device for large-cooling-capacity stirling cryocooler | |
| CN204790831U (en) | Automatic radiating complete machine cabinet heat pipe exchanger backplate | |
| CN203482559U (en) | A refrigeration apparatus for an electric cabinet | |
| CN203561016U (en) | Heat pipe heat exchange type semiconductor refrigeration device | |
| CN203480396U (en) | Cooling device with external power amplifiers for flat computer | |
| CN205678858U (en) | A kind of heat-exchanger rig and the semiconductor air-conditioner with this heat-exchanger rig | |
| CN201621996U (en) | Heat pipe | |
| CN203480398U (en) | Cooling device with water cushion for flat computer | |
| CN202381296U (en) | Compressor cooling device | |
| CN102113801B (en) | Base vibration type semiconductor cold-hot cup | |
| CN216481202U (en) | Heating device capable of blowing | |
| CN204513588U (en) | Energy-efficient air-isolation heat exchanging air conditioner refrigeration machine | |
| CN201622006U (en) | Heat pipe radiator | |
| CN215929928U (en) | Fan with cooling device | |
| CN203480397U (en) | Cooling device for flat computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 300300 Tianjin Tianjin self trade test zone (Airport Economic Zone) No. 12 Rose Road Patentee after: Tianjin Chang Chunhua Rui source technology Co.,Ltd. Address before: 300450 Tianjin Tianjin Port Free Trade Zone (Airport) Rose Road No. 12 Patentee before: TIANJIN HUARUIYUAN TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180110 Address after: The 300300 Tianjin Tianjin FTA test area (Airport Economic Zone) Center Avenue and East five road junction northeast Yee apartment 8-3-805 Patentee after: CHANGYUAN TECHNOLOGY (TIANJIN) Co.,Ltd. Address before: 300300 Tianjin Tianjin self trade test zone (Airport Economic Zone) No. 12 Rose Road Patentee before: Tianjin Chang Chunhua Rui source technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140423 |
|
| CX01 | Expiry of patent term |