CN203536199U - Gold thread adding type transformer structure - Google Patents

Gold thread adding type transformer structure Download PDF

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Publication number
CN203536199U
CN203536199U CN201320596475.2U CN201320596475U CN203536199U CN 203536199 U CN203536199 U CN 203536199U CN 201320596475 U CN201320596475 U CN 201320596475U CN 203536199 U CN203536199 U CN 203536199U
Authority
CN
China
Prior art keywords
wire
gold thread
circuit board
iron core
device structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320596475.2U
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Chinese (zh)
Inventor
张乃千
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TETONG TECHNOLOGY Co Ltd
Original Assignee
TETONG TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TETONG TECHNOLOGY Co Ltd filed Critical TETONG TECHNOLOGY Co Ltd
Priority to CN201320596475.2U priority Critical patent/CN203536199U/en
Application granted granted Critical
Publication of CN203536199U publication Critical patent/CN203536199U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a gold thread adding type transformer structure which comprises a circuit board, an insulating layer, an iron core, a plurality of second wires and a rubber body. The circuit board is provided with a plurality of first wires arranged in a radiate shape, the insulating layer is arranged on the surface of the circuit board and covers the first wires, and only the first contacts and the second contacts of the first wires are exposed. The iron core is arranged on the surface of the insulating layer, the second wires and the first wires are electrically connected to form a coil spirally wound on the iron core, and the rubber body covers the first wires, the iron core and the second wires on the circuit board. The semiconductor packaging technology is used for manufacturing a thin and short flat plate type transformer structure which can be directly arranged on a main board of an electronic device for use without occupying too much space in the electronic device, and a shell or the size of the electronic device can be reduced, or the weight of the electronic device can be reduced.

