CN203325968U - Improved LED support structure - Google Patents
Improved LED support structure Download PDFInfo
- Publication number
- CN203325968U CN203325968U CN2013202977093U CN201320297709U CN203325968U CN 203325968 U CN203325968 U CN 203325968U CN 2013202977093 U CN2013202977093 U CN 2013202977093U CN 201320297709 U CN201320297709 U CN 201320297709U CN 203325968 U CN203325968 U CN 203325968U
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- Prior art keywords
- conducting strip
- support structure
- led wafer
- insulated substrate
- conductive sheets
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Abstract
The utility model relates to the technical field of LEDs and particularly relates to an improved LED support structure. The improved LED support structure comprises an insulating substrate and LED wafers. The improved LED support structure further comprises left conductive sheets and right conductive sheets, the left conductive sheets and the right conductive sheets are detachably connected with the insulating substrate, and a gap is arranged between each left conductive sheet and the corresponding right conductive sheet. The LED wafers are fixedly installed between the left conductive sheets and the right conductive sheets, and the positive poles and the negative poles of the LED wafers are correspondingly and electrically connected with the left conductive sheets and the right conductive sheets respectively. The spacing between the left conductive sheets and the right conductive sheets can be adjusted according to the actual needs, and the left conductive sheets, the right conductive sheets and the LED wafers can be assembled on the insulating substrate according to the actual needs of brightness, thus breaking through the traditional fixed combination and arrangement mode of LED lamps.
Description
Technical field
The utility model relates to the LED technical field, refers in particular to a kind of improved LED support structure.
Background technology
LED is widely used in indicator light, display screen at present, their LED support generally comprises the sheet of copper support, it is heat sink that copper stent is provided with copper, be packaged into one by the colloid pedestal between copper is heat sink, it is heat sink upper that the LED wafer is arranged on copper, the mode that during encapsulation, the LED wafer can only be arranged with plane be arranged on the copper of LED support heat sink on.The LED lamp frame structure of those types is fixed, and causes LED lamp assembled arrangement consistent, can not regulate the spacing between the LED lamp and design LED lamp assembled arrangement mode according to different actual needs.
Summary of the invention
The utility model provides a kind of improved LED support structure for the problem of prior art, can design according to actual needs LED lamp assembled arrangement mode and regulate the spacing between the LED lamp.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of improved LED support structure, comprise insulated substrate and LED wafer, also includes left conducting strip and right conducting strip, and described left conducting strip and right conducting strip all removably connect with insulated substrate, and be provided with gap between left conducting strip and right conducting strip; Described LED wafer is fixedly installed between left conducting strip and right conducting strip, the positive pole of described LED wafer, negative pole respectively with left conducting strip, the corresponding electrical connection of right conducting strip.
Wherein, on described insulated substrate, left conducting strip and right conducting strip, be provided with tapped through hole, described left conducting strip is fixedly connected with insulated substrate by screw or bolt respectively with right conducting strip.
Wherein, the right side of described left conducting strip and the left side of right conducting strip correspondence respectively are provided with shape, recess of the same size, and corresponding two recesses constitute the accommodation space of LED wafer.
Wherein, described recess is rectangle or semicircle.
Wherein, the insulated substrate surface that described accommodation space is corresponding is provided with the projection of space for increasing LED wafer height, and described projection and insulated substrate are one-body molded, and the bottom of described LED wafer is fixedly connected with the upper surface of projection.
Wherein, described insulated substrate surface is provided with the recessed groove matched with left conducting strip, right conducting strip and LED wafer, and described left conducting strip, right conducting strip and LED wafer embed respectively in corresponding recessed groove.
The beneficial effects of the utility model:
Left conducting strip in the utility model and right conducting strip removably connect by screw or bolt and insulated substrate respectively, the LED wafer is fixedly installed in the centre of left conducting strip and right conducting strip, the positive pole of LED wafer, negative pole respectively with left conducting strip, the corresponding electrical connection of right conducting strip.Therefore left conducting strip and right conducting strip can be regulated spacing between the two according to actual needs, also can according to intrinsic brilliance need to assemble left conducting strip, right conducting strip and LED wafer at insulated substrate, break through the mode of traditional LED lamp fixed combination, arrangement.
The accompanying drawing explanation
The vertical view that Fig. 1 is a kind of improved LED support structure of the present utility model.
The A-A partial sectional view that Fig. 2 is Fig. 1 in embodiment mono-.
The A-A partial sectional view that Fig. 3 is Fig. 1 in embodiment bis-.
Reference numeral in Fig. 1 to Fig. 3 comprises:
1-insulated substrate, 2-LED wafer 3-left conducting strip
4-right conducting strip 5-recess, 6-projection.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with embodiment and accompanying drawing, the utility model is further described, the content that execution mode is mentioned is not to restriction of the present utility model.Referring to Fig. 1 to Fig. 3, below in conjunction with accompanying drawing, the utility model is described in detail.
Embodiment mono-.
A kind of improved LED support structure that the present embodiment provides, comprise insulated substrate 1 and LED wafer 2, also include left conducting strip 3 and right conducting strip 4, described left conducting strip 3 and right conducting strip 4 all removably connect with insulated substrate 1, and are provided with gap between left conducting strip 3 and right conducting strip 4; Described LED wafer 2 is fixedly installed between left conducting strip 3 and right conducting strip 4, the positive pole of described LED wafer 2, negative pole respectively with left conducting strip 3, the corresponding electrical connection of right conducting strip 4.Wherein, be provided with tapped through hole (not marking in the accompanying drawings) on described insulated substrate 1, left conducting strip 3 and right conducting strip 4, described left conducting strip 3 and right conducting strip 4 are used respectively screw or bolt to be threaded with insulated substrate 1.
Left conducting strip 3 and right conducting strip 4 removably connect by screw or bolt and insulated substrate 1 respectively, and LED wafer 2 is fixedly installed in the centre of left conducting strip 3 and right conducting strip 4; In the present embodiment, left conducting strip 3 is connected with the negative pole of power supply, and right conducting strip 4 is connected with the positive pole of power supply, and the positive pole of LED wafer 2, negative pole are respectively by electronic welding or laser welding mode and left conducting strip 3, the corresponding electrical connection of right conducting strip 4.Therefore left conducting strip 3 and right conducting strip 4 can be regulated spacing between the two according to actual needs, also can be according to intrinsic brilliance need to, at insulated substrate 1 assembling left conducting strip 3, right conducting strip 4 and LED wafer 2, break through the mode of traditional LED lamp fixed combination, arrangement.
Wherein, the left side correspondence of the right side of described left conducting strip 3 and right conducting strip 4 is provided with shape, recess of the same size 5, and corresponding two recesses 5 constitute the accommodation space of LED wafer 2.Wherein, described recess 5 is rectangle or semicircle.As shown in Figure 1, recess 5 is designed to rectangle, and corresponding two recesses 5 form the rectangle accommodation space.When recess 5 is designed to circle, corresponding two recesses 5 form circular accommodation space.Above-mentioned recess 5 is not limited to above-mentioned two kinds of shapes, can also be set as other shapes.
As shown in Figure 2, insulated substrate 1 surface that wherein said accommodation space is corresponding is provided with the projection 6 for increasing LED wafer 2 height, and described projection 6 is one-body molded with insulated substrate 1, and the bottom of described LED wafer 2 is fixedly connected with the upper surface of projection 6.Because LED wafer 2 is thinner, and left conducting strip 3, right conducting strip 4 is relatively thick, and the bottom of LED wafer 2 is fixed on the upper surface of projection 6 by scolder, make LED wafer 2 and the upper plane of left conducting strip 3, right conducting strip 4 remain basically stable.
Embodiment bis-.
As shown in Figure 3, the technical characterictic of the technical characterictic of the present embodiment and embodiment mono-is basic identical, unique difference is: described insulated substrate 1 surface is provided with the recessed groove (not marking in the accompanying drawings) matched with the outline of left conducting strip 3, right conducting strip 4 and LED wafer 2, and described left conducting strip 3, right conducting strip 4 and LED wafer 2 embed respectively in corresponding recessed groove.Left conducting strip 3, right conducting strip 4 are embedded in corresponding recessed groove, then be threaded with insulated substrate 1 with screw or bolt, its connection is more firm; LED wafer 2 is embedded in corresponding recessed groove, can facilitate firm LED wafer 2.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.
Claims (6)
1. an improved LED support structure, comprise insulated substrate and LED wafer, it is characterized in that: also include left conducting strip and right conducting strip, described left conducting strip and right conducting strip all removably connect with insulated substrate, and are provided with gap between left conducting strip and right conducting strip; Described LED wafer is fixedly installed between left conducting strip and right conducting strip, the positive pole of described LED wafer, negative pole respectively with left conducting strip, the corresponding electrical connection of right conducting strip.
2. a kind of improved LED support structure according to claim 1, it is characterized in that: be provided with tapped through hole on described insulated substrate, left conducting strip and right conducting strip, described left conducting strip is fixedly connected with insulated substrate by screw or bolt respectively with right conducting strip.
3. a kind of improved LED support structure according to claim 1, it is characterized in that: the right side of described left conducting strip and the left side of right conducting strip correspondence respectively are provided with shape, recess of the same size, and corresponding two recesses constitute the accommodation space of LED wafer.
4. a kind of improved LED support structure according to claim 3, it is characterized in that: described recess is rectangle or semicircle.
5. a kind of improved LED support structure according to claim 3, it is characterized in that: the insulated substrate surface that described accommodation space is corresponding is provided with the projection for increasing LED wafer height, described projection and insulated substrate are one-body molded, and the bottom of described LED wafer is fixedly connected with the upper surface of projection.
6. a kind of improved LED support structure according to claim 1, it is characterized in that: described insulated substrate surface is provided with the recessed groove matched with left conducting strip, right conducting strip and LED wafer, and described left conducting strip, right conducting strip and LED wafer embed respectively in corresponding recessed groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202977093U CN203325968U (en) | 2013-05-28 | 2013-05-28 | Improved LED support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202977093U CN203325968U (en) | 2013-05-28 | 2013-05-28 | Improved LED support structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203325968U true CN203325968U (en) | 2013-12-04 |
Family
ID=49665271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202977093U Expired - Fee Related CN203325968U (en) | 2013-05-28 | 2013-05-28 | Improved LED support structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203325968U (en) |
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2013
- 2013-05-28 CN CN2013202977093U patent/CN203325968U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131204 Termination date: 20150528 |
|
| EXPY | Termination of patent right or utility model |