CN203369016U - Heat dissipation-type tray for PCB plate - Google Patents
Heat dissipation-type tray for PCB plate Download PDFInfo
- Publication number
- CN203369016U CN203369016U CN2013202971449U CN201320297144U CN203369016U CN 203369016 U CN203369016 U CN 203369016U CN 2013202971449 U CN2013202971449 U CN 2013202971449U CN 201320297144 U CN201320297144 U CN 201320297144U CN 203369016 U CN203369016 U CN 203369016U
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- CN
- China
- Prior art keywords
- heat dissipation
- metal
- tray
- pcb board
- metal tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation-type tray for a PCB plate. The heat dissipation-type tray comprises a metal tray and a fixation device arranged on the metal tray, wherein a plurality of heat dissipation holes are formed in the metal tray; and a plurality of metal heat dissipation tubes are arranged on the bottom surface of the metal tray. Via the design aforementioned, heat can be much fast dissipated outside the board body of the PCB plate via the heat dissipation holes; and area for heat dissipation is increased by arranging the metal heat dissipation tubes on the bottom surface of the metal tray, thus further reinforcing heat dissipation, and the heat dissipation tubes are located on a complete air duct, and airflow is smooth and unobstructed, thus increasing heat dissipation efficiency. According to the heat dissipation-type tray disclosed by the utility model, the heat dissipation problem of the PCB plate provided with a high-power-consumption device in a rack-type complete machine design is greatly solved.
Description
Technical field
The utility model relates to the electronic radiation field, is specifically related to a kind of heat dissipation type pcb board pallet.
Background technology
Communication equipment often adopts the overall design of rack.In the overall design of rack, pcb board is arranged on pallet by screw and fixed bolt.In use, the pallet that pcb board is installed is inserted to corresponding groove position.The design of this rack, the heat radiation of pcb board realizes with the complete machine fan.Construct an air channel through each groove position veneer in cabinet.At present, along with the increase of pcb board processing speed, the power consumption that single groove position produces is increasing, and the heat radiation of pcb board solves difficulty and also becomes large.
Heat dissipation design for pcb board is a system engineering.At present comparatively common, be to adopt the mode to large power consumption device installation of heat radiator to realize.During installation of heat radiator, main difficulty is on layout.When device layout, consider to facilitate on the basis of PCB layout, pyrotoxin is evenly distributed on windward side as far as possible, avoid blocking fully the heater members heat radiation of lower wind direction.Referring to Fig. 1, in implementation procedure, on single pcb board 11, need the device of heat radiation when more, just be difficult to accomplish the above said windward side that is evenly distributed on, avoid air channel to stop.For the selection of radiator 12, the size of its size and thermal resistance has directly determined heat dispersion.For the radiator 12 of material of the same race (thermal resistance is identical), front face area is larger, and radiating effect is better.But can not large radiator 12 heat radiations of unconfined use.In general design, necessarily have some temperature sensors 13 on single pcb board 11, such as crystal oscillator etc., and this class device is mostly that tall and big power consumption device 14 peripheries are used.The too large radiator of area may cover these temperature sensors 13, affects its heat radiation.In addition, the device on same pcb board 11, it highly is difficult to all consistent, in the situation that have certain altitude device 15, if the larger radiator 12 of service regeulations just has structural interference.If customize irregular radiator 12, not only increase the assembling difficulty, but also can increase production cost.
The utility model content
The purpose of this utility model is to overcome the defect existed in prior art, and a kind of heat dissipation type pcb board pallet is provided, and especially is suitable for improving the heat dissipation type pcb board pallet of the radiating efficiency of the single pcb board that high power consumption device is housed in the rack overall design.
For achieving the above object, the technical solution of the utility model has been to provide a kind of heat dissipation type pcb board pallet, comprise metal tray and be arranged at the fixture on described metal tray, described metal tray is provided with a plurality of louvres, and described holder metal dish bottom surface is provided with a plurality of heat dissipation metal pipes.
As preferably, described louvre is rectangular to be evenly distributed on metal tray, between described heat dissipation metal pipe, be arranged in parallel, and described heat dissipation metal pipe is equidistant is welded on described metal tray bottom surface.
