CN203454460U - Semiconductor refrigeration type large-power load simulator - Google Patents
Semiconductor refrigeration type large-power load simulator Download PDFInfo
- Publication number
- CN203454460U CN203454460U CN201320437335.0U CN201320437335U CN203454460U CN 203454460 U CN203454460 U CN 203454460U CN 201320437335 U CN201320437335 U CN 201320437335U CN 203454460 U CN203454460 U CN 203454460U
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- power load
- high power
- power
- load simulator
- semiconductor cooling
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Abstract
The utility model discloses a semiconductor refrigeration type large-power load simulator which comprises a plurality of semiconductor refrigerating devices, radiators, fans, a temperature control switch and a case. The semiconductor refrigerating devices form a set of large-power loads in a parallel connection mode or in a serial connection first and parallel connection second mode. Each large-power load is in parallel connection with one corresponding fan, then, connected with the temperature control switch in series and finally connected to a power end of a power socket. The radiators are arranged on the semiconductor refrigerating devices. The semiconductor refrigerating devices, the radiators and the fans are connected with the case through connectors. According to the semiconductor refrigeration type large-power load simulator, the technical problems that a traditional electrothermal large-power load is low in load efficiency, poor in safety, short in service life and the like are solved.
Description
Technical field
The utility model relates to a kind of electrical load analogue means.
Background technology
At present the implementation method of high power load generally adopts electrothermal method, its principle be with power resistor or resistance wire as load, electric current during by resistance wire electric energy be converted to heat energy and luminous energy consumes.This load realizes fairly simple, but has following shortcoming:
1, load efficiency is low, and high power load is designed with heavy radiator structure conventionally;
2, poor stability, load resistance is mainly to consume electric energy by heating, and the larger heat of power is more, and corresponding temperature also can be higher, so just has potential safety hazard, easily scalds operating personnel or cause fire;
3, the life-span short, heating element can be oxidized in time gradually, degradation, the time has been grown easy damage.
Summary of the invention
The purpose of this utility model is to provide a kind of Semi-conductor refrigerating high power load simulator, and to solve, the load efficiency that traditional electrothermal high power load exists is low, poor stability and the technical problem such as the life-span is short.
In order to realize foregoing invention object, the technical scheme that the utility model adopts is as follows:
A Semi-conductor refrigerating high power load simulator, it comprises semiconductor cooling device, radiator, blower fan, temperature detect switch (TDS) and cabinet; Described several semiconductor cooling devices form one group of high power load by parallel or the connected mode in parallel of first connecting again, and every group of high power load is connected with fan parallel-connection separately, then after being connected in series with temperature detect switch (TDS), is connected on the power end of supply socket; On described semiconductor cooling device, radiator is installed.
Described semiconductor cooling device, radiator and blower fan are connected with cabinet by connector.
The utility model has the advantages that both possessed the function of general power termination, solved again the deficiency of general power termination simultaneously.Semi-conductor refrigerating high power load simulator is determined casing structure form through overheated design of Simulation, semiconductor refrigerating technology and forced air convection heat conduction technology are combined, improved the power of load and reduced volume and weight, and having guaranteed the safe temperature scope of components and parts, the temperature of cabinet housing also guarantees in safe range simultaneously.During load simulator work, surface temperature is no more than 45 ℃, can not cause that personnel scald.Owing to having adopted semiconductor cooling device low as power device and operating temperature, so there is not oxidative phenomena, there is very long service life.
Accompanying drawing explanation
Fig. 1 is circuit theory diagrams of the present utility model.
Fig. 2 is section of structure of the present utility model.
Fig. 3 is perspective view of the present utility model.
The specific embodiment
Structure of the present utility model is referring to Fig. 1, a kind of Semi-conductor refrigerating high power load simulator, and it comprises semiconductor cooling device 1, radiator 5, blower fan 2, temperature detect switch (TDS) 3 and cabinet; Described several semiconductor cooling devices 1 form one group of high power load by parallel or the connected mode in parallel of first connecting again, and every group of high power load is connected in parallel with blower fan 2 separately, then after being connected in series with temperature detect switch (TDS) 3, is connected on the power end of supply socket 4.Referring to Fig. 2,3, on described semiconductor cooling device 1, radiator 5 is installed.Described semiconductor cooling device 1, radiator 5 and blower fan 2 are connected with cabinet by connector.
The utility model primary structure has partly been used aluminum alloy materials as radiator, and heater element and radiator contact portion all scribble conduction material, so pyroconductivity is high, in use can conduct fast heat.When load simulator energising work, electric current flows through semiconductor cooling device hot transport phenomenon occurs, a surface temperature of device declines and the rising of another side temperature, the heat of heating face distributes by the outside T-Ring of radiator border, under the effect of chill surface, make again the temperature of surrounding environment reduce simultaneously, part cold air and heat are cancelled out each other, and blower fan produces mobile air and strengthens radiating efficiency.Based on above-mentioned principle, both improved the efficiency of load, reduced to a great extent again caloric value.
Claims (2)
1. a Semi-conductor refrigerating high power load simulator, is characterized in that, it comprises semiconductor cooling device, radiator, blower fan, temperature detect switch (TDS) and cabinet; Described several semiconductor cooling devices form one group of high power load by parallel or the connected mode in parallel of first connecting again, and every group of high power load is connected with fan parallel-connection separately, then after being connected in series with temperature detect switch (TDS), is connected on the power end of supply socket; On described semiconductor cooling device, radiator is installed.
2. a kind of Semi-conductor refrigerating high power load simulator according to claim 1, is characterized in that, described semiconductor cooling device, temperature detect switch (TDS), radiator and blower fan are connected with cabinet by connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320437335.0U CN203454460U (en) | 2013-07-22 | 2013-07-22 | Semiconductor refrigeration type large-power load simulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320437335.0U CN203454460U (en) | 2013-07-22 | 2013-07-22 | Semiconductor refrigeration type large-power load simulator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203454460U true CN203454460U (en) | 2014-02-26 |
Family
ID=50134328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320437335.0U Expired - Fee Related CN203454460U (en) | 2013-07-22 | 2013-07-22 | Semiconductor refrigeration type large-power load simulator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203454460U (en) |
-
2013
- 2013-07-22 CN CN201320437335.0U patent/CN203454460U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |