CN203434633U - SVG power module based on heat pipe radiator - Google Patents
SVG power module based on heat pipe radiator Download PDFInfo
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- CN203434633U CN203434633U CN201320554590.3U CN201320554590U CN203434633U CN 203434633 U CN203434633 U CN 203434633U CN 201320554590 U CN201320554590 U CN 201320554590U CN 203434633 U CN203434633 U CN 203434633U
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- heat
- pipe radiator
- copper
- bridge unit
- housing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/10—Flexible AC transmission systems [FACTS]
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Abstract
The utility model discloses a SVG power module based on a heat pipe radiator. The module comprises a shell, an alternating current copper bar U, an alternating current copper bar V, a rectification inversion H bridge unit, a positive direct current busbar, a negative direct current busbar, direct current support capacitors, the heat pipe radiator, a temperature measurement chip and a driving board, wherein the alternating current copper bar U, the alternating current copper bar V, the rectification inversion H bridge unit, the positive direct current busbar, the negative direct current busbar, the direct current support capacitors, the heat pipe radiator, the temperature measurement chip and the driving board are arranged in the shell. The direct current support capacitors are uniformly arranged on a bottom of the shell. A binding post of each direct current support capacitor is connected to a lower portion terminal of the rectification inversion H bridge unit. An upper portion terminal of the rectification inversion H bridge unit is connected with the alternating current copper bar U and the alternating current copper bar V respectively. An upper portion of the shell is provided with a heat dissipation channel. The heat pipe radiator is installed in the heat dissipation channel. An IGBT of the rectification inversion H bridge unit and the temperature measurement chip are fixedly arranged on a substrate of the heat pipe radiator. The driving board is arranged in front of the IGBT. The structure of the module of the utility model is simple. Installation and maintenance are convenient. Heat dissipation performance is good and a degree of generalization is high. Series product design and production are convenient.
Description
Technical field
The utility model relates to power system reactive power compensation technical field, particularly a kind of power model being applied in SVG device.
Background technology
Network system needs electrical network to carry out reactive power compensation in running, and the power factor when improving operation of power networks reduces grid loss.Conventional reactive-load compensation equipment is dynamic reactive compensation device in recent years, is called for short SVG device.SVG device comprises control device and is connected to the main switch cabinet of electrical network bus, incoming line cabinet, startup cabinet and power cabinet in turn, in power cabinet, generally there are tens power models, power cabinet top is provided with blower fan, the air blast cooling air channel of power cabinet is positioned at power cabinet rear portion, the process of power model for carrying out reactive power compensation at SVG device, the instruction of sending according to control device is carried out reactive power compensation to electrical network, and blower fan carries out air blast cooling for the radiator on power cabinet power model.
Yet along with the continuous expansion of net capacity, the capacity of SVG device is also in continuous expansion, and common radiator can not meet the heat radiation needs of power model, therefore with the stronger heat-pipe radiator of exchange capability of heat, carrying out heat exchange will be more and more general.But heat-pipe radiator shape matching is large, if be arranged in power cabinet, will make the volume of power cabinet become large, installation is wasted time and energy, and safeguards also more inconvenient.
Utility model content
The utility model technical issues that need to address are to provide the power model that a kind of use heat-pipe radiator that facilitates installation and maintenance, small volume dispels the heat.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is:
SVG power model based on heat-pipe radiator, comprise housing and be arranged on the AC copper-line U in housing, AC copper-line V, commutation inversion H bridge unit, positive direct-current busbar, negative DC master row, DC support electric capacity, heat-pipe radiator, temperature survey chip and drive plate, the evenly distributed bottom that is arranged in housing of described DC support electric capacity, the binding post of DC support electric capacity is connected in the bottom terminals of commutation inversion H bridge unit in parallel by positive direct-current copper bar and negative direct current copper bar, the top terminals of commutation inversion H bridge unit respectively with AC copper-line U, AC copper-line V connects, AC copper-line U, the other end of AC copper-line V stretches out outside housing, described housing top the top that is positioned at DC support electric capacity are provided with the heat dissipation channel that runs through left and right sidewall, heat-pipe radiator is arranged in heat dissipation channel, the IGBT of commutation inversion H bridge unit and temperature survey chip are fixedly installed on the substrate of heat-pipe radiator, and drive plate is arranged on IGBT the place ahead by the insulation board being fixed on sidewall.
Improvement of the present utility model is: described housing adopts aluminizing zine plate bending and punching press to make, and on the surrounding sidewall of housing, is provided with some ventilating heat dissipating holes.
Further improvement of the utility model is: described positive direct-current busbar, negative DC master row are set up in parallel up and down, and the spacing between positive direct-current busbar, negative DC master row is to be filled with NMN insulating material between 2 ± 0.5mm and positive direct-current busbar, negative DC master row.
Further improvement of the utility model is: between described positive direct-current busbar and DC support electric capacity by copper shore supports and be connected.
Further improvement of the utility model is: described DC support electric capacity is provided with several, and the spacing between adjacent direct current Support Capacitor is 8~12mm.
Improvement of the present utility model is also: described temperature survey chip is arranged on heat-pipe radiator near one end of heat dissipation channel air outlet.
Owing to having adopted technique scheme, the technological progress that the utility model is obtained is:
The utility model is simple in structure, convenient for installation and maintenance, and heat dispersion is good, and generalization degree is high, is convenient to tandem product design and produces.Particularly for large capacity SVG product, can to the quantity of DC support electric capacity, carry out reasonable disposition according to its amount of capacity, because DC support electric capacity is all set up in parallel at housing bottom, so structure is comparatively compact, and weight focuses mostly in bottom, guaranteed the stability of power model.
Accompanying drawing explanation
Fig. 1 is the front view of the utility model when drive plate is not installed.
Fig. 2 is the stereogram of the utility model when drive plate is not installed.
Fig. 3 is the structural representation of the utility model enclosure interior.
Fig. 4 is that the utility model is installed the stereogram after drive plate.
Wherein: 1. AC copper-line U, 2. AC copper-line V, 3. commutation inversion H bridge unit, 4. positive direct-current busbar, 5. negative DC master row, 6. DC support electric capacity, 7. heat-pipe radiator, 8. temperature survey chip, 9. drive plate, 10. housing.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further details:
SVG power model based on heat-pipe radiator, comprise housing 10, in housing, be provided with AC copper-line U1, AC copper-line V2, commutation inversion H bridge unit, positive direct-current busbar 4, negative DC master row 5, DC support electric capacity 6, heat-pipe radiator 7, temperature survey chip 8 and drive plate 9, commutation inversion H bridge of the present utility model unit is provided with four IGBT, and the position relationship between each parts as shown in Figure 1 to Figure 3.
Housing of the present utility model adopts aluminizing zine plate bending and punching press to make, and on the surrounding sidewall of housing, is provided with some ventilating heat dissipating holes, is provided with the handle of being convenient to pull, as shown in Figure 2 and Figure 4 on the left and right sides sidewall of housing.
DC support electric capacity 6 is provided with several, the evenly distributed bottom that is arranged in housing 10, and the spacing between adjacent direct current Support Capacitor 6 is 8~12mm, so that DC support electric capacity carries out good heat radiation during operation.The binding post of DC support electric capacity 6 is connected in the bottom terminals of commutation inversion H bridge unit in parallel by positive direct-current busbar 4 and negative DC master row 5.Positive direct-current busbar 4, negative DC master row 5 are set up in parallel up and down, and the spacing between positive direct-current busbar 4, negative DC master row 5 is 2 ± 0.5mm, and between positive direct-current busbar 4, negative DC master row 5, are filled with NMN insulating material and isolate.For guaranteeing reliable connection the between positive direct-current busbar and DC support electric capacity, the copper pillar that connection reliability is higher is set between positive direct-current busbar 4 and DC support electric capacity 6.
The top terminals of commutation inversion H bridge unit are connected with AC copper-line U, AC copper-line V respectively, and the other end of AC copper-line U, AC copper-line V stretches out outside housing.
The top that housing top is positioned at DC support electric capacity 6 is provided with heat dissipation channel, and heat dissipation channel runs through the left and right sidewall of housing, and heat-pipe radiator 7 is arranged in heat dissipation channel, so that heat-pipe radiator dispels the heat outside housing.
Four IGBT and the temperature survey chip of commutation inversion H bridge unit are all fixedly installed on the substrate of heat-pipe radiator 7.Temperature survey chip, near one end of heat dissipation channel air outlet, for measuring heat pipe radiator base plate temperature, prevents that excess Temperature from damaging IGBT.
Drive plate 9 is for driving the IGBT of commutation inversion H bridge unit to move, and drive plate is placed on IGBT the place ahead by the insulation board being fixed on sidewall, to reduce cabling in housing.Structure after the utility model installation drive plate as shown in Figure 4.
Claims (6)
1. the SVG power model based on heat-pipe radiator, comprise housing (10) and be arranged on the AC copper-line U(1 in housing), AC copper-line V(2), commutation inversion H bridge unit (3), positive direct-current busbar (4), negative DC master row (5), DC support electric capacity (6), heat-pipe radiator (7), temperature survey chip (8) and drive plate (9), it is characterized in that: the evenly distributed bottom that is arranged in housing (10) of described DC support electric capacity (6), the binding post of DC support electric capacity (6) is connected in the bottom terminals of commutation inversion H bridge unit (3) in parallel by positive direct-current copper bar (4) and negative direct current copper bar (5), the top terminals of commutation inversion H bridge unit (3) respectively with AC copper-line U(1), AC copper-line V(2) connect, AC copper-line U(1), AC copper-line V(2) the other end stretches out outside housing, described housing top the top that is positioned at DC support electric capacity (6) are provided with the heat dissipation channel that runs through left and right sidewall, heat-pipe radiator (7) is arranged in heat dissipation channel, commutation inversion H bridge unit (3) and temperature survey chip (8) are fixedly installed on the substrate of heat-pipe radiator (7), and drive plate (9) is arranged on IGBT the place ahead by the insulation board being fixed on sidewall.
2. the SVG power model based on heat-pipe radiator according to claim 1, is characterized in that: described housing adopts aluminizing zine plate bending and punching press to make, and on the surrounding sidewall of housing, is provided with some ventilating heat dissipating holes.
3. the SVG power model based on heat-pipe radiator according to claim 1, it is characterized in that: described positive direct-current busbar (4), negative DC master row (5) are set up in parallel up and down, the spacing between positive direct-current busbar (4), negative DC master row (5) is to be filled with NMN insulating material between 2 ± 0.5mm and positive direct-current busbar (4), negative DC master row (5).
4. the SVG power model based on heat-pipe radiator according to claim 3, is characterized in that: between described positive direct-current busbar (4) and DC support electric capacity (6) by copper shore supports and be connected.
5. the SVG power model based on heat-pipe radiator according to claim 1, is characterized in that: described DC support electric capacity (6) is provided with several, and the spacing between adjacent direct current Support Capacitor (6) is 8~12mm.
6. the SVG power model based on heat-pipe radiator according to claim 1, is characterized in that: described temperature survey chip (8) is arranged on heat-pipe radiator (7) near one end of heat dissipation channel air outlet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320554590.3U CN203434633U (en) | 2013-09-06 | 2013-09-06 | SVG power module based on heat pipe radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320554590.3U CN203434633U (en) | 2013-09-06 | 2013-09-06 | SVG power module based on heat pipe radiator |
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CN203434633U true CN203434633U (en) | 2014-02-12 |
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CN201320554590.3U Expired - Lifetime CN203434633U (en) | 2013-09-06 | 2013-09-06 | SVG power module based on heat pipe radiator |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107104579A (en) * | 2017-06-08 | 2017-08-29 | 安徽华腾电气有限公司 | The power unit device of Large Copacity |
CN108123619A (en) * | 2016-11-30 | 2018-06-05 | 现代自动车株式会社 | For driving the inverter of the motor of vehicle |
CN109313985A (en) * | 2016-08-29 | 2019-02-05 | 宝马股份公司 | The capacitor assembly of cooling of electrode |
-
2013
- 2013-09-06 CN CN201320554590.3U patent/CN203434633U/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109313985A (en) * | 2016-08-29 | 2019-02-05 | 宝马股份公司 | The capacitor assembly of cooling of electrode |
US11404216B2 (en) | 2016-08-29 | 2022-08-02 | Bayerische Motoren Werke Aktiengesellschaft | Electrode cooled capacitor assembly |
CN108123619A (en) * | 2016-11-30 | 2018-06-05 | 现代自动车株式会社 | For driving the inverter of the motor of vehicle |
CN107104579A (en) * | 2017-06-08 | 2017-08-29 | 安徽华腾电气有限公司 | The power unit device of Large Copacity |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20140212 |