CN203464534U - Box structure with miniature semi-conductor refrigerating devices - Google Patents
Box structure with miniature semi-conductor refrigerating devices Download PDFInfo
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- CN203464534U CN203464534U CN201320523292.8U CN201320523292U CN203464534U CN 203464534 U CN203464534 U CN 203464534U CN 201320523292 U CN201320523292 U CN 201320523292U CN 203464534 U CN203464534 U CN 203464534U
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Abstract
The utility model relates to a box structure with miniature semi-conductor refrigerating devices. The box structure comprises a casing, wherein a refrigerating cavity is enclosed by a liner in the inner middle of the casing, an access window is processed at the top of the casing, a seal bolt which extends to the refrigerating cavity is arranged on the access window, the refrigerating devices are symmetrically arranged on the left side and the right side of the liner, and thermal insulating layers are arranged between the top, the bottom, the front side and the rear side of the liner and the casing. The box structure has the advantages of simple structure, small size, low cost and great heat radiation effect. The application range and the application field of the miniature refrigerating devices are enlarged.
Description
Technical field
The utility model relates to a kind of Miniature refrigerating device, particularly a kind of micro semiconductor refrigerating plant body structure.
Background technology
Existing semiconductor cooling device, general appearance size and refrigeration space are all larger, and power consumption is high, and refrigerating efficiency is poor, and structural design is reasonable not, rarely has the semiconductor cooling device that is specifically applied to Laboratory Instruments equipment development.
Along with the development of micro-electromechanical technology, the miniaturization of various device and microminiaturization have been an inevitable development trend, are also developing direction of current scientific instruments equipment.Miniaturization and microminiaturization have not only reduced the volume of equipment, and power consumption and the cost of the equipment reducing, and have also strengthened the function of instrument simultaneously.The miniaturization of refrigeration plant is particularly urgent, and aspect medicine, biological products, semiconductor cooling device provides good solution route for preserving biologically active.Aspect prepared by material, Refrigeration Technique has obtained development widely as the preparation method of nano-powder material, is widely used in field of new and is used for preparing the single-phase powder of ultra micro or simple doped and compounded powder, is also applied to the preparation of some special construction materials.In addition, aspect the early-stage Study of food processing, agricultural product preservation and other special applications, also need to use micro vacuum Freeze Drying Technique, with Speeding up development progress, saving cost.As can be seen here, experiment is very extensive by the purposes of micro semiconductor refrigerating plant, has the urgent market demand.
Therefore be necessary to design that a kind of experiment is little with volume, cost is low, the high and low power consumption of performance, compactness rational in infrastructure, and to the various parameters such as speed of cryogenic temperature, heating-up temperature and refrigeration and heating can be in real time, accurately control, can accomplish the Multi-stage minitype semiconductor cooling device of the meticulous control of temperature, for laboratory preparation method and the performance study of high-performance biologic product, functional material etc. provides strong support.
Summary of the invention
The purpose of this utility model is to provide that a kind of volume is little, cost is low, the high and low power consumption of performance, micro semiconductor refrigerating plant body structure for the experiment of good refrigeration effect.
To achieve these goals, the technical solution adopted in the utility model is: it comprises housing, in housing, middle part surrounds refrigerating chamber by inner bag, at the top of housing, be processed with and pick and place window, pick and place and on window, be provided with the sealing bolt that extends to refrigerating chamber, left side and right side at inner bag are symmetrically arranged with refrigerating plant, between the top of inner bag, bottom, front side and rear side and housing, are provided with heat-insulation layer;
Above-mentioned refrigerating plant be between the cold effect surface of semiconductor chilling plate and inner bag, be filled with heat insulating mattress, fuel factor face is provided with radiator, between semiconductor chilling plate and heat insulating mattress, by extending to the conduction cooling post of inner bag, be connected, the radiating end both sides of radiator are provided with Air Blast fan and extractor fan; Outer surface at semiconductor chilling plate is coated with heat-conducting silicone grease layer.
On above-mentioned housing, be processed with louvered air-out window with Air Blast fan, position that extractor fan is corresponding
The end of above-mentioned radiator embeds in housing, connects as one structure with casing.
Above-mentioned radiator is copper fin radiator, on each fin, is processed with groove, and fin thickness is 0.5mm, and the distance between a fin and an adjacent fin is 2.0mm.
Above-mentioned semiconductor chilling plate is three level semiconductor cooling pieces.
Above-mentioned sealing bolt is hollow bolt, is provided with digital display probe-type thermometer and lower digital display probe-type thermometer on hollow bolt, and upper digital display probe-type thermometer extends to the top of refrigerating chamber, and lower digital display probe-type thermometer extends to the bottom of refrigerating chamber.
The left and right sidewall of above-mentioned housing is copper plate, and top, bottom and forward and backward sidewall are polyvinyl chloride plastic flitch.
