CN203382815U - Magnetron sputtering target material protective cover and magnetron sputtering winding coating equipment - Google Patents
Magnetron sputtering target material protective cover and magnetron sputtering winding coating equipment Download PDFInfo
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- CN203382815U CN203382815U CN201320390426.3U CN201320390426U CN203382815U CN 203382815 U CN203382815 U CN 203382815U CN 201320390426 U CN201320390426 U CN 201320390426U CN 203382815 U CN203382815 U CN 203382815U
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- guard shield
- cathode targets
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- locating device
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Abstract
The utility model discloses a magnetron sputtering target material protective cover comprising an insulation column, a first protective cover and at least one second protective cover, wherein the first protective cover is fixed on the inner wall of a coating chamber through the insulation column and is provided with a first through hole for guiding impurities such as sediments and the like to pass through and fall onto the inner wall of the coating chamber; the second protective cover is detachably arranged at the end of the first protective cover, and the second protective cover and the first protective cover are formed into an accommodating cavity for accommodating a cathode target material; the impurities such as the sediments and the like generated in the coating process of the magnetron sputtering target material protective cover fall onto the inner wall of the coating chamber through the first through hole, so that the cleaning difficulty is lowered; the second protective cover can be dismounted to be cleaned, so that the cleaning difficulty is also lowered, the ignition phenomenon of the cathode target material is avoided, and the quality of a product is improved. Meanwhile, the utility model provides magnetron sputtering winding coating equipment with the magnetron sputtering target material protective cover.
Description
Technical field
The utility model relates to the magnetron sputtering field, particularly relates to a kind of magnetic control spattering target guard shield and applies the magnetron sputtering coil film coating equipment of this magnetic control spattering target guard shield.
Background technology
Touch-screen is a kind of remarkable input unit that improves man machine operation interface, have intuitively, simply, advantage efficiently.Touch-screen obtains a wide range of applications in many electronic products, such as mobile phone, personal digital assistant (Personal Digital Assistant, PDA), multi-media, public information inquiry system etc.
Can prepare by magnetron sputtering coil film coating equipment by the conducting film of touch-screen.Magnetron sputtering is to form a crossed electric and magnetic field in the surface of cathode targets.After the secondary electron of sputter generation is accelerated as high-energy electron in the cathode fall district, does not directly fly to anode, but do the motion of the approximate cycloid of vibration back and forth under the crossed electric and magnetic field effect.High-energy electron constantly and gas molecule bumps and shift energy to gas molecule makes it ionization, and high-energy electron itself becomes low-energy electron.These low-energy electrons finally float near supplementary anode negative electrode and are absorbed along magnetic line of force, avoid the strong bombardment of high-energy electron to pole plate, eliminate pole plate in the diode sputtering and bombarded the root that heats and caused damage by electron irradiation, embodied the characteristics of pole plate " low temperature " in magnetron sputtering.
Yet in the magnetron sputtering membrane process, easily produce the impurity such as settling, the impurity such as the settling of generation fall into the target below and accumulate in horizontal guard shield surface, and sputtering time is longer, and settling is more, when clean, this settling is difficult to cleaned thorough.The impurity particles such as these settlings discharge in the process of sputter coating, produce electrical spark during electric discharge, very easily cause the cathode targets spark phenomenon, have a strong impact on product quality.
Summary of the invention
Based on this, be necessary to be difficult to the cleaned problem that easily causes the cathode targets spark phenomenon for settling, easily cleaned magnetic control spattering target guard shield and apply the magnetron sputtering coil film coating equipment of this magnetic control spattering target guard shield of a kind of settling is provided.
A kind of magnetic control spattering target guard shield comprises:
Insulated column, an end of described insulated column is fixed in the plated film chamber inner wall;
The first guard shield, be platy structure, described the first guard shield is connected with the other end of described insulated column, so that described the first guard shield is fixed in described plated film chamber inner wall, described the first guard shield offers the first through hole, and the impurity such as the bootable settling of described the first through hole are by fall into described plated film chamber inner wall;
The second guard shield, be platy structure, and the quantity of described the second guard shield is at least one, and described the second guard shield is removably installed in described the first guard shield end, and described the first guard shield and described the second guard shield form host cavity, and described host cavity is for accommodating cathode targets.
