CN203467089U - Novel electronic experiment module - Google Patents

Novel electronic experiment module Download PDF

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Publication number
CN203467089U
CN203467089U CN201320550765.3U CN201320550765U CN203467089U CN 203467089 U CN203467089 U CN 203467089U CN 201320550765 U CN201320550765 U CN 201320550765U CN 203467089 U CN203467089 U CN 203467089U
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CN
China
Prior art keywords
groove
panel
experiment module
profile plate
cell wall
Prior art date
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Expired - Fee Related
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CN201320550765.3U
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Chinese (zh)
Inventor
周雨阳
张宇
向秋林
宫建鹏
王红达
左志远
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CHINA DIDAC EQUIPMENT TECHNOLOGY Co Ltd
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CHINA DIDAC EQUIPMENT TECHNOLOGY Co Ltd
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Priority to CN201320550765.3U priority Critical patent/CN203467089U/en
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Publication of CN203467089U publication Critical patent/CN203467089U/en
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Abstract

The utility model discloses a novel electronic experiment module. The novel electronic experiment module comprises a panel and a casing, wherein mounting holes used for mounting electronic components are molded on the panel, the casing comprises left and right side boards formed through die molding, front and back section material boards and a lower panel taken as a casing bottom, the left and right side boards, the front and back section material boards and the lower panel are clamped and spliced into one body, and adjustable clamping slots which are respectively molded at corresponding positions of top portions of the front and back section material boards are suitable for clamping-in of panels having different thicknesses. According to the novel electronic experiment module, requirements for different-size modules can be satisfied in a teaching experiment by changing the front and back section material boards having different lengths, moreover, the adjustable clamping slots which are respectively molded at the corresponding positions of the top portions of the front and back section material boards are for mounting of the panels having different thicknesses, and the novel electronic experiment module has strong versatility.

Description

Novel electron experiment module
Technical field
The utility model relates to electronic instruction experimental facilities field, specifically a kind of novel electron experiment module.
Background technology
One of electronic experiment module application, in Experiment of Electronics platform, is electronics, automation, info class specialty, and the important tool of the practical teaching of many relevant specialities.Traditional electronic experiment module comprises panel and housing, and housing is by mold injection molding and middle part indent coelosis, and panel and housing are connected together by notch, and electronic devices and components are arranged in the cavity of panel or the formation of housing indent.
Yet, in use there is following defect in the electronic experiment module of the prior art: 1, in the prior art, module housing is to form by mold injection, the high size of its length and width is all determined and can not be regulated, yet size, the quantity of the electronic devices and components that different education experiments is required are also not quite similar, the electronic devices and components that some modules need to be installed are many, by the experiment module peace of the prior art, can not load, and cause using; And the electronic devices and components that some modules need to be installed are less, after installing with the experiment module of the prior art, there is again larger remaining space, cause unnecessary waste; And if the experiment module of the prior art is wanted the varying sized new die of can only again developing, this can increase production cost undoubtedly greatly; 2, in the prior art, because module housing forms by mold injection, its moulding is fixed for the notch size of installation panel, only be suitable for installing the panel of fixed thickness, and electronic devices and components used vary in weight in electronic instruction experiment, the intensity that the panel of requirement installation electronic devices and components bears is different, according to different electronic devices and components, uses the panel of different-thickness, obviously, the prior art can not meet this requirement.
Utility model content
For this reason, the utility model provides a kind of novel electron experiment module, and this kind of novel electron experiment module do not need again development module can realize the requirement of different size module in education experiment, and this novel electron experiment module can be installed the panel of multi-thickness.
For solving the problems of the technologies described above, the utility model is a kind of novel electron experiment module, comprise panel and housing, on described panel, form for the installing hole of electronic devices and components is installed, described housing comprises that described left side plate, described front and back profile plate and described lower panel clamping are assemblied into one by the left side plate of mold injection molding, front and back profile plate and as the lower panel at the bottom of shell; Relevant position, profile plate top, described front and back forms respectively adjustable buckling groove, and the described panel that is suitable for different-thickness snaps in.
Described adjustable buckling groove is relevant position, profile plate top, the described front and back relative groove of opening of moulding respectively, and the upper cell wall of described groove is straight, and lower cell wall is stepped and downward-sloping towards described slot opening direction.
The described lower cell wall of described groove comprises three steps, and the vertical range between described upper cell wall and three described steps is respectively 5mm, 3mm and 2mm.
The middle part of described front and back profile plate forms respectively at least one projection in described housing, and described left side plate is formed respectively and is suitable for the draw-in groove that described projection snaps in by mold injection.
The strip boss of the protruding described front and back profile plate inner panel face moulding of serving as reasons described at least one, the center of described strip boss forms through hole; The described draw-in groove of described left side plate forms the screwed hole corresponding with described through hole, is suitable for screw and screws in.
The relevant position, bottom of described front and back profile plate forms respectively the first adjustable buckling groove, and the described lower panel that is suitable for different-thickness snaps in.
Described the first adjustable buckling groove is relevant position, the described front and back profile plates bottom first relative groove of opening of moulding respectively, and first time cell wall of described the first groove is straight, and cell wall is stepped and be inclined upwardly towards described the first slot opening direction on first.
Technique scheme of the present utility model has the following advantages compared to existing technology:
1, in the utility model, its housing comprises the left side plate, front and back profile plate of mold injection molding and as the lower panel at the bottom of shell, left side plate, front and back profile plate and lower panel are assemblied into one by interface arrangment, in the utility model, by changing the front and back profile plate of different length, can meet the demand of different size module in education experiment, with respect to mold developing again in prior art, it becomes to produce cost and greatly reduces; In addition, in the utility model, by the adjustable buckling groove of relevant position, profile plate top, front and back difference moulding, realize the installation of the panel of different-thickness, made electronic experiment module versatility of the present utility model stronger.
2, in the utility model, its adjustable buckling groove is relevant position, profile plate top, the front and back relative groove of opening of moulding respectively, the upper cell wall of groove is straight, lower cell wall is stepped and downward-sloping towards described slot opening direction, different vertical range between ladder by upper cell wall and lower cell wall, realize the panel that different-thickness is installed, it is simple that this kind arranges structure machine-shaping, and cost is lower.
3, in the utility model, its lower cell wall comprises three steps, vertical range between upper cell wall and three steps is respectively 5mm, 3mm and 2mm, this kind of structure setting adapted to popular in the market 5mm, 3mm and the panel of 2mm, and this kind of structure is arranged so that electronic experiment module of the present utility model can also install the circuit board that 2mm is thick, greatly increased the flexibility of experiment module.
4, in the utility model, front and back profile plate inner panel face forms respectively strip boss, the end of strip boss is suitable for snapping fit onto in the draw-in groove of left side plate moulding, before and after this kind of structure is arranged so that, profile plate can also directly be installed on left side plate after being parallel to vertical cross-section Partial Resection, in addition, strip boss middle part forms through hole, accordingly, the draw-in groove place of left side plate forms the screwed hole corresponding with through hole, by screw, screwing in screwed hole and through hole realizes the secondary of left side plate and front and back profile plate and fixes, further improved the reliability of experiment module of the present utility model.