As preferably described louvre and heat dissipation metal pipe are spaced.
Advantage of the present utility model and beneficial effect are: can be so that heat distributes faster outside the pcb board plate body by louvre is set on metal tray; The metal tray bottom surface arranges the heat dissipation metal pipe and makes the area of heat radiation increase, and further strengthens heat radiation, and radiating tube is to be on complete air channel, and airflow smooth is unobstructed, has improved radiating efficiency; Solved well the heat dissipation problem of the pcb board that high power consumption device is housed in the rack overall design; The Position Design of louvre and heat dissipation metal pipe can make heat radiation more even, reaches optimum efficiency.The design has alleviated the pressure of the positive heat dissipation design of pcb board, thus the final cost that reduces research and development making radiator.
The accompanying drawing explanation
Fig. 1 is the components and parts heat radiation layout structure schematic diagram of existing veneer pcb board;
Fig. 2 is structural representation of the present utility model.
In figure: 1, metal tray; 2, louvre; 3, heat dissipation metal pipe; 4, fixture; 11, pcb board; 12, radiator; 13, temperature sensor; 14, tall and big power consumption device; 15, certain altitude device.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.Following examples are only for the technical solution of the utility model more clearly is described, and can not limit protection range of the present utility model with this.
As shown in Figure 2, a kind of heat dissipation type pcb board pallet comprises metal tray 1 and is arranged at the fixture 4 on described metal tray 1 that described metal tray 1 is provided with a plurality of louvres 2, and described holder metal dish 1 bottom surface is provided with a plurality of heat dissipation metal pipes 3.
Described louvre 2 is rectangular to be evenly distributed on metal tray 1, between described heat dissipation metal pipe 3, be arranged in parallel, and described heat dissipation metal pipe 3 is equidistant is welded on described metal tray 1 bottom surface.
Described louvre 2 is spaced with heat dissipation metal pipe 3.
In actual use procedure, pcb board is positioned on the metal tray 1 of the utility model heat dissipation type pcb board pallet, by fixture 4, pcb board is fixed, a heat part in the process of using on the pcb plate can directly come out along louvre 2, a part can be conducted in heat dissipation metal pipe 3 along metal tray 1 in addition, the wind that makes whole fan blow out by appropriate design is parallel axially to be blown with heat dissipation metal pipe 3, the heat that will directly come out from louvre 2 and the hot blow of saving heat dissipation metal pipe 3 go out, and reach the purpose of heat radiation.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (3)
1. a heat dissipation type pcb board pallet, comprise metal tray and be arranged at the fixture on described metal tray, and it is characterized in that: described metal tray is provided with a plurality of louvres, and described holder metal dish bottom surface is provided with a plurality of heat dissipation metal pipes.
2. want 1 described heat dissipation type pcb board pallet as right, it is characterized in that: described louvre is rectangular to be evenly distributed on metal tray, between described heat dissipation metal pipe, be arranged in parallel, and described heat dissipation metal pipe is equidistant is welded on described metal tray bottom surface.
3. want 2 described heat dissipation type pcb board pallets as right, it is characterized in that: described louvre and heat dissipation metal pipe are spaced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202971449U CN203369016U (en) | 2013-05-27 | 2013-05-27 | Heat dissipation-type tray for PCB plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202971449U CN203369016U (en) | 2013-05-27 | 2013-05-27 | Heat dissipation-type tray for PCB plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203369016U true CN203369016U (en) | 2013-12-25 |
Family
ID=49816722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202971449U Expired - Fee Related CN203369016U (en) | 2013-05-27 | 2013-05-27 | Heat dissipation-type tray for PCB plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203369016U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107666820A (en) * | 2017-09-18 | 2018-02-06 | 通鼎互联信息股份有限公司 | Line card and communication machine box |
-
2013
- 2013-05-27 CN CN2013202971449U patent/CN203369016U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107666820A (en) * | 2017-09-18 | 2018-02-06 | 通鼎互联信息股份有限公司 | Line card and communication machine box |
| CN107666820B (en) * | 2017-09-18 | 2019-09-10 | 通鼎互联信息股份有限公司 | Line card and communication machine box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20140527 |