Micro semiconductor refrigerating plant body structure of the present utility model, by the left side at housing and right side, be symmetrical arranged by semiconductor chilling plate, radiator, heat insulating mattress, heat-conducting silicone grease layer, the refrigeration radiating mechanism that conduction cooling post and Air Blast fan and extractor fan etc. form, and the end of radiator embeds in housing, design with becoming one of housing, between the fin of radiator, spacing is dwindled, profile optimization, greatly improved the heat dispersion of housing, guarantee good refrigeration effect, reduced refrigeration power consumption, greatly improve the quality of freeze-drying prods, after the utility model steady operation, power consumption is about 70W left and right, by universal meter measuring current, be 2.40A, after about 10min, the temperature inside the box can reach-50 ℃ and stable, it is simple in structure, volume is little, cost is low, good heat dissipation effect, expanded the range of application of Miniature refrigerating device, expand its application.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment.
Fig. 2 is the structural representation of the sealing bolt 12 in Fig. 1.
Fig. 3 is the partial enlarged drawing of I in Fig. 1.
The specific embodiment
Now with embodiment, the technical solution of the utility model is further described by reference to the accompanying drawings, but the utility model is not limited only to following enforcement situation.
As shown in Figure 1, the micro semiconductor refrigerating plant body structure of the present embodiment is to be connected and composed by housing 1, heat-insulation layer 2, inner bag 3, semiconductor chilling plate 4, heat insulating mattress 5, radiator 6, extractor fan 7, Air Blast fan 8, bolt 9, conduction cooling post 10, heat-conducting silicone grease layer 11, sealing bolt 12, upper digital display probe-type thermometer 13 and lower digital display probe-type thermometer 14.
Housing 1 size of the present embodiment is 120mm (length) * 120mm (wide) * 162mm (height), the top of housing 1, bottom and front, it is that the PVC polyvinyl chloride plastic flitch of 5mm is made that rear wall all adopts thickness, left side wall and right side wall adopt copper coin to make, left, the two ends of right side wall respectively forward, rear wall extends, and projection cube structure is processed into in extended end, before, on rear wall, relevant position is processed as groove structure, by the embedded connected mode of projection and groove, make a left side, right side wall is respectively with front, rear wall connects as one structure, junction is used bolted again.On housing 1, carry control chip, attemperating unit, display and power connector etc., belong to refrigerating plant casing common in prior art, the present embodiment is processed with a circular window that picks and places at the top of housing 1, be convenient to access frozen material, a sealing bolt 12 is installed picking and placeing on window, is guaranteed the sealing of casing.The sealing bolt 12 of the present embodiment adopts columniform hollow nylon bolt structure, referring to Fig. 2, the diameter of hollow bolt is 20mm, top is provided with circular arc handle, screwing up while being convenient to access frozen material, digital display probe-type thermometer 13 and lower digital display probe-type thermometer 14 on being provided with on hollow bolt, for detection of cryogenic temperature, the top that upper digital display probe-type thermometer 13 and lower digital display probe-type thermometer 14 embed respectively on hollow bolt by hollow bolt connects to hollow bolt bottom.At housing 1 inner chamber middle part, it is the refrigerating chamber being surrounded by copper inner bag 3, refrigerating chamber space size is 40mm (length) * 40mm (wide) * 30mm (height), the lower end of upper digital display probe-type thermometer 13 extends to the top of refrigerating chamber, the lower end of lower digital display probe-type thermometer 14 extends to the bottom of refrigerating chamber, between front side, rear side and top, bottom and housing 1 sidewall of inner bag 3, it is heat-insulation layer 2, heat-insulation layer 2 adopt adiabatic good, lightweight, cementability by force, the solid-state polyurethane foam plastics of the 33mm that do not absorb water, to obtain good heat-insulating property.Left side and right side at housing 1 inner bag 3 are symmetrically arranged with refrigerating plant, this refrigerating plant is by semiconductor chilling plate 4, heat insulating mattress 5, radiator 6, conduction cooling post 10, Air Blast fan 8, extractor fan 7 and heat-conducting silicone grease layer 11 connect and compose, the semiconductor chilling plate 4 of the present embodiment is arranged on respectively Zuo Bi and the right wall outside of inner bag 3, this semiconductor chilling plate 4 is three level semiconductor cooling piece 4TEC3-23003, specification is 20mm * 30mm * 40mm, thickness is 10.8mm, be divided into interconnective first order cooling piece from bottom to top, second level cooling piece and third level cooling piece, wherein first order cooling piece and second level cooling piece, second level cooling piece and third level cooling piece thickness difference are 3.4mm, maximum voltage 12V, maximum current 3A, cold, fuel factor face maximum temperature difference is 102 ℃, the cold effect surface of three level semiconductor cooling pieces 4 is over against copper inner bag 3, space-filling between first order cooling piece and copper inner bag 3 has heat insulating mattress 5, for reducing the heat transmission of first order cooling piece and second level cooling piece, on four angles of heat insulating mattress 5, hollow conduction cooling post 10 is installed, one end of conduction cooling post 10 extends to copper inner bag 3, the other end extends on the surface of first order cooling piece, by conduction cooling post 10 conduction cooling that freezes, referring to Fig. 3, in order further to strengthen heat-conducting effect, on the outer surface of three level semiconductor cooling pieces 4, be coated with heat-conducting silicone grease layer 11, fuel factor face one side at three level semiconductor cooling pieces 4 is provided with copper fin radiator 6, in order to improve radiating effect, on each fin of radiator 6, be processed with groove, the thickness of each fin is 0.5mm, spacing between a fin and an adjacent fin is 2.0mm, the end of radiator 6 embeds in housing 1, connect as one with housing 1, be conducive to heat radiation, also with nylon bolt 9, heat insulating mattress 5 is fixed on radiator simultaneously.In the radiating end both sides of radiator 6, Air Blast fan 8 and extractor fan 7 are installed respectively, Air Blast fan 8 is consistent with the wind direction of extractor fan 7, and Air Blast fan 8 is to radiator 6 air-supply, and 7 pairs of radiator 6 exhausting of extractor fan reach the effect of radiator 6 quick heat radiatings.In order to strengthen heat radiation, the position over against Air Blast fan 8 and extractor fan 7 on housing 1 is processed with louvered air-out window.
