CN203465841U - Anti-interference structure of infrared receiving sensor for mobile phone - Google Patents
Anti-interference structure of infrared receiving sensor for mobile phone Download PDFInfo
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- CN203465841U CN203465841U CN201320584175.2U CN201320584175U CN203465841U CN 203465841 U CN203465841 U CN 203465841U CN 201320584175 U CN201320584175 U CN 201320584175U CN 203465841 U CN203465841 U CN 203465841U
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- receiving sensor
- infrared receiving
- electric capacity
- interference
- ground wire
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Abstract
The utility model discloses an anti-interference structure of an infrared receiving sensor for a mobile phone. The infrared receiving sensor is welded on a bonding pad of a PCB (printed circuit board) and comprises a power end, a ground end and a signal output end; the anti-interference structure comprises a first capacitor, a second capacitor, a power line, a ground wire plane and a ground wire line, wherein the power line is formed on the PCB and connected with a power end of the infrared receiving sensor; the first ends of the first and second capacitors are connected with the power line; the ground wire plane is formed on the PCB; the ground wire line is formed on the PCB and connected between the ground wire plane and the ground end of the infrared receiving sensor; the second ends of the first and second capacitors are both connected with the ground wire line. The anti-interference structure disclosed by the utility model can greatly reduce the interference of external interference signals.
Description
Technical field
The utility model relates to the infrared receiving sensor of a kind of mobile phone, particularly relates to the anti-interference structure of infrared receiving sensor for a kind of mobile phone.
Background technology
Infrared receiving sensor is the photoelectric sensor that a kind of infrared energy by object transmitting converts electric signal to, the photosensitive part of sensor can be transformed into faint current signal by the infrared signal receiving, then by other parts of sensor internal, faint electric signal is amplified and shaping the level signal that finally output can be identified by digital display circuit.From application in the market, be roughly divided into following several application structures:
The integrated infrared receiving sensor of the first as shown in Figure 1, is the inner structure schematic diagram of existing integrated infrared receiving sensor; The integrated infrared receiving sensor TSOP31238 of prestige generation (Vishay) company of take is the inner structure of the existing integrated infrared receiving sensor of example explanation, existing integrated infrared receiving sensor 101 comprises: be arranged in the photodiode (PIN) 102 of making for photochromics of Fig. 1 high order end, photodiode 102 is for receiving infrared signal and infrared signal being converted to electric signal.Input circuit (Input) 103 provides the biasing of photodiode 102, and the output signal of input circuit 103 is input in automatic gain control circuit (AGC) 104 carries out signal amplification.Bandpass filter (Bandpass filter) 105 is for selecting the infrared signal of corresponding frequencies to pass through, and such as for TSOP31238, the infrared signal of 38KHz can be passed through, and the infrared signal of other frequencies is by filtering.Detuner (Demodulator) 106 carries out shaping output for the output signal to after bandpass filtering.The signal of detuner 106 outputs is input to the base stage of NPN triode 108.The source ground GND of NPN triode 108, drains as signal output part OUT, and drain electrode also connects power supply Vs by resistance 109, and resistance 109 is 30K Ω.Control circuit (Control Circiut) 107 output signals according to bandpass filter 105 realize the control to automatic gain control circuit 104 and detuner 106.
The second, for responding to the infrared receiving sensor of carrier wave output, as shown in Figure 2, is the existing inner structure schematic diagram that can respond to the infrared receiving sensor of carrier wave output; The infrared receiving sensor TSMP77000 that can respond to infrared carrier wave of Vishay company of take is the existing inner structure that can respond to the infrared receiving sensor of carrier wave output of example explanation.The existing infrared receiving sensor 201 that can respond to carrier wave output comprises: photodiode 202, for receiving infrared signal and infrared signal being converted to electric signal; Transimpedance amplifier (Transimpedance Amplifier, TIA) 203, input end is connected with photodiode 202 by an electric capacity; Amplifier (Amp) 204, input end connects the output terminal of transimpedance amplifier 203, and transimpedance amplifier 203 and amplifier 204 are realized the electric signal that infrared signal is changed into and are amplified; Signal transformation circuit (Signal Shaping) 205, carries out Shape correction for realizing to amplifying signal; The output terminal of signal transformation circuit 205 is connected to the base stage of NPN triode 206; The source ground GND of NPN triode 206, drains as signal output part OUT, and drain electrode also connects power supply Vs by resistance 207.As seen from Figure 2, the existing infrared receiving sensor 201 that can respond to carrier wave output is that the infrared signal directly photosensitive part being received is amplified and Shape correction, and direct outgoing carrier.