In embodiment, described the first through hole is the long strip shape hole therein.
In embodiment, described the first through hole is positioned at the edge of described the first guard shield therein.
In embodiment, the side of described the first guard shield is rectangle therein, and described the first through hole extends along rectangular long limit.
In embodiment, on described the first guard shield, also offer the second through hole therein, described insulated column wears described the second through hole and is connected in described cathode targets.
In embodiment, described the second guard shield is installed on the end of described the first guard shield by threaded fastener therein.
In embodiment, also comprise wedge-shaped bar therein, described wedge-shaped bar is removably installed in the end of described the second guard shield away from described the first guard shield, and described cathode targets is between described wedge-shaped bar and described the first guard shield.
In embodiment, described the first guard shield and described the second guard shield are metal skirt therein.
A kind of magnetron sputtering coil film coating equipment, for sputter coating on flexible parent metal, comprising:
Film coating roller, described film coating roller is for reeling base material;
At least two cathode targets, adjacent two described cathode targets are the predetermined angular setting, described cathode targets comprises sputter face and the back side relative with described sputter face, described cathode targets by described sputter face sputtering target atom to base material;
Locating device, for directly triangular prism shaped, described locating device is between adjacent two described cathode targets, and two adjacent sides of described locating device are respectively perpendicular to the plane at adjacent two described cathode targets places;
At least two cathode targets bases, described cathode targets inlay card, in described cathode targets base, to support described cathode targets, reaches
Magnetic control spattering target guard shield at least as previously discussed, described adjacent two magnetic control spattering target guard shields lay respectively at described locating device both sides, and an end of adjacent two described the first guard shields is fixed in a side of described locating device.
Therein in embodiment, the bottom of described locating device is provided with the locating device base, described locating device base is the wedge shape bulk, and the two relative side of described locating device base is concaved with groove, and adjacent two described the first guard shields are inserted in respectively the groove of locating device base both sides.
During above-mentioned magnetic control spattering target guard shield work, the impurity such as most of settling that produce in the sputter coating process drop on the first guard shield at any time, and while falling, major part drops in the plated film chamber inner wall via the first through hole of the first guard shield; Simultaneously in sputter procedure, depart and not to the particle deposition of base material direction motion on the second guard shield; After plated film completes, can adopt suction cleaner etc. to be cleaned the plated film chamber inner wall, sputter cathode adopts in the slit of air gun by the cathode targets side and is blown into, and the impurity such as settling is clean clean; The first through hole because of impurity such as settlings by the first guard shield falls into the plated film chamber inner wall, and the difficulty of clean plated film chamber inner wall is lower than directly cleaning the first guard shield; The second guard shield is removably installed in the end of the first guard shield again, so the second guard shield can be disassembled when clean; So above-mentioned magnetic control spattering target guard shield makes the impurity such as settling easily cleaned, thereby has avoided the cathode targets spark phenomenon, has improved the quality of product.
During the magnetron sputtering coil film coating equipment work of this magnetic control spattering target guard shield of above-mentioned application, in the sputter coating process, locating device is right against film coating roller, the cathode targets that is positioned at the locating device both sides is predetermined angular, and guaranteeing that cathode targets is right against need to be by the substrate surface of plated film; The impurity such as the settling produced during plated film drop on the first guard shield at any time, and while falling, major part drops in the plated film chamber inner wall via the first through hole of the first guard shield; Simultaneously in the sputter coating process, depart and not to the particle deposition of base material direction motion on the second guard shield; After plated film completes, can adopt suction cleaner etc. to be cleaned the plated film chamber inner wall, sputter cathode adopts in the slit of air gun by the target side and is blown into, and the impurity such as settling is clean clean; The first through hole because of impurity such as settlings by the first guard shield falls into the plated film chamber inner wall, and the difficulty of clean plated film chamber inner wall is lower than directly cleaning the first guard shield; The second guard shield is removably installed in the end of the first guard shield again, so the second guard shield can be disassembled when clean; So the magnetron sputtering coil film coating equipment of this magnetic control spattering target guard shield of above-mentioned application makes the impurity such as settling easily cleaned, thereby has avoided the cathode targets spark phenomenon, has improved the quality of product.
The accompanying drawing explanation
The structural representation that Fig. 1 is magnetron sputtering coil film coating equipment;
The structural representation that Fig. 2 is magnetic control spattering target guard shield in Fig. 1;
The structural representation that Fig. 3 is the first guard shield in Fig. 2.
Embodiment
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail.A lot of details have been set forth in the following description so that fully understand the utility model.But the utility model can be implemented much to be different from alternate manner described here, those skilled in the art can be in the situation that do similar improvement without prejudice to the utility model intension, so the utility model is not subject to the restriction of following public concrete enforcement.
It should be noted that, when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.
Unless otherwise defined, all technology that this paper is used are identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term used in specification sheets of the present utility model herein, just in order to describe the purpose of specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
The magnetron sputtering coil film coating equipment 100 of one embodiment, comprise film coating roller 110, at least two cathode targets 120, locating device 130, at least two cathode targets bases 140 and at least two magnetic control spattering target guard shields 200.Refer to Fig. 1, be comprise film coating roller 110, two cathode targets 120, locating device 130, two cathode targets bases 140 and two magnetic control spattering target guard shields 200 structural representation.
Particularly, film coating roller 110, for the base material 300 of reeling, can be positioned at cathode targets 120 tops.Film coating roller 110 can be cylindrical.Base material 300 can be the PET film.During plated film, base material 300 is wound in film coating roller 110, and the sputter face 122 of cathode targets 120 is right against base material 300 surfaces.Certainly, in other embodiments, film coating roller 110 also can be positioned at cathode targets 120 belows, if the sputter face 122 that guarantees cathode targets 120 over against with film coating roller 110, the sputter face 122 of cathode targets 120 is over against base material 300 surfaces.
Two cathode targets 120 are the predetermined angular setting, and cathode targets 120 comprises sputter face 122 and the back side 124 relative with sputter face 122, and cathode targets 120 passes through sputter face 122 sputtering target atoms to base material 300 to be coated.In coating process, the part of base material 300 is wound in film coating roller 110, therefore base material 300 is circular shape.Because cathode targets 120, over against base material 300, arranges at an angle so be positioned at the cathode targets 120 of locating device 130 both sides, the radian size that angle forms with base material 300 is determined.The radian that base material 300 forms is larger, and the angle that two cathode targets 120 form is larger; The radian that base material 300 forms is less, and the angle that two cathode targets 120 form is less.
Particularly, locating device 130 is for directly triangular prism shaped.The cross section of locating device 130 can be isosceles triangle, and the angular bisector extended line of trilateral drift angle intersects at the central shaft of film coating roller 110.Be that locating device 130 is right against film coating roller 110.Certainly, in other embodiments, the cross section of locating device 130 can also be equilateral triangle.Locating device 130 is between adjacent two cathode targets 120, and two adjacent sides 132 of locating device 130 are respectively perpendicular to the plane at adjacent two cathode targets 120 places.The purpose that locating device 130 is set be sputter face 122 in order to guarantee cathode targets 120 over against base material 300, thereby guarantee that the target atom that cathode targets 120 sputters is deposited on base material 300 surfaces equably.
Particularly, can also be provided with in the bottom of locating device 130 locating device base 160, locating device base 160 is the wedge shape bulk, and the two relative side of locating device base 160 is concaved with the groove 162 that 162, two the first guard shields 220 of groove are inserted in respectively locating device base 160 both sides.The opening direction of groove 162 is identical with the angle of the first guard shield 220, guarantees that the first guard shield 220 is right against the back side of cathode targets 120.
Corresponding with at least two cathode targets 120, magnetic control spattering target guard shield 200 also can arrange at least two.Refer to Fig. 2 and Fig. 3, be respectively when two magnetic control spattering target guard shields 200 are set, the structural representation of magnetic control spattering target guard shield 200 and the first guard shield 220.