Claims (7)
1. a micro semiconductor refrigerating plant body structure, comprise housing (1), in housing (1), middle part surrounds refrigerating chamber by inner bag (3), it is characterized in that: at the top of housing (1), be processed with and pick and place window, pick and place and on window, be provided with the sealing bolt (12) that extends to refrigerating chamber, left side and right side at inner bag (3) are symmetrically arranged with refrigerating plant, between top, bottom, front side and the rear side of inner bag (3) and housing (1), are provided with heat-insulation layer (2);
Above-mentioned refrigerating plant be between the cold effect surface of semiconductor chilling plate (4) and inner bag (3), be filled with heat insulating mattress (5), fuel factor face is provided with radiator (6), between semiconductor chilling plate (4) and heat insulating mattress (5), by extending to the conduction cooling post (10) of inner bag (3), be connected, the radiating end both sides of radiator (6) are provided with Air Blast fan (8) and extractor fan (7); Outer surface at semiconductor chilling plate (4) is coated with heat-conducting silicone grease layer (11).
2. micro semiconductor refrigerating plant body structure according to claim 1, is characterized in that: described housing (1) is upper is processed with louvered air-out window with Air Blast fan (8), position that extractor fan (7) is corresponding.
3. micro semiconductor refrigerating plant body structure according to claim 1, is characterized in that: the end of described radiator (6) embeds in housing (1), connects as one structure with casing.
4. according to the micro semiconductor refrigerating plant body structure described in claim 1 or 3, it is characterized in that: described radiator (6) is copper fin radiator, on each fin, be processed with groove, fin thickness is 0.5mm, and the distance between a fin and an adjacent fin is 2.0mm.
5. micro semiconductor refrigerating plant body structure according to claim 1, is characterized in that: described semiconductor chilling plate (4) is three level semiconductor cooling pieces.
6. micro semiconductor refrigerating plant body structure according to claim 1, it is characterized in that: described sealing bolt (12) is hollow bolt, digital display probe-type thermometer (13) and lower digital display probe-type thermometer (14) on being provided with on hollow bolt, upper digital display probe-type thermometer (13) extends to the top of refrigerating chamber, and lower digital display probe-type thermometer (14) extends to the bottom of refrigerating chamber.
7. according to the micro semiconductor refrigerating plant body structure described in claim 1 or 2 or 3 or 6, it is characterized in that: the left and right sidewall of described housing (1) is copper plate, top, bottom and forward and backward sidewall are polyvinyl chloride plastic flitch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320523292.8U CN203464534U (en) | 2013-08-26 | 2013-08-26 | Box structure with miniature semi-conductor refrigerating devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320523292.8U CN203464534U (en) | 2013-08-26 | 2013-08-26 | Box structure with miniature semi-conductor refrigerating devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203464534U true CN203464534U (en) | 2014-03-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320523292.8U Expired - Fee Related CN203464534U (en) | 2013-08-26 | 2013-08-26 | Box structure with miniature semi-conductor refrigerating devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203464534U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103999785A (en) * | 2014-03-28 | 2014-08-27 | 浙江中医药大学 | Novel mice metabolism cage |
| CN109668377A (en) * | 2017-10-16 | 2019-04-23 | 佛山市顺德区美的饮水机制造有限公司 | Electronic refrigerating container for water dispenser and the water dispenser with it |
| CN109668376A (en) * | 2017-10-16 | 2019-04-23 | 佛山市顺德区美的饮水机制造有限公司 | Electronic refrigerating container for water dispenser and the water dispenser with it |
-
2013
- 2013-08-26 CN CN201320523292.8U patent/CN203464534U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103999785A (en) * | 2014-03-28 | 2014-08-27 | 浙江中医药大学 | Novel mice metabolism cage |
| CN109668377A (en) * | 2017-10-16 | 2019-04-23 | 佛山市顺德区美的饮水机制造有限公司 | Electronic refrigerating container for water dispenser and the water dispenser with it |
| CN109668376A (en) * | 2017-10-16 | 2019-04-23 | 佛山市顺德区美的饮水机制造有限公司 | Electronic refrigerating container for water dispenser and the water dispenser with it |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140305 Termination date: 20160826 |