CN203446108U - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN203446108U CN203446108U CN201320497268.1U CN201320497268U CN203446108U CN 203446108 U CN203446108 U CN 203446108U CN 201320497268 U CN201320497268 U CN 201320497268U CN 203446108 U CN203446108 U CN 203446108U
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- circuit board
- flexible circuit
- kink
- pad
- cabling
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Abstract
The utility model discloses a flexible circuit board. The flexible circuit board comprises a substrate and an electronic element mounted on the substrate and provided with pins. The substrate is provided with pads connected onto the pins of the electronic element, through holes used for electrical connection among all layers of the flexible circuit board, and wires used for electrically connecting the pads and the through holes. Each of the wires comprises a first bending part lead out from the corresponding pad and a first connecting part connecting the first bending part and the corresponding through hole. The beneficial effects of implementation of the utility model are that circular arc-shaped lines are formed near the pads of the flexible circuit board and the circular arc-shaped lines on the whole flexible circuit board can bear force uniformly, so that the pads on the flexible circuit board are prevented from cracking due to concentration of stress when a liquid crystal display module is torn by external force, and particularly, the pads can be effectively prevented from cracking due to external stress when the width of the flexible circuit board is extremely small.
Description
Technical field
The utility model relates to flexible circuit board wiring technique field, more particularly, relates to a kind of flexible circuit board that is applied in small-medium size liquid crystal display module.
Background technology
Flexible circuit board is widely used because it has pliable and tough frivolous characteristic, and for example, in small-medium size liquid crystal display module, flexible circuit board, as conducting medium, provides good electrical property, realizes the transmission of drive current between chip and display panels.
Exist in the market the cabling being connected with components and parts in small-medium size liquid crystal display module flexible circuit board mostly to adopt simple direct-pulling type, capacitor C 3, C4, C7, C9 and C16 in example flexible circuit board as shown in Figure 1.Fig. 2 is the concrete cabling schematic diagram of capacitor C 3 in Fig. 1, C4, C7, C9 and capacitor C 16, is wherein not difficult to find out, the pin of all electronic components is all welded on corresponding pad in the mode of scolding tin, and the cabling of drawing from pad is vertical pulling mode cabling.
According to the simple direct-pulling type cabling of tradition, to the cabling of some crucial components and parts signals, there is very large risk in flexible circuit board, along with the ultrathin of liquid crystal display module is popular and cost requirement, the flexible circuit board overall width of liquid crystal display module becomes more and more narrow, flexible circuit board pastes double faced adhesive tape reflexed behind the liquid crystal display module back side, when being subject to external force and tearing, because stress is concentrated the pad cracking that easily causes flexible circuit board, therefore can cause that liquid crystal display module is functional bad.
Utility model content
The technical problems to be solved in the utility model is, the cabling of drawing from pad in the above-mentioned traditional flexible circuit board for prior art is vertical pulling mode cabling, existence is subject to external force while tearing, and stress is concentrated the defect that easily causes flexible circuit board pad cracking, and a kind of flexible circuit board is provided.
The utility model solves the technical scheme that its technical problem adopts: a kind of flexible circuit board is provided, described flexible circuit board comprises substrate and is arranged on the electronic component with pin on described substrate, on described substrate, be provided with the pad on the pin that is connected to described electronic component, for the via hole in each interlayer foundation electrical connection of flexible circuit board and for set up the cabling of electrical connection between described pad and via hole, wherein, described cabling comprises first kink of drawing from described pad and the first connecting portion that connects described the first kink, and described the first kink is the curved line with predetermined radius of curvature.
In above-mentioned flexible circuit board, described cabling also comprises the second kink being connected between described the first connecting portion and described via hole, and described the second kink is the curved line with predetermined radius of curvature.
In above-mentioned flexible circuit board, described the first kink has identical radius of curvature with described the second kink.
In above-mentioned flexible circuit board, described the first kink and described the second kink are all served as reasons and are had the broken line of 135 ° of angles through the curved line of chamfer machining formation.
In above-mentioned flexible circuit board, the line layer of described cabling and described flexible circuit board is positioned at same layer.
A kind of flexible circuit board is also provided, described flexible circuit board comprises substrate and is arranged on first electronic component with pin and the second electronic component on described substrate, on described substrate, be provided with the first pad on the pin that is connected to described the first electronic component, be connected to the second pad on the pin of described the second electronic component and for set up the cabling of electrical connection between described the first pad and described the second pad, wherein, described cabling comprises the 3rd kink of drawing from described the first pad, connect the 4th kink of described the second pad and be connected to described the 3rd kink and described the 4th kink between the second connecting portion, and described the 3rd kink and described the 4th kink are the curved line with predetermined radius of curvature.
In above-mentioned flexible circuit board, described the 3rd kink has identical radius of curvature with described the 4th kink.
In above-mentioned flexible circuit board, described the 3rd kink and described the 4th kink are all served as reasons and are had the broken line of 135 ° of angles through the curved line of chamfer machining formation.
In above-mentioned flexible circuit board, the line layer of described cabling and described flexible circuit board is positioned at same layer.
Implement flexible circuit board of the present utility model, there is following beneficial effect: in flexible circuit board by forming circular-arc circuit at pad place, in flexible circuit board because the average force of circular-arc circuit has avoided liquid crystal display module stress when being subject to external force and tearing to concentrate causing pad cracking in flexible circuit board, particularly for the pad cracking that can effectively avoid causing because of external stress in the very narrow situation of flexible circuit board width.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is the cabling schematic diagram in the existing flexible circuit board of the utility model;
Fig. 2 is the concrete cabling schematic diagram of capacitor C 3 in Fig. 1, C4, C7, C9 and capacitor C 16;
Fig. 3 is the cabling schematic diagram in the flexible circuit board of the utility model the first preferred embodiment;
Fig. 4 is the schematic diagram of the blank of flexible circuit board that preferred embodiment in Fig. 3 is provided;
Fig. 5 is the cabling schematic diagram in the flexible circuit board of the utility model the second preferred embodiment;
Fig. 6 is the schematic diagram of the blank of flexible circuit board that preferred embodiment in Fig. 5 is provided;
Cabling schematic diagram when Fig. 7 is the boost capacitor that in Fig. 5, electronic component is liquid crystal module in flexible circuit board;
Fig. 8 is the schematic diagram of the blank of the flexible circuit board to providing in Fig. 7;
Fig. 9 is the cabling schematic diagram in the flexible circuit board of the utility model the 3rd preferred embodiment;
Figure 10 is the schematic diagram of the blank of flexible circuit board that preferred embodiment in Fig. 9 is provided.
Embodiment
For technical characterictic of the present utility model, object and effect being had more clearly, understand, now contrast accompanying drawing and describe embodiment of the present utility model in detail.
Fig. 3 is the cabling schematic diagram in the flexible circuit board of the utility model the first preferred embodiment, flexible circuit board comprises substrate 10 and is arranged on the electronic component with pin on substrate 10, the cabling that is provided with pad on substrate and draws from pad, is also provided with the via hole for each interlayer electrical connection in flexible circuit board on substrate.The quantity of electronic component, pad and via hole is not restricted, can be for a plurality of, and the cabling of electronic component 200 of take is in the present embodiment example, as shown in Figure 3, electronic component 200 can be the conventional electronic components such as resistance or electric capacity.Two pins of electronic component 200 are welded on two corresponding pads in scolding tin mode respectively, pad can be square or circular, be square in the present embodiment, existing cabling of take between pad 201 and via hole 202 is example, and another pad also has same cabling with corresponding via hole.Cabling between pad 201 and via hole 202 comprises first kink 203 with certain curvature radius of drawing from pad 201 and is connected to the first connecting portion 204 between the first kink 203 and via hole 202.Wherein, the first kink 203 is curved line, finally has at pad 201 places and forms a circular-arc circuit.Formed circular-arc circuit can avoid stress concentration at and in flexible circuit board, cause pad cracking, and particularly, in the extremely narrow situation of flexible circuit board width, this kind of Wiring structure can maximum possible be avoided causing pad cracking because of external stress.
Fig. 4 is the schematic diagram of the blank of flexible circuit board that preferred embodiment in Fig. 3 is provided, the curved line that the first kink 203 in Fig. 3 is served as reasons and had the broken line process chamfer machining of 135 ° of angles and form, its forming process is: at pad 201 places first with vertical direction oblique angle at 45 ° cabling, form the straightway a1 drawing from pad 201 and the straightway a2 that is connected via hole 202 as shown in Figure 4, straightway a1 becomes 135 ° of angles to be connected with straightway a2, on straight line a2, select any point, on straight line a1, select with the point being connected with pad 201 and carry out chamfering with certain radius of curvature, its radius of curvature can be set arbitrarily, just formed the kink 203 in Fig. 3.Wherein, straightway a1 length is at least 0.2mm, makes the transition that the circuit at pad 201 places can be level and smooth when carrying out chamfering.