Magnetic control spattering target guard shield 200 comprises insulated column 210, the first guard shield 220 and the second guard shield 230.
One end of insulated column 210 is fixed in plated film chamber inner wall 150.
The first guard shield 220 is platy structure, can be right against the back side 124 of cathode targets 120.The first guard shield 220 is connected with the other end of insulated column 210, so that the first guard shield 220 is fixed in plated film chamber inner wall 150.The first guard shield 220 offers at least one the first through hole 222.The impurity such as the first through hole 222 bootable settlings are by fall into plated film chamber inner wall 150.
Particularly, the first through hole 222 can be the long strip shape hole, and the port area in long strip shape hole is large, is conducive to guide the impurity such as settling to fall on plated film chamber inner wall 150 by the first through hole 222, reduce settling and be deposited on the probability on the first guard shield 220 surfaces, thereby reduced clean difficulty.Certainly, in other embodiments, can also be the hole of other shape, as long as be conducive to the impurity such as settling by.
Particularly, the first through hole 222 is positioned at the edge of the first guard shield 220.Because the foreign material such as settling that cathode targets 120 produces in the process of sputter coating generally drop on the first guard shield 220, and the cross-sectional area of general the first guard shield 220 will be a bit larger tham the cross-sectional area of cathode targets 120, so the impurity such as settling generally drop on the edge section of the first guard shield 220, so the first through hole 222 is arranged on to the edge of the first guard shield 220, be conducive to improve the impurity such as settling by the probability of the first through hole 222, thereby reduced clean difficulty.Certainly, in other embodiments, can also also offer at the middle portion of the first guard shield 220 the first through hole 222.
Particularly, the side of the first guard shield 220 is rectangle, and the first through hole 222 extends along rectangular long limit.Because the side of the first guard shield 220 is roughly rectangle, take a limit of the first guard shield 220 is example, and the first through hole 222 of long strip shape extends along rectangular long limit, forms the long strip shape hole parallel with this limit.In the situation that the equal port area of needs is conducive to reduce the number of the first through hole 222, thereby reduce processing requirement.Certainly, in other embodiments, the first through hole can also extend and arrange along any direction.
Particularly, can offer the second through hole 224 at the first guard shield 220, insulated column 210 wears the second through hole 224 and is connected in cathode targets.The second through hole 224 can be circular port, and insulated column 210 is cylindrical shape.In other embodiment, the second through hole 224 can also be for other shape as rectangle, square, rectangle etc., and the cross section of insulated column 210 is the shape identical with the second through hole 224, and insulated column 210 and the second through hole 224 form fit are got final product.Certainly, the second through hole 224 can also be set, and make insulated column 210 and the first guard shield 220 one-body molded, also can realize the first guard shield 220 is fixed in to plated film chamber inner wall 150.
The second guard shield 230 can be platy structure particularly, and the quantity of the second guard shield 230 can be at least one.The second guard shield 230 is removably installed in the end of the first guard shield 220, can, perpendicular to the plane at cathode targets 120 places, also can be with the plane at cathode targets 120 places other angle setting.Guard shield 220 is parallel while being right against cathode targets 120 when first, also the plane at vertical the first guard shield 220 places.The first guard shield 220 and the second guard shield 230 form a host cavity, and cathode targets 120 is contained in this host cavity.When the quantity of the second guard shield 230 is one, can be arranged in any one side of the left side, the right side, front or the back of the first guard shield 220, and the second guard shield 230 and cathode targets 120 are positioned at the same side of the first guard shield 220.The second guard shield 230 can make depart and not to the particle deposition of base material 300 directions motions on the second guard shield 230, be that particle in order to prevent from sputtering is toward edge-diffusion.The quantity of the second guard shield 230 can also be two or three certainly.When the quantity of the second guard shield 230, when being greater than one, the second 230 of guard shields can removably connect, also can be one-body molded.
When the quantity of the second guard shield 230 is three, three the second guard shields 230 can be positioned at three different faces, the second guard shield 230, the first guard shield 220 and the locating device 130 that is positioned at the first guard shield 220 sides surround into one and have the box like structure of opening surface, and cathode targets 120 is contained in box like structure with cathode targets base 140.
The second guard shield 230 is removably mounted on the periphery of the first guard shield 220, when clean, the second guard shield 230 can be disassembled cleanly, has reduced clean difficulty.
Particularly, the second guard shield 230 can be installed on by threaded fastener an end of the first guard shield 220.When the quantity of the second guard shield 230, when being greater than one, the second 230 of guard shields also can connect by threaded fastener.Threaded fastener can be screw, can certainly be rivet, pin etc.Certainly, when the quantity of the second guard shield 230, when being greater than one, the second 230 of guard shields also can be one-body molded.
Particularly, magnetic control spattering target guard shield 200 can also comprise wedge-shaped bar 240, and wedge-shaped bar 240 is removably installed in the end of the second guard shield 230 away from the first guard shield 220, and cathode targets 120 is between wedge-shaped bar 240 and the first guard shield 220.In the present embodiment, wedge-shaped bar 240 can be installed on the end of the second guard shield 230 away from the first guard shield 220 by threaded fastener, easy for installation.Threaded fastener can be screw, can certainly be rivet, pin etc.Wedge-shaped bar 240 can be stuck on cathode targets 120 mount pads, to avoid the second guard shield 230 run-off the straights.
In other embodiments, three or three above cathode targets 120 can also be set, accordingly, each cathode targets 120 is positioned on a cathode targets base 140, between adjacent two cathode targets 120, locating device 130 is set.Adjacent two cathode targets 120 arrange at an angle, and angle is determined with radian that base material 300 becomes size.Accordingly, be provided with three or three above magnetic control spattering target guard shields 200.Each cathode targets 120 is contained in by the first guard shield 220 and the formed host cavity of the second guard shield 230.
When the magnetron sputtering coil film coating equipment 100 of above-mentioned magnetic control spattering target guard shield 200 and this magnetic control spattering target guard shield 200 of application is worked, because the first guard shield 220 offers the first through hole 222, the impurity such as settling that produce in the sputter coating process drop on the first guard shield 220, and while falling, major part drops in plated film chamber inner wall 150 via the first through hole 222 of the first guard shield 220; Simultaneously in sputter procedure, depart and not to the particle deposition of base material 300 directions motions on the second guard shield 230; After plated film completes, can adopt suction cleaner etc. to be cleaned plated film chamber inner wall 150, sputter cathode adopts in the slit of air gun by the target side and is blown into, and the impurity such as settling is clean clean; The first through hole 222 because of impurity such as settlings by the first guard shield 220 falls into plated film chamber inner wall 150, and the difficulty of clean plated film chamber inner wall 150 is lower than directly cleaning the first guard shield 220; The second guard shield 230 is removably installed in the end of the first guard shield 220 again, so the second guard shield 230 can be disassembled when clean; So the impurity such as settling are easily cleaned, thereby avoid cathode targets 120 spark phenomenons, improved the quality of product.
Refer to Fig. 3, in the present embodiment, adjacent two first through holes 222 can be positioned at the both sides of the second through hole 224 axisymmetrically.The second through hole 224 is used for wearing insulated column 210 so that the first guard shield 220 is fixed in plated film chamber inner wall 150, the first through hole 222 is arranged on the second through hole 224 both sides symmetrically, thereby the first through hole 222 is distributed equably, and the impurity such as the settling that is conducive to produce in coating process are equably by the first through hole 222.
In the present embodiment, described the first guard shield 220 and the second guard shield 230 can be all metal skirt.Utilized metal to there is this feature of satisfactory electrical conductivity.Particularly, can be the metals such as aluminium.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. a magnetic control spattering target guard shield, is characterized in that, comprising:
Insulated column, an end of described insulated column is fixed in the plated film chamber inner wall;
The first guard shield, be platy structure, described the first guard shield is connected with the other end of described insulated column, so that described the first guard shield is fixed in described plated film chamber inner wall, described the first guard shield offers the first through hole, and the bootable settling of described the first through hole is by fall into described plated film chamber inner wall;
The second guard shield, be platy structure, and the quantity of described the second guard shield is at least one, and described the second guard shield is removably installed in described the first guard shield end, and described the first guard shield and described the second guard shield form host cavity, and described host cavity is for accommodating cathode targets.
2. magnetic control spattering target guard shield according to claim 1, is characterized in that, described the first through hole is the long strip shape hole.
3. magnetic control spattering target guard shield according to claim 2, is characterized in that, described the first through hole is positioned at the edge of described the first guard shield.
4. magnetic control spattering target guard shield according to claim 3, is characterized in that, the side of described the first guard shield is rectangle, and described the first through hole extends along rectangular long limit.
5. magnetic control spattering target guard shield according to claim 1, is characterized in that, on described the first guard shield, also offers the second through hole, and described insulated column wears described the second through hole and is connected in described cathode targets.
6. magnetic control spattering target guard shield according to claim 1, is characterized in that, described the second guard shield is installed on the end of described the first guard shield by threaded fastener.
7. magnetic control spattering target guard shield according to claim 1, it is characterized in that, also comprise wedge-shaped bar, described wedge-shaped bar is removably installed in the end of described the second guard shield away from described the first guard shield, and described cathode targets is between described wedge-shaped bar and described the first guard shield.
8. magnetic control spattering target guard shield according to claim 1, is characterized in that, described the first guard shield and described the second guard shield are metal skirt.
9. a magnetron sputtering coil film coating equipment, for sputter coating on flexible parent metal, is characterized in that, comprising:
Film coating roller, described film coating roller is for reeling base material;
At least two cathode targets, adjacent two described cathode targets are the predetermined angular setting, described cathode targets comprises sputter face and the back side relative with described sputter face, described cathode targets by described sputter face sputtering target atom to base material;
Locating device, for directly triangular prism shaped, described locating device is between adjacent two described cathode targets, and two adjacent sides of described locating device are respectively perpendicular to the plane at adjacent two described cathode targets places;
At least two cathode targets bases, described cathode targets inlay card, in described cathode targets base, to support described cathode targets, reaches
At least two magnetic control spattering target guard shields as claimed in any of claims 1 to 8 in one of claims, described adjacent two magnetic control spattering target guard shields lay respectively at described locating device both sides, and an end of adjacent two described the first guard shields is fixed in a side of described locating device.
10. magnetron sputtering coil film coating equipment according to claim 9, it is characterized in that, the bottom of described locating device is provided with the locating device base, described locating device base is the wedge shape bulk, the two relative side of described locating device base is concaved with groove, and adjacent two described the first guard shields are inserted in respectively the groove of locating device base both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320390426.3U CN203382815U (en) | 2013-07-02 | 2013-07-02 | Magnetron sputtering target material protective cover and magnetron sputtering winding coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320390426.3U CN203382815U (en) | 2013-07-02 | 2013-07-02 | Magnetron sputtering target material protective cover and magnetron sputtering winding coating equipment |
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| Publication Number | Publication Date |
|---|---|
| CN203382815U true CN203382815U (en) | 2014-01-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320390426.3U Withdrawn - After Issue CN203382815U (en) | 2013-07-02 | 2013-07-02 | Magnetron sputtering target material protective cover and magnetron sputtering winding coating equipment |
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| CN (1) | CN203382815U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103343322A (en) * | 2013-07-02 | 2013-10-09 | 南昌欧菲光科技有限公司 | Magnetron sputtering target material shield and magnetron sputtering winding coating equipment |
-
2013
- 2013-07-02 CN CN201320390426.3U patent/CN203382815U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103343322A (en) * | 2013-07-02 | 2013-10-09 | 南昌欧菲光科技有限公司 | Magnetron sputtering target material shield and magnetron sputtering winding coating equipment |
| CN103343322B (en) * | 2013-07-02 | 2015-09-09 | 南昌欧菲光科技有限公司 | Magnetic control spattering target guard shield and magnetron sputtering coil film coating equipment |
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