CN203408857U - System for preparing flexible copper-clad plate - Google Patents

Abstract

The utility model discloses a system for preparing a flexible copper-clad plate. The system sequentially comprises a dissolution stirring bucket, a heating and stirring bucket, a high-speed stirring bucket, a washing pool, a filter, a vacuum drier, a dissolution stirring bucket, a cladding machine, a nitrogen protection drier and a slow cooling chamber. According to the system, as the non-adhesive type flexible copper-clad plate is prepared by directly cladding a soluble polyimide resin solution, the problem that the adhesive liquid is poor in long-term storage stability when the non-adhesive type flexible copper-clad plate is prepared by mainly cladding polyamide acid in the conventional cladding method is solved, and moreover the needed aftertreatment temperature is low, requirements on equipment and environment conditions are low, the cladding process is accomplished once, the preparation process is simple, the production cost is low, and ultra-thin type flexible copper-clad plates can be prepared.

Description

A kind of preparation system of flexibility coat copper plate

Technical field

The utility model directly adopts high dissolubility polyimide powder obtain solution to apply to prepare flexibility coat copper plate, be specifically related to a kind of preparation system of flexibility coat copper plate.

Background technology

Flexible printed circuit (FPC), as a kind of special basic material that is applied to electronic interconnection, has distinguishing feature thin, light, flexible structure, except can static buckling, also can do dynamic bending, curling and folding etc.In recent years, along with developing rapidly of electronics industry, electronic product is further towards the future development of miniaturization, lightweight and assembling densification.This development trend has directly promoted nearly all high-tech electronic product and has all adopted in a large number flexible printed circuit, as folding cell phone, digital camera, DV, automobile satellite direction positioner, LCD TV, notebook computer, band carry IC substrate etc.As the base material of flexible printed circuit, flexibility coat copper plate (Flexible Copper Clad Laminate is called for short FCCL) is also complied with this development trend, constantly towards having the more high-quality performance future development with meeting specific environment needs.

Flexibility coat copper plate is mainly comprised of materials such as conductor Copper Foil and insulating basement membranes.Because of Kapton, have the feature performance benefits such as fabulous heat-resisting quantity and excellent mechanical property, electric property, radioresistance, it is often used as the insulating basement membrane material of flexibility coat copper plate.According to different formations, FCCL can be divided into two large classifications: have three stratotype flexibility coat copper plates (3L-FCCL) of adhesive and two stratotype flexibility coat copper plates (2L-FCCL) of non-adhesive.Glue-free flexible copper-clad plate is because the epoxies without traditional or acrylic resin are as bond layer, and it is for having gluing formulation flexibility coat copper plate, and the combination properties such as heat resistance and stability are better.Therefore, nearly ten years, its market demand cumulative year after year, but its production equipment is still perfect not, mainly adopts at present polyamic acid to apply and prepare the poor problem of glue long term storage stability that glue-free flexible copper-clad plate faces in cladding process.

Summary of the invention

The utility model is to apply and prepare the poor problem of glue long term storage stability that glue-free flexible copper-clad plate faces for existing equipment still perfect not, employing polyamic acid, and a kind of preparation system of flexibility coat copper plate is provided.

The preparation system of this flexibility coat copper plate, is characterized in that, comprises successively following equipment:

One, dissolve agitator: first the aromatic diamine monomers containing benzimidazole structure and the mixture that contains the aromatic diamine monomers of benzoxazine and benzoxazole structure are dissolved in METHYLPYRROLIDONE (NMP); Then add the aromatic dianhydride monomer with the amount of substance such as aromatic diamine monomers mixture, stir 5 ~ 10 hours, generate intermediate polyamic acid;

Two, heating agitator: with pump, polyamic acid is squeezed into heating agitator, carry out immediately the processing of solution hot-imide, add appropriate band aqua dimethylbenzene or chlorobenzene, make the reflux temperature of mixed solution be controlled at 150 ~ 190 ^owithin the scope of C, continue to stir 12 ~ 48 hours, obtain the polyimide solution of homogeneous phase, steam band aqua completely, stop heating, treat that it is naturally cooling;

