CN203282283U - Polishing device based on dielectrophoresis effect - Google Patents
Polishing device based on dielectrophoresis effect Download PDFInfo
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- CN203282283U CN203282283U CN2013203022145U CN201320302214U CN203282283U CN 203282283 U CN203282283 U CN 203282283U CN 2013203022145 U CN2013203022145 U CN 2013203022145U CN 201320302214 U CN201320302214 U CN 201320302214U CN 203282283 U CN203282283 U CN 203282283U
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Abstract
The utility model relates to a polishing device based on dielectrophoresis effect. The polishing device comprises an upper polishing disc, a lower polishing disc and a polisher body of a workpiece clamp, wherein the workpiece clamp is located in a polishing area between the upper polishing disc and the lower polishing disc, and the upper polishing disc and the lower polishing disc are additionally provided with electrodes, respectively. An insulating plate is arranged on the surface of each electrode facing the polishing area, and a polishing pad is adhered to the surface of the insulating plate. The upper polishing disc is provided with a polishing liquid injection opening. The electrodes of the upper and lower polishing discs are respectively connected with an alternating current power supply, the current input end of which is connected with a frequency modulating and voltage regulating controller to control the voltage and frequency of the alternating current power supply. The polishing device provided by the utility model has the beneficial effects that throwing of the polishing liquid and abrasive particles by centrifugal force is slowed down, the dwell time of the polishing liquid and abrasive particles is prolonged, and the planeness of the workpiece is higher.
Description
Technical field
The utility model relates to a kind of polissoir based on the dielectrophoresis effect.
Background technology
Along with improving constantly of properties of product, modern optoelectronic information field, precision optical machinery field require more and more high to machining accuracy and the surface quality of material.Materials processing be original material to components and parts change must be through approach, the precision of processing has determined the performance of components and parts, the efficiency of processing has determined the process of applying of material.
The plane polishing technology is widely used in the final processing of optical element, semiconductor chip and all kinds of high accuracy, great surface quality flat element device.In polishing process, generally by polishing disk rotate form and workpiece between relative velocity,, by the polishing fluid that injects polishing area and abrasive particle wherein, realize the workpiece material removal.Due to the polishing disk rotation, polishing fluid is subject to centrifugal action, always has the trend of leaving polishing disk, and the polishing disk rotating speed is faster, and the time of the resident machining area of polishing fluid is just shorter.This certainly will cause only having the small part polishing fluid to enter the removal of actual polishing area participation material, and most of polishing fluid is thrown out of polishing disk, can not play one's part to the full.Particularly in the polishing of a lot of light, electronics, information word device, in order to guarantee surface quality, polishing fluid does not recycle, and the invalid loss of polishing fluid has increased production cost greatly.Simultaneously, centrifugal force makes polishing fluid distribute thicker and along the polishing pad radial position, present uneven distribution the closer to the polishing pad periphery, present larger polishing rate variance between workpiece centre part and peripheral part, reduced the complanation degree of workpiece, and then reduced the polishing precision of workpiece.Tradition polishing mode adopts lower polishing disk rotating speed usually, and this has seriously limited the efficiency of polishing.Therefore, how to improve the residence time of polishing fluid at machining area, become and realized one of subject matter that efficient, high-quality, low-cost polishing face.
At present, the research that improves machining accuracy and efficiency for the conventional planar finishing method mainly concentrates on aspects such as polishing parameter, polishing fluid composition, pad material and structures, for how solving polishing fluid and abrasive particle in the plane polishing process, is subjected to centrifugal action also not look into and see from research and patent that machining area throws away problem.
Generally speaking, material in the world all has positive electricity, the negative electricity of equivalent, and be dispersed in interior of articles everywhere, if positive electrode or negative electrode are arranged near (when electric field exists) outside this material, complying with two like magnetic poles repel each other, the principle that there is a natural attraction between the sexes, the time marquis that negative electrode is close, the positive electricity in object can be partial to by the close surface of negative electrode, makes this object have also in electric field that there is a natural attraction between the sexes, the phenomenon of two like magnetic poles repel each other.Conventional electrophoretic refers to that charged corpuscle is subject to electric field action power in uniform electric field.Dielectrophoresis refers to that neutral corpuscle polarizes in inhomogeneous field, particulate after polarizing is different because of electric-field intensity distribution, the suffered electric field force in two ends is varied in size, thereby towards the large electrode direction of suffered electric-field intensity, move, suffered electric field action power is called the dielectrophoresis active force.Neutral corpuscle is understood polarized and is moved in AC field.Whole dielectrophoresis system is because of alternating current, and direction of an electric field can constantly change, and therefore the particulate in polarization also can constantly change the arrangement of own internal electron, and electronics translational speed in particulate affects the moving direction of particulate.In AC field, the polarity of electrode is constantly positive and negative, and alternately its inner electronic energy of particulate moves along with the polarity of electrode rapidly, and therefore, particulate still moves towards the higher direction of electric-field intensity.The utility model utilizes this thinking to reequip present polishing machine, thereby obtains that polishing efficiency is higher, cost is low, avoid the equipment of polishing fluid and abrasive particle waste.
Summary of the invention
The utility model is subjected to centrifugal action to throw away to cause from machining area for polishing fluid and abrasive particle in present plane polishing process to enter actual polishing area and participate in the amount of abrasive that material removes and descend, can't give full play to abrasive machining effect, polishing fluid in machining area problem pockety, has proposed a kind of polishing fluid, polissoir based on the dielectrophoresis effect that polishing effect is good do not wasted.
Polissoir based on the dielectrophoresis effect described in the utility model, comprise the polishing machine body with upper polishing disk, lower polishing disk and work piece holder, described work piece holder is polishing zone between polishing disk and described lower polishing disk on described, it is characterized in that: add respectively loading electrode on described upper polishing disk and described lower polishing disk, each described electrode surface arranges insulation board to the surface in polishing zone, and polishing pad is pasted on described insulation board surface; On described upper polishing disk, the polishing fluid inlet is set; The electrode of described upper polishing disk be connected the electrode of lower polishing disk and be connected with AC power respectively, the current input terminal of described AC power is connected with the frequency modulation and voltage modulation controller, controls voltage and the frequency of AC power.
The step of utilizing polissoir described in the utility model to operate is as follows:
1) workpiece sticks on polishing pad on insulation board after being placed in work piece holder;
2) polishing fluid and abrasive particle are regional from the polishing that the polishing fluid inlet enters between upper polishing disk and lower polishing disk;
3) during polishing, the upper polishing disk of electrode and lower polishing disk and AC power are housed to link, voltage and frequency that frequency modulation, voltage regulator controllers are controlled AC power change, make between the electrode that connects on polishing disk and the electrode that lower polishing disk is connected and produce inhomogeneous field, the polishing fluid drop in the polishing zone and abrasive particle are polarized in its surface generation charge inducing in the inhomogeneous field that electrode produces;
4) effect that in the polishing zone, the polishing fluid drop after polarization and abrasive particle are subject to dielectrophoretic force (electric field force) moves near the polishing pad of up and down, thereby slow down directly the throw away effect of centrifugal force to polishing fluid and abrasive particle, make and enter polishing fluid and the increase of abrasive particle quantity that polishing area participates in the workpiece material removal, surface of the work is carried out polishing.
Operation principle: AC power adds voltage for simultaneously upper and lower polishing disk electrode, along with input voltage value and frequency change, form an inhomogeneous field between two-plate, the polishing fluid drop and the abrasive particle that are initially neutral state polarize in inhomogeneous field, make polishing fluid drop and abrasive particle surface produce charge inducing.Charge inducing is subjected to dielectrophoretic force (electric field force) effect of inhomogeneous field, and the polishing fluid drop of drives polarization and abrasive particle move to the electrode of polishing disk, makes the polishing fluid drop of polarization and abrasive particle have absorption in polishing disk surface trend.
The beneficial effects of the utility model are: dielectrophoretic force (electric field force) can slow down the throw away effect of centrifugal force to polishing fluid and abrasive particle to the attraction function of polishing fluid and abrasive particle, participate in the abrasive particle quantity that workpiece material is removed in corresponding increase machining area, extend polishing fluid and the residence time of abrasive particle in machining area.Because more abrasive particles are realized highly-efficient processing to the micro-cutting effect of workpiece.Simultaneously, dielectrophoretic force (electric field force) makes the polishing fluid drop of polarization and abrasive particle absorption improve polishing fluid and the abrasive particle distributing homogeneity on the polishing disk surface in polishing disk surface trend, and workpiece can obtain higher flatness.
Description of drawings
Fig. 1 is structure chart of the present utility model (direction of arrow represents the direction of rotation of upper and lower polishing disk).
Fig. 2 a is that (1 ' represents electrode to the original state of neutral corpuscle in electrode; 2 ' represents neutral corpuscle).
Fig. 2 b is that (1 ' represents electrode to the neutral corpuscle process that the meeting generation polarizes in inhomogeneous field; 2 ' represents neutral corpuscle; 3 ' represents AC power).
Fig. 2 c is that after polarization, the particulate internal charge can move the motion diagram of electric field force (or claiming dielectrophoretic force) effect that rear particulate can be subjected to inhomogeneous field to microparticle surfaces (1 ' represents electrode along with polarity of electrode changes; 2 ' represents neutral corpuscle; 3 ' represents AC power).
The specific embodiment
Further illustrate the utility model below in conjunction with accompanying drawing
With reference to accompanying drawing:
Operation principle: AC power adds voltage for simultaneously upper and lower polishing disk electrode, along with input voltage value and frequency change, form an inhomogeneous field between two-plate, the polishing fluid drop and the abrasive particle that are initially neutral state polarize in inhomogeneous field, make polishing fluid drop and abrasive particle surface produce charge inducing.Charge inducing is subjected to dielectrophoretic force (electric field force) effect of inhomogeneous field, and the polishing fluid drop of drives polarization and abrasive particle move to the electrode of polishing disk, makes the polishing fluid drop of polarization and abrasive particle have absorption in polishing disk surface trend.
The step that embodiment 2 utilizes the described polissoir of embodiment 1 to operate is as follows:
1) workpiece 7 sticks on polishing pad on insulation board after being placed in work piece holder;
2) polishing fluid and abrasive particle 8 are regional from the polishing that the polishing fluid inlet enters between upper polishing disk and lower polishing disk;
3) during polishing, the upper polishing disk of electrode and lower polishing disk and AC power are housed to link, voltage and frequency that frequency modulation, voltage regulator controllers are controlled AC power change, make between the electrode that connects on polishing disk and the electrode that lower polishing disk is connected and produce inhomogeneous field, the polishing fluid drop in the polishing zone and abrasive particle are polarized in its surface generation charge inducing in the inhomogeneous field that electrode produces;
4) effect that in the polishing zone, the polishing fluid drop after polarization and abrasive particle are subject to dielectrophoretic force (electric field force) moves near the polishing pad of up and down, thereby slow down directly the throw away effect of centrifugal force to polishing fluid and abrasive particle, make and enter polishing fluid and the increase of abrasive particle quantity that polishing area participates in the workpiece material removal, surface of the work is carried out polishing.
The described content of this specification embodiment is only enumerating the way of realization of utility model design; protection domain of the present utility model should not be regarded as only limiting to the concrete form that embodiment states, protection domain of the present utility model also comprises those skilled in the art's equivalent technologies means that design can be expected according to the utility model.
Claims (1)
1. based on the polissoir of dielectrophoresis effect, comprise the polishing machine body with upper polishing disk, lower polishing disk and work piece holder, described work piece holder is polishing zone between polishing disk and described lower polishing disk on described, it is characterized in that: add respectively loading electrode on described upper polishing disk and described lower polishing disk, each described electrode surface arranges insulation board to the surface in polishing zone, and polishing pad is pasted on described insulation board surface; On described upper polishing disk, the polishing fluid inlet is set; The electrode of described upper polishing disk be connected the electrode of lower polishing disk and be connected with AC power respectively, the current input terminal of described AC power is connected with the frequency modulation and voltage modulation controller, controls voltage and the frequency of AC power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203022145U CN203282283U (en) | 2013-05-29 | 2013-05-29 | Polishing device based on dielectrophoresis effect |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203022145U CN203282283U (en) | 2013-05-29 | 2013-05-29 | Polishing device based on dielectrophoresis effect |
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| CN203282283U true CN203282283U (en) | 2013-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013203022145U Expired - Fee Related CN203282283U (en) | 2013-05-29 | 2013-05-29 | Polishing device based on dielectrophoresis effect |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104875081A (en) * | 2015-06-03 | 2015-09-02 | 浙江工业大学 | Microhole precision-machining method based on dielectrophoresis |
| CN108436744A (en) * | 2018-05-21 | 2018-08-24 | 浙江工业大学 | A kind of continually changing liquid metal burnishing device of electric field |
-
2013
- 2013-05-29 CN CN2013203022145U patent/CN203282283U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104875081A (en) * | 2015-06-03 | 2015-09-02 | 浙江工业大学 | Microhole precision-machining method based on dielectrophoresis |
| CN104875081B (en) * | 2015-06-03 | 2017-04-12 | 浙江工业大学 | Microhole precision-machining method based on dielectrophoresis |
| CN108436744A (en) * | 2018-05-21 | 2018-08-24 | 浙江工业大学 | A kind of continually changing liquid metal burnishing device of electric field |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131113 Termination date: 20180529 |
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| CF01 | Termination of patent right due to non-payment of annual fee |