CN203544701U - Silicon wafer transportation packing box - Google Patents

Silicon wafer transportation packing box Download PDF

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Publication number
CN203544701U
CN203544701U CN201320673778.XU CN201320673778U CN203544701U CN 203544701 U CN203544701 U CN 203544701U CN 201320673778 U CN201320673778 U CN 201320673778U CN 203544701 U CN203544701 U CN 203544701U
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CN
China
Prior art keywords
silicon chip
package box
dividing plate
transport package
described casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201320673778.XU
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Chinese (zh)
Inventor
杨乐
俞振明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konca Solar Cell Co Ltd
Original Assignee
Konca Solar Cell Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konca Solar Cell Co Ltd filed Critical Konca Solar Cell Co Ltd
Priority to CN201320673778.XU priority Critical patent/CN203544701U/en
Application granted granted Critical
Publication of CN203544701U publication Critical patent/CN203544701U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a silicon wafer transportation packing box which comprises a box body. An upper cover is fixed at the top of the box body through a lock catch, the inner wall of the box body is covered with a buffer lining layer, a strengthening base is arranged at the bottom of the box body, a consigning hole bringing convenience to transportation is formed in the strengthening base, and the interior of the box body is divided into a structure with at least two layers through a separating plate. According to the silicon wafer transportation packing box, the silicon wafer packing and transporting procedures can be simplified, the working efficiency can be improved, and the stability and the safety performance of silicon wafers in the transportation process can be further guaranteed.

Description

A kind of silicon chip transport package box
Technical field
The utility model relates to silicon chip packed and transported technical field, relates in particular to a kind of silicon chip transport package box.
Background technology
At present, the manner of packing of existing silicon chip transportation is that hundreds of silicon chips are placed in foam box, then allows several foam boxs put into carton, finally by dozens of carton stacking on pallet, and fix with rope, wrap up with plastic winding films outside.The carton thinner thickness using in this manner of packing, hardness is lower, and the ability that anti-external impacts is destroyed is poor.The mode wrapping with rope and plastic winding films on pallet, stability is not high, and without antidetonation safety method, silicon chip easily produces fragment phenomenon in transportation, causes transporting loss always higher.When the silicon chip of existing method packing is to client in addition, dismounting is wasted time and energy, and the effectively recycling of part packing, does not meet environment protection requirement.
Utility model content
The purpose of this utility model is to propose a kind of silicon chip transport package box, can simplify the packed and transported flow process of silicon chip, has improved work efficiency, has guaranteed again stability and the safety of silicon chip in transportation simultaneously.
For reaching this object, the utility model by the following technical solutions:
A kind of silicon chip transport package box, it comprises casing, the top of described casing is fixed with upper cover by snap close, wherein, on the inwall of described casing, be coated with one deck buffer liner layer, and the bottom of described casing is provided with reinforcement base, on described reinforcement base, offer the delivery hole of being convenient to transportation, in described casing, by dividing plate, be divided at least two-layer.
Especially, described casing is made by wood materials.
Especially, described buffer liner layer is waveform sponge liner.
Especially, in described casing, by two dividing plates, be divided into three layers.
Especially, described dividing plate is waveform sponge dividing plate.
Especially, in described casing every layer be provided with the common sponge dividing plate that prevents that silicon chip carton from colliding mutually.
The beneficial effects of the utility model are: compared with prior art, use described silicon chip transport package box the carton of dress silicon chip directly can be put into casing, and without extra fixing, convenient operation; Wooden casing can effectively be resisted external impacts, prevents the silicon chip damage that collision causes; Waveform sponge liner in casing and waveform sponge dividing plate can effectively cushion in transportation and shake, the common sponge dividing plate of filling between silicon chip carton also can prevent the mutual collision of silicon chip carton, therefore can significantly reduce the silicon chip Fragmentation Phenomena producing because of vibrations; The upper cover of wooden casing is fixed on wooden casing by snap close, is convenient to open; Strengthen base simultaneously and can replace pallet directly with fork truck, to move, greatly simplified handling flow process, improved work efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of the silicon chip transport package box that provides of the utility model specific embodiment 1.
The specific embodiment
Below in conjunction with accompanying drawing and by the specific embodiment, further illustrate the technical solution of the utility model.
Refer to shown in Fig. 1, Fig. 1 is the structural representation of the silicon chip transport package box that provides of the utility model specific embodiment 1.
In the present embodiment, a kind of silicon chip transport package box comprises wooden casing 1, the top of described wooden casing 1 is fixed with upper cover 3 by snap close 2, on the inwall of described wooden casing 1, be coated with one deck waveform sponge liner 4, and the bottom of described wooden casing 1 is provided with strengthens base 5, on described reinforcement base 5, offer the delivery hole 6 of being convenient to transportation, two waveform sponge dividing plates 7 that arrange by upper and lower parallel interval in described wooden casing 1 are divided into three-decker, and interior every layer of described wooden casing 1 is provided with the common sponge dividing plate 8 that prevents that silicon chip carton from colliding mutually.
During actual use, first with fork truck, insert delivery hole 6 silicon chip transport package box is placed into suitable position, then detachable top cover 3 is opened, the carton that silicon chip is housed is put in order on the waveform sponge liner 4 of wooden casing 1 bottom, and guarantee that the silicon chip carton that silicon chip is housed is close to the waveform sponge liner 4 of surrounding, common sponge dividing plate 8 jam-packs for space between carton, prevent direct impact between carton.Discharge after ground floor, cover waveform sponge dividing plate 7, and then put into successively the carton that silicon chip is housed also with common sponge dividing plate 8 jam-pack spaces.The 3rd layer operation as above.Wooden casing 1 can only be put into three layers of carton that silicon chip is housed, and prevents from piling up the too high lower floor's pressure that causes excessive and impaired.Install detachable top cover 3 on bonnet, and used snap close 2 to be fixed on wooden casing 1, labelled, stamp strip of paper used for sealing and pack complete.Owing to strengthening base 5, not only can strengthen the structural strength of whole packing chest, can also replace the effect of conveying tray, after packing, can, directly with this silicon chip transport package box of carrying fork truck, simplify flow package, improve work efficiency.The utility model has fully guaranteed again stability and the safety of silicon chip in transportation simultaneously, and whole packing are in the recyclable recycling of client, for the packed and transported of cell piece, environmental protection.
Above embodiment has just set forth groundwork of the present utility model and characteristic; the utility model is not limited by above-mentioned example; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various variations and change, and these variations and change all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.

