CN203339685U

CN203339685U - SPD overcurrent and overheating protection device

Info

Publication number: CN203339685U
Application number: CN2013204611965U
Authority: CN
Inventors: 舒正福; 罗飞
Original assignee: SHENZHEN ZHONGPENG ELECTRONICS CO Ltd
Current assignee: SHENZHEN ZHONGPENG ELECTRONICS CO Ltd
Priority date: 2013-07-30
Filing date: 2013-07-30
Publication date: 2013-12-11
Anticipated expiration: 2023-07-30

Abstract

The utility model discloses a SPD overcurrent and overheating protection device. The SPD overcurrent and overheating protection device comprises a module lower cover, a pressure-sensitive chip, a microswitch, and a tripping elastic sheet. The pressure-sensitive chip, the microswitch and the tripping elastic sheet are installed in the module lower cover; the tripping elastic sheet comprises a first end portion and a second end portion; wherein the first end portion is installed on the module lower cover; and the second end portion is soldered onto the pressure-sensitive chip through a low-temperature solder and used to make the tripping elastic sheet undergo elastic deformation so as to be pressed onto the microswitch directly to make the microswitch in the normally-closed state. In the SPD overcurrent and overheating protection device of the utility model, the second end portion and the pressure-sensitive chip are soldered together through the low-temperature solder, and a pressing portion is pressed onto a long handle of the microswitch directly so as to make the microswitch in the normally-closed state. When the system is in lightning invasion to cause the soldering point to be melted, the tripping elastic sheet can be bounced upwards under the action of the elastic force itself to make the microswitch switched into the normally open state. Thus, the SPD overcurrent and overheating protection device has advantages, such as simple structure, low cost, stable and reliable performance, etc.

Description

SPD overcurrent, overtemperature protection system

Technical field

The utility model relates to a kind of SPD(Surge protection Device, surge protector) overcurrent, overtemperature protection system.

Background technology

Thunder and lightning is a kind of special weather phenomenon of by charged cloud, aloft being discharged and being caused.Thunder and lightning is the major reason that causes electronic equipment to damage, and it threatens the safe and stable operation of the every field electronic informations such as building, railway, civil aviaton, communication, industry control, military affairs.On the metallic circuits such as the power line be connected with electronic equipment, holding wire and control line, surge protector being installed is one of important measures of lightning protection.SPD has been widely used in various fields, has important effect in lightning protection.The quality of its state directly affects its lightning protection effect, thereby the safety of protected equipment is brought to hidden danger.

Existing SPD utilizes the dropout copper sheet to push down a working of plastics usually, and utilizes linkage to control SPD to switch between normal condition, failure state.Yet, the complex structure of existing SPD, the quality of fit between part and part had to higher requirement cause cost higher, and, once certain part occur size not to or fault, easily cause SPD overcurrent, the alarm of superheat state mistake.

The utility model content

Technical problem to be solved in the utility model is, a kind of SPD overcurrent, overtemperature protection system are provided, and it adopts simple structure control SPD to switch between normal condition, failure state, makes the cost of SPD low and stable and reliable for performance.

The utility model is achieved in that provides a kind of SPD overcurrent, overtemperature protection system, comprises module lower cover, chip varistor, sensitive switch and dropout shell fragment; Described chip varistor, sensitive switch and dropout shell fragment are installed in described module lower cover; Described dropout shell fragment has first end and contrary the second end; Described first end is arranged under described module and covers; Described the second end is welded on described chip varistor by the soldered agent and makes described dropout shell fragment produce strain and directly be pressed on described sensitive switch, thereby makes described sensitive switch in normally off.

Further, described soldered agent weldering is low temperature scolding tin.

Further, described sensitive switch has long handle; Described dropout shell fragment also comprises extension and press section; Described extension extends and described the second end is connected with described first end between described the second end and described first end; Described press section is extended and directly is pressed in described long handle towards described long handle from the inside edge of described extension.

Further, be formed with connecting portion on described chip varistor; Further be formed with socket on described the second end; Described connecting portion is inserted in described socket and is connected with described the second end by described soldered agent.

Further, described connecting portion is for vertically being arranged on the laminated structure on described chip varistor.

In the SPD overcurrent of the utility model one embodiment, overtemperature protection system, utilize the soldered agent as low temperature scolding tin, the second end and chip varistor to be welded together; And the dropout shell fragment produces strain and makes press section directly be pressed on the long handle of sensitive switch, thereby makes sensitive switch in normally off.Like this, when system during by lightning ingress, when the piezo-resistance in SPD will produce thunderbolt overcurrent or the overheated temperature that makes the pad between chip varistor and dropout shell fragment and reach the soldered agent as the fusing point of low temperature scolding tin, pad is in molten state.So, the dropout shell fragment can upwards flick under the elastic force effect of dropout shell fragment itself.Therewith therefore, SPD overcurrent of the present utility model, overtemperature protection system have simple structure, low cost, stable performance and the advantage such as reliable.

The accompanying drawing explanation

Fig. 1 is the schematic diagram of SPD when normal condition in the utility model one embodiment.

Fig. 2 is the schematic diagram of SPD when failure state in Fig. 1.

Embodiment

In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.

As shown in Figure 1, be a preferred embodiment of SPD overcurrent, overtemperature protection system in the utility model, this SPD overcurrent, overtemperature protection system 100 comprise module lower cover 110, chip varistor 120, sensitive switch 140 and dropout shell fragment 150.Wherein, chip varistor 120, sensitive switch 140 and dropout shell fragment 150 are installed in module lower cover 110; One end of dropout shell fragment 150 is arranged on module lower cover 110, the other end can be welded on chip varistor 120 and make dropout shell fragment 150 produce strains and directly be pressed on sensitive switch 140 by the soldered agent, thereby makes sensitive switch 140 in normally off.

Particularly, as shown in Figure 1, chip varistor 120 is arranged in module lower cover 110.As upper as front side and rear side (as SPD during in the position as shown in Fig. 1) in the both sides of chip varistor 120, be formed with respectively connecting portion 122.In one embodiment, connecting portion 122 can be for generally perpendicularly being arranged on the laminated structure on chip varistor 120.

Sensitive switch 140 is arranged in module lower cover 110 and between two connecting portions 122.Sensitive switch 140 has long handle 142.When long handle 142 is not subject to applied external force, as shown in Figure 2, long handle 142 pops up (as SPD during in the position shown in Fig. 1) and makes sensitive switch 140 in normally open.

Dropout shell fragment 150 comprises first end 152, the second end 153, extension 154 and press section 156.As depicted in figs. 1 and 2, the side that first end 152 is arranged on module lower cover 110 is as on right side (as SPD during in the position as shown in Fig. 1).The second end 153 and the two ends of first end 152 for de-mouthful shell fragment 150.Extension 154 extends and the second end 153 is connected with first end 152 between the second end 153 and first end 152.In the embodiment shown in Fig. 1 and Fig. 2, two extensions 154 are spaced apart and arranged on first end 152.The second end 153 and the two ends that are extension 154 with first end 152.Press section 156 is extended and is positioned at long handle 142 tops (as SPD during in the position shown in Fig. 1) from the inside edge of extension 154 towards long handle 142.

Wherein, the second end 153 can be welded on chip varistor 120 by the soldered agent.Here, the soldered agent refers to: as SPD during by lightning ingress, and the welding compound that heat melted that can be produced by the piezo-resistance in SPD.In one embodiment, the soldered agent can be eutectic welding tin.Be connected with chip varistor 120 for the ease of the second end 153 by dropout shell fragment 150, on the second end 153, can further be formed with socket 158.Socket 158 and the corresponding setting of connecting portion 122 on chip varistor 120, and connecting portion 122 can be inserted in corresponding socket 158 and by the soldered agent and is connected with the second end 153.

When the second end 153 is welded on chip varistor 120 by the soldered agent, dropout shell fragment 150 produces strain and makes press section 156 directly be pressed on the long handle 142 of sensitive switch 140, thereby makes sensitive switch 140 in normally off.

Above-mentioned is the concrete structure of SPD overcurrent, overtemperature protection system in the utility model one embodiment, its practical method of brief description.

As shown in Figure 1, SPD is in normal condition.Now, SPD normal operation.

When system during by lightning ingress, the energy that thunder and lightning will carry high voltage, large electric current enters in SPD, piezo-resistance in SPD will produce thunderbolt overcurrent or overheated, make the temperature of the pad formed by the soldered agent between chip varistor 120 and dropout shell fragment 150 fall rapid rising.When the temperature of pad reaches the soldered agent as the fusing point of low temperature scolding tin, pad is in molten state.Like this, dropout shell fragment 150 can upwards flick (as SPD during in the position shown in Fig. 1) under the elastic force effect of dropout shell fragment 150 itself.Simultaneously, along with dropout shell fragment 150 moves upward, press section 156 is separated and is made long handle 142 upwards flick and recover nature with long handle 142, thereby makes sensitive switch 140 be converted to normally open by normally off.Therewith now, by remote transmission, the conversion of this signal will be detected in the remote monitoring chamber, can locate in time the particular location of lightning ingress, thereby the lightning protection equipment of this position is investigated and followed and change.

As mentioned above, the SPD in the utility model one embodiment utilizes the soldered agent as low temperature scolding tin, the second end 153 and chip varistor 120 to be welded together; And dropout shell fragment 150 produces strain and makes press section 156 directly be pressed on the long handle 142 of sensitive switch 140, thereby makes sensitive switch 140 in normally off.Like this, when system during by lightning ingress, when the piezo-resistance in SPD will produce thunderbolt overcurrent or the overheated temperature that makes the pad between chip varistor 120 and dropout shell fragment 150 and reach the soldered agent as the fusing point of low temperature scolding tin, pad is in molten state.So, dropout shell fragment 150 can upwards flick under the elastic force effect own at dropout shell fragment 150.Meanwhile, along with dropout shell fragment 150 moves upward, press section 156 is separated and is made long handle 142 upwards flick and recover nature with long handle 142, thereby makes sensitive switch 140 be converted to normally open by normally off.Therefore, SPD overcurrent of the present utility model, overtemperature protection system have simple structure, low cost, stable performance and the advantage such as reliable.

The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.

Claims

1. a SPD overcurrent, overtemperature protection system, is characterized in that, comprises module lower cover, chip varistor, sensitive switch and dropout shell fragment; Described chip varistor, sensitive switch and dropout shell fragment are installed in described module lower cover; Described dropout shell fragment has first end and contrary the second end; Described first end is arranged under described module and covers; Described the second end is welded on described chip varistor by the soldered agent and makes described dropout shell fragment produce strain and directly be pressed on described sensitive switch, thereby makes described sensitive switch in normally off.

2. SPD overcurrent according to claim 1, overtemperature protection system, is characterized in that, described soldered agent weldering is low temperature scolding tin.

3. SPD overcurrent according to claim 1, overtemperature protection system, is characterized in that, described sensitive switch has long handle; Described dropout shell fragment also comprises extension and press section; Described extension extends and described the second end is connected with described first end between described the second end and described first end; Described press section is extended and directly is pressed in described long handle towards described long handle from the inside edge of described extension.

4. SPD overcurrent according to claim 3, overtemperature protection system, is characterized in that, on described chip varistor, is formed with connecting portion; Further be formed with socket on described the second end; Described connecting portion is inserted in described socket and is connected with described the second end by described soldered agent.

5. SPD overcurrent according to claim 4, overtemperature protection system, is characterized in that, described connecting portion is for vertically being arranged on the laminated structure on described chip varistor.