Fig. 5 is the cabling schematic diagram on the flexible circuitry of the utility model the second preferred embodiment, flexible circuit board comprises substrate 10 and is arranged on the electronic component with pin on substrate 10, the cabling that is provided with pad on substrate and draws from pad, is also provided with the via hole for each interlayer electrical connection in flexible circuit board on substrate.The quantity of electronic component, pad and via hole is not restricted, can be for a plurality of.The cabling of electronic component 200 of still take is in the present embodiment example, and as shown in Figure 5, electronic component 200 can be the conventional electronic components such as resistance or electric capacity.Two pins of electronic component 200 are welded on two corresponding pads in scolding tin mode respectively, pad can be square or circular, be circular in the present embodiment, existing cabling of still take between pad 201 and via hole 202 is example, and another pad also has same cabling with corresponding via hole.Connecting pad 201 and the cabling of via hole 202 comprises first kink 203 of drawing from pad 201, is connected the connecting portion of the first kink 203 and is connected to the second kink 205 between the first connecting portion 204 and via hole 202.If pad 201 is shorter to the cabling between via hole 202, connecting portion 204 can be set, two kinks are only set.Wherein, kink 203 and kink 205 are curved line, finally at pad 201 places and via hole 202 places, form circular-arc circuit.
Fig. 6 is the schematic diagram of the blank of flexible circuit board that preferred embodiment in Fig. 5 is provided, the first kink 203 in Fig. 5 and the second kink 205 are all served as reasons and are had the broken line process chamfer machining formation of 135 ° of angles, its forming process is: twice of the cabling of drawing from pad 201 is along laying with the direction at vertical direction oblique angle at 45 °, form the straightway b1 of connection pad 201 as shown in Figure 6, the straightway b3 that connects via hole 202 and one end and connect straightway b1, the other end connects the straightway b2 of straightway b3.Wherein, straightway b1 becomes 135 ° of angles with straightway b2, straightway b2 becomes 135 ° of angles with straightway b3, the point of selecting to be again connected with pad 201 on straightway b1, on straightway b2, select any point to carry out chamfering with certain radius of curvature, and again on straightway b2, select any point, on straightway b3, select the point being connected with via hole 202 to carry out chamfering with certain radius of curvature, its radius of curvature can be set arbitrarily, finally forms first kink 203 with certain curvature radius and the second kink 205 shown in Fig. 5.Wherein, the radius of curvature of the first kink 203 and the second kink 205 can be identical, also can be not identical.In the length of Fig. 6 cathetus section b1 and the length of straightway b3, be all at least 0.2mm, make the transition that circuit at pad and via hole place can be level and smooth.
Fig. 7 is that in Fig. 5, electronic component is liquid crystal module cabling schematic diagram in flexible circuit board while working necessary boost capacitor, Fig. 8 is the schematic diagram of the blank in the flexible circuit board to providing in Fig. 7, flexible circuit board comprises substrate 10 and is arranged on capacitor C 18, capacitor C 19 and the capacitor C 20 on substrate 10, the cabling that substrate is provided with pad and draws from pad, is also provided with the via hole for each interlayer electrical connection in flexible circuit board on substrate.Capacitor C 18, capacitor C 19 and capacitor C 20 are the liquid crystal display module necessary boost capacitors that work, the equal Yi Han of the pin Xi mode of capacitor C 18, capacitor C 19 and capacitor C 20 is welded on corresponding pad, wherein, the cabling between each pad and corresponding via hole is all by the cabling mode cabling in Fig. 5 and Fig. 6.
Fig. 9 is the cabling schematic diagram in the flexible circuit board of the utility model the 3rd preferred embodiment, flexible circuit board comprises substrate 10 and is arranged on first electronic component with pin and the second electronic component on substrate 10, is also provided with the first pad on the pin that is connected to the first electronic component and is connected to the second pad on the pin of the second electronic component on substrate 10.The first electronic component is that resistance R 21, the second electronic components are capacitor C 21 in the present embodiment.Wherein, the filter circuit cabling that resistance R 21 and capacitor C 21 forms is the cabling that pass Key signal that liquid crystal display module works required must pass through as Reset reset signal.Therefore, resistance R 21 and capacitor C 21 are the crucial electronic components in the flexible circuit board of liquid crystal display module.Two pins of resistance R 21 and two pins of capacitor C 21 are welded on four corresponding pads in the mode of scolding tin respectively, the cabling of now take between the first pad 401 and the second pad 402 is example, be the cabling between pad and pad, connect the first pad 401 and the cabling of the second pad 402 comprise the 3rd kink 403 of drawing from the first pad 401, be connected the 4th kink 405 of the second pad 402 and be connected to the 3rd kink 403 and the 4th kink 405 between the second connecting portion 404.If the cabling between the first pad 401 to second pads 402 is shorter, the 4th connecting portion 404 can be set, two kinks are only set.Wherein, the 3rd kink 403 and the 4th kink 405 are curved line, finally at the second pad 401 places and the second pad 402 places, all form circular-arc circuit.
Figure 10 is the schematic diagram of the blank of flexible circuit board that preferred embodiment in Fig. 9 is provided, the 3rd kink 403 in Fig. 9 and the 4th kink 405 are all served as reasons and are had the broken line process chamfer machining formation of 135 ° of angles, its forming process is: twice of the cabling of drawing from the first pad 401 is along laying with the direction at vertical direction oblique angle at 45 °, straightway c1, the straightway c3 that connects the second pad 402 and one end of forming connection the second pad 401 as shown in figure 10 connect straightway c1, and the other end connects the straightway c2 of straightway c3.Wherein, straightway c1 becomes 135 ° of angles with straightway c2, straightway c2 becomes 135 ° of angles with straightway c3, on straightway c1, select again the point being connected with the first pad 401, on straightway c2, select any point to carry out chamfering with certain radius of curvature, and again on straightway c2, select any point, on straightway c3, select the point being connected with the second pad 402 to carry out chamfering with certain radius of curvature, its radius of curvature can be set arbitrarily, the 3rd kink 403 with certain curvature radius and the 4th kink 405 shown in final formation Fig. 9, at the first pad 401 places and the second pad 402 places, form circular-arc circuit.Wherein, the radius of curvature of the 3rd kink 403 and the 4th kink 405 can be identical, also can be not identical.In the length of Figure 10 cathetus section c1 and the length of straightway c3, be all at least 0.2mm, making can excess smoothness at the circuit at the first pad 401 and the second pad 402 places.While carrying out cabling between two pads, as long as meet at two pad places respectively with vertical direction oblique angle at 45 ° cabling and at the formed broken line by thering are 135 ° of angles, on two straightways, select respectively at 2 and carry out chamfer machining with certain radius of curvature, finally at two pad places, form circular-arc circuit.In the present embodiment, on substrate 10, be also provided with the via hole for each interlayer electrical connection of flexible circuit board, wherein, cabling between the second pad 402 and via hole 406 carries out cabling according to the cabling mode in Fig. 3 and Fig. 4, and the cabling between pad 407 and via hole 408 carries out cabling according to the cabling mode in Fig. 5 and Fig. 6.
In addition, cabling between pad and pad, pad and via hole also can be repeatedly along laying with the direction at vertical direction oblique angle at 45 °, form a plurality of 135 ° of angles and carry out again chamfering, the circular-arc circuit of final formation, as the cabling between pad in Figure 10 409 and via hole 410, as long as meet at pad 409 places' kinks of formation, be circular-arc circuit.Further, except adopting 45 ° of oblique angle cablings to carry out chamfering again, necessary components and parts cabling that liquid crystal display module is worked guarantees excess smoothness, final formation outside circular-arc circuit, can also to other components and parts in liquid crystal display module flexible circuit board, adopt above-mentioned same method to carry out cabling as required, as long as meet at pad place, form circular-arc circuit, thereby could avoid the concentrated pad cracking causing in flexible circuit board of stress because of the circular-arc circuit average force in flexible circuit board like this.All cablings are all positioned at same layer with the line layer of flexible circuit board in all embodiments.
Even by above-mentioned cabling mode liquid crystal display module flexible circuit board narrow hour of flexible circuit board width, external stress acts in flexible circuit board, circular arc circuit meeting average force in whole flexible circuit board, therefore can avoid the stress of traditional simple vertical pulling circuit concentrate and produce the pad cracking in flexible circuit board, strengthen the reliability of flexible circuit board.
By reference to the accompanying drawings embodiment of the present utility model is described above; but the utility model is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; rather than restrictive; those of ordinary skill in the art is under enlightenment of the present utility model; not departing from the scope situation that the utility model aim and claim protect, also can make a lot of forms, within these all belong to protection of the present utility model.
Claims (9)
1. a flexible circuit board, it is characterized in that, described flexible circuit board comprises substrate and is arranged on the electronic component with pin on described substrate, on described substrate, be provided with the pad on the pin that is connected to described electronic component, for the via hole in each interlayer foundation electrical connection of flexible circuit board and for set up the cabling of electrical connection between described pad and via hole, wherein, described cabling comprises first kink of drawing from described pad and the first connecting portion that connects described the first kink, and described the first kink is the curved line with predetermined radius of curvature.
2. flexible circuit board according to claim 1, is characterized in that, described cabling also comprises the second kink being connected between described the first connecting portion and described via hole, and described the second kink is the curved line with predetermined radius of curvature.
3. flexible circuit board according to claim 2, is characterized in that, described the first kink has identical radius of curvature with described the second kink.
4. flexible circuit board according to claim 3, is characterized in that, described the first kink and described the second kink are all served as reasons and had the broken line of 135 ° of angles through the curved line of chamfer machining formation.
5. flexible circuit board according to claim 3, is characterized in that, the line layer of described cabling and described flexible circuit board is positioned at same layer.
6. a flexible circuit board, it is characterized in that, described flexible circuit board comprises substrate and is arranged on first electronic component with pin and the second electronic component on described substrate, on described substrate, be provided with the first pad on the pin that is connected to described the first electronic component, be connected to the second pad on the pin of described the second electronic component and for set up the cabling of electrical connection between described the first pad and described the second pad, wherein, described cabling comprises the 3rd kink of drawing from described the first pad, connect the 4th kink of described the second pad and be connected to described the 3rd kink and described the 4th kink between the second connecting portion, and described the 3rd kink and described the 4th kink are the curved line with predetermined radius of curvature.
7. flexible circuit board according to claim 6, is characterized in that, described the 3rd kink has identical radius of curvature with described the 4th kink.
8. flexible circuit board according to claim 6, is characterized in that, described the 3rd kink and described the 4th kink are all served as reasons and had the broken line of 135 ° of angles through the curved line of chamfer machining formation.
9. flexible circuit board according to claim 6, is characterized in that, the line layer of described cabling and described flexible circuit board is positioned at same layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320497268.1U CN203446108U (en) | 2013-08-14 | 2013-08-14 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320497268.1U CN203446108U (en) | 2013-08-14 | 2013-08-14 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203446108U true CN203446108U (en) | 2014-02-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320497268.1U Expired - Fee Related CN203446108U (en) | 2013-08-14 | 2013-08-14 | Flexible circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN203446108U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142349A (en) * | 2015-10-19 | 2015-12-09 | 厦门利德宝电子科技有限公司 | Circuit board capable of being assembled stereoscopically and making method thereof |
| CN107241854A (en) * | 2017-07-31 | 2017-10-10 | 武汉光迅科技股份有限公司 | A kind of flexible printed circuit board resistant to bending and preparation method |
| CN114641151A (en) * | 2022-05-19 | 2022-06-17 | 广东省新一代通信与网络创新研究院 | Manufacturing method of base station radio frequency circuit based on PCB castle board |
-
2013
- 2013-08-14 CN CN201320497268.1U patent/CN203446108U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142349A (en) * | 2015-10-19 | 2015-12-09 | 厦门利德宝电子科技有限公司 | Circuit board capable of being assembled stereoscopically and making method thereof |
| CN105142349B (en) * | 2015-10-19 | 2019-03-12 | 厦门利德宝电子科技股份有限公司 | One kind can three-dimensional wiring harness plate and preparation method thereof |
| CN107241854A (en) * | 2017-07-31 | 2017-10-10 | 武汉光迅科技股份有限公司 | A kind of flexible printed circuit board resistant to bending and preparation method |
| CN114641151A (en) * | 2022-05-19 | 2022-06-17 | 广东省新一代通信与网络创新研究院 | Manufacturing method of base station radio frequency circuit based on PCB castle board |
| CN114641151B (en) * | 2022-05-19 | 2022-08-02 | 广东省新一代通信与网络创新研究院 | Manufacturing method of base station radio frequency circuit based on PCB castle plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140219 Termination date: 20170814 |
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| CF01 | Termination of patent right due to non-payment of annual fee |