Claims (6)

1. a silicon chip transport package box, it comprises casing, the top of described casing is fixed with upper cover by snap close, it is characterized in that, on the inwall of described casing, be coated with one deck buffer liner layer, and the bottom of described casing is provided with reinforcement base, on described reinforcement base, offer the delivery hole of being convenient to transportation, in described casing, by dividing plate, be divided at least two-layer.
2. silicon chip transport package box according to claim 1, is characterized in that, described casing is made by wood materials.
3. silicon chip transport package box according to claim 1, is characterized in that, described buffer liner layer is waveform sponge liner.
4. silicon chip transport package box according to claim 1, is characterized in that, in described casing, by dividing plate, is divided into three-decker.
5. according to the silicon chip transport package box described in claim 1 or 4 any one, it is characterized in that, described dividing plate is waveform sponge dividing plate.
6. silicon chip transport package box according to claim 1, is characterized in that, in described casing, every layer is provided with the common sponge dividing plate that prevents that silicon chip carton from colliding mutually.
CN201320673778.XU 2013-10-29 2013-10-29 Silicon wafer transportation packing box Active CN203544701U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320673778.XU CN203544701U (en) 2013-10-29 2013-10-29 Silicon wafer transportation packing box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320673778.XU CN203544701U (en) 2013-10-29 2013-10-29 Silicon wafer transportation packing box

Publications (1)

Publication Number Publication Date
CN203544701U true CN203544701U (en) 2014-04-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320673778.XU Active CN203544701U (en) 2013-10-29 2013-10-29 Silicon wafer transportation packing box

Country Status (1)

Country Link
CN (1) CN203544701U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103523384A (en) * 2013-10-29 2014-01-22 高佳太阳能股份有限公司 Transport packaging box for silicon wafers
CN105438645A (en) * 2015-11-24 2016-03-30 无锡普瑞腾传动机械有限公司 Improved silicon wafer transportation packaging box

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103523384A (en) * 2013-10-29 2014-01-22 高佳太阳能股份有限公司 Transport packaging box for silicon wafers
CN105438645A (en) * 2015-11-24 2016-03-30 无锡普瑞腾传动机械有限公司 Improved silicon wafer transportation packaging box

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