CN203282658U - Material removing machine structure - Google Patents
Material removing machine structure Download PDFInfo
- Publication number
- CN203282658U CN203282658U CN2013202481435U CN201320248143U CN203282658U CN 203282658 U CN203282658 U CN 203282658U CN 2013202481435 U CN2013202481435 U CN 2013202481435U CN 201320248143 U CN201320248143 U CN 201320248143U CN 203282658 U CN203282658 U CN 203282658U
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- CN
- China
- Prior art keywords
- symmetrical
- bearing device
- cylinder
- plate
- ejector plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims abstract description 52
- 238000003825 pressing Methods 0.000 claims description 10
- 238000004064 recycling Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims 1
- 239000002699 waste material Substances 0.000 abstract description 26
- 238000005538 encapsulation Methods 0.000 abstract description 8
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000003860 storage Methods 0.000 abstract description 2
- 239000012141 concentrate Substances 0.000 abstract 1
- 238000011084 recovery Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a depiler structure, include to be equipped with bearing device and clamping device at a base, this bearing device provides to jet out the mould benevolence that contains the waste material after the shaping and connect LED wafer encapsulation support and puts, and can borrow a plurality of material needles of getting of locating bearing device to separate waste material and LED wafer encapsulation support, by clamping device from bearing device top with the waste material centre gripping after, automatic displacement concentrates to the recovery storage bucket on adjacent limit and abandons, and operating personnel can utilize this clamping device to remove the stroke time of material at the displacement, take out the LED wafer encapsulation support of separation from bearing device, and place another mould benevolence that does not remove the material in bearing device, treat that clamping device playback can repeat the aforesaid and actuate, in order to reach the automatic function of removing the material of mould benevolence.
Description
Technical Field
The utility model relates to a depiler structure indicates especially that one kind is applicable to the mould and jets out the shaping after, and the mould benevolence of this master model still is in under the state that the waste material links LED wafer encapsulation support, can via the utility model discloses a depiler separates waste material and LED wafer encapsulation support automatically to can press from both sides the waste material of separation from mould benevolence department and get the depiler technique that the back was concentrated and is detached.
Background
After the traditional thermosetting resin is formed in a mold, the mold core is taken out from the lower part of a female mold and placed on a workbench by a manual material removing method, waste materials connected with an LED wafer packaging support are sequentially and forcedly clamped from the mold core by a clamp, then the LED wafer packaging support attached to the mold core is slowly picked from the periphery of the mold core by a sharp tool, and then the LED wafer packaging support is taken out from the mold core by a hand taking method, and then the mold core is cleaned so as to be sleeved on the female mold again for the next injection molding operation.
The above disadvantages existing in the manual material removing mode include: the waste materials are manually clamped and removed in a mode of clamping and pulling in sequence, so that the operation speed is slow and time is consumed; in addition, when a sharp tool is used for picking up and separating the die core and the LED wafer packaging support, the sharp end of the tool easily scratches the support due to careless manual operation, so that the reject ratio is improved; when the mold cavity is still in a high temperature state after the injection molding is completed, the mold cavity often burns hands carelessly due to the rapidity, efficiency and carelessness when the material removing personnel clamp the waste material head.
Moreover, since the operation of removing the waste material from the mold core is slow, the operation time of continuing the injection molding after the mold core is combined with the female mold is relatively influenced, and thus the overall production efficiency cannot be effectively improved.
SUMMERY OF THE UTILITY MODEL
In view of the above disadvantages, the present invention provides an automatic material removing machine structure with automatic material removing function for removing the waste material and automatically separating the LED chip package support from the mold core for material removal, which is mainly aimed at the material removing operation of the thermosetting resin after the package formation.
The utility model provides a depiler structure, it includes: a base is provided with a bearing device and a material clamping device; wherein,
the bearing device comprises: a frame is provided with an accommodating space, an ejector plate is arranged in the accommodating space, a symmetrical side plate of the frame is provided with a symmetrical material shifting device which can synchronously move inwards or outwards, the material shifting device comprises a plurality of through holes arranged on the symmetrical side plate and transversely arranged in a row, and a plurality of guide pins are arranged on the opposite outer side of the symmetrical side plate; a symmetrical slide block is respectively sleeved on the guide pins of the symmetrical side plates in a sliding way, and a plurality of material taking needles are fixedly arranged on the opposite inner side of the symmetrical slide block and are opposite to the plurality of through holes and are correspondingly sleeved; a double-shaft cylinder is arranged in the accommodating space, a symmetrical shaft lever is arranged on the opposite outer side of the double-shaft cylinder, the tail end of the symmetrical shaft lever is respectively connected to the opposite inner sides of the symmetrical sliding blocks, and the symmetrical sliding blocks are driven to synchronously move inwards or outwards;
this press from both sides material device includes: a transverse rail is arranged above the side of the bearing device, the transverse rail is provided with a sliding seat which can drive and move along the rail of the transverse rail, the sliding seat is provided with a first air cylinder and a symmetrical downward-pressing air cylinder, the first air cylinder is arranged above the ejector plate, the bottom of the first air cylinder extends to form a plurality of first driving rods, the tail end of each first driving rod is connected with a fixed seat, the bottom of the fixed seat is at least provided with more than one group of parallel air cylinders and a plurality of second air cylinders, the bottom of each group of parallel air cylinders is connected with a symmetrical fixture which can synchronously move inwards or outwards, the opposite inner sides of the symmetrical fixture are provided with a plurality of symmetrical longitudinal grooves, and the bottom of the symmetrical fixture is provided with a plurality of inner grooves with downward openings; the bottom of the second pneumatic cylinder extends to form a second driving rod, and the tail end of the second driving rod is connected with a material removing plate; the bottom of the downward-pressing pneumatic cylinder is provided with a downward-pressing shaft rod in an extending way; a recycling bin is disposed adjacent to the base on the support device.
The components can be used for automatically removing the thermosetting resin hardened waste attached to the mold core and the finished product of the LED chip packaging bracket.
In a preferred embodiment, in the above-mentioned structure of the material removing machine, the upper end surface of the ejector plate is lower than the top surface of the frame.
In a preferred embodiment, in the structure of the material removing machine, the position of the through hole of the side plate is higher than the upper end surface of the ejector plate.
The utility model discloses the liftout plate of preferred embodiment is connected with more than one ejection cylinder in the bottom at least, can drive vertical lift from top to bottom of this liftout plate, and when the liftout plate goes up, its up end is higher than the top surface of frame at least to make things convenient for operating personnel safe taking out from the frame upper end to bear the LED wafer encapsulation support finished product in the liftout plate upper end.
The utility model discloses the symmetry anchor clamps of preferred embodiment are equipped with the symmetry in the relative outside of each symmetrical inner groovy and insert the material needle, and this symmetry is inserted material needle top-down and is a tipping angle toward relative inboard, and when the symmetry anchor clamps toward relative inboard displacement to the in-process to closing the state, the waste material head of recess can be via inserting the puncture of material needle including this holding, further ensures that the symmetry anchor clamps can firmly clip the waste material head.
The utility model provides a depiler structure has the automatic function that presss from both sides the thermosetting resin waste material that removes the solidification in the watering of mould benevolence to and separation that can be quick is attached to the shaping LED wafer encapsulation support of mould benevolence, removes material activity duration with effectively shortening mould benevolence, and LED wafer encapsulation support is not scraped essential benefits such as loss. In addition, the utility model discloses shorten mould benevolence in the use and remove the time of material, can make follow-up mould wait to registrate mould benevolence and prepare to carry out the fashioned operation of ejaculate, be unlikely to because of mould benevolence removes the material time long and hinder, have the efficiency that promotes the shaping productivity ratio of ejaculate.
Drawings
Fig. 1 is a perspective assembly view of the preferred embodiment of the structure of the present invention.
Fig. 2 is a schematic view of a bearing device according to a preferred embodiment of the present invention.
Fig. 3 is a side view of fig. 2 with a partial frame removed.
FIG. 4 is an operation diagram of FIG. 3.
Fig. 5 is a bottom view of the material clamping device according to the preferred embodiment of the present invention.
Fig. 5-1 is a schematic view of a symmetrical fixture according to a preferred embodiment of the present invention.
Fig. 6 is a sectional view a-a of fig. 5.
Fig. 7 is a schematic view illustrating the symmetrical fixture of the preferred embodiment of the present invention being moved toward the opposite inner sides.
Fig. 8 is a front view of the actuator of fig. 7.
FIG. 9 is a partial cross-sectional view of the bearing device of FIG. 8.
Fig. 10 is a schematic bottom view of the waste material clamping device of the preferred embodiment of the present invention.
Fig. 11 is a sectional view taken along line B-B of fig. 10.
Fig. 12 is an operation diagram of the material clamping device according to the preferred embodiment of the present invention.
[ description of main element symbols ]
Base-100; a support column- - -101; a mold core-200;
scrap- -210; scrap-2100;
LED chip package support-220;
a bearing means-10; a frame-11; an accommodating space-111;
side panels- -112; a knock-out plate- -12; a knockout cylinder-121;
a material clamping device-20; cross rail-21; a slider-211;
a first cylinder-22; a first driving lever 221; pressing the pneumatic cylinder-23 downwards;
a lower presser bar-231; a fixed seat- - -24; a parallel pneumatic cylinder-25;
a clamp- -251; a longitudinal groove-252; inner recess- -253;
a pin-254; a second pneumatic cylinder-26; the second drive lever 261;
a material removing plate-27; a recycling bin-28; a kick-out device-30;
-31-a perforation; a guide pin-32; a slider-33;
-34 of a take-out needle; a double-shaft cylinder-35; shaft-351.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Referring to fig. 1 to 6, a structure of a material removing machine of the present invention includes: a base 100 is provided with a bearing device 10 and a material clamping device 20; wherein,
the bearing device 10 includes: a frame 11 has an accommodating space 111 with an upward opening, an ejector plate 12 is disposed at the upper end of the accommodating space, and the upper end surface of the ejector plate 12 is slightly lower than the top surface of the frame 11; the frame 11 is provided with a symmetrical material-shifting device 30 capable of synchronously moving inwards or outwards on a symmetrical side plate 112, the material-shifting device 30 comprises a plurality of through holes 31 arranged on the symmetrical side plate 112 in a row transversely, the positions of the through holes 31 are higher than the upper end surface of the ejector plate 12, and a plurality of guide pins 32 are arranged on the opposite outer sides of the symmetrical side plate 112; a symmetrical sliding block 33 is respectively sleeved on the guide pins 32 of the symmetrical side plates 112 in a sliding manner, and a plurality of material taking needles 34 which are oppositely matched with the plurality of through holes 31 and correspondingly sleeved on the opposite inner side of the symmetrical sliding block 33 are fixedly arranged; a double-shaft cylinder 35 disposed in the accommodating space 111, wherein a symmetrical shaft 351 is disposed at an opposite outer side of the double-shaft cylinder, and two ends of the double-shaft cylinder are respectively connected to opposite inner sides of the symmetrical sliding blocks 33, and can drive the symmetrical sliding blocks 33 to synchronously move inwards or outwards;
this press from both sides material device 20 includes: a transverse rail 21 mounted on the upper side of the bearing device 10, the transverse rail 21 is provided with a slide 211 capable of driving and displacing along the rail, the sliding base 211 is provided with a first pneumatic cylinder 22 and a symmetrical downward-pressing pneumatic cylinder 23, the first pneumatic cylinder 22 is located above the ejecting plate 12, a plurality of first driving rods 221 extend from the bottom of the frame, a fixing base 24 is connected to the end of each first driving rod 221, at least one group of parallel pneumatic cylinders 25 and a plurality of second pneumatic cylinders 26 are arranged at the bottom of the fixed seat 24, the bottom of each set of parallel pneumatic cylinders 25 is connected with a symmetrical clamp 251 which can be synchronously displaced inwards or outwards, as shown in figure 5-1, the symmetrical fixture 251 is provided with a plurality of symmetrical longitudinal grooves 252 on opposite inner sides, and a plurality of inner grooves 253 with downward openings on the bottom, the plurality of longitudinal grooves 252 and inner grooves 253 primarily provide accommodation for the scrap head 2100 (shown in figure 11); the second pneumatic cylinder 26 is provided with a second driving rod 261 extending from the bottom, and a material removing plate 27 is connected to the end of the second driving rod 261; the bottom of the said lower pressure cylinder 23 is extended with a lower pressure shaft 231; a recycling bin 28 is disposed on the base 100 and adjacent to the supporting device 10;
as shown in fig. 8, 9 and 12, the thermosetting resin hardened waste 210 attached to the mold core 200 and the LED chip package support 220 can be automatically removed.
As shown in fig. 7-12, the operation of the structure of the material removing machine of the present invention includes that after the bearing device 10 is provided at the upper end of the frame for injection molding, the waste material 210 is still connected to the mold core 200 of the LED chip package support 220 for placement, and then the end of the pressing shaft 231 of the pressing pneumatic cylinder 23 is driven to press against the upper end of the mold core 200, so that the mold core 200 is kept in a fixed state (as shown in fig. 8); then, the symmetrical shaft 351 of the driving double-shaft cylinder 35 drives the symmetrical slider 112 to move to a predetermined position relatively to the inner side, the ends of the plurality of material taking needles 34 which are symmetrical at two sides are LED in from the gap between the mold core 200 and the LED chip packaging bracket 220, and the outer diameter of the material taking needle 34 is designed to be larger than the gap, so that the gap where the material taking needle 34 passes is enlarged enough to break and separate the joint of all the thermosetting resin hardened waste materials 210 and the LED chip packaging bracket 220, and the LED chip packaging bracket 220 product separated from the waste materials 210 can fall on the upper end of the ejector plate 12; then, the first driving rod 221 of the first cylinder 22 of the material clamping device 20 is driven to lower the fixing base 24 to a position where the plurality of sets of symmetrical fixtures 251 are enough to clamp the thermosetting resin hardened waste head 2100, then the parallel pneumatic cylinder 25 is driven to move the symmetrical fixtures 251 inward to an involutive state, that is, the waste head 2100 is clamped by the plurality of longitudinal grooves 252 and the inner grooves 253, and then, after the first driving rod 221 is driven to raise the fixing base 24 to a return position, the sliding base 211 is driven to move to the upper end of the recycling bin 28, the parallel pneumatic cylinder 25 is started to move the symmetrical fixtures 251 outward, and then, the second driving rod 261 of the second pneumatic cylinder 26 is driven to drive the material removing plate 27 to move downward to push the waste 210 and the waste head 2100 to fall into the recycling bin 28 for centralized storage.
It should be further noted that, during the process of moving the slide 211 toward the recycling bin 28, the operator can remove the mold core 200 after removing the material from the frame 11, take out the LED chip package support 220, and place another mold core 200 to be removed on the frame 11 again, and repeat the above automatic material removing operation after the slide 211 is returned to the position above the supporting device 10, thereby achieving the purpose of effectively improving the efficiency of the material removing operation.
As shown in fig. 3, the ejector plate 12 of the preferred embodiment of the present invention is connected with at least one ejection cylinder 121 at the bottom, which can drive the ejector plate 12 to vertically lift up and down, and when the ejector plate 12 is lifted up to the positioning point, the upper end surface of the ejector plate is at least higher than the top surface of the frame 11, so that the operator can safely take out the LED chip package support 220 carried on the upper end of the ejector plate 12 from the upper end of the frame 11.
As shown in fig. 5, 6 and 11, the symmetrical fixture 251 of the preferred embodiment of the present invention has symmetrical insertion pins 254 at opposite outer sides of the symmetrical inner grooves 253, the symmetrical insertion pins 254 form a tilting angle toward the opposite inner sides from top to bottom, and when the symmetrical fixture 251 is displaced toward the opposite inner sides to the closed state, the waste tips 2100 accommodated in the inner grooves 253 can be pierced by the insertion pins 254, thereby further ensuring that the symmetrical fixture 251 can firmly clamp the waste tips 2100.
Furthermore, as shown in fig. 1, the cross rail 21 of the preferred embodiment of the present invention is provided with a device capable of driving the displacement slide 211 along the rail, which can be a conventional rodless cylinder device.
As described above, the lateral rail 21 is fixed to a symmetrical support column 101 at the opposite outer ends, so that the lateral rail 21 is suspended above the frame 11.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (5)
1. A material removing machine structure comprises a base provided with a bearing device and a material clamping device; it is characterized in that the preparation method is characterized in that,
the bearing device comprises: a frame is provided with an accommodating space, an ejector plate is arranged in the accommodating space, a symmetrical side plate of the frame is provided with a symmetrical material shifting device which can synchronously move inwards or outwards, the material shifting device comprises a plurality of through holes arranged on the symmetrical side plate and transversely arranged in a row, and a plurality of guide pins are arranged on the opposite outer side of the symmetrical side plate; a symmetrical slide block is respectively sleeved on the guide pins of the symmetrical side plates in a sliding way, and a plurality of material taking needles are fixedly arranged on the opposite inner side of the symmetrical slide block and are opposite to the plurality of through holes and are correspondingly sleeved; a double-shaft cylinder is arranged in the accommodating space, a symmetrical shaft lever is arranged on the opposite outer side of the double-shaft cylinder, and the tail ends of the symmetrical shaft lever are respectively connected to the opposite inner sides of the symmetrical sliding blocks;
this press from both sides material device includes: a transverse rail is arranged above the side of the bearing device, the transverse rail is provided with a sliding seat which can drive and move along the rail of the transverse rail, the sliding seat is provided with a first air cylinder and a symmetrical downward-pressing air cylinder, the first air cylinder is arranged above the ejector plate, the bottom of the first air cylinder extends to form a plurality of first driving rods, the tail end of each first driving rod is connected with a fixed seat, the bottom of the fixed seat is at least provided with more than one group of parallel air cylinders and a plurality of second air cylinders, the bottom of each group of parallel air cylinders is connected with a symmetrical fixture which can synchronously move inwards or outwards, the opposite inner sides of the symmetrical fixture are provided with a plurality of symmetrical longitudinal grooves, and the bottom of the symmetrical fixture is provided with a plurality of inner grooves with downward openings; the bottom of the second pneumatic cylinder extends to form a second driving rod, and the tail end of the second driving rod is connected with a material removing plate; the bottom of the downward-pressing pneumatic cylinder is provided with a downward-pressing shaft rod in an extending way; a recycling bin is disposed adjacent to the base on the support device.
2. The structure of claim 1, wherein the top surface of the ejector plate is lower than the top surface of the frame.
3. The structure of claim 1, wherein the side plate has a perforated portion that is higher than the upper end surface of the ejector plate.
4. The structure of claim 1, wherein the bottom of the ejector plate is connected to at least one ejector cylinder for driving the ejector plate to vertically move up and down.
5. The structure of claim 1, wherein symmetrical pins are provided on opposite outer sides of the symmetrical inner grooves of the fixture, and the symmetrical pins are inclined at a tilt angle from top to bottom toward the opposite inner sides.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102203363 | 2013-02-22 | ||
| TW102203363U TWM464309U (en) | 2013-02-22 | 2013-02-22 | Material removal machine structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203282658U true CN203282658U (en) | 2013-11-13 |
Family
ID=49539037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202481435U Expired - Fee Related CN203282658U (en) | 2013-02-22 | 2013-05-09 | Material removing machine structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203282658U (en) |
| TW (1) | TWM464309U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103985795A (en) * | 2014-05-28 | 2014-08-13 | 阿博建材（昆山）有限公司 | Discharging mechanism of LED chip |
| CN104319232A (en) * | 2014-10-27 | 2015-01-28 | 广安市嘉乐电子科技有限公司 | Automatic material taking machine for forming of rectifier diode and automatic material taking method |
-
2013
- 2013-02-22 TW TW102203363U patent/TWM464309U/en not_active IP Right Cessation
- 2013-05-09 CN CN2013202481435U patent/CN203282658U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103985795A (en) * | 2014-05-28 | 2014-08-13 | 阿博建材（昆山）有限公司 | Discharging mechanism of LED chip |
| CN103985795B (en) * | 2014-05-28 | 2017-07-28 | 阿博建材（昆山）有限公司 | A kind of shedding mechanism of LED chip |
| CN104319232A (en) * | 2014-10-27 | 2015-01-28 | 广安市嘉乐电子科技有限公司 | Automatic material taking machine for forming of rectifier diode and automatic material taking method |
| CN104319232B (en) * | 2014-10-27 | 2017-04-12 | 广安市嘉乐电子科技有限公司 | Automatic material taking machine for forming of rectifier diode and automatic material taking method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM464309U (en) | 2013-11-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |