CN203559128U - 一种真空环境下的流动柔性基板的加热装置 - Google Patents
一种真空环境下的流动柔性基板的加热装置 Download PDFInfo
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- CN203559128U CN203559128U CN201320575757.4U CN201320575757U CN203559128U CN 203559128 U CN203559128 U CN 203559128U CN 201320575757 U CN201320575757 U CN 201320575757U CN 203559128 U CN203559128 U CN 203559128U
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106653632A (zh) * | 2016-12-29 | 2017-05-10 | 淄博才聚电子科技有限公司 | 一种半导体器件焊接机构 |
CN106735702A (zh) * | 2016-12-29 | 2017-05-31 | 淄博才聚电子科技有限公司 | 一种半导体器件自动焊接装置 |
CN115213578A (zh) * | 2022-08-30 | 2022-10-21 | 科威尔技术股份有限公司 | 一种真空焊接设备及其控制方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106653632A (zh) * | 2016-12-29 | 2017-05-10 | 淄博才聚电子科技有限公司 | 一种半导体器件焊接机构 |
CN106735702A (zh) * | 2016-12-29 | 2017-05-31 | 淄博才聚电子科技有限公司 | 一种半导体器件自动焊接装置 |
CN115213578A (zh) * | 2022-08-30 | 2022-10-21 | 科威尔技术股份有限公司 | 一种真空焊接设备及其控制方法 |
CN115213578B (zh) * | 2022-08-30 | 2023-10-31 | 科威尔技术股份有限公司 | 一种真空焊接设备及其控制方法 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 102209 Beijing city Changping District town Beiqijia Hongfu Pioneer Park No. 15 hospital Patentee after: BEIJING CHUANGYU TECHNOLOGY Co.,Ltd. Address before: 102209 Beijing city Changping District town Beiqijia Hongfu Pioneer Park No. 15 hospital Patentee before: BEIJING HANERGY CHUANGYU S&T Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 102209 Beijing city Changping District town Beiqijia Hongfu Pioneer Park No. 15 hospital Patentee after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd. Address before: 102209 Beijing city Changping District town Beiqijia Hongfu Pioneer Park No. 15 hospital Patentee before: Beijing Chuangyu Technology Co.,Ltd. Address after: 102209 Beijing city Changping District town Beiqijia Hongfu Pioneer Park No. 15 hospital Patentee after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. Address before: 102209 Beijing city Changping District town Beiqijia Hongfu Pioneer Park No. 15 hospital Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210201 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Patentee after: Zishi Energy Co.,Ltd. Address before: 102209 Beijing city Changping District town Beiqijia Hongfu Pioneer Park No. 15 hospital Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |
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CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20140423 |