CN203465998U - Novel thermistor - Google Patents
Novel thermistor Download PDFInfo
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- CN203465998U CN203465998U CN201320493324.4U CN201320493324U CN203465998U CN 203465998 U CN203465998 U CN 203465998U CN 201320493324 U CN201320493324 U CN 201320493324U CN 203465998 U CN203465998 U CN 203465998U
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- thermistor
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Abstract
The utility model discloses a novel thermistor belonging to the technical field of electrical appliance elements. The novel thermistor comprises a heat-sensitive chip, a copper wire connected with the heat-sensitive chip and a glass encapsulating layer for encapsulating the whole heat-sensitive chip, wherein a thin polyimide surface treatment layer is arranged outside the glass encapsulating layer and the copper wire to enhance insulation, interference resistance and impact resistance of the thermistor, so that the thermistor has good mechanical properties and good stability and can meet the using requirements of modern products.
Description
Technical field
The utility model belongs to electronic component technology field, is specifically related to a kind of thermal resistance.
Background technology
Along with the development of electronic technology, the further miniaturization of various electronics and intellectuality, thermistor variously need to surveying temperature, control, the application of the occasion such as compensation increases day by day.Because electronic equipment high-precision temperature is surveyed, temperature controlled needs, the precision and stability of the R resistance value of thermistor, B value has been proposed to more and more higher requirement simultaneously.Incessantly at this on the one hand, even the requirement of resistance to pressure, mechanical strength etc. is also improving, current thermistor obviously cannot meet insulation, anti-pressure and abrasion-proof, shock resistance, high temperature resistant, reactance voltage effect, the demand of mechanical strength etc.
Utility model content
In order to overcome above-mentioned technological deficiency, the utility model provides a kind of insulation, anti-pressure and abrasion-proof, can meet the thermal resistance using in high temperature and high pressure environment.
In order to address the above problem, the utility model is achieved by following technical scheme:
Thermal resistance described in the utility model, comprises temperature-sensitive chip and the copper cash being connected with temperature-sensitive chip, and described temperature-sensitive chip is outside equipped with encapsulated layer, described copper cash and encapsulated layer outer encapsulating layer protective layer.
Further, in order to improve resistance to wear, described encapsulated layer is glass encapsulating layer.
Further, for reinforced insulation, anti-interference, described protective layer is polyimide surface processing layer.
Compared with prior art, the beneficial effects of the utility model are:
The utility model adopts advanced manufacture craft; one deck polyimide surface processing layer that made thermistor outer encapsulating; insulating properties, anti-pressure and abrasion-proof, impact resistance, heat-resisting quantity, the reactance voltage effect of thermistor have been strengthened; there is good mechanical strength simultaneously; strengthen stability, protected better copper cash not to be subject to external influence.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail, wherein:
Fig. 1 is structural representation of the present utility model;
In figure: 1-glass encapsulating layer, 2-temperature-sensitive chip, 3-copper cash, 4-polyimide surface processing layer
Embodiment
As shown in Figure 1, thermal resistance described in the utility model, comprise temperature-sensitive chip 2, the copper cash 3 being connected with temperature-sensitive chip 2 and the glass encapsulating layer 1 of sealing whole temperature-sensitive chip 2, described glass encapsulating layer 1 and copper cash 3 outer encapsulatings the polyimide surface processing layer 4 of thin layer, for strengthening insulating properties and the anti-interference of thermistor.
The utility model is simple in structure; adopt advanced process, through the imido spraying of three stratas, then distinguish baking-curing, form protective layer; improved insulating properties, anti-pressure and abrasion-proof, impact resistance, enhancing stability, made it in high temperature and high pressure environment, work and still satisfy the demand.
Described in the present embodiment, other structure of thermal resistance is referring to prior art.
The above, it is only preferred embodiment of the present utility model, not the utility model is done to any pro forma restriction, therefore every, do not depart from technical solutions of the utility model content, any modification, equivalent variations and the modification above embodiment done according to technical spirit of the present utility model, all still belong in the scope of technical solutions of the utility model.
Claims (3)
1. a thermal resistance, comprises temperature-sensitive chip and the copper cash being connected with temperature-sensitive chip, and described temperature-sensitive chip is outside equipped with encapsulated layer, it is characterized in that: described copper cash and encapsulated layer outer encapsulating layer protective layer.
2. thermal resistance according to claim 1, is characterized in that: described encapsulated layer is glass encapsulating layer.
3. thermal resistance according to claim 2, is characterized in that: described protective layer is polyimide surface processing layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320493324.4U CN203465998U (en) | 2013-08-13 | 2013-08-13 | Novel thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320493324.4U CN203465998U (en) | 2013-08-13 | 2013-08-13 | Novel thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203465998U true CN203465998U (en) | 2014-03-05 |
Family
ID=50178346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320493324.4U Expired - Lifetime CN203465998U (en) | 2013-08-13 | 2013-08-13 | Novel thermistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203465998U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275016A (en) * | 2017-06-28 | 2017-10-20 | 中国振华集团云科电子有限公司 | The method and resistor obtained by this method of protective layer are formed on a resistor |
-
2013
- 2013-08-13 CN CN201320493324.4U patent/CN203465998U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275016A (en) * | 2017-06-28 | 2017-10-20 | 中国振华集团云科电子有限公司 | The method and resistor obtained by this method of protective layer are formed on a resistor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140305 |
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| CX01 | Expiry of patent term |