CN203481207U - Open type supporting board for pin - Google Patents
Open type supporting board for pin Download PDFInfo
- Publication number
- CN203481207U CN203481207U CN201320548447.3U CN201320548447U CN203481207U CN 203481207 U CN203481207 U CN 203481207U CN 201320548447 U CN201320548447 U CN 201320548447U CN 203481207 U CN203481207 U CN 203481207U
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- CN
- China
- Prior art keywords
- supporting board
- pin
- open type
- support plate
- board body
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses an open type supporting board for a pin. The open type supporting board for the pin mainly solves the technical problem that an existing supporting board for the pin can not be suitable for wafers of two or more sizes. A supporting board body is triangular, and one side of the supporting board body is of an open type structure. The edge of the supporting board body is provided with a datum line in a machining mode, a common surface is arranged on the plane of the supporting board body in a machining mode, and positions, adjacent to the common surface, are provided with finish machining faces respectively. The three angles of the supporting board body are provided with jacking pin positions respectively, the vertex angle of the supporting board body is provided with a through hole, and the through hole is connected with a lifting mechanism moving component. The vertex angle of the supporting board body is further provided with a pin hole, and the pin hole is used for ensuring the connection precision. The supporting board body is made of ceramic materials, the advantages of high strength, small high-temperature deformation and the like of ceramics are fully utilized. According to the open type supporting board for the pin, the jacking positions of the wafers of various specifications can be integrated on the same supporting board. The open type supporting board for the pin further has the advantages that the same supporting frame can be used for jacking pins of various wafer sizes, the maintenance cost of transformation of equipment is saved, and the open type supporting board for the pin can be widely applied to the technical field of semiconductor coating.
Description
Technical field
The utility model relates to a kind of open pin support plate, is mainly used in semiconductor coated film equipment, belongs to semiconductive thin film deposition applications and preparing technical field.
Background technology
In existing semiconductor coated film equipment, especially 12 inches of semiconductor coated film equipment, pin support plate, in whole technical process, is realized the unified lifting of the pin on diverse location by self lifting, thereby is realized the lifting of wafer in piece delivery process.Pin generally distributes by even circumferential, and quantity is not generally three or more not etc.For guarantee wafer in whole technical process without phenomenons such as skew, slide plates, the height that need to guarantee the pin on diverse location is consistent, no matter under any state, the lifting of pin is the same with the speed of decline.This has just improved the requirement of pin support plate.Need to sell support plate under any state, the lifting that is positioned at residing of the pin of diverse location is consistent, and guarantees that these faces are in the same plane all the time.Sealing and the installing space of considering cavity are limited, and pin support plate is generally only provided with a lifting fulcrum.This has improved the requirement of strength of pin support plate again, does not allow it under the condition of high temperature, to have larger distortion to exist.To guarantee that the height of pin does not have large difference everywhere, thereby guarantee that the transmission of wafer is smooth and easy.Meanwhile, pin support plate himself can not be too heavy, avoids causing distortion because of Action of Gravity Field.
According to the needs of semiconductor industry, some equipment need possess the ability of producing different size wafer simultaneously.For different diameter wafers, also there is difference the position of jacking pin.Existing way is to change heating plate to adapt to corresponding wafer size in the industry; Change the support plate of jacking pin, to adapt to different wafer jacking positions simultaneously.And change ejector pin support plate, bring a series of activities amounts such as installation leveling, increased maintenance cost.
Summary of the invention
The utility model be take and addressed the above problem as object, mainly solve existing pin and can not be suitable for the deficiency of two or more size wafer with support plate, and providing a kind of structure relatively simple, intensity is high, can meet the open pin support plate of multiple wafer size simultaneously.
For achieving the above object, the utility model adopts following technical proposals: open pin support plate, the triangular in shape and limit of support plate main body is Open architecture.The edge of above-mentioned support plate main body is processed with datum line (2); The plane place of support plate main body is processed with surface (3), with surface (3) adjacent be shaped with respectively polished surface A(5-1), polished surface B(5-2) and polished surface C(5-3).On three angles of above-mentioned support plate main body, be shaped with respectively ejector pin position A(4), ejector pin position B(6), ejector pin position C(7), ejector pin position D(8), ejector pin position E(9) and ejector pin position F(11).On the drift angle of above-mentioned support plate main body, be shaped with through hole (1), be connected with elevating mechanism moving component, be also shaped with pin-and-hole (10) on the drift angle of support plate main body, pin-and-hole (10) is for guaranteeing to connect precision.
The advantages such as above-mentioned support plate main body adopts ceramic material, takes full advantage of ceramics strength high, and high temperature deformation is little.
The beneficial effects of the utility model and feature are:
The wafer jacking position of plurality of specifications is integrated on a support plate, effectively utilizes polished surface, reduce costs, remove excess stock, weight reduction, reduces everywhere due to the thermal stress producing in uneven thickness.Feature of the present utility model is also that same support can be used for the jacking pin of multiple wafer size, the maintenance cost of having saved equipment transition.Simple and reasonable, the pin of better having avoided the distortion because of support plate to cause highly differs, thereby causes wafer tilt or the appearance of slide plate phenomenon.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the schematic diagram of specific embodiment of the utility model.
Embodiment
Embodiment
With reference to Fig. 1-2, open pin support plate, the triangular in shape and limit of support plate main body is Open architecture.The edge of above-mentioned support plate main body is processed with datum line 2; The plane place of support plate main body is processed with surface 3, is shaped with respectively polished surface A5-1, polished surface B5-2 and polished surface C5-3 with surperficial 3 adjacents.On three angles of above-mentioned support plate main body, be shaped with respectively ejector pin position A4, ejector pin position B6, ejector pin position C7, ejector pin position D8, ejector pin position E9 and ejector pin position F11.On the drift angle of above-mentioned support plate main body, be shaped with through hole 1, be connected with elevating mechanism moving component, be also shaped with pin-and-hole 10 on the drift angle of support plate main body, pin-and-hole 10 is for guaranteeing to connect precision.
As shown in Figure 2, large wafer 12 is by ejector pin position A4, ejector pin position D8, the F11 jacking of ejector pin position; Little wafer 13 is by ejector pin position B6, ejector pin position C7, the E9 jacking of ejector pin position.As equipment has need to do different size wafer time, jacking pin is installed on to relevant position.
Described pin-and-hole 10 is 1, and through hole 1 is 3.
During installation, support plate main body realizes the location with elevating mechanism by pin-and-hole 10, by through hole 1, realizes and being fastenedly connected of elevating mechanism.
During use, the utility model is installed on to the moving component top of lifting body, datum line 2 is for measuring installation direction, and pin-and-hole 10 is for locating assurance installation accuracy, and screw is fastening by through hole 1, and the installation of whole like this pin support plate has just completed.
Claims (2)
1. an open pin support plate, is characterized in that: the triangular in shape and limit of support plate main body is Open architecture, and the edge of above-mentioned support plate main body is processed with datum line (2); The plane place of support plate main body is processed with surface (3), with surface (3) adjacent be shaped with respectively polished surface A(5-1), polished surface B(5-2) and polished surface C(5-3), on three angles of above-mentioned support plate main body, be shaped with respectively ejector pin position A(4), ejector pin position B(6), ejector pin position C(7), ejector pin position D(8), ejector pin position E(9) and ejector pin position F(11), on the drift angle of above-mentioned support plate main body, be shaped with through hole (1), be connected with elevating mechanism moving component, on the drift angle of support plate main body, be also shaped with pin-and-hole (10).
2. open pin support plate as claimed in claim 1, is characterized in that: described pin-and-hole (10) is 1, and through hole (1) is 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320548447.3U CN203481207U (en) | 2013-09-04 | 2013-09-04 | Open type supporting board for pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320548447.3U CN203481207U (en) | 2013-09-04 | 2013-09-04 | Open type supporting board for pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203481207U true CN203481207U (en) | 2014-03-12 |
Family
ID=50229486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320548447.3U Withdrawn - After Issue CN203481207U (en) | 2013-09-04 | 2013-09-04 | Open type supporting board for pin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203481207U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456672A (en) * | 2013-09-04 | 2013-12-18 | 沈阳拓荆科技有限公司 | Open type supporting board for pin |
-
2013
- 2013-09-04 CN CN201320548447.3U patent/CN203481207U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456672A (en) * | 2013-09-04 | 2013-12-18 | 沈阳拓荆科技有限公司 | Open type supporting board for pin |
| CN103456672B (en) * | 2013-09-04 | 2016-03-09 | 沈阳拓荆科技有限公司 | Open pin support plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140312 Effective date of abandoning: 20160309 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20140312 Effective date of abandoning: 20160309 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |