CN203434987U - Structure of compatible single-chip light transmitting and receiving module - Google Patents
Structure of compatible single-chip light transmitting and receiving module Download PDFInfo
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- CN203434987U CN203434987U CN201320306628.5U CN201320306628U CN203434987U CN 203434987 U CN203434987 U CN 203434987U CN 201320306628 U CN201320306628 U CN 201320306628U CN 203434987 U CN203434987 U CN 203434987U
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Abstract
The utility model discloses a structure of a compatible single-chip light transmitting and receiving module. The structure is characterized in that the structure comprises a first communication module having a first communication end capable of communicating with an external memory, a second communication module having a second communication end capable of communicating with external equipment, and a control core having a DDM function; the control core is provided with a register, is connected with the first communication module and the second communication module and is further connected to a continuous-mode limiting amplifier capable of driving a light receiving sub module of GEPON and GPON specifications and an LD driver capable of driving a light transmitting sub module of GEPON and GPON specifications; the control core is further provided with a current output end which is multiplexed to output an editable current and monitor information of the light receiving sub module; and the first communication module, the second communication module, the control core, the limiting amplifier and the LD driver are located on a same chip. The single-chip integration scheme enables GPON and GEPON module schemes on a same PCB to be realized and has very good hardware compatibility.
Description
Technical field
The utility model relates to a kind of single-chip optical transceiver module for optical communication, specifically a kind of single-chip optical transceiver module with compatible GPON and GEPON two schemes.
Background technology
The Gigabit Passive Optical Network (GPON) of International Telecommunications Union (ITU) is advocated by Full-Services access network (FSAN) supporter of Europe and Asia Desk region-by-region, it comes from broadband P ON (BPON) and ATMPON standard based on asynchronous transfer mode (ATM), can effectively support Ethernet and IP traffic.The Ethernet PON (EPON) of IEEE is extensively favored in Japan and the U.S., and it uses local ethernet frame structure, generally can be upgraded to gigabit and 10,000,000,000 speed.
At present, can provide the specialized vendor of EPON acp chip to have 5-6 family's (system manufacturer that does not comprise autonomous Design chip), in the process of discussing in standard, just oneself starts design and the checking of chip in these manufacturers, therefore when 802.3ah standard is formally promulgated, they have released the chip that the second generation and standard are completely compatible mostly, can support rapidly the large scale deployment of EPON system.Recently, the chip manufacturer in China mainland and Taiwan Province also starts to have started EPON chip design project.The mainstream vendor of EPON module also transfers to Chinese Taiwan and continent from Japan and the U.S..Can provide now the manufacturer of EPON module to have 10-20 house.
Outside the GPON chip of ，Chu GPON equipment vendors autonomous Design, the chip manufacturer of rare specialty releases commercial GPON acp chip at present.The module of using on GPON equipment is all the module of special-purpose autonomous or collaborative development, does not also have the professional module manufacturer can sampling, let alone scale of mass production.GPON standard-required module index is supported three class ODN, but C class ODN is subject to the restriction of current optical module technical merit, is difficult to realize under economic cost.
Development along with the integration of three networks (broadcasting and television network, telecommunications network and the Internet), PON module also will be as emerged rapidly in large numbersBamboo shoots after a spring rain, building block technique level and the scheme space that also improves a lot, such as the chip in module, components and parts arranging density, the cost of module, the compatibility function of module etc.The problem of GPON module has a few days ago: 1. opto-electronic conversion core needs several chips (LA, LDD etc.) to realize, DDM function needs plug-in MCU or other DDM monitoring companion chip to realize, so the module of GPON chip on it, density of components are higher; Module cost is high.2. current, a module pcb board, can only be applied to GPON module or can only be for GEPON module.Fail to make full use of resource, raised module production cost.
Utility model content
The wasting of resources problem that incompatibility on hardware is brought in view of above-mentioned GPON and GEPON two schemes module, the utility model proposes a kind of structure of compatible type single-chip optical transceiver module, and its technical scheme is as follows:
A structure for compatible type single-chip optical transceiver module, it comprises:
First communication module, has the first communication ends that can communicate by letter with an external memory storage;
Second communication module, have can with the second communication end of external device communication; And
The control core with DDM function, this control core has register, be connected with second communication module with first communication module, be also connected in a limiting amplifier and a LD driver that can drive light emission secondary module of the driven light-receiving secondary module of continuous mode; This control core also has a current output terminal that monitors light-receiving secondary module information; This first communication module, second communication module, control core, limiting amplifier and LD driver are all positioned on same chip.