Three, high-speed stirred bucket: be that polyimide solution pumps in the methyl alcohol of high-speed stirred by reactant liquor, be precipitated thing;

Four, kitchen sink: gained sediment is first fully washed by methyl alcohol and absolute ether;

Five, filter: the sediment after washing is filtered;

Six, vacuum drier: after the sediment after filtering is natural drying, continue dry 24h at 120 ℃, vacuum, obtain polyimide powder;

Seven, dissolve agitator: preparation-obtained polyimide powder is dissolved in aprotic polar solvent, and to be mixed with solid content be 10 ~ 25% polyimide solution;

Eight, coating machine: it is the electrolytic copper foil of 6 ~ 35 microns or through chemically treated rolled copper foil that gained polyimide solution is coated in to thickness, controlling the thickness of liquid film after solvent evaporates is 6 ~ 25 microns,

Nine, nitrogen protection dryer: the Copper Foil after applying is positioned in high temperature drying tunnel, under nitrogen protection respectively 80 ^oc, 120 ^oc, 160 ^oCand 210 ^owithin under C each 1 hour, remove desolventizing;

Ten, Slow cooling chamber: the Copper Foil of oven dry is positioned over to Slow cooling chamber, slowly cools to room temperature and make flexibility coat copper plate.

The utility model compared with prior art, has the following advantages:

Because adopting directly coating soluble polyimide resin solution, the utility model prepares glue-free flexible copper-clad plate, thereby solved in current cladding process and mainly to have adopted polyamic acid to apply to prepare the poor problem of glue long term storage stability that glue-free flexible copper-clad plate faces, and needed post-processing temperature is relatively low, conditional request to equipment and environment is low, coating procedure one-shot forming, preparation technology is simple, and low production cost can obtain extra-thin flexibility coat copper plate.

Accompanying drawing explanation

Fig. 1 is equipment schematic diagram of the present utility model.

The specific embodiment

Provide embodiment below so that the utility model is specifically described; be necessary to be pointed out that at this following examples are only for being further described the utility model; can not be interpreted as the restriction to the utility model protection domain, some nonessential improvement that the person skilled in the art of this area makes the utility model according to above-mentioned content of the present utility model and adjustment still belong to protection domain of the present utility model.

In Fig. 1: the preparation system of this flexibility coat copper plate, comprises following equipment successively:

A preparation system for flexibility coat copper plate, comprises following equipment successively:

One, dissolve agitator;

Two, heating agitator: dissolve agitator and be connected with pipeline with pump with heating agitator;

Three, high-speed stirred bucket: heating agitator is connected with pipeline with pump with high-speed stirred bucket;

Four, kitchen sink: high-speed stirred bucket lower part outlet has kitchen sink;

Five, filter: there is filter on kitchen sink side;

Six, vacuum drier: there is vacuum drier on filter side;

Seven, dissolve agitator: there is dissolving agitator on vacuum drier side;

Eight, coating machine: dissolving agitator side has coating machine,

Nine, nitrogen protection dryer: there is nitrogen protection dryer on coating machine side;

Ten, Slow cooling chamber: there is Slow cooling chamber on nitrogen protection dryer side.

Claims (1)

1. a preparation system for flexibility coat copper plate, is characterized in that, comprises successively following equipment:

One, dissolve agitator;

Two, heating agitator: dissolve agitator and be connected with pipeline with pump with heating agitator;

Three, high-speed stirred bucket: heating agitator is connected with pipeline with pump with high-speed stirred bucket;

Four, kitchen sink: high-speed stirred bucket lower part outlet has kitchen sink;

Five, filter: there is filter on kitchen sink side;

Six, vacuum drier: there is vacuum drier on filter side;

Seven, dissolve agitator: there is dissolving agitator on vacuum drier side;

Eight, coating machine: dissolving agitator side has coating machine,

Nine, nitrogen protection dryer: there is nitrogen protection dryer on coating machine side;

Ten, Slow cooling chamber: there is Slow cooling chamber on nitrogen protection dryer side.

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