CN203333807U - Device for recycling electroplating liquid from electroplating bath - Google Patents
Device for recycling electroplating liquid from electroplating bath Download PDFInfo
- Publication number
- CN203333807U CN203333807U CN2013203261540U CN201320326154U CN203333807U CN 203333807 U CN203333807 U CN 203333807U CN 2013203261540 U CN2013203261540 U CN 2013203261540U CN 201320326154 U CN201320326154 U CN 201320326154U CN 203333807 U CN203333807 U CN 203333807U
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- CN
- China
- Prior art keywords
- container
- electroplating
- room
- overflow
- plating tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a device for recycling electroplating liquid from an electroplating bath, belongs to the field of metal electroplating. The device comprises an electroplating bath and a container connected with the electroplating bath, wherein a plurality of overflow plates are arranged in the container from top to bottom; a recycling vessel is arranged at the bottom of the container; and a heat absorption device is arranged between the recycling vessel and the overflow plates; a drainage port is formed in the bottom of the electroplating bath, and a container inlet is formed in the top of the container, the drainage port and the container inlet are connected through a pipeline, and a deliver pump is arranged on the pipeline connecting the drainage port and the container inlet together; one end of each overflow plate in the container is fixedly connected to the inner wall of the container, open ends of the overflow plates are gradually lengthened from top to bottom, so that the connecting line of the free ends and the plane form an included angle of 45-50 DEG C. The recycling device has the beneficial effects that heat remained in the electroplating liquid can be well absorbed by the heat absorption device, the overflow area of the electroplating liquid can be increased after the electroplating liquid flows down through the overflow plates, and the heat absorption effect is better.
Description
Technical field
The utility model belongs to the Metal plating field, for the recovery of plating tank electroplate liquid.
Background technology
Plating is to utilize chemistry and electrochemical method to plate various metals at metal or at other material surface.Electroplating electroplate liquid used as any discharge, will be a large chief culprit of environmental pollution.Because temperature in electroplating process is higher, when reclaiming, can cause a part of electroplate liquid drain evaporation.
Summary of the invention
The purpose of this utility model is to provide the retrieving arrangement of electroplate liquid in a kind of plating tank, reaches the purpose of cooling recovery.
In order to achieve the above object, the technical solution adopted in the utility model is:
In a kind of plating tank, the retrieving arrangement of electroplate liquid, comprise plating tank, it is characterized in that: be connected a room with plating tank, be provided with some overflow plates in room from top to bottom, the bottom of room is provided with the recovery ware, between recovery ware and overflow plate, is provided with heat sink.
The above plating tank bottom is provided with discharge outlet, is provided with the room entrance at the room top, and is connected by pipeline, on the pipeline connected, is provided with transferpump.
Overflow plate one end in the above room is fixed on the room inwall, and its open end lengthens from top to bottom gradually, makes open end line and plane form 45-50 ° of angles.
The beneficial effects of the utility model are that the heat sink of increase can well absorb the heat that electroplate liquid retains, and, after overflow plate flows down, has increased the overflow area of electroplate liquid, makes endothermic effect more desirable.
The accompanying drawing explanation
Fig. 1 is the utility model structural representation;
In figure: 1. plating tank; 2. discharge outlet; 3. transferpump; 4. room entrance; 5. room; 6. overflow plate; 7. heat sink; 8. recovery ware.
Embodiment
From accompanying drawing 1, the utility model comprises plating tank 1, be connected a room 5 with plating tank 1, be provided with some overflow plates 6 in room 5 from top to bottom, overflow plate 6 one ends are fixed on room 5 inwalls, the open end of overflow plate 6 lengthens from top to bottom gradually, makes open end line and plane form 45-50 ° of angles.The bottom of room 5 is provided with reclaims ware 8, between recovery ware 8 and overflow plate 6, is provided with heat sink 7.
The above plating tank 1 bottom is provided with discharge outlet 2, is provided with room entrance 4 at room 5 tops, and is connected by pipeline, on the pipeline connected, is provided with transferpump 3.Electroplate liquid in plating tank 1, in transferpump 3 is squeezed into room 5, and slowly flows down through overflow plate 6 from top to bottom, finally falls into room 5 bottoms and reclaims wares 8 and collected.
It should be noted that embodiment described in the utility model is only its optimal way, to belonging to the utility model general idea, and is only apparent change, within all should belonging to protection domain of the present utility model.
Claims (3)
1. the retrieving arrangement of electroplate liquid in a plating tank, comprise plating tank, and it is characterized in that: be connected a room with plating tank, be provided with some overflow plates in room from top to bottom, the bottom of room is provided with the recovery ware, is provided with heat sink reclaiming between ware and overflow plate.
2. the retrieving arrangement of electroplate liquid in plating tank according to claim 1, is characterized in that: be provided with discharge outlet bottom described plating tank, be provided with the room entrance at the room top, and be connected by pipeline, on the pipeline connected, be provided with transferpump.
3. the retrieving arrangement of electroplate liquid in plating tank according to claim 1 is characterized in that: overflow plate one end in described room is fixed on the room inwall, and its open end lengthens from top to bottom gradually, makes 45-50 ° of angles of open end line and plane formation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013203261540U CN203333807U (en) | 2013-06-07 | 2013-06-07 | Device for recycling electroplating liquid from electroplating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013203261540U CN203333807U (en) | 2013-06-07 | 2013-06-07 | Device for recycling electroplating liquid from electroplating bath |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203333807U true CN203333807U (en) | 2013-12-11 |
Family
ID=49702493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2013203261540U Expired - Fee Related CN203333807U (en) | 2013-06-07 | 2013-06-07 | Device for recycling electroplating liquid from electroplating bath |
Country Status (1)
Country | Link |
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CN (1) | CN203333807U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104451832A (en) * | 2014-10-21 | 2015-03-25 | 德清县浙北通讯器材有限公司 | Liquid recovery device for wire electroplating equipment |
-
2013
- 2013-06-07 CN CN2013203261540U patent/CN203333807U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104451832A (en) * | 2014-10-21 | 2015-03-25 | 德清县浙北通讯器材有限公司 | Liquid recovery device for wire electroplating equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131211 Termination date: 20210607 |