Photodiode in Fig. 1 and Fig. 2 and other parts are all integrated on same chip, in existing application, have in order to reduce costs, photodiode is external, directly by chip, process the induction output signal of photodiode, and the infrared signal that can be identified by digital circuitry of last output, such as process the induction output signal of photodiode by the infrared reception signal processing chip VSOP98260 of Vishay company.
Infrared receiving sensor can be built in mobile phone, mobile phone is easily subject to strong interference with infrared receiving sensor, the main source of disturbing comprises: be the interference from power-supply system of cell phone on the one hand, because interior of mobile phone has the electron device of a lot of other high-speed cruisings, the frequent alternation state in switch, thereby easily affect the stability of power-supply system, in power supply, parasitic ripple disturbs.Secondly in cell phone system, especially the high-speed cruising of high-end mobile phone CPU, easily forms certain radiation interference, more seriously the wifi antenna in mobile phone, the powerful electromagnetic interference (EMI) of the radio frequency part in communication network, is easy to form electromagnetic interference signal on the pin of infrared sensor.The electromagnetic signal that circuit in mobile phone is also easily come from the outside is disturbed.
From the pin of infrared receiving sensor, connect, what the most easily import interference is exactly power pin and ground pin.Output signal is digital signal, and the epidemic situation comparison of signal is clearly demarcated, is not easy to form to disturb.By the understanding to the infrared receiving sensor in top, infrared receiving sensor is faint interchange photosignal to be amplified to shaping then export the pulse signal that can be identified by digital display circuit, so the undesired signal in power pin, the undesired signal that ground wire pin is introduced all easily causes the erroneous trigger signal of infrared receiving sensor.For this reason, in order to guarantee that infrared receiving sensor can work normally in mobile phone, need to do a little special processing to VDD-to-VSS line.
The anti-interference structure of infrared receiving sensor for existing mobile phone, mainly to add electric capacity between the power end of infrared receiving sensor and ground end, filtering enters the interference of infrared receiving sensor, as shown in Figure 3, is the anti-interference structure schematic diagram of infrared receiving sensor for existing mobile phone; Infrared receiving sensor 301 comprises power end 302, earth terminal 303 and signal output part 304, infrared receiving sensor 301 can adopt the infrared receiving sensor shown in Fig. 1 or Fig. 2, power end 302 is for connecting power supply Vs, earth terminal 303 is for ground connection GND, and signal output part 304 is for carrying out signal output OUT.Electric capacity 305 and electric capacity 306 are anti-interference capacitor.Infrared receiving sensor 301, electric capacity 305 and electric capacity 306 are all welded on PCB(printed circuit board (PCB)) on plate 307.Power end 302 is connected with power supply Vs by power supply cabling 309, and electric capacity 305 is also all connected with power supply cabling 309 with 306 first end.Earth terminal 303 is connected with ground plan 308, and ground plan 308 is all surrounded whole infrared receiving sensor 301, and is a planar structure.Electric capacity 305 and the second end of 306 are all connected in ground plan 308.
As shown in Figure 3, that existing mobile phone can have good inhibiting effect to the electromagnetic interference (EMI) of high frequency with the electric capacity 305 and 306 of the anti-interference structure of infrared receiving sensor, if but line is noted not, add filter capacitor 305 and 306 well interference and the electromagnetic interference (EMI) of filter out power system, as shown in Figure 3:
Local linear flow is in the time of electric capacity 305 and 306, and the interference 310a on ground wire can be by electric capacity 305 and 306 filterings; But do not note in the time of due to pcb board 307 upper berth ground plan 308, in fact the interference on other local ground wires is as disturbed 310b and 310c can walk around electric capacity 305 and 306, directly enter the inside of infrared receiving sensor 301, the signal formation of infrared receiving sensor 301 inside is disturbed.
Utility model content
Technical problem to be solved in the utility model is to provide the anti-interference structure of infrared receiving sensor for a kind of mobile phone, can greatly reduce the interference of external interference signals.
For solving the problems of the technologies described above, the mobile phone that the utility model provides is welded on pcb board with the infrared receiving sensor of the anti-interference structure of infrared receiving sensor, and infrared receiving sensor comprises power end, earth terminal and signal output part; Anti-interference structure comprises:
The first electric capacity and the second electric capacity.
Be formed at the power supply cabling on described pcb board, the connection of the power end of described power supply cabling and described infrared receiving sensor; The first end of described the first electric capacity and described the second electric capacity is all connected with described power supply cabling and described power supply cabling is connected to the power end of described infrared receiving sensor successively afterwards through the first end of described the first electric capacity and described the second electric capacity.
Be formed at the ground plan on described pcb board, the earth terminal of described ground plan and described infrared receiving sensor does not directly contact.
Be formed at the ground wire cabling on described pcb board, described ground wire cabling is connected between described ground plan and the earth terminal of described infrared receiving sensor; The second end of described the first electric capacity and described the second electric capacity is all connected with described ground wire cabling and described ground wire cabling is connected to the earth terminal of described infrared receiving sensor successively afterwards through the second end of described the first electric capacity and described the second electric capacity.
Further improve and be, distance between described the first electric capacity and the first end of described the second electric capacity and the power end of described infrared receiving sensor is all less than or equal to 5 millimeters, and the second end and the distance between the earth terminal of described infrared receiving sensor of described the first electric capacity and described the second electric capacity are all less than or equal to 5 millimeters.
The second end and the distance between the earth terminal of described infrared receiving sensor of the distance between described the first electric capacity and the first end of described the second electric capacity and the power end of described infrared receiving sensor and described the first electric capacity and described the second electric capacity are less, the interference being produced by first end and the metal routing between described infrared receiving sensor of described the first electric capacity and described the second electric capacity is less, and anti-jamming effectiveness is better.
The earth terminal of described ground plan and described infrared receiving sensor does not directly contact, but the segment distance of being separated by, this distance is larger, and described ground plan is to also less with the interference of described infrared receiving sensor generation.
In the utility model, the not direct and infrared receiving sensor earth terminal of ground plan is directly connected but by a ground wire cabling, realizes the connection of ground plan and infrared receiving sensor earth terminal, the second end of filter capacitor is all connected with ground wire cabling simultaneously, after all interference of ground plan all can be first by two filter capacitors, just can enter into infrared receiving sensor like this, so filter capacitor can be realized all interference filterings to ground plan, thereby can greatly reduce external interference signals, infrared receiving sensor is disturbed.
Accompanying drawing explanation
Fig. 1 is the inner structure schematic diagram of existing integrated infrared receiving sensor;
Fig. 2 is the existing inner structure schematic diagram that can respond to the infrared receiving sensor of carrier wave output;
Fig. 3 is the anti-interference structure schematic diagram of infrared receiving sensor for existing mobile phone;
Fig. 4 is the anti-interference structure schematic diagram of infrared receiving sensor for embodiment of the present invention mobile phone.
Embodiment
As shown in Figure 4, be the anti-interference structure schematic diagram of infrared receiving sensor for embodiment of the present invention mobile phone.The utility model embodiment mobile phone is welded on pcb board 7 with the infrared receiving sensor 1 in the anti-interference structure of infrared receiving sensor, and infrared receiving sensor 1 comprises power end 2, earth terminal 3 and signal output part 4.Described in the utility model embodiment, infrared receiving sensor 1 can adopt structure as shown in Figure 1 or 2.
Anti-interference structure comprises:
The first electric capacity 5 and the second electric capacity 6;
Be formed at the power supply cabling 9 on described pcb board 7, the connection of the power end 2 of described power supply cabling 9 and described infrared receiving sensor 1; The first end of described the first electric capacity 5 and described the second electric capacity 6 is all connected with described power supply cabling 9 and described power supply cabling 9 is connected to the power end 2 of described infrared receiving sensor 1 successively afterwards through the first end of described the first electric capacity 5 and described the second electric capacity 6.Distance between the first end of described the first electric capacity 5 and described the second electric capacity 6 and the power end 2 of described infrared receiving sensor 1 is less, by the first end of described the first electric capacity 5 and described the second electric capacity 6 and the metal routing between described infrared receiving sensor 1, be that the interference that produces of described power supply cabling 9 is less, anti-jamming effectiveness is better.Be preferably, the distance between the first end of described the first electric capacity 5 and described the second electric capacity 6 and the power end 2 of described infrared receiving sensor 1 is all less than or equal to 5 millimeters.
Be formed at the ground plan 8 on described pcb board 7, the earth terminal 3 of described ground plan 8 and described infrared receiving sensor 1 does not directly contact.The earth terminal 3 of described ground plan 8 and described infrared receiving sensor 1 does not directly contact, but the segment distance of being separated by, this distance is larger, and the interference that 8 pairs of described ground plan and described infrared receiving sensor 1 produce is also less.
Be formed at the ground wire cabling 10 on described pcb board 7, described ground wire cabling 10 is connected between described ground plan 8 and the earth terminal 3 of described infrared receiving sensor 1; The second end of described the first electric capacity 5 and described the second electric capacity 6 is all connected with described ground wire cabling 10 and described ground wire cabling 10 is connected to the earth terminal 3 of described infrared receiving sensor 1 successively afterwards through the second end of described the first electric capacity 5 and described the second electric capacity 6.Distance between described the first electric capacity 5 and the second end of described the second electric capacity 6 and the earth terminal 3 of described infrared receiving sensor 1 is less, by the second end of described the first electric capacity 5 and described the second electric capacity 6 and the metal routing between described infrared receiving sensor 1, be that the interference that produces of described ground wire cabling 10 is less, anti-jamming effectiveness is better.Be preferably, the distance between described the first electric capacity 5 and the second end of described the second electric capacity 6 and the earth terminal 3 of described infrared receiving sensor 1 is all less than or equal to 5 millimeters.
As seen from Figure 4, described ground plan 8 the described infrared receiving sensor 1 of getting along well directly contact, interference in described ground plan 8 all can by described the first electric capacity 5 and described the second electric capacity 6 is rear just can enter into described infrared receiving sensor 1, and can both be by described the first electric capacity 5 and described the second electric capacity 6 filterings, so the utility model embodiment can greatly reduce the interference of external interference signals to infrared receiving sensor when disturbing by described the first electric capacity 5 and described the second electric capacity 6.
These are only preferred embodiment of the present utility model, and be not used in restriction the utility model.For a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (2)
1. an anti-interference structure for infrared receiving sensor for mobile phone, is characterized in that, infrared receiving sensor is welded on pcb board, and infrared receiving sensor comprises power end, earth terminal and signal output part; Anti-interference structure comprises:
The first electric capacity and the second electric capacity;
Be formed at the power supply cabling on described pcb board, the connection of the power end of described power supply cabling and described infrared receiving sensor; The first end of described the first electric capacity and described the second electric capacity is all connected with described power supply cabling and described power supply cabling is connected to the power end of described infrared receiving sensor successively afterwards through the first end of described the first electric capacity and described the second electric capacity;
Be formed at the ground plan on described pcb board, the earth terminal of described ground plan and described infrared receiving sensor does not directly contact;
Be formed at the ground wire cabling on described pcb board, described ground wire cabling is connected between described ground plan and the earth terminal of described infrared receiving sensor; The second end of described the first electric capacity and described the second electric capacity is all connected with described ground wire cabling and described ground wire cabling is connected to the earth terminal of described infrared receiving sensor successively afterwards through the second end of described the first electric capacity and described the second electric capacity.
2. the anti-interference structure of infrared receiving sensor for mobile phone as claimed in claim 1, it is characterized in that: the distance between described the first electric capacity and the first end of described the second electric capacity and the power end of described infrared receiving sensor is all less than or equal to 5 millimeters, the second end and the distance between the earth terminal of described infrared receiving sensor of described the first electric capacity and described the second electric capacity are all less than or equal to 5 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320584175.2U CN203465841U (en) | 2013-09-22 | 2013-09-22 | Anti-interference structure of infrared receiving sensor for mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320584175.2U CN203465841U (en) | 2013-09-22 | 2013-09-22 | Anti-interference structure of infrared receiving sensor for mobile phone |
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| Publication Number | Publication Date |
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| CN203465841U true CN203465841U (en) | 2014-03-05 |
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| CN201320584175.2U Expired - Lifetime CN203465841U (en) | 2013-09-22 | 2013-09-22 | Anti-interference structure of infrared receiving sensor for mobile phone |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108921112A (en) * | 2018-07-10 | 2018-11-30 | Oppo广东移动通信有限公司 | A kind of mobile terminal and its flash lamp fingerprint recognition component |
-
2013
- 2013-09-22 CN CN201320584175.2U patent/CN203465841U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108921112A (en) * | 2018-07-10 | 2018-11-30 | Oppo广东移动通信有限公司 | A kind of mobile terminal and its flash lamp fingerprint recognition component |
| CN108921112B (en) * | 2018-07-10 | 2022-01-07 | Oppo广东移动通信有限公司 | Mobile terminal and flash lamp fingerprint identification assembly thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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Granted publication date: 20140305 |
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| CX01 | Expiry of patent term |