Description

Beat the transformer device structure of gold thread formula
Technical field
The utility model relates to a kind of transformer, espespecially a kind ofly to beat gold thread mode, makes flat transformer device structure.
Background technology
Transformer (ransformer) is application Faraday's electromagnetic induction law and raise or reduce the device of voltage.Transformer comprises two groups or above coil conventionally.Main application is voltage, change impedance and the isolating circuit of lifting alternating current.
At present common transformer includes the iron core that utilizes the silicon steel sheet of E and I font to build up, by coil winding on drum stand, again the drum stand and this iron core that are wound with coil are formed, or utilize pressing and sintering technology to make a ring-type iron core iron powder, again by winding around on ring-type iron core, to form ring-shaped transformer.And the volume of transformer and weight, conventionally be decided by the number of turns of institute's kinking circle and the thickness of wire diameter, therefore can reduce or increase the turn ratio of primary coil and secondary coil, thereby raise or reduce voltage, this assembly of transformer makes it become the visual plant of changing voltage.
If need the transformer of a larger output power, this transformer is when making, and the wire diameter of the coil on institute's iron core that is wound in or drum stand will be thick, and the number of turns being wound around also wants many, therefore just can make transformer export larger electric power.Also because transformer has been wound around copper cash of wire diameter and be wound around the number of turns when more, can make the volume of transformer become large, it is heavy that weight also becomes, once become large at transformer volume, after weight also becomes heavily, make transformer cannot be installed on upper use of mainboard (circuit board) of electronic installation, avoid mainboard to damage by pressure or press distortion and cause the Copper Foil thread breakage on mainboard, therefore must be installed on the housing with electronic installation, thus, cause the puzzlement in the making that transformer is installed, and cause the housing of electronic installation also to become large.In flourish cyberage concerning any product all towards certainly will be one to hinder greatly the design of compact direction.
Utility model content
In view of this, the technical problems to be solved in the utility model is to provide a kind of transformer device structure of beating gold thread formula, compact, can reduce the transformer device structure inner too much space of electronic installation that accounts for.
For solving the problems of the technologies described above, the technical solution of the utility model is achieved in that
A transformer device structure of beating gold thread formula, it comprises: a circuit board, a side of this circuit board has the first wire of plural radial arrangement; One iron core, is located on the surface of the first wire of this circuit board; Plural number the second wire, is electrically connected formation helical form with this first wire and is set around on this iron core; And colloid, be covered in the first wire and this iron core and this second wire of this circuit board.
As preferred version, this circuit board is glass mat or ceramic wafer.
As preferred version, respectively this first wire is Copper Foil, respectively on this first wire, has one first contact and one second contact.
As preferred version, more include a power input and a power output end, this power input and the defeated end of this power supply respectively with this first wire respectively in any two electric connections.
As preferred version, more include an insulating barrier, this insulating barrier is insulating varnish, is located between a side and this iron core of this circuit board, covers respectively this first wire, only exposes this first contact and this second contact.
As preferred version, this iron core one side is provided with a lip-deep adhesion layer that is attached to this insulating barrier, and this adhesion layer is adhesive agent.
As preferred version, the surface of this iron core has a dielectric isolation layer or iron core surface is exposed shape.
As preferred version, respectively this second wire is gold thread or copper cash.
As preferred version, the surface of this circuit board is provided with an enclosure wall, and described enclosure wall surrounds this transformer device structure and forms a groove, and this colloid is located in the groove of this enclosure wall.
As preferred version, this enclosure wall is glass fibre or ceramic material.
The technique effect that the utility model reaches is as follows: it is compact that the utility model is beaten the transformer device structure of gold thread formula, can directly be made on the mainboard of electronic installation and use, and the inner too much space of the electronic installation that can not account for, makes the housing of this electronic installation or the weight that volume can dwindle or alleviate electronic installation itself.
Accompanying drawing explanation
Fig. 1 is the schematic top plan view of the circuit board of the utility model transformer of beating gold thread formula;
Fig. 2 has insulating barrier schematic diagram on the circuit board of the utility model transformer of beating gold thread formula;
Fig. 3 is iron core and the circuit board disassembling schematic diagram of the utility model transformer of beating gold thread formula;
Fig. 4 is the iron core of transformer and the side cross-sectional schematic of circuit board assembling that the utility model is beaten gold thread formula;
Fig. 5 be the circuit board of the utility model transformer of beating gold thread formula and iron core play gold thread schematic diagram;
Fig. 6 is that the side of Fig. 5 is cutd open schematic diagram;
Fig. 7 is that the circuit board of the utility model transformer of beating gold thread formula and iron core carry out a glue package-side and analyse and observe signal;
Fig. 8 is another embodiment schematic diagram of the present utility model;
Fig. 9 is an embodiment schematic diagram more of the present utility model;
Figure 10 is the some glue schematic perspective view of Fig. 9;
Figure 11 is the side cross-sectional schematic of Figure 10.
[symbol description]
Circuit board 1
The first wire 11
The first contact 111
The second contact 112
Power input 12
Power output end 13
Insulating barrier 2
Iron core 3
The second wire 4
Colloid 5
Mainboard 6
Electronic component 61
Enclosure wall 7
Groove 8.
Embodiment
Relevant the technical content and a detailed description of the present utility model, now coordinate graphic being described as follows:
Refer to Fig. 1 and Fig. 2, for the utility model, beat and on the circuit board of transformer of gold thread formula, overlook and circuit board has insulating barrier schematic diagram.As shown in the figure: the utility model is beaten the transformer device structure of gold thread formula, comprising: a circuit board 1 and an insulating barrier 2.
Circuit board 1, the side on it has the first wire 11 that plural number radial (circle) is arranged, and on each first wire 11, has the first contact 111 and the second contact 112.And any two in each first wire 11 are electrically connected with a power input 12 and power output end 13.In this is graphic, circuit board 1 is glass mat or ceramic wafer, and the first wire 11 is Copper Foil.
Insulating barrier 2, is located on a side of circuit board 1, to cover each the first wire 11, only exposes the first contact 111 and the second contact 112, during for following process, to be electrically connected gold thread, forms coil winding state.In this is graphic, insulating barrier 2 is insulating varnish.
Refer to Fig. 3 ~ Fig. 6, for the utility model is beaten iron core and the circuit board disassembling schematic diagram of the transformer of gold thread formula, the iron core of transformer of beating gold thread formula and side cross-sectional schematic, the circuit board of transformer of beating gold thread formula and the side cross-sectional schematic of beating gold thread schematic diagram and Fig. 5 of iron core of circuit board assembling.As shown in the figure: after circuit board making of the present utility model completes, one side of one iron core 3 is provided with adhesion layer, be coated with adhesive agent (not shown), to be attached on the surface of insulating barrier 2, insulating barrier 2 makes iron core 3 and each first wire 1 on circuit board 1 be state of insulation.In this is graphic, the surface of iron core 3 has a dielectric isolation layer or iron core 3 surfaces are naked state.
After iron core 3 and circuit board 1 combination, while beating gold thread processing and fabricating, one end of the second wire 4 is electrically connected on the first contact 111 of the first wire 1, again the other end of the second wire 4 is electrically connected to the connected mode on the second contact 112 of another adjacent the first wire 11, to complete the first all wires 11 and the second wire 4 electric connections, make the first wire 11 and the second wire 4 form helical forms and be wound in the coil on iron core 3.In this is graphic, the second wire 4 is gold thread or copper cash.
Refer to Fig. 7, circuit board and the iron core of for the utility model, making the transformer of gold thread formula carry out a glue package-side cross-sectional schematic.As shown in the figure: after the second wire 4 on transformer of the present utility model completes; on circuit board 1, carry out a glue; by on 5 the first wires 11 in circuit board 1 of colloid, iron core 3 and the second wire 4; to seal iron core 3 and the second wire 4 formation one protective layers, to protect iron core 2 and the second conductor wire 3 not to be subject to external force or other things clash into and damage.
Please read Fig. 8, be another embodiment schematic diagram of the present utility model.As shown in the figure; While combining due to the mainboard of transformer of the present utility model and general electronic installation, when mainboard 6 is being made, can directly the first wire 11 of transformer of the present utility model be produced on mainboard 6, when mainboard 6 carries out other electronic component 61 welding, carry out the making of the utility model transformer core 3, the second wire 4 and some glue simultaneously, to save mainboard 6, be connected making man-hour and operation with transformer.
Referring to Fig. 9 ~ Figure 11, is the some glue solid of an embodiment more of the present utility model and Fig. 9 and the side cross-sectional schematic of Figure 10.As shown in the figure: the present embodiment is provided with an enclosure wall 7 on the surface of circuit board 1, enclosure wall 7 is for insulation material, to surround this transformer device structure and to form a groove 8, when carrying out glue, can avoid the too excessive glue of colloid 5, colloid 5 can be blocked in enclosure wall 7 completely.In this is graphic, enclosure wall 7 is glass fibre or ceramic material.
The above, be only preferred embodiment of the present utility model, is not intended to limit protection range of the present utility model.

Claims (10)

1. a transformer device structure of beating gold thread formula, is characterized in that, it comprises:
One circuit board, a side of this circuit board has the first wire of plural radial arrangement;
One iron core, is located on the surface of the first wire of this circuit board;
Plural number the second wire, is electrically connected formation helical form with this first wire and is set around on this iron core; And
Colloid, is covered in the first wire and this iron core and this second wire of this circuit board.
2. the transformer device structure of beating gold thread formula according to claim 1, is characterized in that, this circuit board is glass mat or ceramic wafer.
3. the transformer device structure of beating gold thread formula according to claim 2, is characterized in that, respectively this first wire is Copper Foil, respectively on this first wire, has one first contact and one second contact.
4. the transformer device structure of beating gold thread formula according to claim 3, is characterized in that, more includes a power input and a power output end, this power input and the defeated end of this power supply respectively with this first wire respectively in any two electric connections.
5. the transformer device structure of beating gold thread formula according to claim 4, is characterized in that, more includes an insulating barrier, this insulating barrier is insulating varnish, be located between a side and this iron core of this circuit board, cover respectively this first wire, only expose this first contact and this second contact.
6. the transformer device structure of beating gold thread formula according to claim 5, is characterized in that, this iron core one side is provided with a lip-deep adhesion layer that is attached to this insulating barrier, and this adhesion layer is adhesive agent.
7. the transformer device structure of beating gold thread formula according to claim 6, is characterized in that, the surface of this iron core has a dielectric isolation layer or iron core surface is exposed shape.
8. the transformer device structure of beating gold thread formula according to claim 7, is characterized in that, respectively this second wire is gold thread or copper cash.
9. the transformer device structure of beating gold thread formula according to claim 8, is characterized in that, the surface of this circuit board is provided with an enclosure wall, and described enclosure wall surrounds this transformer device structure and forms a groove, and this colloid is located in the groove of this enclosure wall.
10. the transformer device structure of beating gold thread formula according to claim 9, is characterized in that, this enclosure wall is glass fibre or ceramic material.
CN201320596475.2U 2013-09-26 2013-09-26 Gold thread adding type transformer structure Expired - Fee Related CN203536199U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320596475.2U CN203536199U (en) 2013-09-26 2013-09-26 Gold thread adding type transformer structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320596475.2U CN203536199U (en) 2013-09-26 2013-09-26 Gold thread adding type transformer structure

Publications (1)

Publication Number Publication Date
CN203536199U true CN203536199U (en) 2014-04-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320596475.2U Expired - Fee Related CN203536199U (en) 2013-09-26 2013-09-26 Gold thread adding type transformer structure

Country Status (1)

Country Link
CN (1) CN203536199U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114097049A (en) * 2019-07-09 2022-02-25 株式会社村田制作所 Surface-mounted magnetic component module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114097049A (en) * 2019-07-09 2022-02-25 株式会社村田制作所 Surface-mounted magnetic component module

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140409

Termination date: 20160926

CF01 Termination of patent right due to non-payment of annual fee