5, in the utility model, before and after it, the relevant position, bottom of profile plate forms respectively the first adjustable buckling groove, the first adjustable buckling groove and adjustable buckling groove structure are similar, the lower cell wall of different is the one the first adjustable buckling grooves is straight, upper cell wall is stepped and be inclined upwardly towards slot opening direction, and this kind arranges structure and make experiment module of the present utility model that the lower panel of different-thickness can be installed.
Accompanying drawing explanation
For content of the present utility model is more likely to be clearly understood, according to specific embodiment of the utility model also by reference to the accompanying drawings, the utility model is described in further detail, wherein below
Fig. 1 is the utility model perspective view;
Fig. 2 is that described panel of the present utility model and described front and back profile plate are installed installation diagram;
Fig. 3 is panel described in Fig. 2 and described rear profile plate access section partial enlarged drawing;
Fig. 4 is that described front and back profile plate of the present utility model and described left side plate are installed installation diagram;
Fig. 5 is the three-dimensional structure diagram of described rear profile plate of the present utility model;
Fig. 6 is the three-dimensional structure diagram of described right plate of the present utility model.
In figure, Reference numeral is expressed as: cell wall, 5-the first groove under profile plate, 25-lower panel, 26-strip boss, 27-draw-in groove, 4-groove, the upper cell wall of 41-, 42-after profile plate, 24-before 1-panel, 2-housing, 21-left plate, 22-right plate, 23-.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated.Should be understood that, embodiment described herein only, for description and interpretation the utility model, is not limited to the utility model.
As shown in Figure 1, a kind of novel electron experiment module of the present embodiment, it comprises panel 1 and housing 2, forms for the installing hole 11 of electronic devices and components is installed on described panel 1, described panel 1 can be to have certain thickness sheet material, can be also current conventional circuit board.As shown in Figure 2 and Figure 4, described housing 2 comprises by the left plate 21 of mold injection molding and right plate 22, front profile plate 23 and rear profile plate 24, and in the present embodiment as the lower panel 25 at the bottom of shell, in the present embodiment, described left side plate, described front and back profile plate and described lower panel 25 are assemblied into one by clamping structure clamping, with respect in prior art by the whole housing of mold injection molding, electronic experiment module in the present embodiment can meet the demand of different size module in education experiment by changing the front and back profile plate of different length, neither can remain less larger installing space because of the electronic devices and components of installing, again can be because the electronic devices and components that will install are pacified and be can not load too much or too greatly.
In addition, in the present embodiment, as shown in Figures 2 and 3, described front profile plate 23 and described rear profile plate 24 top opposite positions form respectively adjustable buckling groove, the described panel 1 that described adjustable buckling groove is suitable for different-thickness snaps in, this kind is arranged so that the described panel 1 that the described housing 2 of the present embodiment can clamping different-thickness, makes the electronic experiment module highly versatile of the present embodiment.
Particularly, as shown in Figures 2 and 3, the described adjustable buckling groove of the present embodiment is the relative groove 4 of opening of described front and back profile plate 23 and 24 relevant positions, top difference moulding, as shown in Figure 3, the upper cell wall 41 of described groove 4 is straight, lower cell wall 42 is stepped and downward-sloping towards described groove 4 opening directions, thereby make described upper cell wall 41 different from the vertical range at the different ladders of described lower cell wall 42 place, in the present embodiment, as shown in Figure 3, the described lower cell wall 42 of described groove 4 preferably includes three steps, vertical range between described upper cell wall 41 and three described steps is respectively 5mm, 3mm and 2mm.Corresponding, the sheet metal thickness of the described panel 1 of installation is selected 5mm, 3mm and 2mm, and the described panel 1 of installation is that 2mm is thick during for circuit board.
Further again, as Figure 4-Figure 6, in the present embodiment, described front and back profile plate 23 and 24 middle part form respectively at least one projection in described housing 2, described left side plate 21 and 22 is formed respectively and is suitable for the described draw-in groove 27 that described projection snaps in by mold injection, in the present embodiment, the strip boss 26 of protruding serve as reasons described front and back profile plate 23 and 24 inner panel face moulding described at least one, described strip boss 26 center forms through hole, correspondence position at described left side plate 21 and 22 described draw-in groove 27 forms the screwed hole relative with described through hole, during installation, first described front and back profile plate 23 is connected with described draw-in groove 27 clampings by described projection with 22 with described left side plate 21 with 24, and then do further to fix by screw being screwed in described screwed hole and described through hole.
Also have, in the present embodiment, as shown in Figure 5, described front and back profile plate 23 and 24 relevant position, bottom form respectively the first adjustable card joint buckling groove, the described lower panel 25 that is suitable for different-thickness snaps in, and described lower panel 25 can be the sheet material at the thick end of difference, can be also circuit board.
Described the first adjustable buckling groove is the first relative groove 5 of opening of described front and back profile plate 23 and 24 relevant positions, bottom difference moulding, the structure of the structure of described the first groove 5 and described groove 4 is similar, first time cell wall of different is described the first groove 5 is straight, on first, cell wall is stepped and be inclined upwardly towards described the first groove 5 opening directions, described the first groove 5 is preferably three steps, during installation, according to the selected different-thickness of described lower panel 25, be connected to the different steps place of described the first groove 5.
Obviously, above-described embodiment is only for example is clearly described, and the not restriction to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all execution modes.And the apparent variation of being extended out thus or change are still among protection range of the present utility model.

Claims (7)

1. a novel electron experiment module, comprises panel (1) and housing (2), forms the installing hole (11) for electronic devices and components are installed on described panel (1), it is characterized in that:
Described housing (2) comprises that described left side plate (21,22), described front and back profile plate (23,24) and described lower panel (25) clamping are assemblied into one by the left side plate of mold injection molding (21,22), front and back profile plate (23,24) and as the lower panel at the bottom of shell (25);
Described front and back profile plate (23,24) relevant position, top forms respectively adjustable buckling groove, and the described panel (1) that is suitable for different-thickness snaps in.
2. novel electron experiment module according to claim 1, it is characterized in that: described adjustable buckling groove is described front and back profile plate (23,24) relevant position, the top relative groove (4) of opening of moulding respectively, the upper cell wall (41) of described groove (4) is straight, and lower cell wall (42) is stepped and downward-sloping towards described groove (4) opening direction.
3. novel electron experiment module according to claim 2, is characterized in that: the described lower cell wall (42) of described groove (4) comprises three steps, and the vertical range between described upper cell wall (41) and three described steps is respectively 5mm, 3mm and 2mm.
4. according to the novel electron experiment module described in any one in claim 1-3, it is characterized in that: the middle part of described front and back profile plate (23,24) forms respectively at least one projection in described housing (2), described left side plate (21,22) forms respectively the draw-in groove (27) that is suitable for described projection and snaps in by mold injection.
5. novel electron experiment module according to claim 4, it is characterized in that: the projection strip boss (26) of described front and back profile plate (23,24) inner panel face moulding of serving as reasons described at least one, the center of described strip boss (26) forms through hole; The described draw-in groove (27) of described left side plate (21,22) forms the screwed hole corresponding with described through hole, is suitable for screw and screws in.
6. novel electron experiment module according to claim 5, is characterized in that: the relevant position, bottom of described front and back profile plate (23,24) forms respectively the first adjustable buckling groove, and the described lower panel (25) that is suitable for different-thickness snaps in.
7. novel electron experiment module according to claim 6, it is characterized in that: described the first adjustable buckling groove is relevant position, described front and back profile plate (23,24) bottom relative first groove (5) of opening of moulding respectively, first time cell wall of described the first groove (5) is straight, and cell wall is stepped and be inclined upwardly towards described the first groove (5) opening direction on first.
CN201320550765.3U 2013-09-05 2013-09-05 Novel electronic experiment module Expired - Fee Related CN203467089U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320550765.3U CN203467089U (en) 2013-09-05 2013-09-05 Novel electronic experiment module

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Application Number Priority Date Filing Date Title
CN201320550765.3U CN203467089U (en) 2013-09-05 2013-09-05 Novel electronic experiment module

Publications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106448388A (en) * 2016-11-30 2017-02-22 贵州大学 Mesh plate for teaching and practical training of electronic circuit
CN106455390A (en) * 2016-11-11 2017-02-22 合肥泰禾光电科技股份有限公司 Sorting box of color selector
CN114980641A (en) * 2022-06-01 2022-08-30 清远市德远能源开发有限公司 Intelligent control panel convenient to dismouting

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106455390A (en) * 2016-11-11 2017-02-22 合肥泰禾光电科技股份有限公司 Sorting box of color selector
CN106448388A (en) * 2016-11-30 2017-02-22 贵州大学 Mesh plate for teaching and practical training of electronic circuit
CN114980641A (en) * 2022-06-01 2022-08-30 清远市德远能源开发有限公司 Intelligent control panel convenient to dismouting
CN114980641B (en) * 2022-06-01 2024-02-27 海南朝闻启学知识产权有限责任公司 Intelligent control panel convenient to dismouting

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140305

Termination date: 20160905

CF01 Termination of patent right due to non-payment of annual fee