As the preferred person of the technical program, can aspect as follows, there is improvement:
In preferred embodiment, also comprise a supervision and temperature control module, this supervision and temperature control module are connected in described limiting amplifier, control core and LD driver simultaneously.
In preferred embodiment, also comprise that one is connected in the security module of this LD driver, this security module has the prompting end of output laser operating state and controls the Enable Pin of this LD driver.
In preferred embodiment, this first communication module is I
2the communication module of C interface.
In preferred embodiment, this second communication module is I
2the communication module of C interface.
In preferred embodiment, this chip is positioned on same pcb board with the GPON booster circuit that can be connected with this current output terminal with described external memory storage.In preferred embodiment, this GPON output circuit that boosts comprises described in a reception and can edit the current controling end of electric current, and can edit according to this bias voltage output that electric current is exported the APD bias voltage of described GPON standard.
The beneficial effect that the technical program is brought is:
1. the built-in curing DDM function of control core, therefore module is without connecing extra CPU or other DDM dedicated processes chips again, control core also has a multiplexing current output terminal IROP, and the multiplexing function of this current output terminal IROP can be edited electric current and monitor light-receiving secondary module information for being exported; First communication module, second communication module, control core, limiting amplifier and and LD driver be all positioned on same chip.The integrated scheme of this single-chip can be realized GPON and the GEPON module scheme on same pcb board, and few line is simply communicated with or is cut off, and between two schemes, switches fast, has good hardware compatibility.
2. the circuit of single-chip UX3328 scheme is to set up/cancel peripheral circuit for the mutual change of GPON and GEPON substantially, need the place of replacement change seldom, can be embodied directly on same PCB, make so module there is good hardware compatibility, be applicable to GPON and GEPON scheme, saved a large amount of costs, adaptability is good.
Accompanying drawing explanation
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail:
Fig. 1 is the modular structure figure of the utility model one embodiment;
Circuit diagram when Fig. 2 is the GEPON of applying to scheme embodiment illustrated in fig. 1;
Circuit diagram when Fig. 3 is the GPON of applying to scheme embodiment illustrated in fig. 1.
Embodiment
As shown in Figure 1 to Figure 3, the utility model one embodiment modular structure and apply to GEPON and practical circuit diagram during GPON two schemes.
Fig. 1 has shown a basic structure of this module, and first communication module 21 has the first communication ends that can communicate by letter with an external memory storage, and this first communication ends comprises SDA_E and SCL_E, is an I
2the communication module form of C interface; Second communication module 22, have can with the second communication end of external device communication, this second communication end comprises SDA and SCL, is also I
2the communication module form of C interface; Control core 30, this control core is connected with second communication module 22 with first communication module 21, has control bus and data/address bus between the two, has register, the storage during for computing in control core 30.Be connected with control core 30, also have limiting amplifier 10, LD driver 60 and supervision and temperature control module 40. wherein, limiting amplifier 10 is continuous mode person, LD driver is the laser driver that works in burst mode and continuous mode, also comprise that one is connected in the security module of this LD driver, in this scheme, security module 50 has the prompting end of output laser operating state and the Enable Pin TX_DISABLE that TX_FAULT controls this LD driver.
In the present embodiment, the built-in curing DDM function of control core 30, so module is without connecing extra CPU or other DDM dedicated processes chips again, then store by completing chip data in first communication module 21 and outside memory device EEPROM.Control core 30 also has a current output terminal IROP, this current output terminal IROP is a multiple user, its multiplexing function can be edited electric current and monitor light-receiving secondary module information for being exported, wherein, output can be edited when function of current is GPON scheme and be controlled APD booster circuit, while monitoring light-receiving secondary module information for GEPON scheme, light-receiving secondary module is monitored and is read.In the present embodiment, this first communication module 21, second communication module 22, control core 33, limiting amplifier and 10 and LD driver 60 be all positioned on same chip.Visible, the integrated scheme of this single-chip can be realized GPON and the GEPON module scheme on same pcb board, and few line is simply communicated with or is cut off, and between two schemes, switches fast, there is good hardware compatibility, saved the cost of optical transceiver module.
As shown in Figures 2 and 3, the GEPON/GPON three-in-one intelligent chip UX3328 that the present embodiment single-chip person is 155Mbps-2.5Gbps.This module radiating portion can provide modulated current can reach 80mA, and bias current reaches as high as 100mA, can be suitable for driving VCSEL in optical module, FP and Distributed Feedback Laser.By digital automated power, control (APC control), the compensation of temperature look-up table, in laser time limit in useful life and operating temperature range, can keep average light power constant stable with extinction ratio.A. this module also has the luminous indication TX_SD function of burst, meets the maintenance extinction ratio of the GPON requirement reduction luminous power function under constant.B. radiating portion also has low-power consumption sleep function.C. receiving unit has the programmable functions such as bandwidth, signal polarity, output amplitude, alarm polarity, and output has noise elimination function, wide received power detection range.Receiving unit has the sleep function of low-power consumption.D. built-in DA electric current output and look-up table thereof in module, can be for controlling the chip that boosts.E. in way, U2 and U4 represent optical device light receiving and transmitting submodule BOSA(ROSA, TOSA partly), for the input and output of light signal.
Visible in Fig. 3 and Fig. 4, under the present embodiment, for GPON and GEPON two schemes that difference is set is very little, first, GPON scheme has increased External memory equipment for GEPON scheme, comprise U1 and peripheral cell thereof, this External memory equipment is directly connected in UX3328 by the first communication ends SCL_E and SDA_E, second, ROSA(light-receiving secondary module) in GEPON scheme, there is monitoring pin MON, need to be connected in current output terminal IROP by a resistance R 21, two in GPON scheme, need to the plug into APD end of ROSA, so, R21 opens circuit in GPON scheme, and current output terminal IROP is connected in the GPON output circuit that boosts, this GPON output circuit that boosts comprises U4 and peripheral cell thereof, especially, current output terminal IROP is now connected in the current controling end MOUT of U4, UX3328 also has the CNTRL end that a DAO end is connected in U4 simultaneously, in the present embodiment, U4 adopts LT3482.GPON boosts the APD end of output circuit just as the APD diode biasing of ROSA in GPON scheme, is connected to the APD place of ROSA in Fig. 3.Visible, it is to set up/cancel peripheral circuit substantially that this circuit is changed the circuit of single-chip UX3328 scheme, need the place of replacement change seldom, can be embodied directly on same PCB, make so module there is good hardware compatibility, be applicable to GPON and GEPON scheme, saved a large amount of costs, adaptability is good.
The above, it is only the utility model preferred embodiment, therefore can not limit according to this scope that the utility model is implemented, the equivalence of doing according to the utility model the scope of the claims and description changes and modifies, and all should still belong in the scope that the utility model contains.
Claims (6)
1. a structure for compatible type single-chip optical transceiver module, is characterized in that: it comprises:
First communication module, has the first communication ends that can communicate by letter with an external memory storage;
Second communication module, have can with the second communication end of external device communication; And
The control core with DDM function, this control core has register, is connected with second communication module with first communication module, is also connected in a limiting amplifier and a LD driver that can drive light emission secondary module of the light-receiving secondary module of continuous mode; This control core also has a current output terminal that monitors light-receiving secondary module information; This first communication module, second communication module, control core, limiting amplifier and LD driver are all positioned on same chip.
2. a kind of structure of compatible type single-chip optical transceiver module according to claim 1, is characterized in that: also comprise a supervision and temperature control module, this supervision and temperature control module are connected in described limiting amplifier, control core and LD driver simultaneously.
3. a kind of structure of compatible type single-chip optical transceiver module according to claim 1, it is characterized in that: also comprise that one is connected in the security module of this LD driver, this security module has the prompting end of output laser operating state and controls the Enable Pin of this LD driver.
4. according to the structure of a kind of compatible type single-chip optical transceiver module described in claim 1 or 2 or 3, it is characterized in that: this first communication module is I
2the communication module of C interface.
5. a kind of structure of compatible type single-chip optical transceiver module according to claim 4, is characterized in that: this second communication module is I
2the communication module of C interface.
6. a kind of structure of compatible type single-chip optical transceiver module according to claim 5, is characterized in that: this chip is positioned on same pcb board with the GPON booster circuit that can be connected with this current output terminal with described external memory storage.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320306628.5U CN203434987U (en) | 2013-05-30 | 2013-05-30 | Structure of compatible single-chip light transmitting and receiving module |
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| CN201320306628.5U CN203434987U (en) | 2013-05-30 | 2013-05-30 | Structure of compatible single-chip light transmitting and receiving module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911427A (en) * | 2021-01-29 | 2021-06-04 | 烽火通信科技股份有限公司 | Passive optical network optical module, all-optical access network system and control method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911427A (en) * | 2021-01-29 | 2021-06-04 | 烽火通信科技股份有限公司 | Passive optical network optical module, all-optical access network system and control method |
| CN112911427B (en) * | 2021-01-29 | 2022-06-21 | 烽火通信科技股份有限公司 | Passive optical network optical module, all-optical access network system and control method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140212 Termination date: 20160530 |