CN203320162U - Electroplating device with electroplating solution blocking function - Google Patents
Electroplating device with electroplating solution blocking function Download PDFInfo
- Publication number
- CN203320162U CN203320162U CN2013202307424U CN201320230742U CN203320162U CN 203320162 U CN203320162 U CN 203320162U CN 2013202307424 U CN2013202307424 U CN 2013202307424U CN 201320230742 U CN201320230742 U CN 201320230742U CN 203320162 U CN203320162 U CN 203320162U
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- China
- Prior art keywords
- electroplating
- thick stick
- transverse slat
- blocks
- electroplate liquid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to an electroplating device with an electroplating solution blocking function. The electroplating device comprises an electroplating bath, and a cathode bar and an anode bar which are arranged in the electroplating bath. The electroplating device further comprises a solution blocking mechanism used for preventing a solution on an electroplating piece from dropping on the anode bar, wherein the solution blocking mechanism is arranged above the anode bar in the electroplating bath and clung to the inner wall of the electroplating bath. After the electroplating device is adopted, because the solution blocking mechanism is arranged above the anode bar, the electroplating solution can directly drop on the solution blocking mechanism without dropping on the anode bar and corroding the anode bar when the electroplating piece passes through the anode bar.
Description
Technical field
The utility model belongs to field of electroplating, specifically discloses a kind of electroplanting device that blocks the electroplate liquid function that has.
Background technology
The principle of electroplating is that power anode is connected on the anode thick stick that is insoluble to electroplate liquid, is plated workpiece and hangs on cathode bar, electroplates the motion of electron ion in electroplate liquid after energising, makes to be subject to the plated product surface to produce electrolytic coating.In general, two anode thick sticks are set in each plating tank, workpiece hangs over the enterprising electroplating of cathode bar between two anode thick sticks, workpiece can enter this plating tank after processing in other grooves, after having electroplated in plating tank, workpiece also needs to enter in other grooves to enter next step operation simultaneously, at this time plated item all will be crossed the anode thick stick, now the electroplate liquid on plated item will drip and fall on the anode thick stick, if drop onto electroplate liquid on the anode thick stick not in time cleaning meeting antianode thick stick produce corrosive nature, so the operator needs often the electroplate liquid on the anode thick stick to be carried out to wiping, this has increased workload undoubtedly, reduced working efficiency.
The utility model content
The purpose of this utility model is to provide a kind of electroplanting device that blocks the electroplate liquid function that has, when this device can prevent that plated item from crossing the anode thick stick, electroplate liquid drops onto on the anode thick stick, guarantee that the anode thick stick is not corroded, removed the operation of wiping anode thick stick from, reduced workload.
The technical solution of the utility model is a kind of electroplanting device that blocks the electroplate liquid function that has, comprise plating tank, cathode bar in plating tank and anode thick stick, this electroplanting device also comprises that the solution prevented on plated item drops onto the gear liquid mechanism on the anode thick stick, described gear liquid mechanism be arranged on plating tank wherein a side anode thick stick top and be close to the plating tank inwall.
Useful technique effect of the present utility model is: after adopting this device, owing to being provided with gear liquid mechanism above the anode thick stick, plated item is when crossing the anode thick stick, electroplate liquid just directly drops onto in gear liquid mechanism, and can not drop onto on the anode thick stick, can not produce corrosion by the antianode thick stick, the operation of having removed wiping anode thick stick from, reduced workload.
The accompanying drawing explanation
Fig. 1 is sectional view of the present utility model;
Fig. 2 is the sectional view of the utility model along A-A;
Fig. 3 is the sectional view of the utility model supporting seat.
Wherein: 1, groove platform; 2, anode thick stick; 3, metal transverse slat; 4, cathode bar; 5, plating tank; 6, riser; 7, supporting seat.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As shown in Figure 1 and Figure 2 a kind of has the electroplanting device that blocks the electroplate liquid function, comprise plating tank 5, cathode bar 4 in plating tank 5 and anode thick stick 2, this electroplanting device also comprises that the solution prevented on plated item drops onto the gear liquid mechanism on anode thick stick 2, and described gear liquid mechanism is arranged on anode thick stick 2 tops in plating tank 5 and is close to plating tank 5 inwalls.After adopting this device, owing to being provided with gear liquid mechanism above anode thick stick 2, hang over plated item on cathode bar 4 when crossing anode thick stick 2, electroplate liquid just directly drops onto in gear liquid mechanism, and can not drop onto on anode thick stick 2, can not produce corrosion by antianode thick stick 2.
