CN203421861U - Semiconductor refrigeration piece - Google Patents

Semiconductor refrigeration piece Download PDF

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Publication number
CN203421861U
CN203421861U CN201320447231.8U CN201320447231U CN203421861U CN 203421861 U CN203421861 U CN 203421861U CN 201320447231 U CN201320447231 U CN 201320447231U CN 203421861 U CN203421861 U CN 203421861U
Authority
CN
China
Prior art keywords
refrigeration
hole
conductive substrate
cooling component
refrigeration piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320447231.8U
Other languages
Chinese (zh)
Inventor
和俊莉
王丹
张文涛
陈磊
钱俊有
蔡水占
刘栓红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Hongchang Electronics Co Ltd
Original Assignee
Henan Hongchang Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan Hongchang Electronics Co Ltd filed Critical Henan Hongchang Electronics Co Ltd
Priority to CN201320447231.8U priority Critical patent/CN203421861U/en
Application granted granted Critical
Publication of CN203421861U publication Critical patent/CN203421861U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a part of a semiconductor, in particular to a semiconductor refrigeration piece. The semiconductor refrigeration piece comprises a refrigeration piece body and is characterized in that a refrigeration hole is formed in the middle of the refrigeration piece, conduction substrates connected with the refrigeration hole are respectively arranged on the front face and the bottom face of the the refrigeration sheet body, refrigeration parts are arranged between the conduction substrates and are provided with inner layers and outer layers, the inner layers are connected to the side wall of the refrigeration hole, and the outer layers are arranged on the conduction substrates. The semiconductor refrigeration piece of the structure has the advantages of being good in refrigeration effect, high in performance, and convenient to use. Moreover, the refrigeration parts can not be burnt down easily.

Description

Conductor refrigeration sheet
Technical field
The utility model relates to a kind of semiconductor electrical equipment parts, relates in particular to a kind of conductor refrigeration sheet.
Background technology
Existing conductor refrigeration sheet is square shape, and conductor refrigeration sheet has conductive sheet up and down, and centre is provided with the structure of cooling component, and such conductor refrigeration sheet exists poor refrigerating efficiency, the shortcoming that cooling component easily burns out.
Summary of the invention
The purpose of this utility model, for above-mentioned existing shortcoming, provides a kind of good refrigeration effect that has, high-performance, and cooling component is easy burn-out not, a kind of conductor refrigeration sheet easy to use.
The technical solution of the utility model is achieved in that conductor refrigeration sheet, comprise refrigerating sheet body, it is characterized in that: in the middle of described refrigerating sheet body, be provided with refrigeration hole, on refrigerating sheet body, have the conductive substrate that connects refrigeration hole, in the middle of described conductive substrate, be provided with cooling component, described cooling component is provided with internal layer and skin, and described internal layer is connected on the sidewall of refrigeration hole, and described skin is arranged in conductive substrate.
Further say: further say: described conductive substrate is provided with for connecting the wire of cooling component.
The beneficial effects of the utility model are: the conductor refrigeration sheet of this spline structure has good refrigeration effect, high-performance, and cooling component is easy burn-out not, advantage easy to use.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Wherein, 1, refrigerating sheet body 2, refrigeration hole 3, conductive substrate 4, cooling component 5, internal layer 6, skin 7, wire.
The specific embodiment
Below in conjunction with accompanying drawing, the utility model will be further described.
As shown in Figure 1: conductor refrigeration sheet, comprise refrigerating sheet body 1, it is characterized in that: in the middle of described refrigerating sheet body 1, be provided with refrigeration hole 2, on refrigerating sheet body 1, have the conductive substrate 3 that connects refrigeration hole 2, in the middle of described conductive substrate 3, be provided with cooling component 4, described cooling component 4 is provided with internal layer 5 and skin 6, and described internal layer 5 is connected on 2 sidewalls of refrigeration hole, and described skin 6 is arranged in conductive substrate 3.
Further say: described conductive substrate 3 is provided with for connecting the wire 7 of cooling component 4.
The conductor refrigeration sheet of this spline structure has good refrigeration effect, high-performance, and cooling component is easy burn-out not, advantage easy to use.

Claims (2)

1. conductor refrigeration sheet, comprise refrigerating sheet body, it is characterized in that: in the middle of described refrigerating sheet body, be provided with refrigeration hole, on refrigerating sheet body, have the conductive substrate that connects refrigeration hole, in the middle of described conductive substrate, be provided with cooling component, described cooling component is provided with internal layer and skin, and described internal layer is connected on the sidewall of refrigeration hole, and described skin is arranged in conductive substrate.
2. conductor refrigeration sheet according to claim 1, is characterized in that: described conductive substrate is provided with for connecting the wire of cooling component.
CN201320447231.8U 2013-07-26 2013-07-26 Semiconductor refrigeration piece Expired - Fee Related CN203421861U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320447231.8U CN203421861U (en) 2013-07-26 2013-07-26 Semiconductor refrigeration piece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320447231.8U CN203421861U (en) 2013-07-26 2013-07-26 Semiconductor refrigeration piece

Publications (1)

Publication Number Publication Date
CN203421861U true CN203421861U (en) 2014-02-05

Family

ID=50020960

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320447231.8U Expired - Fee Related CN203421861U (en) 2013-07-26 2013-07-26 Semiconductor refrigeration piece

Country Status (1)

Country Link
CN (1) CN203421861U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140205

Termination date: 20140726

EXPY Termination of patent right or utility model