CN203411473U

CN203411473U - Coating cutter bit used for manufacturing OGS structure

Info

Publication number: CN203411473U
Application number: CN201320465144.5U
Authority: CN
Inventors: 沈励; 许沭华; 胡里程
Original assignee: Wuhu Token Sciences Co Ltd
Current assignee: Wuhu Token Sciences Co Ltd
Priority date: 2013-07-31
Filing date: 2013-07-31
Publication date: 2014-01-29
Anticipated expiration: 2023-07-31

Abstract

The utility model discloses a coating cutter bit used for manufacturing an OGS (one glass solution) structure. The coating cutter bit comprises two combined cutter blades, wherein a coating gap exists between the cutter blades, a spacer is arranged on each of the two ends of the gap, and the distance between the two spacers is less than the width of a cover plate glass. The improved coater cutter bit can avoid a target, so that the aligning target is not blocked by a BM photoresist.

Description

A kind of coating cutter head for the manufacture of OGS structure

Technical field

The utility model relates to the production unit of capacitive touch screen.

Background technology

Under social progress fast development, people pursue more and more higher to touch-screen.In order to meet intelligent terminal ultrathin and to promote display effect demand, OGS structure is used widely, and OGS is in the upper technology that directly forms ITO conducting film and sensor of protective glass (cover plate).A glass plays the dual function of protective glass and touch sensor simultaneously, can reach and has saved one deck glass cost and reduced the cost of once fitting, and has alleviated weight and thickness; Increased transparence, by the inevitable choice that is High Tier Brand terminal.

While producing OGS structure at present, need to utilize coating cutter head to be coated with photoresist material to glass cover plate surfaces, as shown in Figure 5, be normally coated with cutter head, cutter head internal gasket is not widened 16-22mm.Coating photoresistance width out equals base plate glass width.The complete covered substrate glass of black photoresist material after coating, alignment target can be covered by black, and exposure machine contraposition lamp source cannot see through atrament, differentiates cross alignment target.

Utility model content

Technical problem to be solved in the utility model is while realizing a kind of painting black photoresist material, not block the coating cutter head of alignment target.

To achieve these goals, the technical solution adopted in the utility model is:

A coating cutter head for OGS structure, described coating cutter head is merged and is formed by two blades, between described blade, has coating clearance, and described two ends, gap are respectively provided with a pad, and the spacing between described pad is less than cover-plate glass width.

Spacing between described pad is less than cover-plate glass width 20mm, and described spacer thickness is 40um.

The utility model has the advantage of that improved coating machine cutter head can dodge target, alignment target is not blocked by BM photoresist material.

Accompanying drawing explanation

Below the content of every width accompanying drawing expression in the utility model specification sheets and the mark in figure are briefly described:

Fig. 1 is capacitance plate OGS structure sectional view;

Fig. 2 is coating photoresist material schematic diagram;

Fig. 3 is coating photoresist material back shroud glass structure schematic diagram;

Fig. 4 is painting cloth-knife header structure schematic diagram;

Fig. 5 is that the coating cutter head using is at present coated with photoresist process schematic diagram

Mark in above-mentioned figure is: 1, cover-plate glass; 2, high temperature ITO jump conductor layer; 3, BM frame; 4, insulation bridge formation layer; 5, low temperature ITO unit pattern layer; 6, condactive pattern layer; 7, resin protective layer; 8, alignment target; 9, coating cutter head; 10, photoresist material; 901, blade; 902, pad; 903, coating clearance.

Embodiment

Photoresist material 10 coating process, its coating cutter head 9 is merged and is formed by two blades 901, blade 901 is wolfram steel material plate, between blade, there is coating clearance 903, jet-coating photoresit mouth during coating clearance 903(coating) two ends are respectively provided with a pad 902, photoresist material 10 does not have coating clearance 903 positions of pad 902 to spray out by centre exactly, and the spacing between pad 902 is less than the width of cover-plate glass 1, can dodge BM photoresist material 10 and block alignment target 8 while being coated with like this.

Spacing between pad is less than cover-plate glass width 20mm, and the thickness of pad 902 is 40um.This is also this patent key point, must while avoiding being coated with, block the alignment target 8 that high temperature ITO jump conductor layer 2 processing procedures stay by dodging BM black photoresist material 10, and causes contraposition exposing.

The position of industry conventional design alignment target position 8 is generally 5-7mm from the distance at cover-plate glass 1 edge.Graphics field is from base plate glass edge > 12mm.While making the 3 processing procedure coating of BM frame, alignment target 8 can uncover outside, by black photoresist material 10, is not covered.

The object of improving coating cutter head is in order to adapt to capacitance plate OGS structure fabrication technique.Its manufacture craft is carried out according to following manufacturing step:

Step 1, in cover-plate glass 1 one side after reinforcing process is processed, be coated with ITO layer, cover-plate glass 1 thickness is 0.7-2.0mm, and after strengthening, stressor layers is 10-12um, and stress value is 550-650mpa.

Step 2, by step 1 coating ITO layer be made into high temperature ITO jump conductor layer 2, at edge, produce two alignment targets 8 simultaneously, this step is for fear of BM frame 3(sensitizer black film layer) in high-temperature coating process, be heated too high impaired, and avoid repeatedly soda acid liquid processing procedure (scavenging solution, developing solution, etching solution liquid parting) BM frame 3 sticking power come off, and first carry out high temperature ITO jump conductor layer 2 at this point and make.

The ITO layer system of crossing adopts vacuum magnetic-control sputtering method high temperature to be coated with, and while making high temperature ITO jump conductor layer 2, adopts touch-screen gold-tinted photoetching technique, and ITO layer is carried out successively: clean, and coating, soft roasting, exposure, develops, firmly roasting, etching, stripping art breading.Be made into high temperature ITO jump conductor layer 2(ITO-jumper figure layer).While making high temperature ITO jump conductor layer 2, must leave at edge 2 alignment targets, one when making BM frame 3 contraposition use, another is to use when layer 4 processing procedure built bridge in OC insulation.

Step 3, coating photoresist material 10, adopt coating cutter head 9 of the present utility model during coating, make the edge section that is provided with alignment target 8 not be coated with photoresist material 10, dodges alignment target 8 can guarantee contraposition exposure process by coating machine cutter head 9.By after coating, photoresist material is made to BM frame 3 afterwards, BM frame 3 is produced on high temperature ITO jump conductor layer 2, the main black surround ink replacing on laminating cover-plate glass 1 and laminating cover-plate glass 1.

BM frame 3 is made as conventional means, adopts touch-screen gold-tinted photoetching technique, and photoresist material 10 is carried out: clean, and coating, soft roasting, exposure, develops, and hard curing process is processed.Be made into BM frame 3.

Step 4, on high temperature ITO jump conductor layer 2 and BM frame 3, make one deck insulation layer 4 of building bridge, here making edge bridge formation layer 4 is also conventional means, adopt the touch control part gold-tinted photoetching technique of touch screen, be coated with successively, baking, exposure, develops, hard curing process is processed, and makes insulation bridge formation layer 4.Make to build bridge layer 4 o'clock, must leave at edge 3 alignment targets, and one is used for making low temperature ITO unit figure layer 5, and other 2 are followed successively by respectively contraposition while making metal guide electrograph layer 6 and resin protective layer 7 and use,

Step 5, employing vacuum magnetic-control sputtering method low temperature (25-35 ℃) are coated with ITO layer.Wherein ITO-pattern can adopt low temperature sputtering way.And the utility model make two-layer ITO layer be for to dodge BM frame 3 through high temperature sputter ITO and with ITO jump conductor layer 2 for same substance bring extremely.

Step 6, ITO layer is made to low temperature ITO unit pattern layer 5, during making, adopt touch-screen gold-tinted photoetching technique, the ITO layer being coated with in step 5 is carried out: clean, coating, soft roasting, exposure, develops, firmly roasting, etching, baking, stripping art breading.Its mesoxalic acid carries out after etching, then toasts, and the temperature of baking is 200-220 ℃, and the time length is 20-30 minute, and the ito surface resistance that low temperature sputter goes out can be reverted within the scope of specification standards.

Step 7, adopt vacuum magnetic-control sputtering method to plate layer of metal conductive layer (mo/al/mo) on the low temperature ITO unit pattern layer 5 of making afterwards.

Step 8, metal conducting layer is made to condactive pattern layer, can adopt touch-screen gold-tinted photoetching technique, metal conducting layer is carried out: clean, coating, soft roasting, exposure, develops, firmly roasting, etching, stripping art breading.

Step 9, finally in the outer making one deck of condactive pattern layer 6 resin protective layer 7, protect.Here resin protective layer 7 is also to adopt touch-screen gold-tinted photoetching technique to make, clean successively, and coating, soft roasting, exposure, develops, and hard curing process is processed.

So far complete.

Claims

1. the coating cutter head for the manufacture of OGS structure, described coating cutter head is merged and is formed by two blades, between described blade, there is coating clearance, it is characterized in that: described two ends, gap are respectively provided with a pad, and the spacing between described pad is less than cover-plate glass width.

2. coating cutter head according to claim 1, is characterized in that: the spacing between described pad is less than cover-plate glass width 20mm, and described spacer thickness is 40um.