Further, described gear liquid mechanism is the metal transverse slat 3 tilted to plating tank 5 bottom direction, and concrete, in order to obtain effect preferably, described metal transverse slat 3 angles of inclination are 15 degree.Because metal transverse slat 3 has covered in anode thick stick 2, electroplate liquid is with regard to directly dropping onto on metal transverse slat 3 and can not drop onto on anode thick stick 2, because metal transverse slat 3 tilts, electroplate liquid continues to recycle because the effect of gravity can be slipped in the electroplate liquid in plating tank 5, certainly, gear liquid mechanism also can adopt other forms of device, as adopted the rectangular parallelepiped of upper end open, electroplate liquid can gather in rectangular parallelepiped, when gathering to a certain degree, clears up and gets final product again.
Further, described metal transverse slat 3 front and back ends are provided with the supporting seat 7 supported by groove platform 1, the metal transverse slat 3 that is arranged so that of supporting seat 7 was installed without (as transverse slat is inserted to cell wall) by other means, can directly supporting seat 7 be placed on groove platform 1, and can make transverse slat be close to the inwall of plating tank 5.Concrete, as shown in Figures 2 and 3, the right-angled trapezium that the cross section of described supporting seat 7 is hollow, this supporting seat 7 can be one-body molded with metal transverse slat 3, also can directly be welded on metal transverse slat 3.
Further, described metal transverse slat 3 also is connected with the riser 6 that blocks anode thick stick 2.In order to make metal transverse slat 3 obtain better gear liquid effect, also be connected with the riser 6 that blocks anode thick stick 2 on metal transverse slat 3.If riser 6 is not set, the distance of metal transverse slat 3 and anode thick stick 2 need to be separated by and more just can be obtained reasonable effect, and riser 6 the requirement that has reduced distance between metal transverse slat 3 and anode thick stick 2 is set.Riser 6 can be one-body molded with transverse slat, also can be welded on transverse slat.
Be more preferably, described metal transverse slat 3 and riser 6 are coated with preservative coat.Because some electroplate liquid is to have corrosive liquid, in order to increase the work-ing life of metal transverse slat 3 and riser 6, therefore be coated with one deck preservative coat on metal transverse slat 3 and riser 6.
Claims (6)
1. one kind has the electroplanting device that blocks the electroplate liquid function, comprise plating tank (5), cathode bar (4) in plating tank (5) and anode thick stick (2), it is characterized in that: this electroplanting device also comprises that the solution prevented on plated item drops onto the gear liquid mechanism on anode thick stick (2), and described gear liquid mechanism is arranged on anode thick stick (2) top in plating tank (5) and is close to plating tank (5) inwall.
2. according to claim 1 have an electroplanting device that blocks the electroplate liquid function, it is characterized in that: described gear liquid mechanism is the metal transverse slat (3) tilted to plating tank (5) bottom direction.
3. according to claim 2 have an electroplanting device that blocks the electroplate liquid function, it is characterized in that: described metal transverse slat (3) front and back end is provided with the supporting seat (7) supported by groove platform (1).
4. according to claim 2 have an electroplanting device that blocks the electroplate liquid function, and it is characterized in that: described metal transverse slat (3) angle of inclination is 15 degree.
5. according to claim 2 have an electroplanting device that blocks the electroplate liquid function, and it is characterized in that: described metal transverse slat (3) is connected with the riser (6) that blocks anode thick stick (2).
6. according to claim 5 have an electroplanting device that blocks the electroplate liquid function, and it is characterized in that: described metal transverse slat (3) and riser (6) all are coated with preservative coat.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013202307424U CN203320162U (en) | 2013-04-28 | 2013-04-28 | Electroplating device with electroplating solution blocking function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013202307424U CN203320162U (en) | 2013-04-28 | 2013-04-28 | Electroplating device with electroplating solution blocking function |
Publications (1)
Publication Number | Publication Date |
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CN203320162U true CN203320162U (en) | 2013-12-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2013202307424U Expired - Fee Related CN203320162U (en) | 2013-04-28 | 2013-04-28 | Electroplating device with electroplating solution blocking function |
Country Status (1)
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CN (1) | CN203320162U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111501082A (en) * | 2020-06-04 | 2020-08-07 | 厦门通富微电子有限公司 | Electroplating electrode protection device, electroplating system and semiconductor processing equipment |
-
2013
- 2013-04-28 CN CN2013202307424U patent/CN203320162U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111501082A (en) * | 2020-06-04 | 2020-08-07 | 厦门通富微电子有限公司 | Electroplating electrode protection device, electroplating system and semiconductor processing equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131204 Termination date: 20150428 |
|
EXPY | Termination of patent right or utility model |